Current OIF Work

Physical and Link Layer Working Group/Physical Layer User Group Working Group

  • Common Electrical Interface – 112G – XSR (CEI-112G-XSR)
  • Common Electrical Interface – 112G – Long Reach (CEI-112G-LR)
  • Common Electrical Interface – 112G – Medium Reach (CEI-112G-MR)
  • Common Electrical Interface – 112G – Very Short Reach (CEI-112G-VSR)
  • Common Electrical Interface -112G in MCM
  • Common Electrical Interface – 56G – Extra Short Reach (CEI-56G-XSR)
  • Common Electrical Interface – 56G-Very Short Reach (CEI-56G-VSR)
  • Electro-Mechanical Footprint for Optical Engines in a Chip Scale Package
  • IC-TROSA
  • 400ZR Interoperabiliity
  • Common ACO Electrical I/O
  • Coherent Modem Management Interface
  • High Baud Rate Coherent Modulation Function
  • FlexE 2.1

Networking & Operations Working Group/ Network Operator Working Group

  • APIs for Transport SDN
  • Flex Coherent DWDM Transmission Framework
  • UNI 2.0 and ENNI 2.0 Amendments for beyond 100G OTN
  • Requirements for Integrated Packet Optical SDN

NOTE:  For completed OIF technical work and approved Implementation Agreements and/or White Papers, please click here.


Physical and Link Layer Working Group/Physical Layer User Group Working Group

Common Electrical Interface – 112G-XSR
This project will develop IA specifications for die-to-die (D2D) and die-to-OE (D2OE) electrical I/O interfaces which can be used to support Nx112G I/O links with significantly reduced power, complexity, and enhanced throughput density. For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair at david@kandou.com.

Common Electrical Interface – 112G-Very Short Reach
This project will develop IA specifications for chip-to-module (c2m) interface which can be used to support optical modules (e.g., 112G, 224G and 448G) with reduced power, complexity and enhanced density. For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair at david@kandou.com.

Common Electrical Interface – 112G in MCM
This project will develop and produce an implementation agreement for a low power, ultra short reach (<= 10mm) electrical die-to-die interface @ 75-116 Gbps per pair of wires across a Multi-Chip Module (MCM) substrate, targeting wide-bus high bandwidth applications. For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair at david@kandou.com.

Common Electrical Interface – 112G-LR
This project will develop and produce an implementation agreement for a Long Reach electrical backplane interface operating @ 75-116Gbps signaling over up to 1000 mm of twinax cable with two connectors, or over a shorter length of PCB backplane trace. For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair at david@kandou.com.

Common Electrical Interface – 112G-MR
This project will develop and produce an implementation agreement for a Mediium Reach electrical interface operating @ 75-116Gbps signaling over up to 500 mm of PCB with one connectors. For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair at david@kandou.com.

Common Electrical Interface – 56G-Extra Short Reach
This project will develop and produce an implementation agreement for a low power, Extra Short Reach (<= 50mm) electrical, chip-to-chip interface operating @ 39-56Gbps signalling for PCB use cases and will facilitate an efficient interface to a board mounted optical engine. For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair at david@kandou.com.

Common Electrical Interface – 56G-VSR (CEI-56G-VSR)
The proposed project will develop a single Implementation Agreement with one or more electrical specifications for operation across a single lane for data rates from 39 to 56 Gb/s. The project will determine the optimum modulation format(s) based on measurements, verification, and CMOS Switch ASIC I/O capability. For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair at david@kandou.com.

Electro-Mechanical Footprint for Optical Engines in a Chip Scale Package
This projext will document and detail guidelines to the OIF membership to facilitate optical engine integration on a single circuit package It will define a standardised package for the OE. For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair at david@kandou.com.

Flex Coherent DWDM Transmission Framework
This project will specify one technical approach to Flex Coherent DWDM Transmission in the application fields of long haul, metro, and data center inter-connection. The objective of this specification is to provide guidance to module and component suppliers on a technical direction of interest to a number of network equipment vendors. For more information on this project contact Karl Gass, Physical and Link Layer Working Group, Optical Vice Chair at iamthedonutking@mac.com or
Junjie Li, Network Operator Working Group Chair at lijj.bri@chinatelecom.cn

Integrated Coherent Transmitter-receiver Optical Sub-Assembly (IC-TROSA)
This project will develop an IA for an integrated coherent transmitter-receiver optical sub-assembly (IC-TROSA) supporting high bandwidth and high order QAM operation for DCI, metro and LH applications and having two options: A) Laser Outside, & B) Laser Inside.  For more information, contact Karl Gass, Physical and Link Layer Working Group, Optical Vice Chair at iamthedonutking@mac.com.

