OIF @ OFC/NFOEC 2013 “Enabling the Next Generation of 100G Optical Modules

OFC/NFOEC 2013 – March 19-21, 2013 – Anaheim, California

The Optical Internetworking Forum showcased a demonstration of multi-vendor operation of the 4 x 25G chip-to-module application as defined in the CEI-28G-VSR Implementation Agreement. The OIF’s Physical and Link Layer demonstrations featured for the first time interoperability including both CFP2 and QSFP28 optical modules. This was the OIF’s third interoperability demonstration of 100Gb/s channels and included the largest number of participating component suppliers. Also tested for CEI-28G-VSR interoperability were host ASICs and FPGAs with VSR SERDES, host PCB traces, optical module connectors, and module retimers.

The following companies participated:

Broadcom Corporation
Fujitsu Optical Components
Yamaichi Electronics
Test equipment was donated by Agilent Technologies, Inc. and Tektronix, Inc.

White Paper
Multi-Vendor Interoperability Testing of CFP2 and QSFP28 with CEI-28G-VSR Interface During OFC 2013 Exhibition

Watch a Webinar on the Demo!
OIF’s PLL Demo at OFC/NFOEC 2013 (.WMV file, 9:18 minutes)

Press Releases on OIF at OFC/NFOEC
March 11, 2013
OIF To Speak on SDN and Beyond 100G at OFC/NFOEC
Two Panel Sessions Address Hot Industry Topics

March 4, 2013
OIF To Demonstrate 4 x 25G Multi-Vendor Interoperability at OFC/NFOEC
Largest Number of Demo Participants Testing & Enabling Next-Gen Technology for 100G