Member Companies

Principal Members

Acacia Communications
ADVA AG Optical Networking
Alibaba Co., Ltd.

Amphenol
Anritsu
Arista Networks
Broadcom Limited
BRPhotonics
Cavium
China Telecom
Ciena Communications
Cisco Systems
Coriant R&D GmBH
Corning
Credo Semiconductor (HK) LTD
Dell, Inc
Elenion Technologies, LLC
Epson Electronics America, Inc.
Fiberhome Technologies Group
Finisar Corporation
Foxconn Interconnect Technology, Ltd.
Fujikura
Fujitsu
Furukawa Electric Japan
Gigamon
Global Foundries
Google
Hewlett Packard Enterprise
Hitachi
Huawei Technologies
Infinera
Inphi
Integrated Devices Technology
Intel
Invecas, Inc.
Ixia
Juniper Networks
Kandou Bus
KDDI Research, Inc.
Keysight Technologies, Inc.
Lumentum
M/A-COM Technology Solutions
MaxLinear, Inc.

Mellanox Technologies
Microsemi
Microsoft Corporation
Mitsubishi Electric Corporation
Molex
Multilane SAL Offshore
NEC Corporation
NeoPhotonics
Nokia
NTT Corporation
Oclaro
O-Net Communications (HK) Limited
Orange
PETRA
Qorvo
Ranovus
Rianta Solutions
Rockley Photonics
Samsung Electronics Co. Ltd.
Samtec Inc.
Semtech
SiFotonics Technologies
Silab Tech Private Ltd
Socionext Inc.
Spirent Communications
Sumitomo Electric Industries
Sumitomo Osaka Cement
Tektronix
TE Connectivity
Teledyne LeCroy
TELUS Commnications, Inc.
UNH InterOperability Laboratory (UNH-IOL)

Verizon
Viavi Solutions Deutschland GmBH
Xilinx
Yamaichi Electronics. LTD.
ZTE Corporation


Auditing Members

Cadence Design Systems
CoMira Solutions

EGIDE
Ericsson

Hirose Electric Co. Ltd.
Mentor Graphics Corporation

MorethanIP GmbH
Nephos, Inc.
NGK Electronics Devices, INC.
Oracle
Rambus, Inc.
Renesas Electronics Corporation
Senkko Advanced Components
Vencore
ViaSat
VI Systems


Academic Members

Fraunhofer Heinrich Hertz Institute
Ghent University
University of Pavia