The Co-Packaging Framework IA studied the application spaces and relevant technology considerations for co-packaging of communication interfaces with one or more ASICs and initiated two new projects under its umbrella.

  • The 3.2T Co-Packaged Optical Module IA will define a 3.2T co-packaged module that targets the 51.2T Ethernet switching application utilizing 100G electrical lanes in a near-packaged placement.  Both internal and external laser source configurations are supported.  The IA will define interoperability for mechanical, thermal, electrical, optical pigtails, as well as for copper cable attachment.
  • The External Laser Small Form-Factor Pluggable (ELSFP) IA will define a future proofed external laser source form factor to support co-packaged optical modules. The form factor is a front panel pluggable module which employs a blind-mate optical connector located at the rear of the module for eye-safety considerations. The IA will define interoperability for mechanical, thermal, electrical, as well as for the optical connectors.

Press Releases


  • 2022 PLL Interoperability Demo at OFC

  • Speaking
    • China Fiber Connect Forum 2021 – Suzhou: “Standardization for the Co-packaging of Photonics and Electronics”
      Thursday, June 24, 2021 – TIME TBD
      OIF has been studying the co-packaging of ASICs with optical and electrical transceivers within its Co-Packaging Framework Project.   During this session, an OIF expert will address what co-packaging is, what some of the unique challenges of co-packaging are, and will describe what activities the OIF has initiated to address multi-vendor interoperability for co-packaging.
      Presenter:  Jeff Hutchins, OIF Physical & Link Layer Working Group – Co-Packaging Vice Chair, Ranovus
    • OFC 2021 Media/Analyst Panel: “Data Center Optics are Heading Toward Co-packaged Optics: Why, How and When?
      Tuesday, 08 June, 12:30 – 13:30 PDT (UTC-7:00)

      This panel of esteemed industry experts will discuss the need for co-packaged optics (CPO) inside the data center.
      Speaker: Mark Filer, OIF Board Member, Microsoft, USA


    For more information on this project contact Jeff Hutchins, OIF PLL Co-Packaging WG Vice Chair at

For information on other OIF current projects, please see OIF Current Work.

For public OIF Implementation Agreements, please see Implementation Agreements (IAs).