Current OIF Work

Physical and Link Layer Working Group/Physical Layer User Group Working Group

  • Common Electrical Interface – 112G – Very Short Reach (CEI-112G-VSR)
  • Common Electrical Interface – 56G – Ultra Short Reach (CEI-56G-USR)
  • Common Electrical Interface – 56G – Extra Short Reach (CEI-56G-XSR)
  • Common Electrical Interface – 56G-Very Short Reach (CEI-56G-VSR)
  • Common Electrical Interface – 56G – Medium Reach (CEI-56G-MR)
  • Common Electrical Interface – 56G – Long Reach (CEI-56G-LR)
  • Common Electrical Interface -112G in MCM
  • Intermediate Reach DWDM Framework
  • Electro-Mechanical Footprint for Optical Engines in a Chip Scale Package
  • Flex Coherent DWDM Transmission Framework
  • FlexE Neighbor Discovery
  • FlexE 2.0
  • High Bandwidth Integrated Coherent Receiver
  • CFP8-ACO
  • CFP2-DCO
  • IC-TROSA
  • 400ZR Interoperabiliity
  • Common ACO Electrical I/O
  • Coherent Modem Management Interface
  • High Baud Rate Coherent Modulation Function

Networking & Operations Working Group/Carrier Working Group

  • Programmable Virtual Transport Network Service Specification
  • APIs for Transport SDN
  • Flex Coherent DWDM Transmission Framework
  • UNI 2.0 and ENNI 2.0 Amendments for beyond 100G OTN

NOTE:  For completed OIF technical work and approved Implementation Agreements and/or White Papers, please click here.


Physical and Link Layer Working Group/Physical Layer User Group Working Group

Common Electrical Interface – 112G-Very Short Reach
This project will develop IA specifications for chip-to-module (c2m) interface which can be used to support optical modules (e.g., 112G, 224G and 448G) with reduced power, complexity and enhanced density. For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair at david@kandou.com.

Common Electrical Interface – 56G-Ultra Short Reach
This project will develop and produce an implementation agreement for a low power, Ultra Short Reach (<= 1cm) electrical, chip-to-chip interface operating @ 39-56Gbps signalling for MCM use cases (within a single package) and will facilitate optical engine integration within ASIC packaging. For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair at david@kandou.com.

Common Electrical Interface – 56G-Extra Short Reach
This project will develop and produce an implementation agreement for a low power, Extra Short Reach (<= 50mm) electrical, chip-to-chip interface operating @ 39-56Gbps signalling for PCB use cases and will facilitate an efficient interface to a board mounted optical engine. For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair at david@kandou.com.

Common Electrical Interface – 56G-VSR (CEI-56G-VSR)
The proposed project will develop a single Implementation Agreement with one or more electrical specifications for operation across a single lane for data rates from 39 to 56 Gb/s. The project will determine the optimum modulation format(s) based on measurements, verification, and CMOS Switch ASIC I/O capability. For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair at david@kandou.com.

Common Electrical Interface – 28G-VSR (CEI-28G-VSR)
This clause details the requirements for the CEI-28G-VSR very short reach high speed chip-module electrical I/O of nominal baud rates of 19.60 Gsym/s to 28.05 Gsym/s. A compliant device must meet all of the requirements listed below. The electrical I/O is based on high speed, low voltage logic, and connections are point-to-point balanced differential pairs. The electrical IA is based on channel loss and jitter budgets. It defines the characteristics required to communicate between CEI-28G-VSR drivers and CEI-28G-VSR receivers using copper signal traces on a printed circuit board, a mated connector pair and copper signal traces inside an optical module. These characteristics are normative for the devices and informative for the channel. A ‘length’ is effectively defined in terms of its attenuation and phase response rather than its physical length. CEI-28G-VSR devices from different manufacturers shall be interoperable. For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair at david@kandou.com.

Common Electrical Interface – 112G in MCM

Electro-Mechanical Footprint for Optical Engines in a Chip Scale Package
This projext will document and detail guidelines to the OIF membership to facilitate optical engine integration on a single circuit package It will define a standardised package for the OE. For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair at david@kandou.com.

Flex Coherent DWDM Transmission Framework
This project will specify one technical approach to Flex Coherent DWDM Transmission in the application fields of long haul, metro, and data center inter-connection. The objective of this specification is to provide guidance to module and component suppliers on a technical direction of interest to a number of network equipment vendors. For more information on this project contact Karl Gass, Physical and Link Layer Working Group, Optical Vice Chair at iamthedonutking@mac.com or
Vishnu Shukla, Carrier Working Group Chair at vishnu.shukla@verizon.com.

High Bandwidth Integrated Photonics Projects
These projects will define a PMQ EO modulator that enables coherent electro-optic modulation of a wider optical spectrum per optical carrier than is possible with our existing OIF-PMQ-TX-01.1 IA and an Intradyne Coherent Receiver that enables coherent electro-optic demodulation of a wider optical spectrum per optical carrier than is possible with our current OIF-DPC-MRX-01.0 IA.  For more information, contact Karl Gass, Physical and Link Layer Working Group, Optical Vice Chair at iamthedonutking@mac.com.

