Physical and Link Layer

Electro-Mechanical footprint for Optical Engines in a Chip Scale Package
This projext will document and detail guidelines to the OIF membership to facilitate optical engine integration on a single circuit package It will define a standardised package for the OE. For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair at dstauffe@us.ibm.com

Common Electrical Interface - 28G-VSR (CEI-28G-VSR)
This clause details the requirements for the CEI-28G-VSR very short reach high speed chip-module electrical I/O of nominal baud rates of 19.60 Gsym/s to 28.05 Gsym/s. A compliant device must meet all of the requirements listed below. The electrical I/O is based on high speed, low voltage logic, and connections are point-to-point balanced differential pairs.
The electrical IA is based on channel loss and jitter budgets. It defines the characteristics required to communicate between CEI-28G-VSR drivers and CEI-28G-VSR receivers using copper signal traces on a printed circuit board, a mated connector pair and copper signal traces inside an optical module. These characteristics are normative for the devices and informative for the channel. A ‘length’ is effectively defined in terms of its attenuation and phase response rather than its physical length. CEI-28G-VSR devices from different manufacturers shall be interoperable. For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair at dstauffe@us.ibm.com

Common Electrical Interface - 28G-MR (CEI-28G-MR)
This project will build on the previous 28G CEI projects. The Implementation Agreement shall define data lane(s) that support bit rates up to 28 Gbps over advanced material Printed Circuit Boards, the applicable data characteristics (e.g. DC balance, transition density, maximum run length, equalization), and channel models that support from 0 to 500mm and 1 connector. For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair at dstauffe@us.ibm.com

Common Electrical Interface - 56G-VSR (CEI-56G-VSR)
The proposed project will develop a single Implementation Agreement with one or more electrical specifications for operation across a single lane for data rates from 39 to 56 Gb/s. The project will determine the optimum modulation format(s) based on measurements, verification, and CMOS Switch ASIC I/O capability. For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair at dstauffe@us.ibm.com

Common Electrical Interface - 56G-Ultra Short Reach
This project will develop and produce an implementation agreement for a low power, Ultra Short Reach (<= 1cm) electrical, chip-to-chip interface operating @ 39-56Gbps signalling for MCM use cases (within a single package) and will facilitate optical engine integration within ASIC packaging. For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair at dstauffe@us.ibm.com

Common Electrical Interface - 56G-Close Proximity Reach
This project will develop and produce an implementation agreement for a low power, Close Proximity Reach (<= 50mm) electrical, chip-to-chip interface operating @ 39-56Gbps signalling for PCB use cases and will facilitate an efficient interface to a board mounted optical engine. For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair at dstauffe@us.ibm.com

Intermediate Reach 100G DWDM Transmission Framework
This project will identify market space and specify clear industry direction for next-gen 100G DWDM applications in cost sensitive links (i.e. metro/regional), where higher port density is essential (vs. 1st gen MSA). For more information on this project, contact Karl Gass, Physical and Link Layer Working Group Vice Chair at kgass@sandia.gov

Multi-Link Gearbox (MLG) 2.0
This project will define a 10:4 Mux MLG function to convert one, two, or two plus half of a third, independent 4x10Gb/s links into 4x25G lanes, and a 4:10 DeMux MLG function to convert the 4x25G lanes back to one, two, or two plus one half of a third, independent 4x10Gb/s links. For more information on this project, contact Karl Gass, Physical and Link Layer Working Group Vice Chair at kgass@sandia.gov

Generation 2.0 Intradyne Coherent Receiver
This project will propose next generation integrated coherent receiver targeting lower cost, higher density applications. For more information on this project, contact Karl Gass, Physical and Link Layer Working Group Vice Chair at kgass@sandia.gov

100G Long-Haul DWDM Transmission Module - MDIO (MSA-100G-LH-MDIO)
This project will specify an Implementation Agreement including: logical architecture, frame structure, module control theory, host-module signaling theory, and MDIO register set specifications. For more information on this project, contact Karl Gass, Physical and Link Layer Working Group Vice Chair at kgass@sandia.gov

Integrable Tunable Laser Assembly - MSA Interface Compliance Benchmark
The Integrable Tunable Laser Assembly (ITLA) - MSA Interface Compliance Benchmark project will result in two Implementation Agreements (IA): 1) Layer 1 Application Programming Interface (API) IA specifying the base data types, structures and function calls to interface with the ITLA, 2) Layer 2 Application Programming Interface (API) IA specifying the set of functions and structures that perform a minimum set of atomic compliance tests. The project will also include development of a reference implementation of Layer 1 and Layer 2 APIs and a reference application to audit an ITLA based upon the APIs. For more information, contact Karl Gass, Physical and Link Layer Working Group Vice Chair at kgass@sandia.gov

Next Gen Interconnect Framework Document
A project to generate a Framework Document that explores various applications spaces for next gen optical and/or electrical interconnect and identifies the necessary elements for follow on Implementation Agreements. For more information on this project, contact Torsten Wuth, Physical Layer User Group Working Group at torsten.wuth@nsn.com

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Networking

E-NNI 2.0 Multilayer Amendment
The Networking & Operations Working Group is working on an amendment to the OIF ENNI 2.0 Signaling Implementation Agreement that covers multi-layer signaling. The amendment is additive to the OIF ENNI 2.0 Signaling IA. The document will provide updated requirements for signaling in support of the ENNI Intracarrier Signaling interface and define methods to meet these requirements as well as prototype encodings to be used in OIF Interoperability testing. For more information on this project contact Remi Theillaud, Networking & Operations Working Group Chair at remi.theillaud@marben-products.com

E-NNI 2.0 Recovery Amendment
The amendment is additive to the OIF ENNI 2.0 Signaling IA. The document will provide updated requirements for signaling in support the ENNI Intracarrier Signaling interface and define methods to meet these requirements as well as prototype encodings to be used in OIF Interop testing. For more information, contact Remi Theillaud, Networking & Operations Working Group Chair at remi.theillaud@marben-products.com

Control Plane Security
The Networking & Operations Working Group is working on an Implementation Agreement on Security Extension for UNI and NNI version 2.0. This combines the original Security Extension and its Addendum into a single document and brings the methods up to date with current work in the OIF and IETF. For more information on this project Remi Theillaud, Networking & Operations Working Group Chair at remi.theillaud@marben-products.com

PCE Applicability to ASON Routing
The Networking & Operations Working Group is working on an Implementation Agreement describing implementation of technical solution to support PCE in ASON environment. If required, the IA will specify the protocol extensions and amend existing OIF IAs (routing, security, signaling…). For more information on this project contact Remi Theillaud, Networking & Operations Working Group Chair at remi.theillaud@marben-products.com

UNI Signaling and E-NNI Signaling/Routing IA – G.709 edition 3 (2009-12) and G.709 amd2 (2011-02) Amendment
The Networking & Operations Working Group is working on an amendment to the UNI Signaling, E-NNI Signaling and E-NNI Routing Implementation Agreements to support ODUk as specified in G.709 edition 3 (2009-12) and G.709 amd2 (2011-02). The amendment is additive to the aforementioned OIF IAs. For more information on this project contact Remi Theillaud, Networking & Operations Working Group Chair at remi.theillaud@marben-products.com

Guidelines for Application of OTN TCM
The Networking & Operations Working Group is working on a project to create an OIF whitepaper on Guidelines for Application of OTN TCM. For more information on this project Remi Theillaud, Networking & Operations Working Group Chair at remi.theillaud@marben-products.com