Implementation Agreements (IAS) Summaries
OIF-SPI3-01.0 – SPI-3 Packet Interface for Physical and Link Layers for OC-48.
“…SPI-3 fulfills the need for system designers to target a standard POS Physical Layer interface. Although targeted at implementing POS, the SPI-3 specification is not restricted to this application. It provides a versatile bus interface for exchanging packets within a communication system. SPI-3 defines the requirements for interoperable single-PHY (one PHY layer device connected to one Link Layer device) and multi-PHY (multiple PHY layer devices connected to one Link Layer device) applications. It stresses simplicity of operation to allow forward migration to more elaborate PHY and Link Layer devices. This specification defines 1-the physical implementation of the SPI-3 bus, 2-the signaling protocol used to communicate data and 3-the data structure used to store the data into holding FIFO’s.” (From OIF-SPI3-01.0 Introduction)
OIF-SFI4-01.0 – Proposal for a common electrical interface between SONET framer and serializer/deserializer parts for OC-192 interfaces.
“This specification defines:
a. the clocking of the STS-192 / STM-64 SERDES and SONET/SDH framer,
b. the interface at the STS-192 / STM-64 SERDES, connecting to the SONET/SDH framer ASIC.
This specification does not define other control/status signals that may be implemented in a module containing the serdes and optical transceivers.
An aggregate of 9953.28 Mb/s is transferred in each direction. Sixteen 622.08 Mb/s differential data lines are provided in the transmit direction, and another sixteen in the receive direction. This specification is independent of the type of optics which are used. Because this specification applies to both SONET and SDH, the term OC-192 should be interpreted as applying to both STS-192 and STM-64. This specification applies to speeds up to 10.66 Gb/s.” (From OIF-SFI4-01.0 Introduction)
OIF-SFI4-02.0 – SERDES Framer Interface Level 4 (SFI-4) Phase 2: Implementation Agreement for 10Gb/s Interface for Physical Layer Devices.
“SFI-4, Phase 2 determines aggregate data bandwidths of OC-192 ATM and Packet over SONET/SDH (POS), as well as other applications at the 10 Gbps data rate. The typical line interface of a communications system with 10 Gbps optical links may consist of three separate devices: an optical module containing a SERDES component, a forward error correction (FEC) processor and a framer. The IA includes objectives and requirements for the interconnection between these devices requiring a parallel electrical bus operating significantly slower than the optical data rate…” (From November 21, 2002 OIF press release)
OIF-SFI5-01.0 – Serdes Framer Interface Level 5 (SFI-5): 40Gb/s Interface for Physical Layer Devices.
“…Created by the OIF’s Physical & Link Layer Working Group, the SFI-5 IA is an integral part of a series of agreements addressing the interfaces for packet and cell transfer in 40 Gbps applications like OC-768 ATM and Packet-over-SONET/SDH (POS). The SFI-5 interface allows manufacturers of high speed SerDes devices and Optical Modules to develop components with the certainty that complementary products from FEC and Framer suppliers will be interoperable.…SFI-5 specifies an interface between the SerDes component, the forward-error-correction (FEC) processor and Framer devices within the Physical Layer. SFI-5 addresses aggregate data bandwidths of OC-768, STM256, OTN OTU-3, as well as other applications at the 40 Gb/s data rate. System applications of SFI-5 include the interface between optical transponders and framers and transponders and FEC components.” (From June 19, 2002 OIF press release)
OIF-SFI-S-01.0 – Scalable Serdes Framer Interface (SFI-S): Implementation Agreement for Interfaces Beyond 40G for Physical Layer Devices.
“…implementation agreement that defines a scalable interface between SERDES and Framer devices from 40G to 100G and beyond for the physical layer. The SFI-S IA is based on 4 – 20 data lines plus deskew channel, for aggregate data bandwidths in the range of 40 – 160 Gbps data rate. The SFI-S project is an extension of the prevalent OIF SFI-4 specification for electrical 10 Gbps interfaces used on all 300-pin transponders. SFI-S is targeted to support the 100G work being addressed by standards bodies like IEEE 802.3ba and ITU-T and forums like ATIS and the Ethernet Alliance. ” (From November 13, 2008 OIF press release)
OIF-SPI4-01.0 – System Physical Interface Level 4 (SPI-4) Phase 1: A System Interface for Interconnection Between Physical and Link Layer, or Peer-to-Peer Entities Operating at an OC-192 Rate (10 Gb/s).
