OIF CONCLUDES SUCCESSFUL SDN TRANSPORT API INTEROPERABILITY TESTING – RESULTS TO BE REVEALED TODAY AT NGON

Multi-vendor demo showcases new dynamic behavior uses cases and deployment scenarios

Nice, France—June 26, 2018 – Following a six week testing period, the OIF (Optical Internetworking Forum) today announced the conclusion of its 2018 Software-Defined Networking (SDN) Transport Application Programming Interface (T-API) multi-vendor interoperability demonstration. The much-anticipated demo results will be revealed during a public read-out event being held today from 10:00am-12:00pm at NGON & DCI Europe 2018 in Nice, France. ClicktoTweet

Additionally, Juan Pedro Fernández Palacios, Head of Unit, Telefónica will discuss Telefonica’s view of the demo results and use cases during his NGON keynote presentation tomorrow, June 27th.

“In bringing together service providers and optical networking vendors to demonstrate new SDN deployment scenarios including dynamic-behavior use cases, the OIF in collaboration with MEF has taken another important step towards providing the foundation for service providers to efficiently deliver dynamic multi-domain connectivity services to market,” stated Heidi Adams, Senior Research Director, IP & Optical Networks, IHS Markit. “With the 2018 demo event, the T-API 2.0 interface from the Open Networking Foundation (ONF) is on its way to becoming a standard northbound interface (NBI) to SDN transport network controllers.”

OIF, in collaboration with MEF, is leading the industry toward the validation and widespread commercialization of T-API 2.0 from the Open Networking Foundation (ONF) as a standard northbound interface (NBI) to transport network controllers.

The multi-vendor demo led by four network operator labs included lab deployed and cloud deployed systems testing new dynamic behavior use cases and deployment scenarios. The demo also incorporated service provisioning scenarios at the LSO Presto reference point in the MEF LSO architecture, using the MEF NRP Interface Profile Specification (MEF 60), which defines extensions to T-API in support of Carrier Ethernet services.

“The OIF SDN Interoperability demonstration has successfully brought together carriers, vendors and integrators with a common goal of moving to an open API (TAPI),” said Jack Pugaczewski, Distinguished Architect, CenturyLink. “T-API is a key enabler for providing automated service fulfillment and assurance. We have tested the Connectivity, Topology and Notification software patterns that T-API provides. Common APIs reduce design, development and deployment cycles for all involved, thus getting to market faster and realizing the financial benefits of automation.”

Participating network operators were CenturyLink, China Telecom, SK Telecom and Telefónica and vendors included ADVA, Coriant, Infinera, NEC/Netcracker, Nokia and SM Optics. Centre Tecnològic de Telecomunicacions de Catalunya (CTTC) was a participating academic institution and TELUS Communications participated as a consulting network operator.

Additionally, two private events detailing the test results will be held with participating network operators: CenturyLink on July 10 in Denver, Colorado and China Telecom on July 19 in Beijing. Members of the media and analyst community interested in attending, please contact leah@wilkinson.associates.

“The OIF’s goal for interop events is to improve the quality and clarity of specifications being tested,” explained Jonathan Sadler, OIF VP and Networking & Operations Interoperability Working Group Chair. “As the tests were performed, we noted possible points for misunderstanding and places where the specifications may be enhanced. These results will be liaised to ONF and MEF for review at future meetings.”

A technical white paper and an executive summary of the demo result will be available in August.

An infographic of the demo is

Additional information can be found at 2018 OIF SDN T-API INTEROP DEMO

2018 OIF SDN Transport API Interoperability Demonstration

Committed to accelerating the commercialization of transport SDN worldwide, the Optical Internetworking Forum (OIF), in collaboration with MEF, will bring new dynamic behavior use cases and deployment scenarios into network operator labs around the world to test multi-vendor interoperability of the industry leading T-API 2.0 northbound interface (NBI) from the Open Networking Foundation (ONF). The 2018 Software-Defined Networking (SDN) Transport Application Programming Interface (T-API) interoperability demonstration builds on the OIF’s 2016 interoperability test and demonstration which addressed multi-layer and multi-domain environments as well as on the 2014 demo which prototyped the use of Northbound APIs and helped advance transport SDN standardization. For an infographic of the demo, click here.

