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OIF Unveils CEI-112G-XSR+-PAM4 Extended Extra Short Reach Implementation Agreement, Paving the Way for Advanced Interconnectivity

Organization also releases C-CMIS IA, publishes AI network operations and 400ZR+ demo white papers and announces next CMIS webinar

Fremont, Calif. – OIF, where the optical networking industry’s interoperability work gets done, has published a new Implementation Agreement (IA) for Common Electrical I/O (CEI) CEI-112G-XSR+-PAM4 Extended Extra Short Reach.

The CEI-112G-XSR+-PAM4 IA specifies a 112 Gb/s PAM4 electrical interface for die-to-die (D2D) and die-to-optical-engine (D2OE) interconnect with bump-to-bump insertion loss up to 13 dB at the Nyquist frequency and baud rate in the range 36 Gsym/s to 58 Gsym/s. The intended applications encompass multiple-chip modules (MCM), co-packaged optics (CPO) and near-package optics (NPO) assemblies. It also details the requirements for the CEI-112G-XSR+-PAM4 extended extra short reach high-speed electrical interface with nominal baud rates between 36 Gsym/s and 58 Gsym/s using PAM4 modulation.

“The CEI-112G-XSR+-PAM4 IA represents a significant milestone, extending the reach of previously published XSR class specifications at this speed range,” said David Stauffer, OIF Physical and Link Layer Working Group Chair and Kandou Bus, S.A. “This IA empowers advanced interconnectivity solutions in die-to-die and die-to-optical-engine scenarios, supporting baud rates up to 112 Gb/s (58 Gsym/s). These specifications have the opportunity to revolutionize multiple-chip modules, co-packaged optics, and near-package optics applications, pushing the boundaries of high-speed data transmission.”

Matt Brown, editor of the CEI-112G-XSR+-PAM4 IA and Alphawave Semi, added, “The CEI-112G-XSR+-PAM4 IA addresses a gap in the set of OIF CEI specifications to address new applications identified by the diverse membership of the OIF.”

OIF also recently released the Coherent Common Management Interface Specification (C-CMIS) IA 1.3, published an Application of Artificial Intelligence (AI) to Enhanced Network Operations technical white paper, published the ECOC 400ZR+ demo white paper and launched a series of CMIS technical webinars.

C-CMIS IA 1.3: This Implementation Agreement extends the Common Management Interface Specification [CMIS] to allow the management of digital coherent optics (DCO) modules. Initially covering 400ZR modules, this IA supports the management of modules that have a single data path with an eight-lane host interface for a 400GBASE-R Ethernet signal and a single-lane 400G coherent media interface based on the 400ZR specification. Future extensions to accommodate other DCO modules are anticipated.

Application of Artificial Intelligence (AI) to Enhanced Network Operations Technical White Paper: This new white paper addresses the interoperability requirements for enhanced network functions that interface between transport networks and their management-control systems. It identifies various use cases for applying AI to guide interoperability and provides insights into data requirements, processing needs, output specifications and interfaces relevant to each use case.

ECOC 400ZR+ Demo White Paper: This paper presents the methodology and results of an interoperability study of OpenZR+ MSA QSFP-DD transceivers conducted during the ECOC 2023 plugfest. Ten different transceivers were cross-connected in a matrix of transmitter-to-receiver combinations using a noise-loaded link to characterize the penalties associated with supplier interoperability. Individual transceiver performance was tested using 400GE traffic over a shortened optical line system link with a DWDM 75GHz fixed channel grid and a separate configuration to capture the transmitter error vector magnitude (EVM) performance. The transceiver receiver OSNR performance is compared against the transceiver transmitter EVM performance for each vendor.

CMIS Technical Webinar Series: OIF is hosting a series of free, public CMIS tutorial webinars. The next webinar, “Data Path State Machine (DPSM) and Application Advertising,” will be held on February 7th. These webinars aim to equip engineers, developers and industry professionals with a comprehensive understanding of CMIS. More information on the series can be found here.

 

About OIF

OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 150+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

leah@wilkinson.associates

703-907-0010

OIF Announces Implementation Agreement for High Bandwidth Coherent Driver Modulator (HB-CDM) 2.0, Enabling Coherent Solutions to 800G and Above

New IA addresses the need for increased capacity and higher performance HB-CDM devices

Fremont, Calif.—July 28, 2021 – OIF, where the optical networking industry’s interoperability work gets done, today announced an Implementation Agreement (IA) for High Bandwidth Coherent Driver Modulator (HB-CDM) 2.0. This IA builds upon the HB-CDM 1.0 IA, released in November 2018, and leverages the same form factor.

