Physical and Link Layer Working Group/Physical Layer User Group Working Group

  • Higher Baud Rate Coherent Drive Modulator
  • Low-rate Service Multiplexing using FlexE and 400ZR

Networking & Operations Working Group/ Network Operator Working Group

NOTE:  For completed OIF technical work and approved Implementation Agreements and/or White Papers, please click here.


Physical and Link Layer Working Group/Physical Layer User Group Working Group

  • Common Electrical Interface – 112G-XSR
    This project will develop IA specifications for die-to-die (D2D) and die-to-OE (D2OE) electrical I/O interfaces which can be used to support Nx112G I/O links with significantly reduced power, complexity, and enhanced throughput density. For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair at david@kandou.com.
  • Common Electrical Interface – 112G-Very Short Reach
    This project will develop IA specifications for chip-to-module (c2m) interface which can be used to support optical modules (e.g., 112G, 224G and 448G) with reduced power, complexity and enhanced density. For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair at david@kandou.com.
  • Common Electrical Interface – 112G in MCM
    This project will develop and produce an implementation agreement for a low power, ultra short reach (<= 10mm) electrical die-to-die interface @ 75-116 Gbps per pair of wires across a Multi-Chip Module (MCM) substrate, targeting wide-bus high bandwidth applications. For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair at david@kandou.com.
  • Common Electrical Interface – 112G-LR
    This project will develop and produce an implementation agreement for a Long Reach electrical backplane interface operating @ 75-116Gbps signaling over up to 1000 mm of twinax cable with two connectors, or over a shorter length of PCB backplane trace. For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair at david@kandou.com.
  • Common Electrical Interface – 112G-MR
    This project will develop and produce an implementation agreement for a Mediium Reach electrical interface operating @ 75-116Gbps signaling over up to 500 mm of PCB with one connectors. For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair at david@kandou.com.
  • Common Electrical Interface – 56G-Extra Short Reach
    This project will develop and produce an implementation agreement for a low power, Extra Short Reach (<= 50mm) electrical, chip-to-chip interface operating @ 39-56Gbps signalling for PCB use cases and will facilitate an efficient interface to a board mounted optical engine. For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair at david@kandou.com.
  • Common Electrical Interface – 56G-VSR (CEI-56G-VSR)
    The proposed project will develop a single Implementation Agreement with one or more electrical specifications for operation across a single lane for data rates from 39 to 56 Gb/s. The project will determine the optimum modulation format(s) based on measurements, verification, and CMOS Switch ASIC I/O capability. For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair at david@kandou.com.
  • Electro-Mechanical Footprint for Optical Engines in a Chip Scale Package
    This project will document and detail guidelines to the OIF membership to facilitate optical engine integration on a single circuit package It will define a standardised package for the OE. For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair at david@kandou.com.
  • Integrated Coherent Transmitter-receiver Optical Sub-Assembly (IC-TROSA)
    This project will develop an IA for an integrated coherent transmitter-receiver optical sub-assembly (IC-TROSA) supporting high bandwidth and high order QAM operation for DCI, metro and LH applications and having two options: A) Laser Outside, & B) Laser Inside.  For more information, contact Karl Gass, Physical and Link Layer Working Group, Optical Vice Chair at iamthedonutking@mac.com.
  • 400ZR Interoperability
    This project will develop an implementation agreement for 400G ZR and short-reach DWDM multi-vendor interoperability.  It is relevant for router-to-router interconnect use cases and is targeted at (passive) single channel and amplified DWDM applications with distances up to 120 km. This project should ensure a cost-effective and long-term relevant implementation using single-carrier 400G, coherent detection and advanced DSP/FEC algorithms.  For more information, contact Karl Gass, Physical and Link Layer Working Group, Optical Vice Chair at iamthedonutking@mac.com.
  • Coherent Modem Management Interface
    This project was renamed Coherent Common Management Interface Specification or Coherent CMIS (C-CMIS).

    This project will define an implementation agreement that serves as an extension to the CMIS (QSFP-DD/OSFP/COBO) management specification, specifically targeting DCO modules. The current draft of the document is focused on modules implementing 400ZR. For more information, contact Karl Gass, Physical and Link Layer Working Group, Optical Vice Chair at iamthedonutking@mac.com.
  • Higher Baud Rate Coherent Driver Modulator
    This project will define a new version of the Coherent Driver Modulator supporting at least 96 Gbaud for the low modem implementation penalty segment of the coherent market for single optical carrier line rates beyond 400 Gbit/s. For more information, contact Karl Gass, Physical and Link Layer Working Group, Optical Vice Chair at iamthedonutking@mac.com.
  • Low-rate service multiplexing using FlexE and 400ZR
    This project will create a technical white paper on low-rate service multiplexing using FlexE and 400ZR. A specific example is how FlexE 2.1 can be used to aggregate 4 x 100GE clients into a 400ZR interface. For more information, contact Karl Gass, Physical and Link Layer Working Group, Optical Vice Chair at iamthedonutking@mac.com.

Networking & Operations Working Group/ Network Operator Working Group

  • APIs for Transport SDN
    As the industry looks at Transport Software Defined Networking (SDN), there is a lack of definition for how User Applications interact with Network Applications and Resource Functions. The programmability of Transport SDN requires some of the internal interfaces used by ASON in the past to become open. The expected outcome for this project is a series of Application Program Interface (API) documents addressing: Service Request, Connection Request, Topology, Link Resource Manager, Path Computation, and other APIs identified by the SDN Framework document. For more information on this project contact Jonathan Sadler, Networking Interoperability Working Group Chair (acting) at jsadler@infinera.com.
  • Flex Coherent DWDM Transmission Framework
    This project will specify one technical approach to Flex Coherent DWDM Transmission in the application fields of long haul, metro, and data center inter-connection. The objective of this specification is to provide guidance to module and component suppliers on a technical direction of interest to a number of network equipment vendors. For more information on this project contact Vishnu Shukla, Carrier Working Group Chair at vishnu.shukla@verizon.com or Karl Gass, Physical and Link Layer Working Group, Optical Vice Chair at iamthedonutking@mac.com
  • UNI 2.0 and ENNI 2.0 Amendments for beyond 100G OTN
    This project will generate amendments to the UNI 2.0 and E-NNI 2.0 specifications including the routing and signaling extensions for Beyond-100G G.709 and will not allocate code points or define message formats.  Work on codepoint and message formats will be developed collaboratively with the IETF.  For more information on this project contact Jonathan Sadler, Networking Interoperability Working Group Chair (acting) at jsadler@infinera.com
  • Requirements for Integrated Packet Optical SDN
    This project will specify requirements, reference architecture and application scenarios of Multi-layer SDN for packet and optical integration. The objective of this specification is to normalize the architecture, interfaces and behaviors, so that an interoperable framework can be deployed across service provider community for DCI and other WAN applications. This project will also put together applicable and available standard pieces and organize them from a solution view. This may help the industry to get a clearer picture how those standards relate to each other and fit in a particular application or solve a particular problem.
    For more information on this project contact Jonathan Sadler, Networking Interoperability Working Group Chair (acting) at jsadler@infinera.com.