March 17-19, 2026 
Los Angeles Convention Center
Los Angeles, CA, USA
Booth #2017
OIF’s live multi-vendor interoperability demo featuring 40 member companies at OFC 2026 will highlight real-world interoperability across key technologies including 800ZR, 400ZR, Multi-span Optics, Common Electrical I/O (CEI) CEI-448G, CEI-224G, Common Management Interface Specification (CMIS), Co-Packaging, Energy Efficient Interfaces (EEI) and more.
Visit OIF at booth #2017 to experience these groundbreaking solutions live!
Participating Members
3M, Accelight, Adtek, Adtran, Alphawave Semi, Amphenol, Anritsu Corporation, AOI, Cadence Design Systems, Inc., CICT/Accelink, Ciena, Cisco, Coherent Corp., Eoptolink Technology, EXFO, Furukawa Electric, HGGenuine, HPE, Keysight Technologies, Lessengers, Ligent, Inc., Luxshare, Marvell, MaxLinear Inc., Molex, MultiLane, Nokia, O-Net, Samtec, Semtech, SENKO Advanced Components, Silith, Sumitomo Electric Industries, Synopsys, Inc., TE Connectivity, Terahop PTE Ltd., US Conec, VeEX Inc., Wilder Technologies, Xscape Photonics.
Showfloor Theater Panels
OIF Panel: “OIF CEI-448Gbps – Fast and Furious Signaling Spec Development”
March 17, 2026 – 4:00pm-5:00pm – Theater III
Moderator: Nathan Tracy, OIF President, TE Connectivity
Panelists: John Calvin, Keysight Technologies; Mike Klempa, OIF Secretary/Treasurer and Physical & Link Layer Interoperability Working Group Chair, Qualcomm Incorporated; Cathy Liu, OIF Board Member, Broadcom, Inc.; Yi Tang, OIF Board Member and Physical & Link Layer Working Group Electrical Vice Chair
OIF Panel: “OIF 800ZR/LR and 1600ZR/ZR+/CL – Changing the Game…Again”
March 18, 2026, 11:45am-12:45pm – Theater II
Moderator: Karl Gass, OIF Physical & Link Layer Working Group Optical Vice Chair
OIF Panel: “OIF – Driving Optical Interconnect Specs for AI”
March 19, 2026 – 1:30pm-2:30pm – Theater II
Moderator: Jeff Hutchins, OIF Physical & Link Layer Working Group Energy Efficient Interfaces Vice Chair, Ranovus
Panelists: Jeff Hutchins; Mike Klempa, OIF Board Member and Physical & Link Layer Interoperability Working Group Chair, Qualcomm Incorporated; Cathy Liu, OIF Board Member, Broadcom, Inc.; Nathan Tracy, OIF President, TE Connectivity
Press Release
OIF Demonstrates Industry-Wide Interoperability at Scale at OFC 2026, Advancing Energy Efficiency, Performance and Capacity for AI-Era Data Center Networks
Live multi-vendor interoperability demo features 40 member companies and highlights 800ZR, 400ZR, Multi-span Optics, CEI-448G, CEI-224G, Co-Packaging, CMIS, EEI and more (January 28, 2026)
