The Co-Packaging Framework IA will study the application spaces and relevant technology considerations for co-packaging of communication interfaces with one or more ASICs. A primary objective of this specification is to identify new opportunities for interoperability standards for possible future work at the OIF or other standards organizations. Upon completion, the work will be summarized in a Framework IA.

The scope of the Co-Packaging Framework project is to:

  • Identify the key co-packaged applications and their requirements
  • Study and identify key issues associated with co-packaged optics
  • Identify opportunities and develop industry consensus to pursue interoperability standards
  • Document the study in the Framework IA (a technical whitepaper)
  • Launch follow-on standardization activities at the OIF or other appropriate standard bodies

The initial projects started under Framework project’s umbrella are the 3.2T Co-Packaged Optical Module and the External Laser Small Form Factor Pluggable (ELSFP) Module.

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For information on other OIF current projects, please see OIF Current Work.

For public OIF Implementation Agreements, please see Implementation Agreements (IAs).