OIF Webinar hosted by Lightwave
This event was broadcast on December 6, 2022.
This free webinar, open to the public, features presentations from industry-leading vendors, network operators, and academia.
Experts from Astera Labs; Cisco Systems; Huawei Technologies; Marvell; Meta Platforms, Inc.; NVIDIA; Ranovus; TE Connectivity, and the University of California, Santa Barbara, will provide an overview of the current state of co-packaging standardizations efforts and discuss the potential applications and challenges ahead.
- Welcome & Introduction – Stephen Hardy, Editorial Director and Associate Publisher, Lightwave
- Co-Packaging Overview – Jeff Hutchins, OIF Board Member and Physical & Link Layer Working Group – Co-Packaging Vice Chair, Ranovus
- Co-Packaging State of the Industry on Co-Packaging – John Bowers, Fred Kavli Distinguished Professor, Electrical & Computer Engineering and Distinguished Professor, Materials, University of California, Santa Barbara
Where we are?
- OIF Overview and Co-Packaging Overview – Nathan Tracy, OIF Market Awareness & Education Committee Co-Chair, Physical and Link Layer, TE Connectivity,
- OIF 3.2T Co-Packaged Optical (CPO) Module – Richard Ward, OIF Physical & Link Layer Working Group – Co-Packaging Track’s 3.2Tb/s CPO module project editor, Astera Labs
- OIF External Laser Small Form Factor Pluggable (ELSFP) – Jock Bovington, OIF Physical & Link Layer Working Group – Co-Packaging Track’s ELSFP project editor, Cisco Systems
- OIF Common Management Interface Specification (CMIS) – Todd Rope, Marvell
- OIF Common Electrical I/O (CEI) – Matt Brown, Huawei Technologies Canada
What’s next: End-User Perspectives
- Drew Alduino, Meta Platforms, Inc.
- Craig Thompson, NVIDIA
Drew Alduino, Optical Engineer at Meta Platforms, Inc.
Drew Alduino is an optical engineer at Meta Platforms where his work is focused on integrated optics for Artificial Intelligence & Machine Learning applications. Previously at Intel, he was an early member of the team which developed SiPh and the integrated Silicon hybrid-laser and helped lead the team which demonstrated the first CWDM SiPh integrated optical link in 2010. His interests remain focused on the development and integration of low power, high-bandwidth optics with XPUs to enable future AI/ML and compute systems. He received his PhD in Electrical Engineering from the University of New Mexico in 1999 with a focus on opto-electronics. He has co-authored over a dozen papers and has been awarded 11 patents.
Jock Bovington, OIF Editor of the ELSFP Implementation Agreement; Technical Leader at Cisco
Jock Bovington is the editor of the OIF Physical & Link Layer Working Group – Co-Packaging Track’s External Laser Small Form Factor Pluggable (ELSFP) project. Jock is currently in Cisco’s Client Optics Group working on laser diodes and silicon photonics. He received Bachelor’s degrees in Physics, and Electrical Engineering from Seattle University, M.S. and Ph.D. degrees in Electrical Engineering from the University of California Santa Barbara (UCSB), as an NSF Graduate Research Fellow. During his doctoral studies, he researched heterogeneous III-V laser integration with Si and Si3N4. As a member of Intel’s, Photonic Technology Lab, he demonstrated the first CWDM link using this technology in 2009. Later he joined Oracle and demonstrated efficient hybrid III-V/Si external cavity lasers and flexible comb sources using Si micro-ring mirrors. With this technology he co-founded Axalume co-inventing its core intellectual property, including 15 issued patents. He has authored or coauthored more than 50 technical journal articles, conference publications, and patents in the area of III-V/Si photonic integration. Recently at Cisco Jock’s focus has expanded to enabling Co-Packaged Optics (CPO).
John Bowers, Professor, Electrical and Computer Engineering at University of California, Santa Barbara
John Bowers holds the Fred Kavli Chair in Nanotechnology, and is the Director of the Institute for Energy Efficiency and a Distinguished Professor in the Departments of Electrical and Computer Engineering and Materials at UCSB. Dr. Bowers received his M.S. and Ph.D. degrees from Stanford University and worked for AT&T Bell Laboratories and Honeywell before joining UC Santa Barbara. He is a cofounder of Nexus Photonics, Quintessent, Aurrion, Aerius Photonics, Terabit Technology and Calient Networks. Dr. Bowers is a member of the National Academy of Engineering, the National Academy of Inventors, and is a fellow of the IEEE, OSA and the American Physical Society. He is a recipient of the IEEE Photonics Award, OSA/IEEE Tyndall Award, the OSA Holonyak Award, the IEEE LEOS William Streifer Award and the South Coast Business and Technology Pioneer and Entrepreneur of the Year Awards. He and coworkers received the EE Times Annual Creativity in Electronics (ACE) Award for Most Promising Technology for the hybrid silicon laser in 2007.
