OFC/NFOEC 2012 – March 6-8, 2012 – Los Angeles, California
Physical and Link Layer Interoperability Testing and Demonstration:
OIF vendor members will unite under the banner of the Optical Internetworking Forum to showcase multi-vendor participation in OIF Interoperability 2012 – Enabling High-Speed Dynamic Services. The OIF’s Physical and Link Layer demonstration will showcase interoperability of the forum’s CEI 28G Very Short Reach (VSR) draft implementation agreement that defines chip-to-module electrical interfaces and the OIF’s CEI 25G Long Reach (LR) implementation agreement that defines backplane electrical interfaces.
The following companies participated:
Fujitsu Optical Components
Test equipment was provided by Tektronix, Inc.
Networking Interoperability Testing and Demonstration:
OIF carrier and vendor members will unite under the banner of the Optical Internetworking Forum to showcase multi-vendor participation in a multi-carrier environment at OIF Interoperability 2012 – Enabling High-Speed Dynamic Services. The OIF’s Networking interoperability test and demonstration will be conducted simultaneously in Europe, Asia and North America. The OIF will showcase multi-vendor data plane and control plane interworking of systems supporting Ethernet Services over OTN in a multi-carrier environment.
Telecom Carrier Hosts:
Vendor Participants include:
ADVA Optical Networking
Consulting Carriers include: AT&T, China Telecom and NTT.
PLL Demo Presentation (in pdf)
Networking Demo Presentation (in pdf)
OIF Interoperability 2012 – A Heavy Reading Perspective Sterling Perrin, Senior Analyst, Heavy Reading (in pdf)
PLL Demo White Paper – CEI-25G-LR and CEI-28G-VSR Multi-Vendor Interoperability Testing (in pdf)
Networking Demo White Paper – 2012 OIF Worldwide Interoperability Demonstration – Enabling High-Speed Dynamic Services (in pdf)
February 29, 2012
OIF to Demonstrate Multi-Vendor Interoperability at OFC
OIF Hosting Panels on High-Speed Interconnects and Dynamic OTN Networks
February 15, 2012
OIF to Demonstrate Ethernet over OTN Interoperability
Data and Control Plane Features Tested in OIF’s 5th Worldwide Event
February 9, 2012
OIF To Demonstrate Multi-Vendor Interoperability
Ten Vendor Members to Test Enabling Technology for 100G
Tuesday, March 6, 2012
11:00am – 12:30pm PST
Expo Theater II
OIF Program: Interconnect Challenges
This OIF sponsored session investigates and debates multiple solutions for Next Generation Interconnect challenges. The session offers a market perspective by an industry recognized Analyst, and a systems perspective by OIF member companies, offering insights regarding what the OIF might do to facilitate next generation interconnects that will fuel the growth of the internet. Member companies of the OIF’s Physical and Link Layer (PLL) working group will discuss technical advances in areas such as Fiber Optic cabling, Optical Backplane, SerDes development, 3D integration and line side vs. client side requirements. The OIF 100G interoperability agreements will be showcased including demonstrations of the latest Common Electrical Interface agreements.
Moderator: Rod Smith, TE Connectivity; OIF Market Awareness & Education Co-Chair
Sterling Perrin, Heavy Reading, Senior Industry Analyst
Robert Brunner, Ericsson
Edward Frlan, Gennum; OIF PLL Interoperability WG Chair
Torsten Wuth, Nokia Siemens Networks; OIF Physical Layer User Group WG Chair
Wednesday, March 7, 2012
10:30am – 12:30pm PST
Expo Theater II
OIF Program: Enabling Dynamic Optical Networks
This OIF sponsored session investigates use of the optical control plane to enable dynamic optical network services. OIF members will discuss recent work on dynamic OTN networks, multi-domain and multi-layer networking and Path Computation Elements and offer their insights on future developments that could support services like Bandwidth on Demand and Network Virtualization. The role of recent OIF interoperability testing of OTN and Ethernet-over-OTN will be discussed.