Come and Join us!
OIF Physical & Link Layer Working Group Electrical Interim Meeting
August 7, 2023 – Vancouver, BC, Canada
Hybrid meeting* for members only.
OIF Q3 2023 Technical and Market Awareness & Education Committees Meeting
August 8-10, 2023 – Vancouver, BC, Canada
Hybrid meeting* for members only.
OIF @ ECOC 2023
October 2-4, 2023 – Glasgow, Scotland
Stand #304
*Hybrid Meeting: – A hybrid meeting accommodates active and equal participation by in-person and remote attendees – In-person and remote attendees will participate via Webex. The quarterly meeting will follow the traditional in-person schedule, in the local time zone of the meeting venue, Tuesday through Thursday.
For details on OIF Speaking Engagements, click HERE
NGON & 5G Transport 
May 30-June 1, 2023 – Cote d’Azur, France
Tuesday, May 30, 2023 – 9:00am-10:30am CEST
OIF Workshop – “OIF: Bringing Order to Chaos”
Presenters: Dave Brown, OIF Dir of Communications, Nokia and Karl Gass, OIF Physical & Link Layer Working Group Optical Vice Chair
Wednesday, May 31, 2023 – 5:10pm-5:40pm CEST
OIF Panel – “IP-Optical with Coherent Optics”
Panelists: Karl Gass, OIF Physical & Link Layer Working Group Optical Vice Chair; Edward Echeverry, Telefonica; Ian Redpath, Omdia
OIF @ OFC 2023
March 7-9, 2023 – San Diego, CA
OIF Technology Showcase – “Bringing Order to Chaos – OIF” – Wednesday, March 8 at 3pm PT, Theater 3
One hour session with OIF leadership: Karl Gass, OIF; Nathan Tracy, OIF, TE Connectivity and special guests: Stephen Hardy, Lightwave; Vlad Koslov, LightCounting; Sterling Perrin, Heavy Reading; Alan Weckel, 650 Group
CELEBRATION RECEPTION at OIF Booth #5101 – Wednesday, March 8 at 4pm PT
Show Floor Panel Sessions
“Defining 800ZR and 800LR; An OIF Update” – Wednesday, March 8 at 1pm PT, Theater 2
- Moderator: Karl Gass, OIF Physical & Link Layer Working Group Optical Vice Chair
- Panelists: Josef Berger, Marvell; Sebastien Gareau, Ciena; Scott Wilkinson, Cignal AI; Tom Williams, Cisco Systems
Presentations:
Sebastien Gareau, Ciena
Scott Wilkinson, Cignal AI – click here to download
Tom Williams, Cisco Systems
“Enabling Next Generation Co-Packaging Solutions” – Thursday, March 9 at 12:15pm PT, Theater 2
- Moderator: Jeff Hutchins, OIF Physical & Link Layer Working Group Co-Packaging Vice Chair and Board Member, Ranovus
- Panelists: Kenneth Jackson, Sumitomo Electric Device Innovations; Jeff Hutchins; Yi Tang, Cisco; Nathan Tracy, OIF MA&E Committee Co-Chair, Physical & Link Layer and TE Connectivity; Richard Ward, Astera Labs
OIF Q1 2023 Technical and Market Awareness & Education Committees Meeting
January 10-12, 2023 – Indian Wells, CA
Hybrid meeting for members only.
Guest Speakers!
Vlad Koslov, LightCounting – Tuesday, January 10
Alan Weckel, 650 Group – Wednesday, January 11
Member Reception Celebration – Tuesday, January 10