Matt Brown, Senior Principal System Engineer at Huawei Technologies Canada
Matt Brown is a member of the system engineering group in the Huawei High-Speed Interface IP development group located in Ottawa, Canada. His career spans 35 years of hardware design and system engineering in communication systems and high-speed integrated circuits. He graduated from the University of Alberta with a degree in Electrical Engineering communications stream with a specialty in microwave electronics. He has been an active participant in standards development for IEEE, OIF, and other standards groups for 17 years. He has led multiple IEEE 802.3 Ethernet projects for 25 Gb/s to 1.6 Tb/s Ethernet as Chief Editor and he is currently Chief editor for the IEEE 802.3df and 802.3dj (800 Gb/s and 1.6 Tb/s Ethernet) projects and the OIF 112 Gb/s XSR+ project.
Jeff Hutchins, OIF Physical & Link Layer Working Group – Co-Packaging Vice Chair and Board Member; CTO at Ranovus
Jeff Hutchins is a director in the CTO Office at RANOVUS, a company focused on next-generation optical interconnect solutions utilizing silicon photonics. He is currently a board member at OIF and OIF Physical & Link Layer Working Group Co-Packaging Vice Chair. He was the author and editor of multiple standards documents including: several of the OIF’s Telecom Tunable Laser Agreements (ITLA), COBO’s on-board-optics specification, and was a key driving force behind the OIF’s effort on 100G Long Haul Coherent projects. He previously held a variety of positions at Cisco, CoreOptics, Intel, iolon, HP, and Agilent, and holds BSEE and MSEE degrees from Stanford University.
Todd Rope, Associate Vice President, Firmware, Optics at Marvell
Todd Rope is Associate Vice President, Firmware, Optics at Marvell. In this role, he leads the optical module firmware team responsible for delivering the industry’s first 400ZR QSFP-DD pluggable coherent transceiver. Todd joined Marvell from Inphi where he was Associate Vice President, Firmware, responsible for delivering the world’s first Silicon Photonics PAM4 platform solution. Prior to Inphi, he was the Chief Architect of Embedded and Business Software at Source Photonics. Todd is a key contributor to optical industry standards bodies and has over 25 years of experience developing software for Ethernet switches and optical modules. He holds 16 patents and is an expert in embedded system software architecture, as well as electro-optical calibration and control systems. Todd holds a B.S. in Physics from the California Institute of Technology.
Craig Thompson, Vice President, Business Development, PHY and Interconnect Technologies at NVIDIA
Craig represents PHY and Interconnect products and technologies across NVIDIA’s end-to-end accelerated computing solutions. Craig has more than 20 years’ experience in optical communications and networking products working at Intel, Gennum, EMC and Finisar prior to NVIDIA. He holds a Bachelor of Engineering from the University of New South Wales in Sydney Australia, and a MBA from MIT.
Nathan Tracy, OIF Market Awareness & Education Committee Co-Chair, Physical & Link Layer; Technologist, System Architecture Team and Manager of Industry Standards at TE Connectivity
Nathan Tracy currently serves as OIF’s Market Awareness & Education (MA&E) Committee co-chair, Physical & Link Layer (PLL). During the past twelve years he has also served OIF as president, vice president of marketing, technical committee chair and technical committee vice chair.
As a technologist on the system architecture team and manager of industry standards for the Data and Devices business unit at TE Connectivity (TE), Nathan is responsible for driving standards activities and working with key customers to enable new system architectures. Nathan has more than 30 years of experience in technology development, marketing and business development for TE in areas including RF/microwave, and high-speed signaling technology for the networking, telecom, wireless, automotive and defense markets.
Nathan is also an active member of other industry standards and associations. Currently he is a regular attendee and contributor to IEEE 802.3, Ethernet Alliance and COBO. Additionally, he is active in a number of industry MSAs and forums where he has held leadership roles.
Nathan earned his Bachelor of Science Electrical Engineering Technology degree from the University of Massachusetts, Dartmouth.
Richard Ward, OIF Editor of the 3.2Tb/s Co-Packaged Optical Transceiver Implementation Agreement; VP/GM Data Connectivity at Astera Labs
Richard Ward is VP and GM of the Data Connectivity Group at Astera Labs. With over 30 years IC and system experience Richard has held design, systems, applications, management, marketing, and strategic development roles at Intel Silicon Photonics, Inphi and Texas Instruments. He is the editor for the 3.2Tb/s Co-Packaged Optical Transceiver project at the Optical Internetworking Forum (OIF) and edited previous electro-optical components projects and holds a handful of patents on high speed SerDes and high performance circuit techniques. Outside of work Richard is an endurance runner and enjoys 100k and 100 mile single stage trail/mountain runs, multi-day stage races, and extreme Triathlons around the world.