UPCOMING EVENTS

EA TEF 2026

October 7-8, 2026 – Mountain View, CA

RECENT EVENTS

OFC 2026

March 17-19, 2026 – Los Angeles, CA
OIF Panel: “OIF CEI-448Gbps – Fast and Furious Signaling Spec Development”
Moderator: Nathan Tracy, OIF President, TE Connectivity
Panelists: John Calvin, Keysight Technologies; Mike Klempa, OIF Secretary/Treasurer and Physical and Link Layer Interoperability WG Chair, Qualcomm Incorporated; Cathy Liu, OIF Board Member, Broadcom, Inc.; Yi Tang, OIF Board Member and Physical and Link Layer Working Group Electrical Vice Chair

OIF Panel: OIF 800ZR/LR and 1600ZR/ZR+/CL – Changing the Game…Again”
Moderator: Karl Gass, OIF Physical & Link Layer Working Group Optical Vice Chair
Panelists:
Yishu Zhou, Microsoft Azure – “Scaling Coherent Optics in the Cloud”
Georg Clarici, Coherent – “Coherent Interfaces for the AI Age”
Josef Berger, Marvell – “Coherent Optics: Leading AI Scale-Across Expansion”
Joerg Pfeifle, Keysight Technologies – “Development of extended transmitter constellation closure (ETCC) as a new coherent Tx quality metric”

OIF Panel: “OIF – Driving Optical Interconnect Specs for AI”
Moderator: Jeff Hutchins, OIF Physical and Link Layer Working Group Energy Efficient Interfaces Vice Chair, Ranovus
Panelists: Jeff Hutchins; Mike Klempa, OIF Secretary/Treasurer and Physical and Link Layer Interoperability WG Chair, Qualcomm Incorporated; Cathy Liu, OIF Board Member, Broadcom, Inc.; Nathan Tracy, OIF President, TE Connectivity

DesignCon 2026

February 24-26, 2026 – Santa Clara, CA

Panel: “OIF 448 Gbps Electrical Signaling for AI Progress and 224 Gbps Update for CEI Ongoing Developments”
Moderator: Cathy Liu, OIF Board Member, Broadcom, Inc.
Panelists: John Calvin, Keysight Technologies; Mike Li, Advanced Micro Devices; Dave Stauffer, Physical and Link Layer Working Group Chair, Amphenol; Yi Tang, OIF Board Member and Physical and Link Layer Working Group Electrical Vice Chair, Cisco

Panel: “Energy Efficiency in AI Applications – Making Sense of the Multiple Requirements”
Moderator: Jeff Hutchins, OIF Physical and Link Layer Working Group Energy Efficient Interfaces Vice Chair, Ranovus
Panelists: Jeff Hutchins; Cathy Liu, OIF Board Member, Broadcom, Inc.; Mike Klempa, OIF Secretary/Treasurer and Physical and Link Layer Interoperability Working Group Chair, Qualcomm Incorporated; Dave Stauffer, Physical and Link Layer Working Group Chair, Amphenol