September 29 – October 1, 2025
Bella Center
Copenhagen, Denmark

Live Interoperability Demos!

OIF at ECOC 2025: Bridging Gaps, Accelerating Innovation Through Industry-Wide Interoperability

Recognized as the leading organization enabling industry-wide interoperability, OIF returned to ECOC 2025 with a live, multi-vendor demonstration featuring 34 member companies. The demo spanned OIF’s core technical areas — optical, electrical, energy efficient and management interfaces — and showcased interoperability across technologies including 400ZR, 800ZR, Multi-span Optics, CEI-448G, CEI-224G, Co-Packaging, Energy Efficient Interfaces (EEI), CMIS and more.

CMIS was shown operating within a live simulated network, rather than in a standalone configuration, highlighting its role in enabling plug-and-play integration across disaggregated systems.

Driven by collaboration among component suppliers, system vendors, hyperscalers and network operators, OIF’s work helps close implementation gaps and deliver the building blocks of open, scalable infrastructure.

Interoperability Demo Presentations at ECOC 2025

Market Focus Speaking Sessions

“Coherent Technology Advances in the Market, DCI Interop and Shorter Reaches for AI” (PDF)
Presenter: Karl Gass, OIF Physical & Link Layer Working Group Optical Vice Chair

“CMIS –The Interface that Ties Everything Together for AI” (PDF)
Presenter: Ian Alderdice, OIF Physical & Link Layer Working Group Management Co-Vice Chair, Ciena; Gary Nicholl, OIF Physical & Link Layer Working Group Management Co-Vice Chair, Cisco

“Energy Efficiency in AI Applications – Making Sense of the Multiple Requirements” (PDF)
Presenter: Jeff Hutchins, Physical & Link Layer Working Group Energy Efficient Interfaces Vice Chair, Ranovus

“448G Architectures For AI – Addressing the Challenges, Enabling the Future” (PDF)
Presenter: Mike Klempa, OIF Physical & Link Layer Interoperability Working Group Chair and Board Member, Alphawave Semi

Demo White Paper

Participating Members

1Finity, Adtran, Alphawave Semi, Amphenol, Anritsu Corporation, AOI, Cadence Design Systems, Inc., CICT/Accelink, Ciena, Cisco, Coherent Corp., Eoptolink Technology, EXFO, Furukawa FITEL, HGGenuine, Juniper Networks (now part of HPE), Keysight Technologies, Lessengers, Ligent, Inc., Lumentum, Marvell, Molex LLC, MultiLane, Nokia, Nubis Communications, O-Net, Samtec, SENKO Advanced Components, Sumitomo Electric Industries, Synopsys, Inc., TE Connectivity, Terahop PTE Ltd., US Conec and Wilder Technologies

Demo Participant Material

1Finity
Adtran
Alphawave Semi
Amphenol
Anritsu Corporation
CICT/Accelink
Ciena
Cisco
Eoptolink Technology
EXFO
Furukawa FITEL
Juniper Networks (now part of HPE)
Keysight Technologies
Ligent
Lumentum
Multilane
Nokia
O-Net
Samtec
SENKO Advanced Components
Synopsys, Inc.
TE Connectivity
Terahop PTE Ltd.
US Conec
Wilder Technologies

Press Release

OIF Links Industry Vision with Interoperability Validation Enabling AI Growth at ECOC 2025: 35 Member Companies to Participate in a Multi-Vendor Demonstration
OIF highlights how interoperability enables scalable, AI-era networks through Market Focus sessions and live demos (September 17, 2025)

OIF at ECOC 2025: Eliminating Barriers and Accelerating Innovation Through Industry-Wide Interoperability
35 member companies join forces to demonstrate real-world interoperability across optical and electrical domains (August 13, 2025)