OIF at OFC 2017

OIF Physical and Link Layer  Interoperability Demo 2017

March 21-23, 2017
Los Angeles, CA
Los Angeles Convention Center – Booth #3853

OIF Delivers on Enabling Next Generation Networks!

OIF member companies listed below have teamed up to demonstrate significant progress in delivering an interoperable ecosystem of suppliers and solutions for critical market needs:

  • 56Gbps live electrical signaling over all reaches
  • CFP2-ACO Optical Interoperability
  • FlexE (Flex Ethernet)

Demo Participants


Speaking Sessions

Tuesday, March 21, 2017 – 1:45pm-2:45pm – Expo Theater III
Enabling Next Generation Physical Layer  Solutions
Moderator: Steve Sekel, Keysight Technologies, OIF Physical & Link Layer Interoperability Working Group Chair
Panelists: Ed Frlan, Semtech, OIF Technical Committee Vice Chair; Karl Gass, OIF Physical & Link Layer Working Group – Optical Vice Chair; Tad Hofmeister, Google, OIF Representative

Tuesday, March 21, 2017 – 3pm-4pm – Expo Theater III
OIF Interop – The Key to Unlocking the Benefits of SDN
Moderator: Dave Brown, Nokia, OIF President
Panelists: Victor Lopez, Telefonica; Lyndon Ong, Ciena, OIF MA&E Committee Co-Chair – Networking; Jonathan Sadler, Coriant, OIF Board member and Networking Interoperability WG Chair


OIF Workshop – 100G Serial Electrical Interconnect Needs

March 23, 2017
Los Angeles, CA – USA
12pm-6pm

Los Angeles Convention Center – Level Two, West Hall – Room 518
Workshop Details, including agenda

REGISTRATION

  • OIF Members: $150.00 USD; Non-members: $200.00 USD (fee includes lunch). Methods of payment accepted: AMEX, MC, Visa.
  • After March 17: Additional $25.00, based on available space.
  • Cancellation Policy: To cancel registration and receive a refund (less 10% service fee), contact Kimberly Chiu at kchiu@oiforum.com no later than March 17, 2017.

OIF Members, click HERE to register.

Non-Members, click HERE to register.