Physical and Link Layer Working Group/Physical Layer User Group Working Group

Networking & Operations Working Group/ Network Operator Working Group

NOTE:  For completed OIF technical work and approved Implementation Agreements and/or White Papers, please click here.

To contact a Working Group Chair or Vice Chair, please send an email to technicalquestions@oiforum.com

Physical and Link Layer Working Group/Physical Layer User Group Working Group

  • 3.2T Co-Packaged Optical Module
    The 3.2T Co-Packaged Optical Module IA is the first project initiated under the umbrella of the Co-packaged Framework Project. The IA will define a 3.2T co-packaged optical module that targets Ethernet switching applications utilizing 100G electrical lanes. For more information, contact Jeff Hutchins, Physical and Link Layer WG, Co-Packaging Vice Chair.
  • External  Laser Small Form-Factor Pluggable (ELSFP) Module
    The External Laser Small Form-Factor Pluggable (ELSFP) IA is the second project initiated under the umbrella of the Co-packaged Framework Project.  The ELSFP IA will define a future proofed external laser source form factor to support co-packaged optical modules. . The form factor is a front panel pluggable module which employs a blind-mate optical connector located at the rear of the module for eye-safety considerations. The IA will define interoperability for mechanical, thermal, electrical, as well as for the optical connectors.  For more information, contact Jeff Hutchins, Physical and Link Layer WG, Co-Packaging Vice Chair.
  • Common Electrical I/O-224G-XSR Common Electrical on-Package Interface Project (CEI-224G-XSR)
    This project proposes a CEI-224G-XSR project which will develop IA specifications for die-to- die (D2D) and die-to-OE (D2OE) electrical I/O interfaces which can be used to support Nx224G I/O links with significantly reduced power, complexity, and enhanced throughput density. The reach objective shall be at least 50 mm over organic package substrate or other advanced materials. For more information contact Dave Stauffer, Physical and Link Layer Working Group Chair.
  • Common Electrical I/O-224G-VSR-Common Electrical Chip-to-Module Interface Project (CEI-224G-VSR)
    This project proposes a CEI-224G-VSR project which will develop IA specifications for chip-to- module (c2m) interface which can be used to support applications of Nx224G with optimized power, complexity, and enhanced density. The reach objective shall be at least 200 mm host channel, 20 mm module channel and up to one connector over advanced materials. For more information contact Dave Stauffer, Physical and Link Layer Working Group Chair.
  • Common Electrical I/O-224G-MR Common Electrical Chip-to-Chip Interface Project (CEI-224G-MR)
    This project proposes a CEI-224G-MR project which will develop IA specifications for chip- to-chip (c2c) interface which can be used to support applications of Nx224G with reduced power, complexity, and enhanced density. The reach objective shall be at least 500 mm with up to one connector over advanced materials. For more information contact Dave Stauffer, Physical and Link Layer Working Group Chair.
  • Common Electrical I/O-224G-LR Common Electrical Backplane and Copper Cable Interface Project (CEI-224G-LR)
    This project proposes a CEI-224G-LR project which will develop IA specifications for an interface which can be used to support Nx224G over backplane. The reach objective shall be at least 1000 mm with up to two connectors over advanced materials. For more information contact Dave Stauffer, Physical and Link Layer Working Group Chair.
  • Common Electrical I/O-112G Linear (CEI-112G Linear)
    The CEI-112G-LINEAR project defines interface and interconnect requirements for a linear Chip-to-Optical Engine interface to enable low power, low cost, small form factor 112G serial optical modules in CPO, NPO and server/GPU applications. Data lanes are defined to support up to 112 Gbps over advanced material PCBs, package substrates and intra-box cabled interconnects for chip-to-optical engine/module interfaces. For more information contact Dave Stauffer, Physical and Link Layer Working Group Chair.
  • Common Electrical Interface – 112G-XSR+
    CEI-112G-XSR+-PAM4 project defines a 112 Gb/s PAM4 electrical interface for die-to-die (D2D) and die-to-optical-engine (D2OE) interconnect with bump-to-bump insertion loss up to 13 dB at the Nyquist frequency and symbol rate in the range 36 Gsym/s to 58 Gsym/s. Target platforms include multiple-chip module (MCM), copackaged optics (CPO), and near-package optics (NPO) assemblies. For more information contact Dave Stauffer, Physical and Link Layer Working Group Chair.
  • CMIS for DPO and ELSFP
    The CMIS for DPO and ELSFP define extensions to CMIS for the CPO ecosystem management infrastructure. This includes CPO optical modules, as well as ELSFP external laser pluggable modules.  This project will include use of SPI for a higher speed physical management interface, addition of registers and CDB commands to support the application and any other considerations deemed necessary to specify this solution.  For more information, contact Ian Alderdice or Gary Nicholl, Physical and Link Layer Working Group Management Co-Vice Chairs.
  • Adding CMIS Support for Host-Module Link Training
    This project provides an optional out of band, protocol agnostic, management mechanism for optimizing link and tuning.   Potential use cases may include OIF CEI 112G, IEEE802.3ck, 128 GFC, IB, XSR+, CEI-224G and other standards.  OB link training based on CMIS will be referred to as CMIS-LT collectively.  For more information, contact Ian Alderdice or Gary Nicholl, Physical and Link Layer Working Group Management Co-Vice Chairs.
  • Form Factor Specific Hardware Management
    This project provides Form factor Specific Hardware Management “FSHM” to supplement CIMIS common management.  FSHM will be a supplemental specifications to CMIS providing hardware management for SFP112, SFP-DD/SFP-DD112, QSFP112, QSFP-DD/QSFP-DD800, and OSFP/OSFP-XD.  For more information, contact Ian Alderdice or Gary Nicholl, Physical and Link Layer Working Group Management Co-Vice Chairs.
  • CMIS 5.3
    For more information, contact Ian Alderdice or Gary Nicholl, Physical and Link Layer Working Group Management Co-Chairs.
  • Enhanced SGMII Electrical SpecificationsThis project leverages the legacy SGMII specifications based on LVDS signaling to define a new E-SGMII specifications based on modernized CML signaling.
    E-SGMII is targeted for high speed 1 GbE (1.25 GBd with 8B/10B) packetized management of optical modules.  E-SGMII is a chip-to-module specifications based on differential AC coupled CML signaling.
    The specifications will define compliance test points and will define an informative channel up to 400 mm long. For more information, contact Ian Alderdice or Gary Nicholl, Physical and Link Layer Working Group Management Co-Vice Chairs.

