OIF at ECOC 2013
OIF Interoperability 2013 – Enabling the Next-Generation of 100G Architectures
Optical Internetworking Forum member companies united under the banner of the OIF to showcase multi-vendor participation in OIF Interoperability 2013 – Enabling the Next-Generation of 100G Architectures. The OIF’s Physical and Link Layer demonstration addressed multiple technologies including CEI-28G-VSR chip-to-module interfaces for CFP2 and QSFP28 pluggable module form factors, CEI-25G-LR backplane applications and module thermal specifications that enable 100G capabilities.
The following companies participated in the OIF Interoperability 2013: Amphenol, Applied Micro, Cisco, Finisar, Fujitsu Optical Components, Inphi, Molex, MoSys, Semtech, TE Connectivity, and Xilinx. Agilent Technologies Inc. and Tektronix, Inc. supplied test equipment used in the demonstration.
Public Demonstration at ECOC 2013
September 23-25, 2013
ICC London ExCel, UK
OIF Interoperability 2013 White Paper
Multi-Vendor Interoperability Testing of CFP2, CPAK and QSFP28 with CEI-28G-VSR and CEI-25G-LR Interface During ECOC 2013 Exhibition
September 11, 2013 - OIF To Showcase Record Number of Interoperability Demonstrations at ECOC 2013
Wide Range of Technologies Support Next-Gen 100G and 400G Architectures
as reported by MarketWatch