About the OIF

The OIF facilitates the development and deployment of interoperable networking solutions and services. Members collaborate to drive Implementation Agreements (IAs) and interoperability demonstrations to accelerate and maximize market adoption of advanced internetworking technologies. OIF work applies to optical and electrical interconnects, optical component and network processing technologies, and to network control and operations including software defined networks and network function virtualization. The OIF actively supports and extends the work of national and international standards bodies. Launched in 1998, the OIF is the only industry group uniting representatives from across the spectrum of networking, including many of the world’s leading service providers, system vendors, component manufacturers, software and testing vendors. Information on the OIF can be found at http://www.oiforum.com

 

PR Contact:

 

Leah Wilkinson

Wilkinson + Associates for the OIF

Email: leah@wilkinson.associates

Office: +1-703-907-0010

OIF Initiates New CEI-112G-XSR Project for D2D/D2OE Common Electrical Interface, Addresses Multiple Chip Integration

Forum continues efforts to support new and evolving architectures by defining a range of electrical interfaces which enable optimized system design for power, cost and packaging

Fremont, Calif.—June 12, 2018 – The OIF (Optical Internetworking Forum) today announced the launch of the CEI-112G-XSR project for Die-to-Die (D2D) and Die-to-Optical Engine (D2OE) Common Electrical Interface at the Q218 Technical and MA&E Committees meeting held April 24-26, 2018 in Nuremberg, Germany. The project aims at enabling intra-package interconnects to optical engines or between dies with high throughput density and low normalized power operating in the data rate range of 72-116 Gbps with a reach up to 50 mm.

In addition to the already existing CEI-112G-MCM OIF project, which is dedicated to wide, high bandwidth CMOS-to-CMOS interconnects, the new CEI-112G-XSR project proposes to support technology mix, in particular CMOS-to-SiGe (Silicon Germanium), which is frequently used to build optical engines. System-in-package (SIP) leads to a requirement of supporting up to 50 mm trace length between the multiple chips on a common (organic) package substrate.

“We jointly designed this project to address the problem of integrating multiple dies, including driver devices for optical engines on non-CMOS technologies, onto a common substrate within a large multi-chip-package design. Supporting this mix of technology allows combining the high logic density of CMOS devices with the high drive strength of analog components,” explained Klaus-Holger Otto of Nokia and OIF Technical Committee Chair.

The working group for the CEI-112G-XSR project has identified the following benefits for OIF members:

  • Allow lower normalized power, double shoreline throughput density and provide a multi-source 72-116 Gbps D2D and D2OE electrical I/O interface. This will enhance the integration, normalized power reduction, and cost reduction for integrated OE, multiple-die SIPs.
  • Enable 1 to N lanes of 72-116 Gbps electrical I/Os (e.g. on ASIC/FPGA/OE).

OIF Day at Nokia

Following the quarterly meeting, a sizeable group of OIF members participated in an OIF Day event at the Nokia Nuremberg facility on April 27, 2018. The OIF Day Program is a live educational workshop program to expand awareness of, and educate member company employees on the work of the OIF. The OIF Day event is conducted at network operator and/or vendor sites to reach and obtain inputs from a range of support functions, e.g. operations, network planning, network management, marketing, etc. It is custom-tailored to the needs of each hosting company and comprised of general sessions and tracks focused on Networking and/or Physical and Link Layer topics.

OIF Transport-API for Transport SDN Survey

OIF also recently conducted a survey of OIF members and non-members, including network operators and vendors, on the OIF’s proposed certification project for Transport-API (T-API) for Transport SDN. Nearly 30 responses to the survey were received – 20+ from network operators and 9 from vendors.  The OIF will consider the feedback in any proposal to expand the current program to include T-API certification.

About the OIF
The OIF facilitates the development and deployment of interoperable networking solutions and services. Members collaborate to drive Implementation Agreements (IAs) and interoperability demonstrations to accelerate and maximize market adoption of advanced internetworking technologies. OIF work applies to optical and electrical interconnects, optical component and network processing technologies, and to network control and operations including software defined networks and network function virtualization. The OIF actively supports and extends the work of national and international standards bodies. Launched in 1998, the OIF is the only industry group uniting representatives from across the spectrum of networking, including many of the world’s leading service providers, system vendors, component manufacturers, software and testing vendors. Information on the OIF can be found at http://www.oiforum.com

 

PR Contact:
Leah Wilkinson
Wilkinson + Associates for the OIF
Email: leah@wilkinson.associates
Office: 703-907-0010