OIF Initiates New CEI-112G-XSR Project for D2D/D2OE Common Electrical Interface, Addresses Multiple Chip Integration

Forum continues efforts to support new and evolving architectures by defining a range of electrical interfaces which enable optimized system design for power, cost and packaging

Fremont, Calif.—June 12, 2018 – The OIF (Optical Internetworking Forum) today announced the launch of the CEI-112G-XSR project for Die-to-Die (D2D) and Die-to-Optical Engine (D2OE) Common Electrical Interface at the Q218 Technical and MA&E Committees meeting held April 24-26, 2018 in Nuremberg, Germany.…

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