UPCOMING EVENTS
OCP Global Summit 2025
October 13-16, 2025 – San Jose, California
Panel: “Progress in Optical Interconnects for AI Clusters”
Wednesday, October 15, 2025 – 11:05am-11:30am PT
Panelist: Nathan Tracy, OIF President, TE Connectivity
NetworkX
October 14-16, 2025 – Paris, France
Panel: “Beyond disaggregation – are cloud-native architectures the next step?”
Tuesday, October 14, 2025 – 12:25pm-1:05pm CET
Panelist: Karl Gass, OIF Physical & Link Layer Working Group Optical Vice Chair
Industry Keynote – “Coherent Optical Innovations”
Wednesday, October 15, 2025 – 3:45-4:05pm CET
Speaker: Karl Gass, OIF Physical & Link Layer Working Group Optical Vice Chair
TEF 2025: Ethernet for AI
December 2-3, 2025 – Mountain View, California
(Presented by Ethernet Alliance)
DesignCon 2026
February 24-26, 2026 – Santa Clara, California
“Energy Efficiency in AI Applications – Making Sense of the Multiple Requirements”
Presenter: Jeff Hutchins, OIF PLL WG EEI Vice Chair, Ranovus
RECENT EVENTS
ECOC 2025
September 29-October 1, 2025 – Copenhagen, Denmark
Market Focus Speaking Slots:
“Coherent Technology Advances in the Market, DCI Interop and Shorter Reaches for AI”
Presenter: Karl Gass, OIF Physical & Link Layer Working Group Optical Vice Chair
“CMIS – The Interface that Ties Everything Together for AI”
Presenter: Ian Alderdice, OIF Physical & Link Layer Working Group Management Co-Vice Chair, Ciena
“Energy Efficiency in AI Applications – Making Sense of the Multiple Requirements”
Presenter: Jeff Hutchins, OIF Physical & Link Layer Working Group Energy Efficient Interfaces (EEI) Vice Chair, Ranovus
“400G Architectures For AI – Addressing the Challenges, Enabling the Future”
Presenter: Mike Klempa, OIF Board Member and Physical & Link Layer Interoperability Working Group Chair, Alphawave Semi
China Fiber Connect Forum (CFCF) 2025
June 16-18, 2025 – Suzhou, China
Video Presentation – “OIF Update on Common Electrical I/O (CEI) 448 Gbps Exploration and Developments for Various Chip-to-Chip Architectures”
Speakers:
Tom Issenhuth, OIF Market Awareness & Education Committee Co-Chair, PLL; Mike Klempa, OIF Board Member and Physical & Link Layer Interoperability Working Group Chair, Alphawave Semi; Sam Kocsis, OIF Technical Committee Vice Chair, Amphenol;
Nathan Tracy, OIF President, TE Connectivity
