OIF Unites Interoperability and Innovation at OFC 2025: Driving Industry Progress in Performance, Efficiency and Capacity for Future-Oriented Data Centers
Fremont, Calif. – OIF continues to lead the charge in advancing interoperability, with 35 member companies uniting at OFC 2025 to showcase groundbreaking solutions that redefine performance, efficiency and capacity. This year’s demonstrations will highlight advancements in interoperability tailored to address the growing demands of future-oriented data centers, AI/ML technologies and disaggregated systems. OIF’s live […]
OIF to Showcase Advancements in Common Electrical I/O (CEI) Development and Energy-Efficient Interfaces (EEI) for AI Compute at DesignCon 2025
Fremont, Calif. – Showcasing its commitment to connecting with technical professionals in chip, board and systems design, OIF will host two panels at DesignCon 2025, the premier event for the high-speed communications and semiconductor industries taking place Jan. 28-30 in Santa Clara. The sessions will highlight OIF’s work and advancements in Common Electrical I/O (CEI) […]