400ZR Interoperability
This project will develop an implementation agreement for 400G ZR and short-reach DWDM multi-vendor interoperability.  It is relevant for router-to-router interconnect use cases and is targeted at (passive) single channel and amplified DWDM applications with distances up to 120 km. This project should ensure a cost-effective and long-term relevant implementation using single-carrier 400G, coherent detection and advanced DSP/FEC algorithms.  For more information, contact Karl Gass, Physical and Link Layer Working Group, Optical Vice Chair at iamthedonutking@mac.com.

Common ACO Electrical I/O
The project will define the ACO electrical I/O independent of the choice of form factor and optical carrier count for 45 Gbaud and 64 Gbaud per-carrier applications. This project would build upon the success of the CFP2-ACO but is form factor agnostic so that it could be applied to multiple applications such as  CFP4, CFP8, QSFP, micro QSFP and OFSP.  For more information, contact Karl Gass, Physical and Link Layer Working Group, Optical Vice Chair at iamthedonutking@mac.com.

Coherent Modem Management Interface
Members have requested that the industry combine the coherent modem management interface specifications [4″x5″ LH MSA, CFP2-ACO, CFP2-DCO, Flex-Coherent, etc.] into a standalone document.  OIF leadership, working in conjunction with the CFP MSA group, is inviting companies to participate in creating a complementary Normative document.  For more information, contact Karl Gass, Physical and Link Layer Working Group, Optical Vice Chair at iamthedonutking@mac.com.

High Baud Rate Coherent Modulation Function
This project will define a small form factor component implementation agreement that combines the high baud-rate PMQ (HB-PMQ) modulator plus the RF drive functions into a single component. This new component will be used in conjunction with a high baud Integrated Coherent Receiver (ICR), a micro Integrable Tunable Laser Assembly (ITLA) and a coherent DSP, to implement a high performance coherent modem.  For more information, contact Karl Gass, Physical and Link Layer Working Group, Optical Vice Chair at iamthedonutking@mac.com.

FlexE 2.1
This project will extend the FlexE 2.0 IA to add support for forming FlexE Groups from 50GBASE-R PHYs in addition to the existing support for 100GBASE-R, 200GBASE-R, and 400GBASE-R PHYs. This support is important use cases that include the 5G backhaul network. For more information contact David Ofelt Physical and Link Layer Working Group, Protocol Vice Chair at ofelt@juniper.net.


Networking and Operations Working Group/Network Operator Working Group

APIs for Transport SDN
As the industry looks at Transport Software Defined Networking (SDN), there is a lack of definition for how User Applications interact with Network Applications and Resource Functions. The programmability of Transport SDN requires some of the internal interfaces used by ASON in the past to become open. The expected outcome for this project is a series of Application Program Interface (API) documents addressing: Service Request, Connection Request, Topology, Link Resource Manager, Path Computation, and other APIs identified by the SDN Framework document. For more information on this project contact Jonathan Sadler, Networking Interoperability Working Group Chair (acting) at jsadler@infinera.com.

Flex Coherent DWDM Transmission Framework
This project will specify one technical approach to Flex Coherent DWDM Transmission in the application fields of long haul, metro, and data center inter-connection. The objective of this specification is to provide guidance to module and component suppliers on a technical direction of interest to a number of network equipment vendors. For more information on this project contact Vishnu Shukla, Carrier Working Group Chair at vishnu.shukla@verizon.com or Karl Gass, Physical and Link Layer Working Group, Optical Vice Chair at iamthedonutking@mac.com

UNI 2.0 and ENNI 2.0 Amendments for beyond 100G OTN

This project will generate amendments to the UNI 2.0 and E-NNI 2.0 specifications including the routing and signaling extensions for Beyond-100G G.709 and will not allocate code points or define message formats
Work on codepoint and message formats will be developed collaboratively with the IETF.
For more information on this project contact Jonathan Sadler, Networking Interoperability Working Group Chair (acting) at jsadler@infinera.com.

Requirements for Integrated Packet Optical SDN

This project will specify requirements, reference architecture and application scenarios of Multi-layer SDN for packet and optical integration. The objective of this specification is to normalize the architecture, interfaces and behaviors, so that an interoperable framework can be deployed across service provider community for DCI and other WAN applications. This project will also put together applicable and available standard pieces and organize them from a solution view. This may help the industry to get a clearer picture how those standards relate to each other and fit in a particular application or solve a particular problem.
For more information on this project contact Jonathan Sadler, Networking Interoperability Working Group Chair (acting) at jsadler@infinera.com.