“This specification describes a data path interface between the physical and link layers to support physical line data rates up to 10 Gb/s… The specification outlines the system architecture, I/O and design considerations for implementing the interface. An optional 4×16 interface mode is also described, which allows up to four separate 16-bit interfaces to support four independent Link Layer devices connected to a single Physical Layer device, or four independent Physical Layer devices connected to a single Link Layer device.” (From OIF-SPI4-01.0 Introduction)
OIF-SPI4-2.01 – System Packet Interface Level 4 (SPI-4) Phase 2: OC-192 System Interface for Physical and Link Layer Devices.
“This document specifies the Optical Internetworking Forum’s recommended interface for the interconnection of Physical Layer (PHY) devices to Link Layer devices for 10 Gb/s aggregate bandwidth applications by means of a higher-speed interface than defined in SPI-4 Phase 1… SPI-4 is an interface for packet and cell transfer between a physical layer (PHY) device and a link layer device, for aggregate bandwidths of OC-192 ATM and Packet over SONET/SDH (POS), as well as 10 Gb/s Ethernet applications…” (From OIF-SPI4-2.01 Introduction)
OIF-SPI5-01.1 – System Packet Interface Level 5 (SPI-5) : OC-768 System Interface for Physical and Link Layer Devices.
“The System Packet Interface Level 5 (SPI-5) builds on the previously approved OIF SPI specifications (SPI-3 for 2.5 Gbps and SPI-4 for 10 Gbps), providing guidelines for the interaction between physical layer and link layer devices.” … “System Packet Interface Level 5 (SPI-5) is an interface for packet and cell transfer between a physical layer device and a link layer device for 40 Gbps applications, such as OC-768 ATM and Packet over SONET/SDH (POS). SPI-5 will allow system vendors to use interoperable components from multiple suppliers leading to a higher level of competition and lower system costs. Developed by the OIF’s Physical Link Layer Working Group, the chip-to-chip and module-to-module multi-vendor interoperability made possible by SPI-5 will stimulate demand for 40 Gbps systems among service providers. In addition, the enhanced interoperability of SPI-5-compliant equipment will lower product costs, reducing the risks associated with developing products for the 40 Gbps market.” (From February 12, 2002 OIF press release)
OIF-SxI5-01.0 – System Interface Level 5 (SxI-5): Common Electrical Characteristics for 2.488 – 3.125Gbps Parallel Interfaces.
This Implementation Agreement is “for the electrical and jitter specifications between:
- The Serdes and Framer devices within the Physical Layer (Serdes Framer Interface or SFI).
- The System Packet Interface (SPI)
- Future interfaces using 2.5-3.125Gbps parallel data paths
The initial application is for SFI-5 and SPI-5. These interfaces support OC-768 ATM and Packet over SONET/SDH (POS), as well as other protocols at the 40 Gb/s data rate.” (From OIF-SxI5-01.0 Abstract)“ This document defines the electrical I/O characteristics for the SPI-5 and SFI-5 interfaces. This specification is based on 1.2 volts CML for the reasons below:
- Easier for non-CMOS technologies to implement
- Wider industry experience with signal integrity performance.
