OIF Reveals New Common Electrical I/O Project to Strengthen an Open Ecosystem for Near Package Optics Architecture, Launches Management Track and Facebook joins Board of Directors at Q3 2021 Virtual Meeting

Fremont, Calif.—August 27, 2021 – OIF’s Q3 2021 Technical and MA&E Committees Meeting, held virtually August 2-6, 2021, demonstrated OIF’s leadership in next-generation channel definition by revealing a new Common Electrical I/O (CEI) project. Two projects under the Physical and Link Layer (PLL) newly formed Management track were also initiated. Jimmy Yu, vice president of Dell’Oro Group, was featured as the guest speaker, and a new Board Member was appointed.

NEW PROJECTS:

The CEI-112G-Extra Short Reach (XSR)+ project will allow lower power, multi-source 112Gbps (optimized for 106.25Gbps) electrical I/O interface to be developed with advanced PCB and substrate technology. The project will also support an open ecosystem based on Near Package Optics (NPO) architecture. OIF members are proposing that an “XSR+” type interface is used to add reach for NPO applications over the existing XSR interface to enable a multi-vendor open ecosystem without adding significant power.

The two projects under the PLL Management track include one to transition ownership and maintenance of the Common Management Interface Specification (CMIS) from the Quad Small Form Factor Pluggable Double Density (QSFP-DD) Multi-Source Agreement (MSA) to OIF, and the second project will focus on CMIS extensions for co-packaging implementations.

“Our quarterly meetings provide a critical platform for our members to discuss and debate interoperability challenges and industry standards that help OIF continue its mission to accelerate industry innovation,” explained David Stauffer, OIF Physical & Link Layer WG Chair and Kandou. “The new CEI-112G-XSR+ project will help strengthen an open ecosystem for NPO demonstrating OIF’s leadership in next-generation channel definition. Another significant new activity that addresses industry interoperability and standards is OIF’s new Management track. Due to the complementary/synergistic nature of the work with the OIF co-packaged optics, NPO, CEI and coherent optics projects, OIF will take over the ongoing CMIS revisions as well as further enhancements and CMIS extensions under this track.”

BOARD OF DIRECTORS APPOINTMENT

Rob Stone of Facebook was appointed to the OIF Board of Directors, filling an open position. Stone will serve the term for this position that goes through September 2022.

GUEST SPEAKER

Jimmy Yu served as the guest speaker providing OIF members with an update on the optical transport market. He leads Dell’Oro’s Optical Transport, Microwave Transmission and Mobile Backhaul Transport market research.

“OIF is a critical enabler to the optical market’s progression,” commented Yu. “The work of OIF members in these quarterly meetings to help guide interoperability is a significant benefit to the industry.”

About OIF

OIF is where the optical networking industry’s interoperability work gets done. Building on more than 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 125+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

Email: leah@wilkinson.associates

Office: 703-907-0010

 

 

 

OIF Experts to Share CEI Expertise and Provide Channel Standards Update at DesignCon 2021

What: DesignCon 2021 panel presentation on “Interoperable Common Electrical I/O (CEI) & Channel Standards Update: An OIF Perspective

Who: Join OIF members and industry experts:

  • Moderator: Nathan Tracy, OIF VP of Marketing, TE Connectivity
    Panelists:
  • Pirooz Tooyserkani, Cisco (presenting for Gary Nicholl, OIF Secretary/Treasurer, Cisco)
  • Mike Li, OIF Board Member, Intel
  • Cathy Liu, Broadcom Inc.
  • Keysight Technologies (presented by Mike Li)

When: Tuesday, August 17, 2021, 4:00-5:15 pm PT

Where: Meeting Room 211AB, Upper Level, San Jose McEnery Convention Center, San Jose, CA

Panel Overview:
With 50 Gbps electrical rates ramping in the industry, it’s the perfect time to understand the 72-116 Gbps common electrical interface (CEI) standardization performance levels coming from the OIF’s next update to their CEI-112G Implementation Agreements. OIF members and industry experts will provide an update on the 112 Gbps challenges and the tradeoffs considered and debated to reach this point in the draft document maturity.

And now that the CEI-112G standards work is wrapping up, OIF is turning its attention to knowledge building on the challenges that an electrical rate at 224 Gbps will bring and ideas to address these challenges, as well as initial ideas and proposals on how CEI-224G ought to be standardized. The industry will need to move to optical rates of 1.6Tbps and electrical interfaces and standards such as CEI-224G to enable 1.6Tbps optics and related networks.

Event Overview:
DesignCon is the premier high-speed communications and system design conference, offering industry-critical engineering education in the heart of electronics innovation — Silicon Valley.

