OIF at ECOC 2013
OIF Interoperability 2013 – Enabling the Next-Generation of 100G Architectures
Optical Internetworking Forum member companies will unite under the banner of the OIF to showcase multi-vendor participation in OIF Interoperability 2013 – Enabling the Next-Generation of 100G Architectures. The OIF’s Physical and Link Layer demonstration addresses multiple technologies including CEI-28G-VSR chip-to-module interfaces for CFP2 and QSFP28 pluggable module form factors, CEI-25G-LR backplane applications and module thermal specifications that enable 100G capabilities.
The following companies are participating in the OIF Interoperability 2013: Amphenol, Applied Micro, Cisco, Finisar, Fujitsu Optical Components, Inphi, Molex, MoSys, Semtech, TE Connectivity, and Xilinx. Agilent Technologies Inc. and Tektronix, Inc. will supply test equipment used in the demonstration.
Public Demonstration at ECOC 2013
September 23-25, 2013
ICC London ExCel, UK
OIF Interoperability 2013 White Paper
Multi-Vendor Interoperability Testing of CFP2, CPAK and QSFP28 with CEI-28G-VSR and CEI-25G-LR Interface During ECOC 2013 Exhibition
September 11, 2013 - OIF To Showcase Record Number of Interoperability Demonstrations at ECOC 2013
Wide Range of Technologies Support Next-Gen 100G and 400G Architectures
as reported by MarketWatch
Additional OIF Activity at ECOC 2013 - OIF Presentations at the Market Focus Theater
September 23, 2013
Title: Evolution of System Electrical Interfaces Towards 400G Transport
Networks based upon first generation 100G optical modules have been an area of intensive R&D focus over the last few years in the pursuit of higher density, higher power efficiency and an improved cost structure. As a case in point, next generation client side QSFP28 and CFP2 MSA modules having 4x25G electrical interfaces are just now coming to market and will begin to replace CFP modules in new network builds. The next significant evolution by the networking industry will be associated with the transition from 100G towards 400G networks as demonstrated by the launch of the IEEE 802.3 400G Study Group. This presentation will highlight the work that the OIF has recently undertaken in support of 400G equipment and networks, specifically the next generation of high-speed electrical and optical interfaces which will be required to enable such networks.
Speakers: Edward Frlan, OIF PLL Interoperability Working Group chair, Semtech and Nathan Tracy, OIF Technical Committee vice chair, TE Connectivity
September 24, 2013
Title: Requirements and Technologies for Transport SDN
Emerging data centric networking is leading transformation of current hardware-based networks towards Software Defined Networking (SDN) which involves application aware routing and separation of transport and control functions. SDN facilitates introduction of new services and adopt to changing traffic patterns.
SDN architecture requires dynamic, programmable and application aware optical networking and orchestrated actions among data centers and related transport networks.
This presentation will highlight the current industry SDN transport standardization and requirements activities, including high level use cases.
Speakers: Hans-Martin Foisel, OIF Carrier Working Group chair and board member, Deutsche Telekom and Vishnu Shukla, OIF president, Verizon