CFP8-ACO
This project will support higher baud rate and higher wavelength/ carrier-count applications at higher density than the existing CFP2-ACO. The new project, dubbed CFP8-ACO, utilizes the existing CFP8 definition from the CFP-MSA group and provides up to 4 wavelengths/carriers per module. In addition to a 20w power profile, the new specification includes a 9.5mm module height, allowing for a double-stack line card or belly-to-belly. A 40mm module width will enable a 2 x 8 configuration for a 16 module line card. This allows for an increased number of modules as well as an increased number of wavelength/carriers.  For more information, contact Karl Gass, Physical and Link Layer Working Group, Optical Vice Chair at iamthedonutking@mac.com.

CFP2-DCO
This project aims to develop a new standard for the Digital-Coherent-Optical transceiver implemented in the CFP2 MSA package.  For more information, contact Karl Gass, Physical and Link Layer Working Group, Optical Vice Chair at iamthedonutking@mac.com.

Integrated Coherent Transmitter-receiver Optical Sub-Assembly (IC-TROSA)
This project will develop an IA for an integrated coherent transmitter-receiver optical sub-assembly (IC-TROSA) supporting high bandwidth and high order QAM operation for DCI, metro and LH applications and having two options: A) Laser Outside, & B) Laser Inside.  For more information, contact Karl Gass, Physical and Link Layer Working Group, Optical Vice Chair at iamthedonutking@mac.com.

400ZR Interoperability
This project will develop an implementation agreement for 400G ZR and short-reach DWDM multi-vendor interoperability.  It is relevant for router-to-router interconnect use cases and is targeted at (passive) single channel and amplified DWDM applications with distances up to 120 km. This project should ensure a cost-effective and long-term relevant implementation using single-carrier 400G, coherent detection and advanced DSP/FEC algorithms.  For more information, contact Karl Gass, Physical and Link Layer Working Group, Optical Vice Chair at iamthedonutking@mac.com.

Common ACO Electrical I/O
The project will define the ACO electrical I/O independent of the choice of form factor and optical carrier count for 45 Gbaud and 64 Gbaud per-carrier applications. This project would build upon the success of the CFP2-ACO but is form factor agnostic so that it could be applied to multiple applications such as  CFP4, CFP8, QSFP, micro QSFP and OFSP.  For more information, contact Karl Gass, Physical and Link Layer Working Group, Optical Vice Chair at iamthedonutking@mac.com.

Coherent Modem Management Interface
Members have requested that the industry combine the coherent modem management interface specifications [4″x5″ LH MSA, CFP2-ACO, CFP2-DCO, Flex-Coherent, etc.] into a standalone document.  OIF leadership, working in conjunction with the CFP MSA group, is inviting companies to participate in creating a complementary Normative document.  For more information, contact Karl Gass, Physical and Link Layer Working Group, Optical Vice Chair at iamthedonutking@mac.com.

High Baud Rate Coherent Modulation Function
This project will define a small form factor component implementation agreement that combines the high baud-rate PMQ (HB-PMQ) modulator plus the RF drive functions into a single component. This new component will be used in conjunction with a high baud Integrated Coherent Receiver (ICR), a micro Integrable Tunable Laser Assembly (ITLA) and a coherent DSP, to implement a high performance coherent modem.  For more information, contact Karl Gass, Physical and Link Layer Working Group, Optical Vice Chair at iamthedonutking@mac.com.


Networking and Operations Working Group/Carrier Working Group

Programmable Virtual Network Service Specification
Virtual Network Services (VNS) could become a main driver for deployment of SDN in Transport Networks. To be able to objectively compare products and services, attributes to describe and differentiate VNS Types should be defined. Expected outcome of this project: IA specifying attributes and characteristics of Programmable Virtual Transport Network Services,VNS invocation/management/teardown procedure specifications and extensions to existing API, if needed. For more information on this project contact Peter Landon, Networking & Operations Working Group Chair at plandon@btisystems.com.

APIs for Transport SDN
As the industry looks at Transport Software Defined Networking (SDN), there is a lack of definition for how User Applications interact with Network Applications and Resource Functions. The programmability of Transport SDN requires some of the internal interfaces used by ASON in the past to become open. The expected outcome for this project is a series of Application Program Interface (API) documents addressing: Service Request, Connection Request, Topology, Link Resource Manager, Path Computation, and other APIs identified by the SDN Framework document. For more information on this project contact Peter Landon, Networking & Operations Working Group Chair at plandon@btisystems.com or Jonathan Sadler, Networking Interoperability Working Group Chair (acting) at jonathan.sadler@coriant.com.

Flex Coherent DWDM Transmission Framework
This project will specify one technical approach to Flex Coherent DWDM Transmission in the application fields of long haul, metro, and data center inter-connection. The objective of this specification is to provide guidance to module and component suppliers on a technical direction of interest to a number of network equipment vendors. For more information on this project contact Vishnu Shukla, Carrier Working Group Chair at vishnu.shukla@verizon.com or Karl Gass, Physical and Link Layer Working Group, Optical Vice Chair at iamthedonutking@mac.com

UNI 2.0 and ENNI 2.0 Amendments for beyond 100G OTN