About OIF

OIF is where the optical networking industry’s interoperability work gets done. Building on more than 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 125+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

Email: leah@wilkinson.associates

Office: 703-907-0010

OIF Announces Implementation Agreement for High Bandwidth Coherent Driver Modulator (HB-CDM) 2.0, Enabling Coherent Solutions to 800G and Above

New IA addresses the need for increased capacity and higher performance HB-CDM devices

Fremont, Calif.—July 28, 2021 – OIF, where the optical networking industry’s interoperability work gets done, today announced an Implementation Agreement (IA) for High Bandwidth Coherent Driver Modulator (HB-CDM) 2.0. This IA builds upon the HB-CDM 1.0 IA, released in November 2018, and leverages the same form factor.

The HB-CDM 2.0 follows the integrated laser and coherent receiver standards from OIF in enabling next-generation compact, high-performance coherent networking solutions. Since OIF’s HB-CDM 1.0 was released for 64 Gigabaud (GBd), enabling 400Gbps coherent systems, the market has seen a need for increased network capacity and higher performance. The HB-CDM 2.0 leverages the original Type 1 form factor for compatibility with existing systems and also includes a Flexible Printed Circuit (FPC) as an alternate interface and higher performance RF pitch options for extended rates for future systems.

“OIF’s HB-CDM 1.0 standard was a critical new component enabling optimized 400G+ metro and long-haul coherent networks, supporting the industry need for more capacity with a standardized footprint, interface and performance,” explained Technical Editor of the OIF HB-CDM 2.0 IA, Richard Ward, Intel. “The HB-CDM 2.0 is a natural extension covering 128GBd in coherent technology for 800G per wavelength and beyond coherent systems. The market demand reinforces OIF’s critical role in creating solutions to fulfill industry requirements and accelerating market adoption of optical networking technologies.”

About OIF

OIF is where the optical networking industry’s interoperability work gets done. Building on more than 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 120+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

Email: leah@wilkinson.associates

Office: 703-907-0010

 

OIF Thought Leaders to Provide Updates on Co-Packaging, 400ZR, Electrical Data Rates and Transport SDN Projects at Global Conferences

Presenting developments on innovative projects at OFC 2021, Optinet China 2021 and
China Fiber Connect Forum 2021

Fremont, Calif.—June 7, 2021 – OIF thought leaders will share insight into OIF’s interoperability work in groundbreaking technologies at some of the world’s largest global communications conferences: OFC 2021, Optinet China 2021 and China Fiber Connect Forum 2021.

OIF’s dynamic membership has brought about significant advances in the industry through its interoperability work.

“For more than 20 years, we’ve led the way for network operators and system, component and test equipment vendors to collaborate on, and test the interoperability of the electrical, optical and control solutions that directly impact the industry. Our members continue the path forward by sharing their expertise and OIF project updates at three global conferences this month,” said Ian Betty, OIF Board President, Ciena.

OFC 2021 Panels – Virtual

“Electrical Data Rates Keep Pushing Forward: An OIF Update”
Tuesday, June 08, 2021 – 11:00-12:00 PDT
A panel of industry experts and OIF members will provide an update on OIF’s CEI-112G and CEI-224G development work, including discussion and debate of 224G modulations.

  • Moderator: Nathan Tracy, OIF VP of Marketing, TE Connectivity
  • Panelists: David Stauffer, OIF Physical & Link Layer Working Group Chair, Kandou Bus SA; Gary Nicholl, OIF Secretary/Treasurer, Cisco; Cathy Liu, Broadcom Inc.; Mike Li, OIF Board Member, Intel and Thananya Baldwin, Keysight Technologies

“OFC Media/Analyst Panel: Data Center Optics are Heading Toward Co-packaged Optics: Why, How and When?”
Tuesday, June 08, 2021 – 12:30 – 13:30 PDT
This OFC-sponsored panel of industry experts will discuss the need for co-packaged optics (CPO) inside the data center. The path to CPO commercialization is fraught with risk. An entire ecosystem must be developed to support the transition from pluggable modules. The panel consists of specialists who come from different parts of this potential ecosystem to deliberate CPO’s merits, its potential pitfalls, how and perhaps when it can be successful.

  • OIF Speaker: Mark Filer, OIF Board Member, Microsoft

“400ZR Deployment and What’s Next: An OIF Update”
Friday, June 11, 2021 – 11:30-13:00 PDT
A panel of industry experts will provide an update to the state of the 400G coherent transmission ecosystem. They will provide an update for 400ZR deployment and the status of ongoing OIF projects that are intended to accelerate the deployment of optical networking equipment. A panel discussion including representatives of the DSP, optics, equipment, and end-user communities will ensure this will be a lively discussion.

