Co-Packaging

The Co-Packaging Framework IA studied the application spaces and relevant technology considerations for co-packaging of communication interfaces with one or more ASICs and initiated two new projects under its umbrella.

• The 3.2T Co-Packaged Optical Module IA will define a 3.2T co-packaged module that targets the 51.2T Ethernet switching application utilizing 100G electrical lanes in a near-packaged placement.  Both internal and external laser source configurations are supported.  The IA will define interoperability for mechanical, thermal, electrical, optical pigtails, as well as for copper cable attachment.

• The External Laser Small Form-Factor Pluggable (ELSFP) IA will define a future proofed external laser source form factor to support co-packaged optical modules. The form factor is a front panel pluggable module which employs a blind-mate optical connector located at the rear of the module for eye-safety considerations. The IA will define interoperability for mechanical, thermal, electrical, as well as for the optical connectors.

Press Releases

• • February 23, 2022 – OIF Members Demonstrate How Interoperability Accelerates Solutions for Today’s and Future Global Networks at OFC 2022
  • January 11, 2022 – OIF to Present “Co-Packaging Standardization Progress” Webinar to Provide Updates on Overcoming Implementation Challenges to Enable Interoperability
  • June 7, 2021 –OIF Thought Leaders to Provide Updates on Co-Packaging, 400ZR, Electrical Data Rates and Transport SDN Projects at Global Conferences
  • May 26, 2021 – OIF Reveals Three Innovative Projects – External Laser Small Form Factor Pluggable Module for Co-Packaged Optics, Artificial Intelligence for Enhanced Network Operations and CEI-112G-Linear – at Q2 2021 Virtual Meeting
  • March 11, 2021 – OIF Wraps Q1 2021 Member Meeting with New Co-Packaging Project; 3.2T Co-Packaged Module Project for Intra Data Center Switching Applications
  • November 10, 2020 – OIF Launches Co-Packaging Framework Implementation Agreement Project
  • September 21,2020 – OIF to Lead “Co-Packaged Optics – Why, What and How” Live Webinar Event; Industry Experts to Provide Perspectives on Co-Packaged Optics Challenges and Opportunities

Demos

• 2022 PLL Interoperability Demo at OFC
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• Speaking
  • China Fiber Connect Forum 2021 – Suzhou: “Standardization for the Co-packaging of Photonics and Electronics”
    Thursday, June 24, 2021 – TIME TBD
    OIF has been studying the co-packaging of ASICs with optical and electrical transceivers within its Co-Packaging Framework Project.   During this session, an OIF expert will address what co-packaging is, what some of the unique challenges of co-packaging are, and will describe what activities the OIF has initiated to address multi-vendor interoperability for co-packaging.
    Presenter:  Jeff Hutchins, OIF Physical & Link Layer Working Group – Co-Packaging Vice Chair, Ranovus
  • OFC 2021 Media/Analyst Panel: “Data Center Optics are Heading Toward Co-packaged Optics: Why, How and When?”
    Tuesday, 08 June, 12:30 – 13:30 PDT (UTC-7:00)
    This panel of esteemed industry experts will discuss the need for co-packaged optics (CPO) inside the data center.
    Speaker: Mark Filer, OIF Board Member, Microsoft, USA

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  Webinars

  • • • October 14, 2020 – “Co-Packaged Optics – Why, What and How” in partnership with Lightwave – This event is now available for on demand viewing here.
      • July 20, 2020 – “Co-packaging of Optics with ASICS” – Open to OIF principal members only.

  For more information on this project contact Jeff Hutchins, OIF PLL Co-Packaging WG Vice Chair at technicalquestions@oiforum.com.

For information on other OIF current projects, please see OIF Current Work.

For public OIF Implementation Agreements, please see Implementation Agreements (IAs).