UPCOMING EVENTS
ECOC 2025
September 29-October 1, 2025 – Copenhagen, Denmark 
Market Focus Speaking Slots:
“400G Architectures For AI – Addressing the Challenges, Enabling the Future”
Presenter: Mike Klempa, OIF Board Member and Physical & Link Layer Interoperability Working Group Chair, Alphawave Semi
“Coherent Technology Advances in the Market, DCI Interop and Shorter Reaches for AI”
Presenter: Karl Gass, OIF Physical & Link Layer Working Group Optical Vice Chair
“CMIS – The Interface that Ties Everything Together for AI ”
Presenter: Gary Nicholl, OIF Physical & Link Layer Working Group Management Co-Vice Chair, Cisco
“Energy Efficiency in AI Applications – Making Sense of the Multiple Requirements”
Presenter: Jeff Hutchins, OIF Board Member and Secretary/Treasurer and Physical & Link Layer Working Group Energy Efficient Interfaces Vice Chair, Ranovus
NetworkX 
October 14-16, 2025 – Paris, France
Panel: “Beyond disaggregation – are cloud-native architectures the next step?”
Tuesday, October 14, 2025 – 12:25pm-1:05pm CET
Panelist: Karl Gass, OIF Physical & Link Layer Working Group Optical Vice Chair
Industry Keynote – “Coherent Optical Innovations ”
Wednesday, October 15, 2025 – 3:45-4:05pm CET
Speaker: Karl Gass, OIF Physical & Link Layer Working Group Optical Vice Chair
RECENT EVENTS
China Fiber Connect Forum (CFCF) 2025
June 16-18, 2025 – Suzhou, China
Video Presentation – “OIF Update on Common Electrical I/O (CEI) 448 Gbps Exploration and Developments for Various Chip-to-Chip Architectures”
Speakers:
Tom Issenhuth, OIF Market Awareness & Education Committee Co-Chair, PLL; Mike Klempa, OIF Board Member and Physical & Link Layer Interoperability Working Group Chair, Alphawave Semi; Sam Kocsis, OIF Technical Committee Vice Chair, Amphenol;
Nathan Tracy, OIF President, TE Connectivity
OFC 2025
April 1-3, 2025 – San Francisco, CA
OIF Panel: “Coherent Optics Unleashed: 400ZR Success to 800ZR/LR Advancements and 1600ZR/ZR+ Kick-off – An OIF Update”
Moderator: Karl Gass, OIF PLL WG Optical Vice Chair
Panelists: Josef Berger, Marvell; Doug Cattarusa, Cisco; Sebastien Gareau, Ciena; David Hillerkuss, Infinera; Jason Wang, Google
OIF Panel: “Optical Interconnects for AI”
Moderator: Tom Issenhuth, OIF MA&E Committee Co-Chair PLL, Huawei
Panelists: Ashkan Seyedi, Nvidia; Chris Cole, Coherent; Jeff Hutchins, OIF PLL WG EEI Vice Chair and Secretary/Treasurer, Ranovus; Tom Palkert, OIF Editor, MACOM
OCP Panel: “Moving Beyond 200 Gb/s Signaling and the Future of AI Systems”
Panelist: Nathan Tracy, OIF President, TE Connectivity
DesignCon 2025
January 28-30, 2025 – Santa Clara, CA
OIF Panel: “OIF Update on 224 Gbps & 448 Gbps Common Electrical I/O (CEI) Development”
Moderator: Nathan Tracy, OIF President, TE Connectivity
Panelists: Cathy Liu, OIF VP, Broadcom; Mike Li, OIF Board Member, Intel; Srinivas Venkataraman, Meta; John Calvin, Keysight and Nathan Tracy
OIF Panel: “Energy Efficient Interfaces for the Next Generation of AI Compute”
Moderator: Jeff Hutchins, OIF PLL WG EEI Vice Chair and Secretary/Treasurer, Ranovus
Panelists: Mike Klempa, OIF PLL Interoperability WG Chair, Alphawave Semi; Sam Kocsis, OIF Technical Committee Vice Chair, Amphenol; Nathan Tracy, OIF President, TE Connectivity and Jeff Hutchins
