OIF @ ECOC 2014 “Accelerating Momentum on the Road to Next-Generation Architecture”

ECOC 2014- September 22-24, 2014 – Cannes, France

OIF member companies united under the banner of the Optical Internetworking Forum to showcase multi-vendor participation in OIF Interoperability 2014 – Accelerating Momentum on the Road to Next-Generation Architectures. The OIF’s Physical and Link Layer demonstration highlighted the expansion of 100G technology to smaller form factors and demonstrated live traffic over various media including optical fiber, copper cables and backplanes.

The following companies participated:

Amphenol
Finisar
Fujitsu Optical Components
Inphi
JDSU
Molex
MoSys
Semtech
TE Connectivity
Xilinx
Yamaichi Electronics

Test Equipment was provided by Agilent Technologies and Tektronix.

 

    

White Paper
Multi-Vendor Interoperability Testing of CFP4, QSFP28, and Backplanes with CEI-28G-VSR and CEI-25G-LR Interface During ECOC 2014 Exhibition

Press Release
OIF To Demonstrate 100G Multi-Vendor Interoperability at ECOC 2014
Live Tests Highlight 100G Links and Thermal Optimization

Market Focus Theater
September 24, 2014
10:20am – 10:50am
Topic: Transport SDN at OIF – Assuring a Seamless Evolution to Interoperable Transport Networks of the Future
Speaker: Jonathan Sadler, OIF Technical Committee Vice Chair, Interim Networking Interoperability WG Chair, Coriant