Physical and Link Layer Working Group/Physical Layer User Group Working Group

Networking & Operations Working Group/ Network Operator Working Group

NOTE:  For completed OIF technical work and approved Implementation Agreements and/or White Papers, please click here.

To contact a Working Group Chair or Vice Chair, please send an email to technicalquestions@oiforum.com


Physical and Link Layer Working Group/Physical Layer User Group Working Group

  • Co-Packaging Framework Project
    The Co-Packaging Framework IA is an umbrella project that will study the application spaces and relevant technology considerations for co-packaging of communication interfaces with one or more ASICs.  A primary objective is to identify new opportunities for interoperability standards. The work will be summarized in a Framework IA.  For more information, contact Jeff Hutchins, Physical and Link Layer WG, Co-Packaging Vice Chair.
  • 3.2T Co-Packaged Optical Module
    The 3.2T Co-Packaged Optical Module IA is the first project initiated under the umbrella of the Co-packaged Framework Project. The IA will define a 3.2T co-packaged optical module that targets Ethernet switching applications utilizing 100G electrical lanes. For more information, contact Jeff Hutchins, Physical and Link Layer WG, Co-Packaging Vice Chair.
  • External  Laser Small Form-Factor Pluggable (ELSFP) Module
    The External Laser Small Form-Factor Pluggable (ELSFP) IA is the second project initiated under the umbrella of the Co-packaged Framework Project.  The ELSFP IA will define a future proofed external laser source form factor to support co-packaged optical modules. . The form factor is a front panel pluggable module which employs a blind-mate optical connector located at the rear of the module for eye-safety considerations. The IA will define interoperability for mechanical, thermal, electrical, as well as for the optical connectors.  For more information, contact Jeff Hutchins, Physical and Link Layer WG, Co-Packaging Vice Chair.
  • Common Electrical Interface – 224G
    This project will develop a body of knowledge summarized into a white paper that will enable new project launches for specific next generation 224 Gbps CEI (Common Electrical IO) clauses.   Electrical data rates in the range of 224 Gbps will be technically challenging with many factors to be considered and addressed.  This project solicits input as follows (not a comprehensive list):
    -End users and Equipment Developers/Suppliers on next generation requirements (reach, power, latency, etc.) and architectures,
    -Component Developers on modulations and target DER simulations and trade-offs,
    -Semiconductor Suppliers on process capabilities/technologies and timelines,
    -PCB and Package Providers on materials and process performance,
    -Equipment Developers/Suppliers and Connector and Cable Suppliers on material performance and channel simulations,
    -Optical Suppliers on interface requirements,
    -Test and Measurement Suppliers on capabilities and methodologies,
    -Package Suppliers on performance simulations
    For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair.
  • Common Electrical Interface – 112G-Extra Short Reach
    This project will develop IA specifications for die-to-die (D2D) and die-to-OE (D2OE) electrical I/O interfaces which can be used to support Nx112G I/O links with significantly reduced power, complexity, and enhanced throughput density. For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair.
  • Common Electrical Interface – 112G-LR
    This project will develop and produce an implementation agreement for a Long Reach electrical backplane interface operating @ 75-116Gbps signaling over up to 1000 mm of twinax cable with two connectors, or over a shorter length of PCB backplane trace. For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair.
  • Common Electrical Interface – 112G-MR
    This project will develop and produce an implementation agreement for a Medium Reach electrical interface operating @ 75-116Gbps signaling over up to 500 mm of PCB with one connectors. For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair.
  • Common Electrical Interface – 112G-Very Short Reach
    This project will develop IA specifications for chip-to-module (c2m) interface which can be used to support optical modules (e.g., 112G, 224G and 448G) with reduced power, complexity and enhanced density. For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair.
  • Common Electrical Interface – 112G in MCM
    This project will develop and produce an implementation agreement for a low power, ultra short reach (<= 10mm) electrical die-to-die interface @ 75-116 Gbps per pair of wires across a Multi-Chip Module (MCM) substrate, targeting wide-bus high bandwidth applications. For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair.
  • Common Electrical Interface – 112G Linear
    The CEI-112G-LINEAR project defines interface and interconnect requirements for a linear Chip-to-Optical Engine interface to enable low power, low cost, small form factor 112G serial optical modules in CPO, NPO and server/GPU applications. Data lanes are defined to support up to 112 Gbps over advanced material PCBs, package substrates and intra-box cabled interconnects for chip-to-optical engine/module interfaces. For more information contact Dave Stauffer, Physical and Link Layer Working Group Chair.
  • Common Electrical Interface – 56G-Extra Short Reach
    This project will develop and produce an implementation agreement for a low power, Extra Short Reach (<= 50mm) electrical, chip-to-chip interface operating @ 39-56Gbps signalling for PCB use cases and will facilitate an efficient interface to a board mounted optical engine. For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair.
  • Common Electrical Interface – 56G-VSR (CEI-56G-VSR)
    The proposed project will develop a single Implementation Agreement with one or more electrical specifications for operation across a single lane for data rates from 39 to 56 Gb/s. The project will determine the optimum modulation format(s) based on measurements, verification, and CMOS Switch ASIC I/O capability. For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair.
  • 400ZR Maintenance
    This project will update the published 400ZR Implementation Agreement to include operation with 75GHz channel spacing.  For more information, contact Karl Gass, Physical and Link Layer Working Group, Optical Vice Chair.

Networking & Operations Working Group/ Network Operator Working Group

  • APIs for Transport SDN
    As the industry looks at Transport Software Defined Networking (SDN), there is a lack of definition for how User Applications interact with Network Applications and Resource Functions. The programmability of Transport SDN requires some of the internal interfaces used by ASON in the past to become open. The expected outcome for this project is a series of Application Program Interface (API) documents addressing: Service Request, Connection Request, Topology, Link Resource Manager, Path Computation, and other APIs identified by the SDN Framework document. For more information on this project contact Jonathan Sadler, Networking Interoperability Working Group Chair (acting).
  • UNI 2.0 and ENNI 2.0 Amendments for beyond 100G OTN
    This project will generate amendments to the UNI 2.0 and E-NNI 2.0 specifications including the routing and signaling extensions for Beyond-100G G.709 and will not allocate code points or define message formats.  Work on codepoint and message formats will be developed collaboratively with the IETF.  For more information on this project contact Jonathan Sadler, Networking Interoperability Working Group Chair (acting).
  • Application of Artificial Intelligence to Enhanced Network Operations
    Traditional approaches for network operations face significant difficulties in automatically and efficiently analyzing network data, predicting network faults, and optimizing network performance. This new project will result in a white paper identifying a collection of use cases and requirements for applying AI (Artificial Intelligence) to packet and optical networks to achieve enhanced network operations.  For more information on this project contact Jia He, Network & Operations Working Group Chair.

To contact a Working Group Chair or Vice Chair, please send an email to technicalquestions@oiforum.com