- Greater compatibility with future lower voltage technologies.” (From OIF-SxI5-01.0 Introduction)
OIF-TFI5-01.0 – TDM Fabric to Framer Interface(TFI-5)
“…Known as TFI-5, the agreement is intended to allow framer and switch components from multiple vendors to interoperate. The IA defines support for key functionality including link integrity monitoring, connection management and mapping mechanisms for both SONET/SDH and non-SONET/SDH clients such as Ethernet and Fiber Channel. TFI-5 is intended for use in Time Domain Multiplexed applications compared to the previously release SPI-5, which is targeted for packet/cell applications. …With the addition of the TFI-5 interface IA, the OIF completes a portfolio of 40 Gbps bandwidth IC interfaces consisting of SFI-5, SPI-5 and TFI-5,”.” (From October 6, 2003 OIF press release)
OIF-CEI-01.0 – Common Electrical I/O (CEI) – Electrical and Jitter Interoperability Agreements for 6G+bps and 11G+bps I/O
“…Applications covered by the IA include high-speed backplanes, chip-to-chip interconnect and chip to optical module interfaces. The three electrical interfaces approved in the IA are:
- CEI-6G-SR 6 Gigabit Short Reach, 4.976 to 6.375 Gigabit per second, 0 to 200 mm of printed circuit board and 1 connector
- CEI-6G-LR 6 Gigabit Long Reach, 4.976 to 6.375 Gigabit per second, 0 to 1 Meter of printed circuit board and up to 2 connectors
- CEI-11G-SR 11 Gigabit Short Reach, 9.95 to 11.1 Gigabits per second, 0 to 200 mm of printed circuit board and 1 connector.” (From December 16, 2004 OIF press release)
OIF-CEI-02.0 – Common Electrical I/O (CEI) – Electrical and Jitter Interoperability Agreements for 6G+bps and 11G+bps I/O
“…CEI 11G-LR addresses 11 to 13 Gbps applications over backplanes. This IA responds to the industry’s move toward higher speed electrical signaling, driven by system vendors’ desire to quadruple the bandwidth of existing systems without increasing the number of backplane traces.” (From April 28, 2005 OIF press release)
OIF-CEI-P-01.0 – Common Electrical I/O – Protocol (CEI-P)- Implementation Agreement
“…The…CEI Protocol (CEI-P) is a new protocol designed for use with the fast electrical interfaces developed by the CEI project team. A key feature of this new protocol is the Forward Error Correction (FEC) capability, which is tolerant of burst errors and substantially improves the error rate performance of a link. The FEC has the capability to improve the channel’s bit error ratio by as much as 12 orders of magnitude. “The CEI 11G-LR and CEI-P IAs complete the high speed electrical signaling work of the OIF Physical and Link Layer working group,” said Mike Lerer of Xilinx, and OIF Physical and Link Layer Working Group chair.” (From April 28, 2005 OIF press release)
OIF-CEI-P-02.0 – Common Electrical I/O – Protocol (CEI-P)- Implementation Agreement
The CEI Protocol Implementation Agreement defines protocols that take advantage of faster electrical interfaces developed by the CEI project. The CEI Electrical Implementation Agreement and the CEI Protocol Implementation Agreement are peer documents. Adherence to one does not force adherence to the other. For example, a 10G SONET framer may connection directly to an optical module using CEI electricals with SONET scrambled data. In this case, CEI Protocol would be absent. It is also possible to use CEI Protocol without CEI Electricals. An example would be to encapsulate TFI-5 frames with CEI Protocol to provide forward error correction capability. The target applications of CEI Protocol are Lane Aggregation and Physical layer management of future OIF interfaces.
Optical Transponder Interoperability
OIF-LRI-02.0 – Interoperability for Long Reach and Extended Reach 10 Gb/s Transponders and Transceivers
“…The agreement, titled Interoperability for Long Reach and Extended Reach 10 Gb/s Transponders and Transceivers, was tested publicly at OFC/NFOEC in March 2006. The IA uses alternate signaling technologies to extend 10 Gb/s links beyond the traditional long reach distance of 80 km to distances of 120 km, while simultaneously lowering infrastructure costs by eliminating in-line optical dispersion compensating modules. “This agreement is timely because several network equipment manufacturers have already implemented alternate signaling technologies such as duobinary transmission or chirp managed lasers within their products,” said Karl Gass of Sandia National Laboratories and the OIF’s Physical Layer Users Working Group chair. “Standardizing the testing of this functionality supports true interoperability between the systems offered by different network equipment manufacturers.” (From July 27, 2006 OIF press release)
OIF-TL-01.1 – Implementation Agreement for Common Software Protocol, Control Syntax, and Physical (Electrical and Mechanical) Interfaces for Tunable Laser Modules.
