Physical and Link Layer Working Group/Physical Layer User Group Working Group

Networking & Operations Working Group/ Network Operator Working Group

NOTE:  For completed OIF technical work and approved Implementation Agreements and/or White Papers, please click here.


Physical and Link Layer Working Group/Physical Layer User Group Working Group

  • Common Electrical Interface – 224G
    This project will develop a body of knowledge summarized into a white paper that will enable new project launches for specific next generation 224 Gbps CEI (Common Electrical IO) clauses.   Electrical data rates in the range of 224 Gbps will be technically challenging with many factors to be considered and addressed.  This project solicits input as follows (not a comprehensive list):
    -End users and Equipment Developers/Suppliers on next generation requirements (reach, power, latency, etc.) and architectures,
    -Component Developers on modulations and target DER simulations and trade-offs,
    -Semiconductor Suppliers on process capabilities/technologies and timelines,
    -PCB and Package Providers on materials and process performance,
    -Equipment Developers/Suppliers and Connector and Cable Suppliers on material performance and channel simulations,
    -Optical Suppliers on interface requirements,
    -Test and Measurement Suppliers on capabilities and methodologies,
    -Package Suppliers on performance simulations
    For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair at david@kandou.com
  • Common Electrical Interface – 112G-XSR
    This project will develop IA specifications for die-to-die (D2D) and die-to-OE (D2OE) electrical I/O interfaces which can be used to support Nx112G I/O links with significantly reduced power, complexity, and enhanced throughput density. For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair at david@kandou.com.
  • Common Electrical Interface – 112G-Very Short Reach
    This project will develop IA specifications for chip-to-module (c2m) interface which can be used to support optical modules (e.g., 112G, 224G and 448G) with reduced power, complexity and enhanced density. For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair at david@kandou.com.
  • Common Electrical Interface – 112G in MCM
    This project will develop and produce an implementation agreement for a low power, ultra short reach (<= 10mm) electrical die-to-die interface @ 75-116 Gbps per pair of wires across a Multi-Chip Module (MCM) substrate, targeting wide-bus high bandwidth applications. For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair at david@kandou.com.
  • Common Electrical Interface – 112G-LR
    This project will develop and produce an implementation agreement for a Long Reach electrical backplane interface operating @ 75-116Gbps signaling over up to 1000 mm of twinax cable with two connectors, or over a shorter length of PCB backplane trace. For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair at david@kandou.com.
  • Common Electrical Interface – 112G-MR
    This project will develop and produce an implementation agreement for a Mediium Reach electrical interface operating @ 75-116Gbps signaling over up to 500 mm of PCB with one connectors. For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair at david@kandou.com.
  • Common Electrical Interface – 56G-Extra Short Reach
    This project will develop and produce an implementation agreement for a low power, Extra Short Reach (<= 50mm) electrical, chip-to-chip interface operating @ 39-56Gbps signalling for PCB use cases and will facilitate an efficient interface to a board mounted optical engine. For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair at david@kandou.com.
  • Common Electrical Interface – 56G-VSR (CEI-56G-VSR)
    The proposed project will develop a single Implementation Agreement with one or more electrical specifications for operation across a single lane for data rates from 39 to 56 Gb/s. The project will determine the optimum modulation format(s) based on measurements, verification, and CMOS Switch ASIC I/O capability. For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair at david@kandou.com.
  • Electro-Mechanical Footprint for Optical Engines in a Chip Scale Package
    This project will document and detail guidelines to the OIF membership to facilitate optical engine integration on a single circuit package It will define a standardised package for the OE. For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair at david@kandou.com.
  • Higher Baud Rate Coherent Driver Modulator
    This project will define a new version of the Coherent Driver Modulator supporting at least 96 Gbaud for the low modem implementation penalty segment of the coherent market for single optical carrier line rates beyond 400 Gbit/s. For more information, contact Karl Gass, Physical and Link Layer Working Group, Optical Vice Chair at iamthedonutking@mac.com.
  • Low-rate Service Multiplexing Using FlexE and 400ZR
    This project will create a technical white paper on low-rate service multiplexing using FlexE and 400ZR. A specific example is how FlexE 2.1 can be used to aggregate 4 x 100GE clients into a 400ZR interface. For more information, contact Karl Gass, Physical and Link Layer Working Group, Optical Vice Chair at iamthedonutking@mac.com.
  • 400ZR Maintenance
    This project will update the published 400ZR Implementation Agreement to include operation with 75GHz channel spacing.  For more information, contact Karl Gass, Physical and Link Layer Working Group, Optical Vice Chair at iamthedonutking@mac.com.

Networking & Operations Working Group/ Network Operator Working Group

  • APIs for Transport SDN
    As the industry looks at Transport Software Defined Networking (SDN), there is a lack of definition for how User Applications interact with Network Applications and Resource Functions. The programmability of Transport SDN requires some of the internal interfaces used by ASON in the past to become open. The expected outcome for this project is a series of Application Program Interface (API) documents addressing: Service Request, Connection Request, Topology, Link Resource Manager, Path Computation, and other APIs identified by the SDN Framework document. For more information on this project contact Jonathan Sadler, Networking Interoperability Working Group Chair (acting) at jsadler@infinera.com.
  • UNI 2.0 and ENNI 2.0 Amendments for beyond 100G OTN
    This project will generate amendments to the UNI 2.0 and E-NNI 2.0 specifications including the routing and signaling extensions for Beyond-100G G.709 and will not allocate code points or define message formats.  Work on codepoint and message formats will be developed collaboratively with the IETF.  For more information on this project contact Jonathan Sadler, Networking Interoperability Working Group Chair (acting) at jsadler@infinera.com