OIF has led the industry for the past 25 years in the development and publication of next generation electrical definitions for transmitters, receivers and channels to enable interoperable electrical links for chip to chip, chip to optical, line card to line card and equipment to equipment applications.

OIF recently published 112Gbps specifications for die to die, chip to chip, chip to module, medium reach chip to chip and long reach chip to chip also known as backplane.

Click here for CEI-224G project information.

Common Electrical I/O – 112G-Linear Project
A linear Chip-to-Optical Engine interface is needed to enable low power, low cost, small form factor 112G serial optical modules in Co-Packaged Optics, Near Package Optics (NPO) and server/GPU applications. This new project will facilitate increased bandwidth and reduced power of switch ports using co-packaged and closely packaged optical modules.


Press Releases


  • DesignCon 2021 OIF Panel:“Interoperable Common Electrical I/O and Channel Standards – An OIF Perspective”
    Tuesday, August 17, 2021 – 4:00-5:15 PDT
    Moderator: Nathan Tracy, OIF VP of Marketing, TE Connectivity
    Panelists: Pirooz Tooyserkani, Cisco (presenting for Gary Nicholl); Mike Li, OIF Board Member, Intel; Cathy Liu, Broadcom Inc.; Keysight Technologies (presented by Mike Li)
  • OFC 2021 OIF Panel: “Electrical Data Rates Keep Pushing Forward; An OIF Update”
    Tuesday, June 08, 2021 – 11:00-12:00 PDT
    Moderator: Nathan Tracy, OIF VP of Marketing, TE Connectivity
    Panelists: David Stauffer, OIF Physical & Link Layer Working Group Chair, Kandou Bus SA; Gary Nicholl, OIF Secretary/Treasurer, Cisco; Cathy Liu, Broadcom Inc.; Mike Li, OIF Board Member, Intel and Thananya Baldwin, Keysight Technologies
  • DesignCon 2019 OIF Panel: “112Gbps Electrical Interfaces – An OIF update on CEI-112G
    Track: 08. Optimizing High-Speed Serial Design
    Moderator: Nathan Tracy, OIF VP of Marketing, TE Connectivity
    Panelists: Brian Holden, Kandou Bus; Cathy Liu, OIF Board Member, Broadcom Limited; Steve Sekel, OIF PLL Interoperability WG Chair, Keysight
  • NGON & DCI Europe 2018
  • DesignCon 2018

Success Story

Fact Sheet

For more information, contact Dave Stauffer, Physical and Link Layer Working Group Chair at technicalquestions@oiforum.com.

For information on other OIF current projects, please see OIF Current Work

For public OIF Implementation Agreements, please see Implementation Agreements (IAs)