“…The first tunable laser IA from the OIF PLL working group addresses the communication protocol, electrical interface and mechanical form factor interoperability for tunable continuous wavelength (CW) lasers. This agreement defines a common form, fit, interface and function of a tunable laser subsystem. Optical specifications are not included in the scope of the agreement due to the wide range of applications for tunable lasers. This allows system and component vendors to reduce costs and increase interoperability and sourcing by targeting a common platform…” (From November 21, 2002 OIF press release)
OIF-TLMSA-01.0 – Multi-Source Agreement for CW Tunable Lasers
“…This Agreement specifically addresses module physical (electrical) interface, communications interfaces and optical performance parameters for continuous wavelength (CW) tunable laser modules. This new IA builds upon the OIF’s first tunable laser specification (OIF TL-01.1), which was released in November 2002.…” (From June 3, 2003 OIF press release)
OIF-ITLA-MSA-01.0 – Integratable Tunable Laser Assembly Multi-Source Agreement
“…The Agreement specifies a compact, standardized form factor for incorporation into a 300pin 3.5”x4.5” transponder. The OIF recognizes the industry trend to use an off-the-shelf transponder and the ITLAMSA defines a standardized component, which simplifies the manufacture of tunable 300pin transponders as well as providing multiple sources for the same component. The agreement complements a previous OIF tunable laser MSA-IA that addresses communication protocols and electrical interfaces for standalone continuous wavelength (CW) lasers.…” (From July 14, 2004 OIF press release)
OIF-ITLA-MSA-01.1 – Integrable Tunable Laser Assembly Multi-Source Agreement
“…The multi-source agreement for integrable tunable laser assembly details a communication protocol, electrical interface, power supply, optical specifications, and a mechanical interface for use in telecommunications equipment operating in the C or L band. The MSA focuses on standardization of a CW laser subassembly for integration into transponders. This relates to both the 3.5″x4.5″ transponder as well as the small form factor 3″x2.2″ transponder.…” (From December 15, 2005 OIF press release)
UNI – E-NNI
OIF-UNI-01.0 – User Network Interface (UNI) 1.0 Signaling Specification.
“The specification defines the signaling protocols implemented by client and transport network equipment from different vendors to invoke services, the mechanisms used to transport signaling messages and the auto-discovery procedures that aid signaling. The primary service offered by the transport network over the UNI is the ability to create and delete connections on-demand…” (From October 24, 2001 OIF press release)
OIF-UNI-01.0-R2-Common – User Network Interface (UNI) 1.0 Signaling Specification, Release 2: Common Part
OIF-UNI-01.0-R2-RSVP – RSVP Extensions for User Network Interface (UNI) 1.0 Signaling, Release 2
“…The second IA the OIF membership has approved is an update to the UNI 1.0 Signaling IA, addressing extensions to RSVP-TE signaling protocols. While not changing UNI 1.0 functionality, the new agreement reflects recent developments in other standards bodies and builds upon lessons learned from the OIF’s multi-vendor interoperability event conducted at the OFC 2003 show in Atlanta. The UNI 1.0 Signaling Release 2 IA defines a set of services, signaling protocols and mechanisms used to transport signaling messages and the autodiscovery procedures that aid signaling. The agreement is aimed at assisting client and transport network equipment vendors in supporting UNI 1.0 and defines UNI signaling based on adapting GMPLS RSVP-TE specifications .” (From March 4, 2004 OIF press release)
OIF-UNI-02.0 – User Network Interface (UNI) 2.0 Signaling Specification Common Part
OIF-UNI-02.0 – User Network Interface (UNI) 2.0 Signaling Specification – RSVP Extensions
“…Improvements made to UNI 2.0 were gleaned from the OIF’s Worldwide Interoperability Demonstration – On-Demand Ethernet Services held last summer between 7 carriers and 8 equipment vendors. UNI 2.0 complies with the ITU-T ASON architecture, and supports all UNI 1.0 signaling with additional protocol extensions for the following new UNI 2.0 features: – Support for Ethernet clients, providing both Ethernet Private Line (EPL) and Ethernet Virtual Private Line (EVPL) services – Dynamic bandwidth modification, without service disruption – G.709 connection services for ODU and OTU switching layers – Low order SONET/SDH connection services For network users, these improvements deliver more responsive and flexible services plus right-sized bandwidth for their dynamic traffic needs. Carriers can simplify their networks, maintain reliability, and improve network performance and customer satisfaction. “UNI 2.0 is at the forefront of the emerging Carrier Ethernet market,” said Stephen Shew with Nortel Networks and OIF board member. “It allows Ethernet attached clients to request and modify EPL, and EVPL services that are defined in MEF (Metro Ethernet Forum) specifications.” During the development of the OIF UNI 2.0, two interoperability events were held that refined various UNI 2.0 features, including EPL and bandwidth modification. These service requests were signaled from client Ethernet equipment or application and adapted into SONET/SDH at the edge nodes, enabling transport services with global coverage. “The OIF continues to test the interoperability of UNI with close collaboration between equipment vendors and carriers,” said Jim Jones of Alcatel-Lucent and OIF’s vice president of marketing. “OIF members then incorporate the results of those tests into the IA, providing the industry with ready-to-use, mature specifications.” (From February 25, 2008 OIF press release)
OIF-CDR-01.0 – Call Detail Records for OIF UNI 1.0 Billing.
