OIF Interoperability 2013 - Enabling the Next-Generation of 100G Optical Modules
The Optical Internetworking Forum is hosting a demonstration of multi-vendor operation of the 4 x 25G chip-to-module application as defined in the CEI-28G-VSR Implementation Agreement. The OIF's Physical and Link Layer demonstrations will feature for the first time interoperability including both CFP2 and QSFP28 optical modules. This is the OIF's third interoperability demonstration of 100Gb/s channels and includes the largest number of participating component suppliers. Also being tested for CEI-28G-VSR interoperability are host ASICs and FPGAs with VSR SERDES, host PCB traces, optical module connectors, and module retimers.
Participants include: Altera, Broadcom Corporation, Finisar, Fujitsu Optical Components, Inphi, Luxtera, Molex, Oclaro, Semtech, Xilinx and Yamaichi Electronics.
Test equipment donated by Agilent Technologies, Inc. and Tektronix, Inc.
Press Release on OIF Interoperability 2013
March 19-21, 2013
March 4, 2013
OIF To Demonstrate 4 x 25G Multi-Vendor Interoperability at OFC/NFOEC
Largest Number of Demo Participants Testing & Enabling Next-Gen Technology for 100G