ECOC 2013 – September 23-25, 2013 – London, England
The demonstration addressed multiple technologies including CEI-28G-VSR chip-to-module interfaces for CFP2 and QSFP28 pluggable module form factors, CEI-25G-LR backplane applications and module thermal specifications that enable 100G capabilities.
The following companies participated:
Fujitsu Optical Components
Test Equipment used in the demonstration was provided by Agilent Technologies Inc. and Tektronix, Inc.
OIF Interoperability 2013 White Paper
Multi-Vendor Interoperability Testing of CFP2, CPAK and QSFP28 with CEI-28G-VSR and CEI-25G-LR Interface During ECOC 2013 Exhibition
September 11, 2013 – OIF To Showcase Record Number of Interoperability Demonstrations at ECOC 2013
Wide Range of Technologies Support Next-Gen 100G and 400G Architectures
as reported by MarketWatch