“An implementation agreement (OIF-CDR-01.0) outlining the Call Detail Records (CDR) for User-Network Interface (UNI) 1.0 billing has passed principal ballot providing both carriers and suppliers with an agreement on CDR procedures and formats. The CDR IA supplements the UNI 1.0 signaling IA, which enables dynamic establishment of optical connections. Traditionally, optical connections have been billed on a flat-rate basis without regard to usage. CDR-01.0 allows carriers to capture usage records on optical connections thus offering usage-based billing for optical services.” (From August 12, 2002 OIF press release)
OIF-SEP-03.0 – Implementation Agreement for Security Extension for UNI and E-NNI 2.0
This Implementation Agreement defines a common Security Extension for securing the protocols used in all versions of the OIF’s UNI and E-NNI. It is based on previously agreed upon security requirements for UNI 2.0 and E-NNI, which call for a complete, unified, and simplified approach to security. Guidelines for using this approach in the most straightforward manner are given, and informative material on operational security aspects is included. This version 2.0 obsoletes version 1.0 of the Security Extension for UNI and NNI and its Addendum.
OIF-SMI-01.0 – Security for Management Interfaces to Network Elements
“…The Security for Management Interfaces to Network Elements IA lists objectives for securing OAM&P interfaces to a Network Element and then specifies ways of using security systems (e.g., IPsec or TLS) for securing these interfaces. It summarizes how well each of the systems, used as specified, satisfies the objectives.…” (From September 4, 2003 OIF SMI-01.0 IA)
OIF-E-NNI-Sig-01.0 – Intra-Carrier E-NNI Signaling Specification
“…The Intra-Carrier External Network-to-Network Interface (E-NNI) 1.0 Signaling IA enables end-toend connection management by providing a uniform way for carriers to interconnect network domains. “The UNI and E-NNI IAs exemplify the OIF’s commitment and contribution to the optical telecommunication industry,” said Vishnu Shukla, Technology Planning, Verizon. “These IAs will facilitate Carriers in end-to-end auto provisioning of cost effective bandwidth services.” The advent of the automatic switched transport network has made it necessary for carriers to employ interoperable procedures for requesting and establishing dynamic connection services across diverse networks. “E-NNI is important to the telecommunications industry at large because it was derived directly from carrier requirements,” said Jim Jones, Alcatel, OIF Architecture/Signaling Working Group chair. “At a time when the industry needs direction and structure with rapidly changing technology, OIF’s E-NNI 1.0 helps carriers establish a way for multiple networks to interconnect…” (From March 4, 2004 OIF press release)
OIF-E-NNI-OSPF-01.0 – External Network-Network Interface (E-NNI) OSPF-based Routing – 1.0 (Intra-Carrier) Implementation Agreement
“…The External Network-Network-Interface (E-NNI) OSPF-based Routing Implementation Agreement (IA) defines key requirements for exchange of network topology and status information between control domains within an ASON network. This allows for path computation across optical domains managed individually by different methods, such as GMPLS. E-NNI Routing will support scalable routing and interoperability across a carrier’s multi-vendor optical network for services such as Ethernet transport and bandwidth on demand. The IA document includes results from multi-vendor interoperability testing performed in 2003, 2004 and 2005. …” (From February 12, 2007 OIF press release)
Very Short Reach Interface
OIF-VSR4-01.0 – Very Short Reach (VSR) OC-192 Interface for Parallel Optics.
