Member Companies

Principal Members

Acacia Communications
ADVA AG Optical Networking
Alibaba Co., Ltd.
Amphenol
Anritsu
Arista Networks
Barefoot Networks
Broadcom Limited
BRPhotonics
Cavium
China Telecom
Ciena Corporation
Cisco Systems
Coriant R&D GmBH
Corning
Credo Semiconductor (HK) LTD
Dell, Inc
Elenion Technologies, LLC
Epson Electronics America, Inc.
Fiberhome Technologies Group
Finisar Corporation
Foxconn Interconnect Technology, Ltd.
Fujikura
Fujitsu
Furukawa Electric Japan
Gigamon
Global Foundries
Google
Hewlett Packard Enterprise
Hitachi
Huawei Technologies
Infinera
Inphi
Integrated Devices Technology
Intel
International Business Machines Corporation
Invecas, Inc.
IPG Photonics Corporation
Ixia
JCRFO
Juniper Networks
Kaiam
Kandou Bus
KDDI Research, Inc.
Keysight Technologies, Inc.
Lumentum
M/A-COM Technology Solutions
Marvell Semiconductor, Inc.
Maxim Integrated
MaxLinear, Inc.
MediaTek
Mellanox Technologies
Microsemi
Microsoft Corporation
Mitsubishi Electric Corporation
Molex
Multilane SAL Offshore
NEC Corporation
NeoPhotonics
Nokia
NTT Corporation
Oclaro
O-Net Communications (HK) Limited
Orange
PETRA
Precise-ITC, Inc.
Qorvo
Ranovus
Rianta Solutions
Rockley Photonics
Samsung Electronics Co. Ltd.
Samtec Inc.
Semtech
SiFotonics Technologies
Silab Tech Private Ltd
Sino-Telecom Technology Co., Inc.
Socionext Inc.
Spirent Communications
Sumitomo Electric Industries
Sumitomo Osaka Cement
Tektronix
TE Connectivity
Teledyne LeCroy
TELUS Commnications, Inc.
UNH InterOperability Laboratory (UNH-IOL)

Verizon
Viavi Solutions Deutschland GmBH
Xilinx
Yamaichi Electronics. LTD.
ZTE Corporation


Auditing Members

Cadence Design Systems
CoMira Solutions
EGIDE
Ericsson
Hirose Electric Co. Ltd.
Mentor Graphics Corporation

MorethanIP GmbH
Nephos, Inc.
NGK Electronics Devices, INC.
Rambus, Inc.
Renesas Electronics
Sanmina Corporation
Senko Advanced Components
Shenzhen Gigalight Technology Co. Ltd.
Vencore
ViaSat
VI Systems


Academic Members

Fraunhofer Heinrich Hertz Institute
Ghent University
University of Pavia