The HB-CDM 2.0 follows the integrated laser and coherent receiver standards from OIF in enabling next-generation compact, high-performance coherent networking solutions. Since OIF’s HB-CDM 1.0 was released for 64 Gigabaud (GBd), enabling 400Gbps coherent systems, the market has seen a need for increased network capacity and higher performance. The HB-CDM 2.0 leverages the original Type 1 form factor for compatibility with existing systems and also includes a Flexible Printed Circuit (FPC) as an alternate interface and higher performance RF pitch options for extended rates for future systems.

“OIF’s HB-CDM 1.0 standard was a critical new component enabling optimized 400G+ metro and long-haul coherent networks, supporting the industry need for more capacity with a standardized footprint, interface and performance,” explained Technical Editor of the OIF HB-CDM 2.0 IA, Richard Ward, Intel. “The HB-CDM 2.0 is a natural extension covering 128GBd in coherent technology for 800G per wavelength and beyond coherent systems. The market demand reinforces OIF’s critical role in creating solutions to fulfill industry requirements and accelerating market adoption of optical networking technologies.”

About OIF

OIF is where the optical networking industry’s interoperability work gets done. Building on more than 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 120+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

Email: leah@wilkinson.associates

Office: 703-907-0010

 

OIF Launches Co-Packaging Framework Implementation Agreement Project

Co-packaging of communication interfaces project establishes OIF’s leadership in this critical new area of standards for interoperability

Fremont, Calif. – OIF, the global industry forum accelerating market adoption of advanced interoperable optical networking solutions, today announced the start of the Co-Packaging Framework Implementation Agreement (IA) umbrella project. The new project start approval took place during last week’s Q420 Technical and MA&E Committee meetings held virtually November 2-6, 2020.

The Co-Packaging Framework IA will study the application spaces and relevant technology considerations for co-packaging of communication interfaces with one or more ASICs. A primary objective of this specification is to identify new opportunities for interoperability standards for possible future work at the OIF or other standards organizations. Upon completion, the work will be summarized in a Framework IA.

“It is critical that the industry be aligned on the solutions needed to move co-packaged interoperability forward,” said Jeff Hutchins, Ranovus and OIF Physical and Link Layer (PLL) Working Group – Co-Packaging Vice Chair. “With its member-driven focus, OIF is the ideal forum to facilitate industry conversation and drive interoperability of co-packaging with ASICs.”

The scope of the Co-Packaging Framework project is to:

  • Identify the key co-packaged applications and their requirements
  • Study and identify key issues associated with co-packaged optics
  • Identify opportunities and develop industry consensus to pursue interoperability standards
  • Document the study in the Framework IA (a technical whitepaper)
  • Launch follow-on standardization activities at the OIF or other appropriate standard bodies

In October, OIF’s public webinar “Co-Packaged Optics – Why, What and How” in partnership with Lightwave drew significant industry interest, reinforcing the need for industry discussion. The virtual event featured talks from industry-leading experts from: Cisco, Facebook, Intel, Juniper Networks,  Microsoft, Ranovus, Senko Advanced Components and TE Connectivity. Click here for free on-demand viewing of this webinar.

 

About OIF
OIF is where the optical networking industry’s interoperability work gets done. Building on 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
Email: leah@wilkinson.associates
Office: 703-907-0010

 

OIF Publishes Implementation Agreement for 400ZR Coherent Optical Interface

Spec addresses 400ZR multi-vendor interoperability required for cloud scale data center interconnect (DCI)

Fremont, Calif.—April 29, 2020OIF, where the optical networking industry’s interoperability work gets done, today announced it has published the Implementation Agreement (IA) for a 400ZR coherent optical interface. The document is available now for all to download.

This IA, the first OIF project with a scope that focused on interoperability at a specific distance, reinforces OIF’s critical role in creating solutions to fulfill industry requirements and accelerating market adoption of optical networking technologies.

“As a member driven organization, OIF’s work toward the 400ZR IA was the combination of significant interest from network operator members and component supplier members responding to that demand,” said Karl Gass, OIF Physical and Link Layer (PLL) Working Group – Optical Vice Chair. “The 400ZR IA is the culmination of this significant effort by OIF member companies and is critical for managing cost and driving interoperability for the industry.”

