The Co-Packaging Framework IA studied the application spaces and relevant technology considerations for co-packaging of communication interfaces with one or more ASICs and initiated two new projects under its umbrella.

  • The 3.2T Co-Packaged Optical Module IA will define a 3.2T co-packaged module that targets the 51.2T Ethernet switching application utilizing 100G electrical lanes in a near-packaged placement.  Both internal and external laser source configurations are supported.  The IA will define interoperability for mechanical, thermal, electrical, optical pigtails, as well as for copper cable attachment.
  • The External Laser Small Form-Factor Pluggable (ELSFP) IA will define a future proofed external laser source form factor to support co-packaged optical modules. The form factor is a front panel pluggable module which employs a blind-mate optical connector located at the rear of the module for eye-safety considerations. The IA will define interoperability for mechanical, thermal, electrical, as well as for the optical connectors.

Press Releases

For information on other OIF current projects, please see OIF Current Work.

For public OIF Implementation Agreements, please see Implementation Agreements (IAs).