The Co-Packaging Framework IA will study the application spaces and relevant technology considerations for co-packaging of communication interfaces with one or more ASICs. A primary objective of this specification is to identify new opportunities for interoperability standards for possible future work at the OIF or other standards organizations. Upon completion, the work will be summarized in a Framework IA.
The scope of the Co-Packaging Framework project is to:
- Identify the key co-packaged applications and their requirements
- Study and identify key issues associated with co-packaged optics
- Identify opportunities and develop industry consensus to pursue interoperability standards
- Document the study in the Framework IA (a technical whitepaper)
- Launch follow-on standardization activities at the OIF or other appropriate standard bodies
The first project started under Framework project’s umbrella is the 3.2T Co-Packaged Optical Module.
Press Releases
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- March 11, 2021 – OIF Wraps Q1 2021 Member Meeting with New Co-Packaging Project; 3.2T Co-Packaged Module Project for Intra Data Center Switching Applications
- November 10, 2020 – OIF Launches Co-Packaging Framework Implementation Agreement Project
- September 21,2020 – OIF to Lead “Co-Packaged Optics – Why, What and How” Live Webinar Event; Industry Experts to Provide Perspectives on Co-Packaged Optics Challenges and Opportunities
Webinars
- October 14, 2020 – “Co-Packaged Optics – Why, What and How” in partnership with Lightwave – This event is now available for on demand viewing here.
- July 20, 2020 – “Co-packaging of Optics with ASICS” – Open to OIF principal members only.
For more information on this project contact contact Jeff Hutchins, OIF PLL Co-Packaging WG Vice Chair at jeff@ranovus.com.
For information on other OIF current projects, please see OIF Current Work
For public OIF Implementation Agreements, please see Implementation Agreements (IAs)
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