Developed to create an interoperable, low-cost 400 Gigabit coherent interface, the 400ZR IA addresses two applications:

  • Amplified, point-to-point DWDM links with reaches of 120 km or less
  • Unamplified, single wavelength links with a loss budget of 11dB

The 400ZR project was initiated when large-scale data center operators and their suppliers approached OIF to develop an interoperable coherent interface that transports 400 Gigabit Ethernet over longer distances. Traditional network operators also became interested in 400ZR for their metro needs. Based on their different requirements, OIF developed specs and tweaked the channel requirements so the IA would benefit both data center and network operators. While developing the IA, OIF collaborated closely with other standards bodies.

“400ZR is a key enabler of Microsoft’s regional architecture for the 400G generation,” said Mark Filer, Principal Optical Engineer in Microsoft Azure. “The creation of a multi-vendor, interoperable coherent interface to meet these needs would not have been possible without the extensive work and cooperation of OIF members and leadership.”

“The 400ZR IA is an example of OIF’s ability to quickly and effectively mobilize opinion and to bring interoperability to a rapidly evolving world,” said Andrew Schmitt, Directing Analyst at Cignal AI. “The 400ZR specification is the organization’s first step to establish broader interoperability among coherent transport interfaces.”

The IA aims to enable interoperable, cost-effective, 400Gb/s implementations based on single-carrier coherent DP-16QAM modulation, low-power DSPs supporting absolute (Non-Differential) phase encoding/decoding, and a Concatenated FEC (C-FEC) with a post-FEC error floor <1.0E-15. 400ZR operates as a 400GBASE-R PHY.

No restriction on the physical form factor is implied by the IA (QSFP-DD, OSFP, COBO, CFP2, CFP8), but the specifications target a pluggable DCO architecture with port densities equivalent to grey client optics.

About OIF

OIF is where the optical networking industry’s interoperability work gets done. Building on 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

Email: leah@wilkinson.associates

Office: 703-907-0010

OIF Approves IC-TROSA Implementation Agreement, Specifications Speed Delivery of a Higher Level of Integration for Transmit and Receive Optical Components

IC-TROSA IA enables miniaturization of optical transceiver modules and lowers the component cost for 400ZR, metro, data center interconnect (DCI) applications

Fremont, Calif.—September 23, 2019OIF, where the optical networking industry’s interoperability work gets done, continues its efforts to reduce cost and speed market adoption of next-generation solutions through the approval of the Integrated Coherent Transmitter-Receiver Optical Subassembly (IC-TROSA) Implementation Agreement (IA). IC-TROSA integration will be demonstrated during this week’s OIF Physical and Link Layer (PLL) Interoperability Demo at ECOC 2019 in Dublin, Ireland (OIF booth 441).

“The IC-TROSA project took an aggressive approach to coherent optical component integration and has delivered two new package designs incorporating TX and RX integration, common digital controls and performance monitoring all in a small form factor package,” explained Scott Grindstaff, Director R&D, ADVA, and IC-TROSA IA Technical Editor. “Additionally, package specific features such as fiber-free interface and solder reflow compatibility have been incorporated.”

The optical sub-assembly supports high-bandwidth and high-order dual-polarization quadrature amplitude modulation (QAM) operations and is suited for data center interconnect, metro and long-haul applications. As module sizes decrease, coherent optics components need similar size reductions to enable next generation multi-terabit switches, line cards and transport platforms.

“The IC-TROSA IA is a solution for density requirements for line cards, front-pluggable and future on-board coherent 400G+ optical modules,” said Karl Gass, OIF PLL Working Group, Optical Vice Chair. “It aims to standardize a photonic package for coherent applications that is easy to use while leaving the internal implementation to the vendor.”

The IC-TROSA Type-1 is optimized for silicon photonics technology and uses a surface-mount package with Ball Grid Array (BGA) electrical interface. Important advantages include an increased electrical bandwidth and solder reflow capability. The IC-TROSA Type-2 is optimized for Indium Phosphide technology and uses a gold-box package with flex-cable electrical interface. Important advantages include an integrated tunable laser and a duplex LC optical connector.

The IC-TROSA’s low power dissipation and miniature footprint enables small form factor digital coherent optics (DCO) transceivers in a QSFP-DD or OSFP form factor, as well as very high-density coherent line card or daughtercard designs. Devices can support multiple modulation formats, including QPSK, 8QAM, and 16QAM, at symbol rates up to 64Gbaud, enabling data transmission up to 600 Gb/s.

