UPCOMING EVENTS
OFC 2026
March 17-19, 2026 – Los Angeles, CA
OIF Panel: “OIF – Driving Optical Interconnect Specs for AI”
March 19, 2026 – 1:30pm-2:30pm – Theater II
Moderator: Jeff Hutchins, OIF Physical and Link Layer Working Group Energy Efficient Interfaces Vice Chair, Ranovus
Panelists: Jeff Hutchins; Mike Klempa, OIF Secretary/Treasurer and Physical and Link Layer Interoperability WG Chair, Qualcomm Incorporated; Cathy Liu, OIF Board Member, Broadcom, Inc.; Nathan Tracy, OIF President, TE Connectivity
RECENT EVENTS
OFC 2026
March 17-19, 2026 – Los Angeles, CA
OIF Panel: OIF CEI-448Gbps – Fast and Furious Signaling Spec Development
March 17, 2026
Moderator: Nathan Tracy, OIF President, TE Connectivity
Panelists: John Calvin, Keysight Technologies; Mike Klempa, OIF Secretary/Treasurer and Physical and Link Layer Interoperability WG Chair, Qualcomm Incorporated; Cathy Liu, OIF Board Member, Broadcom, Inc.; Yi Tang, OIF Board Member and Physical and Link Layer Working Group Electrical Vice Chair
OIF Panel: OIF 800ZR/LR and 1600ZR/ZR+/CL – Changing the Game…Again”
March 18, 2026
Moderator: Karl Gass, OIF Physical & Link Layer Working Group Optical Vice Chair
Panelists:
Yishu Zhou, Microsoft Azure – “Scaling Coherent Optics in the Cloud”
Georg Clarici, Coherent – “Coherent Interfaces for the AI Age”
Josef Berger, Marvell – “Coherent Optics: Leading AI Scale-Across Expansion”
Joerg Pfeifle, Keysight Technologies – “Development of extended transmitter constellation closure (ETCC) as a new coherent Tx quality metric”
DesignCon 2026
February 24-26, 2026 – Santa Clara, CA
Panel: “OIF 448 Gbps Electrical Signaling for AI Progress and 224 Gbps Update for CEI Ongoing Developments”
Moderator: Cathy Liu, OIF Board Member, Broadcom, Inc.
Panelists: John Calvin, Keysight Technologies; Mike Li, Advanced Micro Devices; Dave Stauffer, Physical and Link Layer Working Group Chair, Amphenol; Yi Tang, OIF Board Member and Physical and Link Layer Working Group Electrical Vice Chair, Cisco
Panel: “Energy Efficiency in AI Applications – Making Sense of the Multiple Requirements”
Moderator: Jeff Hutchins, OIF Physical and Link Layer Working Group Energy Efficient Interfaces Vice Chair, Ranovus
Panelists: Jeff Hutchins; Cathy Liu, OIF Board Member, Broadcom, Inc.; Mike Klempa, OIF Secretary/Treasurer and Physical and Link Layer Interoperability Working Group Chair, Qualcomm Incorporated; Dave Stauffer, Physical and Link Layer Working Group Chair, Amphenol
EE World Online Podcast
December 10, 2025
Editorial Webinar – “Interoperability Drives Optical and Electrical Communications”
Speakers: Nathan Tracy, OIF President, TE Connectivity and Tom Issenhuth, OIF Market Awareness & Education Committee Co-Chair, Huawei
TEF 2025: Ethernet for AI
December 2-3, 2025 – Mountain View, CA
(Presented by Ethernet Alliance)
Panel: “The Path To 448G in Support of Next Generation AI”
Moderator: Nathan Tracy, OIF President, TE Connectivity
Panelists: Cathy Liu, OIF VP, Broadcom Inc.; Mike Li, OIF Board Member, Altera; Jeff Hutchins, PLL WG EEI Vice Chair, Ranovus; John Calvin, Keysight Technologies
OCP Global Summit 2025
October 13-16, 2025 – San Jose, California
Panel: “Progress in Optical Interconnects for AI Clusters”
Panelist: Nathan Tracy, OIF President, TE Connectivity
NetworkX
October 14-16, 2025 – Paris, France
Panel: “Beyond disaggregation – are cloud-native architectures the next step?”
Panelist: Karl Gass, OIF Physical & Link Layer Working Group Optical Vice Chair
Industry Keynote – “Coherent Optical Innovations”
Speaker: Karl Gass, OIF Physical & Link Layer Working Group Optical Vice Chair
ECOC 2025
September 29-October 1, 2025 – Copenhagen, Denmark
Market Focus Speaking Slots:
“Coherent Technology Advances in the Market, DCI Interop and Shorter Reaches for AI”
Presenter: Karl Gass, OIF Physical & Link Layer Working Group Optical Vice Chair
“CMIS – The Interface that Ties Everything Together for AI”
Presenter: Ian Alderdice, OIF Physical & Link Layer Working Group Management Co-Vice Chair, Ciena
“Energy Efficiency in AI Applications – Making Sense of the Multiple Requirements”
Presenter: Jeff Hutchins, OIF Physical & Link Layer Working Group Energy Efficient Interfaces (EEI) Vice Chair, Ranovus
“400G Architectures For AI – Addressing the Challenges, Enabling the Future”
Presenter: Mike Klempa, OIF Board Member and Physical & Link Layer Interoperability Working Group Chair, Alphawave Semi
China Fiber Connect Forum (CFCF) 2025
June 16-18, 2025 – Suzhou, China
Video Presentation – “OIF Update on Common Electrical I/O (CEI) 448 Gbps Exploration and Developments for Various Chip-to-Chip Architectures”
Speakers:
Tom Issenhuth, OIF Market Awareness & Education Committee Co-Chair, PLL; Mike Klempa, OIF Board Member and Physical & Link Layer Interoperability Working Group Chair, Alphawave Semi; Sam Kocsis, OIF Technical Committee Vice Chair, Amphenol;
Nathan Tracy, OIF President, TE Connectivity
