March 17-19, 2026
Los Angeles Convention Center
Los Angeles, CA, USA
Booth #2017

OIF’s live multi-vendor interoperability demo featuring 40 member companies at OFC 2026 will highlight real-world interoperability across key technologies including 800ZR, 400ZR, Multi-span Optics, Common Electrical I/O (CEI) CEI-448G, CEI-224G, Common Management Interface Specification (CMIS), Co-Packaging, Energy Efficient Interfaces (EEI) and more.

Visit OIF at booth #2017 to experience these groundbreaking solutions live!

Interoperability Demo Presentations at OFC 2026

Participating Members

3M, Accelight, Adtek, Adtran, Alphawave Semi, Amphenol, Anritsu Corporation, AOI, Cadence Design Systems, Inc., CICT/Accelink, Ciena, Cisco, Coherent Corp., Eoptolink Technology, EXFO, Furukawa Electric, HGGenuine, HPE, Keysight Technologies, Lessengers, Ligent, Inc., Luxshare, Marvell, MaxLinear Inc., Molex, MultiLane, Nokia, O-Net, Samtec, Semtech, SENKO Advanced Components, Silith, Sumitomo Electric Industries, Synopsys, Inc., TE Connectivity, Terahop PTE Ltd., US Conec, VeEX Inc., Wilder Technologies, Xscape Photonics.

Demo Participant Material

3M
Accelight
Adtek
Adtran
Amphenol
Anritsu
CICT/Accelink
Ciena
Cisco
Eoptolink
EXFO
Furukawa Electric/Lightera
HGGenuine
HPE
Keysight Technologies
Ligent
MultiLane
Nokia
O-Net
Samtec
SENKO Advanced Components
Silith
Sumitomo Electric Industries
TE Connectivity
Terahop PTE Ltd.
VeEX Inc.
Wilder Technologies
Xscape Photonics

Educational White Paper

OFC 2026 800ZR Plugfest White Paper – OFC 2026 (March 2026)
800ZR Tx Waveforms 2026 (zipfile) (March 2026)

Showfloor Theater Panels

OIF Panel: “OIF CEI-448Gbps – Fast and Furious Signaling Spec Development” (PDF)
March 17, 2026
Moderator: Nathan Tracy, OIF President, TE Connectivity
Panelists: John Calvin, Keysight Technologies; Mike Klempa, OIF Secretary/Treasurer and Physical & Link Layer Interoperability Working Group Chair, Qualcomm Incorporated; Cathy Liu, OIF Board Member, Broadcom, Inc.; Yi Tang, OIF Board Member and Physical & Link Layer Working Group Electrical Vice Chair

OIF Panel: “OIF 800ZR/LR and 1600ZR/ZR+/CL – Changing the Game…Again”
March 18, 2026
Moderator: Karl Gass, OIF Physical & Link Layer Working Group Optical Vice Chair
Panelists:
Yishu Zhou, Microsoft Azure – “Scaling Coherent Optics in the Cloud” (PDF)
Georg Clarici, Coherent – “Coherent Interfaces for the AI Age” (PDF)
Josef Berger, Marvell – “Coherent Optics: Leading AI Scale-Across Expansion” (PDF)
Joerg Pfeifle, Keysight Technologies – “Development of extended transmitter constellation closure (ETCC) as a new coherent Tx quality metric” (PDF)

OIF Panel: “OIF – Driving Optical Interconnect Specs for AI” (PDF)
March 19, 2026
Moderator: Jeff Hutchins, OIF Physical & Link Layer Working Group Energy Efficient Interfaces Vice Chair, Ranovus
Panelists: Jeff Hutchins; Mike Klempa, OIF Board Member and Physical & Link Layer Interoperability Working Group Chair, Qualcomm Incorporated; Cathy Liu, OIF Board Member, Broadcom, Inc.; Nathan Tracy, OIF President, TE Connectivity

Press Release

OIF Validates Critical Interoperability Live at OFC 2026 Through Multi-Vendor Demonstrations and Expert Panels
OIF member experts present panels on CEI-448Gbps signaling, next-generation ZR optics and optical interconnect specs for AI, alongside the interoperability showcase at booth #2017 (February 18, 2026)

OIF Demonstrates Industry-Wide Interoperability at Scale at OFC 2026, Advancing Energy Efficiency, Performance and Capacity for AI-Era Data Center Networks
Live multi-vendor interoperability demo features 40 member companies and highlights 800ZR, 400ZR, Multi-span Optics, CEI-448G, CEI-224G, Co-Packaging, CMIS, EEI and more (January 28, 2026)