About OIF
OIF is where the optical networking industry’s interoperability work gets done. Building on 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
Email: leah@wilkinson.associates
Office: 703-907-0010

FierceTelecom – What is 400ZR?

Aimed predominantly at short-reach, single-span fiber optic links for Data Center Interconnect (DCI), 400ZR is an interoperable networking Implementation Agreement (IA) in progress by the OIF. It defines a footprint-optimized solution for transporting 400Gb Ethernet over DCI links targeting a minimum of 80 km. Enabled by advanced coherent optical technology design targeting small, pluggable form factor modules such as QSFP-DD and OSFP, 400ZR proposes a technology-driven solution for high capacity data transport, matched to 400GE switch port market introduction.

https://www.fiercetelecom.com/sponsored/what-400zr

(Sponsored by Ciena)

OIF Delivers on Enabling Next Generation Network Flexibility through Three New Interoperability Agreements

OIF efforts provide the growing networking industry with advanced network connectivity, provisioning and flexibility combined with improved data rates

Fremont, Calif.—October 23, 2018 – Continuing its efforts to drive network connectivity and flexibility worldwide, OIF announced three Interoperability Agreements (IAs) aimed at expanded interoperability of Flex Ethernet and increased data rates. The completed IAs—FlexE 2.0, FlexE Neighbor Discovery and Common ACO Electrical I/O—reinforce OIF’s work to provide the industry with solutions for flexible deployment and provisioning of network bandwidth.

“The completion of these projects reinforces OIF’s commitment to provide the industry with the flexibility and increased bandwidth solutions combined with increased data speeds it requires to keep up with market demands and drive solutions that enable the next generation of networks,” explained Dave Stauffer of Kandou Bus and OIF’s Physical and Link Layer (PLL) Working Group Chair.

FlexE 2.0

Initiated in 2016, the FlexE 2.0 project enables equipment to support new Ethernet connection types and FlexE allows network providers and operators to utilize optical transport network bandwidth in more flexible ways. FlexE can deterministically utilize the entire aggregated link, creating a more efficient alternative to the traditional IEEE 802.3ad or IEEE 802.1-based Link Aggregation (LAG) solutions which often can only utilize 70-80% of the available bandwidth. Key features of the FlexE 2.0 project include adding support for FlexE groups composed of 200GBASE-R and 400GBASE-R PHYs, in addition to groups composed of 100GBASE-R PHYs, and adding an option for the support of time and frequency synchronization at the FlexE group level.

FlexE Neighbor Discovery

The FlexE Neighbor Discovery project recognizes that FlexE capability discovery is still required to facilitate the setup of FlexE groups and clients. The project introduced some extensions to the Link Layer Discovery Protocol (LLDP) for FlexE capability discovery. It enables remote FlexE PHY and deskew capability discovery, PHY connectivity discovery and verifications, and FlexE Group subgroup integrity verification.

Common ACO Electrical I/O Project

The implementation agreement for Common Analog Coherent Optics (ACO) Electrical I/O follows the success of the CFP2-ACO optical transceiver implementation agreement but is form factor agnostic, so it also benefits analog coherent modules based on such form factors as CFP4, CFP8, QSFP, microQSFP, QSFP-DD and OSFP. The project defines the ACO electrical I/O independent of the choice of form factor and optical carrier count for 45 Gbaud and 64 Gbaud per-carrier applications.

“We recognize that the data center and communications industries require solutions for flexible deployment and provisioning of network bandwidth combined with component level interoperable infrastructure that can enable system capacity demands,” Stauffer continued.

OIF Day at CenturyLink

OIF Day at CenturyLink was held on October 16, 2018 in Littleton, CO. The interactive and educational workshop featured OIF and CenturyLink subject matter experts covering: OIF projects and directions including Networking Transport SDN work and an overview of Physical & Link Layer work.

 

About the OIF
The OIF facilitates the development and deployment of interoperable networking solutions and services. Members collaborate to drive Implementation Agreements (IAs) and interoperability demonstrations to accelerate and maximize market adoption of advanced internetworking technologies. OIF work applies to optical and electrical interconnects, optical component and network processing technologies, and to network control and operations including software defined networks and network function virtualization. The OIF actively supports and extends the work of national and international standards bodies. Launched in 1998, the OIF is the only industry group uniting representatives from across the spectrum of networking, including many of the world’s leading service providers, system vendors, component manufacturers, software and testing vendors. Information on the OIF can be found at http://www.oiforum.com