“VSR-1 adapts high-volume Gigabit Ethernet technology in the form of 1.25 Gbit/s signaling with 850 nanometer lasers over multi-mode fiber. VSR-1 uses 12 of these channels over ribbon fiber and reaches up to 300 meters. The 12 lasers can be implemented with a single Vertical Cavity Surface Emitting Laser (VCSEL) array. 10 of the fibers carry data, one carries CRC error detection codes, and the 12th fiber carries parity of the 10 data fibers. This enables hitless correction of errors on any single fiber, including the loss of a fiber. Field termination of the multi-mode ribbon fiber is supported. The link electronics automatically adapt to either ribbon connector put on upside down. The components required to implement VSR-1 are now available from suppliers, and OIF members have demonstrated multi-vendor interoperability of the interface.” (From January 16, 2001 OIF press release)
VSR4-02 (OC-192 Very Short Reach Interface, 1 fiber 1310nm)
“VSR4-02 is based on ITU G.691. It uses 10 Gbit/s serial signaling with a 1310 nanometer laser over SMF and reaches up to 600 meters. Compared to SONET Short Reach (SR) interfaces, it relaxes some optical parameters. It allows increased dispersion and reduced reach with the intent of enabling lower cost devices.”
Note: The VSR4-02 IA has been included as the 4dB link option in VSR4-05 below.
OIF-VSR4-03.0 – Very Short Reach (VSR) OC-192 Four Fiber Interface Based on Parallel Optics.
“The target performance of the four fiber VSR interface is to transmit the OC-192 data over 300 meters of 50 micrometer core multimode ribbon fiber cable. VSR-3 utilizes four 2.5 Gb/s vertical cavity surface emitting lasers (VCSELs) in each direction on a single 12-fiber ribbon (with 4 unused fibers). It has a reach of up to 300 meters. The four fiber solution leverages the low cost parallel fiber VCSEL base technology currently being deployed in many optical backplane applications for digital crossconnect systems, terabit routers and terabit switches.
Four fiber solutions are also being specified in the ANSI Fiber Channel standard and the Infiniband Industrial consortium. These applications and the VSR OC-192 applications have very similar optical power and jitter link budgets. The four fiber VSR OC-192 solution will map the OC-192 frame onto the parallel optical link with no bandwidth expansion and no overwriting of the SONET overhead bytes.” (From March 20, 2001 OIF press release)
OIF-VSR4-04.0 – Serial Shortwave Very Short Reach (VSR) OC-192 Interface for Multimode Fiber.
“The target performance of VSR-4 is to transmit a SONET/SDH OC-192 data stream over 50 micrometer multimode fiber at distances up to 85 meters, or up to 300 meters with 2000 MHz.km high bandwidth multimode fiber. VSR-4 utilizes a single 850 nanometer vertical cavity surface emitting laser (VCSEL) for the transmitter optical element, and a single PIN PD for the receiver. A similar 10Gbs serial 850nm optical interface is under consideration by IEEE 802.3ae for inclusion in the 10 Gigabit Ethernet standard.” (From March 20, 2001 OIF press release)
OIF-VSR4-05.0 – Very Short Reach (VSR) OC-192 Interface Using 1310 Wavelength and 4 and 11 dB Link Budgets.
“VSR4-05 includes both 4dB and 11dB optical link budgets, which covers distances from 2m to 600m. The 11dB option can be deployed in an optical network where the optical path includes a passive (transparent) photonic cross-connect (PXC), patch panels and up to 600m of single mode fiber.” (From November 21, 2002 OIF press release)
OIF-VSR5-01.0 – Very Short Reach Interface Level 5 (VSR-5): SONET/SDH OC-768 Interface for Very Short Reach (VSR) Applications.
“As the first 40 Gbps optical interface project defined by the Forum, VSR5 is four times faster than previous 10 Gbps interfaces and is a lower cost alternative to interconnect within a central office (CO). VSR5 is capable of nominal 40 Gbps aggregate bit rate intra-office systems for link distances up to 2 km. The IA specifies a set of functional SONET/SDH OC-768/STM-256 interfaces for VSR applications. The complete solution set is intended to address the set of reference applications, while minimizing overall network and operational cost and complexity.” (From November 21, 2002 press release)
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