Networking & Operations Working Group/ Network Operator Working Group

  • APIs for Transport SDN
    As the industry looks at Transport Software Defined Networking (SDN), there is a lack of definition for how User Applications interact with Network Applications and Resource Functions. The programmability of Transport SDN requires some of the internal interfaces used by ASON in the past to become open. The expected outcome for this project is a series of Application Program Interface (API) documents addressing: Service Request, Connection Request, Topology, Link Resource Manager, Path Computation, and other APIs identified by the SDN Framework document. For more information on this project contact Jonathan Sadler, Networking Interoperability Working Group Chair.
  • UNI 2.0 and ENNI 2.0 Amendments for beyond 100G OTN
    This project will generate amendments to the UNI 2.0 and E-NNI 2.0 specifications including the routing and signaling extensions for Beyond-100G G.709 and will not allocate code points or define message formats.  Work on codepoint and message formats will be developed collaboratively with the IETF.  For more information on this project contact Jonathan Sadler, Networking Interoperability Working Group Chair.
  • Application of Artificial Intelligence to Enhanced Network Operations
    Traditional approaches for network operations face significant difficulties in automatically and efficiently analyzing network data, predicting network faults, and optimizing network performance. This new project will result in a white paper identifying a collection of use cases and requirements for applying AI (Artificial Intelligence) to packet and optical networks to achieve enhanced network operations.  For more information on this project contact Jia He, Networking & Operations Working Group Chair.

To contact a Working Group Chair or Vice Chair, please send an email to technicalquestions@oiforum.com