The Co-Packaging Framework IA will study the application spaces and relevant technology considerations for co-packaging of communication interfaces with one or more ASICs. A primary objective of this specification is to identify new opportunities for interoperability standards for possible future work at the OIF or other standards organizations. Upon completion, the work will be summarized in a Framework IA.
The scope of the Co-Packaging Framework project is to:
- Identify the key co-packaged applications and their requirements
- Study and identify key issues associated with co-packaged optics
- Identify opportunities and develop industry consensus to pursue interoperability standards
- Document the study in the Framework IA (a technical whitepaper)
- Launch follow-on standardization activities at the OIF or other appropriate standard bodies
The initial projects started under Framework project’s umbrella are the 3.2T Co-Packaged Optical Module and the External Laser Small Form Factor Pluggable (ELSFP) Module.
- June 7, 2021 –OIF Thought Leaders to Provide Updates on Co-Packaging, 400ZR, Electrical Data Rates and Transport SDN Projects at Global Conferences
- May 26, 2021 – OIF Reveals Three Innovative Projects – External Laser Small Form Factor Pluggable Module for Co-Packaged Optics, Artificial Intelligence for Enhanced Network Operations and CEI-112G-Linear – at Q2 2021 Virtual Meeting
- March 11, 2021 – OIF Wraps Q1 2021 Member Meeting with New Co-Packaging Project; 3.2T Co-Packaged Module Project for Intra Data Center Switching Applications
- November 10, 2020 – OIF Launches Co-Packaging Framework Implementation Agreement Project
- September 21,2020 – OIF to Lead “Co-Packaged Optics – Why, What and How” Live Webinar Event; Industry Experts to Provide Perspectives on Co-Packaged Optics Challenges and Opportunities
- China Fiber Connect Forum 2021 – Suzhou: “Standardization for the Co-packaging of Photonics and Electronics”
Thursday, June 24, 2021 – TIME TBD
OIF has been studying the co-packaging of ASICs with optical and electrical transceivers within its Co-Packaging Framework Project. During this session, an OIF expert will address what co-packaging is, what some of the unique challenges of co-packaging are, and will describe what activities the OIF has initiated to address multi-vendor interoperability for co-packaging.
Presenter: Jeff Hutchins, OIF Physical & Link Layer Working Group – Co-Packaging Vice Chair, Ranovus
- OFC 2021 Media/Analyst Panel: “Data Center Optics are Heading Toward Co-packaged Optics: Why, How and When?”
Tuesday, 08 June, 12:30 – 13:30 PDT (UTC-7:00)This panel of esteemed industry experts will discuss the need for co-packaged optics (CPO) inside the data center.Speaker: Mark Filer, OIF Board Member, Microsoft, USA
For more information on this project contact Jeff Hutchins, OIF PLL Co-Packaging WG Vice Chair at firstname.lastname@example.org.
For information on other OIF current projects, please see OIF Current Work.
For public OIF Implementation Agreements, please see Implementation Agreements (IAs).