  • Moderator: Richard Ward, OIF Market Awareness & Education Committee Co-Chair – PLL, Intel
  • Panelists: Ian Betty, OIF President, Ciena; Josef Berger, Marvell; Tom Williams, Cisco;  Paul Brooks, Viavi Solutions

Optinet China 2021 – Beijing

“Overview of OIF Transport SDN Projects”
Wednesday, June 16, 2021 – 11:50-12:10 China Standard Time
During this session, an OIF expert will discuss OIF’s Transport SDN projects and the 2020 Transport SDN API Interop Demonstration, where operator-defined use cases and deployment scenarios for multi-vendor Layer 0 and Layer 1 networks were tested in the Telefonica Madrid lab using the ONF T-API 2.1.3 and OpenConfig device APIs for interoperability between devices, SDN controllers and orchestrators.

  • Presenter: Hu Qian, OIF Representative, Senior Engineer, Optical Communication Research Center of China Telecom Beijing Research Institute

China Fiber Connect Forum 2021 – Suzhou

“Standardization for the Co-packaging of Photonics and Electronics”
Thursday, June 24, 2021 – Time TBD
OIF has been studying the co-packaging of ASICs with optical and electrical transceivers within its Co-Packaging Framework Project.   During this session, an OIF expert will define co-packaging, its’ unique challenges, and describe OIF activities to address multi-vendor interoperability for co-packaging.

  • Presenter:  Jeff Hutchins, OIF Physical & Link Layer Working Group – Co-Packaging Vice Chair, Ranovus

 

About OIF

OIF is where the optical networking industry’s interoperability work gets done. Building on more than 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

Email: leah@wilkinson.associates

Office: 703-907-0010

 

 

OIF Reveals Three Innovative Projects – External Laser Small Form Factor Pluggable Module for Co-Packaged Optics, Artificial Intelligence for Enhanced Network Operations and CEI-112G-Linear – at Q2 2021 Virtual Meeting

Fremont, Calif.—May 26, 2021 – Activity was high at OIF’s Q2 2021 Technical and MA&E Committees Meeting, held virtually May 10-14. Members initiated three new innovative projects, including a Co-Packaged Optics external laser module, Artificial Intelligence (AI) for Enhanced Network Operations and CEI-112G-Linear, in addition to announcing a network operator survey for the 2022 Networking Demo.

External Laser Small Form Factor Pluggable (ELSFP) Module Project – companion project to support co-packaged optics applications

This project for a blind-mate pluggable external light source module will define a new form factor optimized to package lasers to support co-packaged optical modules. It also includes provisions for the longevity of this form factor beyond the initial scope of the Co-Packaged Optics Module project (i.e., more fibers, thermal, and optical power classes).

“The ELSFP project is an important step for enabling co-packaged optics deployments,” according to Gary Nicholl, Cisco and OIF board member. “And, the project objectives include the necessary technical considerations to ensure this project will be relevant for multiple generations.”

Application of Artificial Intelligence to Enhanced Network Operations Project

A healthy and high-performance network serves as the foundation for all 5G application scenarios. Traditional approaches face significant difficulties in automatically and efficiently analyzing network data, solving network faults, and optimizing network performance. This new project will result in a white paper identifying a collection of use cases for applying AI to construct intelligent, resilient and high-performance optical and packet networks.

CEI-112G-Linear Project

A linear Chip-to-Optical Engine interface is needed to enable low power, low cost, small form factor 112G serial optical modules in Co-Packaged Optics, Near Package Optics (NPO) and server/GPU applications. This new project will facilitate increased bandwidth and reduced power of switch ports using co-packaged and closely packaged optical modules.

Network Operator Survey – 2022 Transport SDN Interoperability Demonstration

The OIF Networking Interoperability Working Group is surveying operators worldwide for their input and interest in participating in a 2022 Transport SDN Interoperability Demonstration. As with past surveys, responses will be anonymized, tabulated and summarized. The deadline to complete the survey is Tuesday, June 15, 2021. Interested operators can click here to download the survey.

About OIF

OIF is where the optical networking industry’s interoperability work gets done. Building on more than 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

Email: leah@wilkinson.associates

Office: 703-907-0010

 

OIF Wraps Q1 2021 Member Meeting with New Co-Packaging Project; 3.2T Co-Packaged Module Project for Intra Data Center Switching Applications

Fremont, Calif. – Highlights from OIF’s first member meeting of the year include a new co-packaging project launch, an industry talk from Vladimir Kozlov, founder and CEO, LightCounting and a joint workshop with the Telecom Infra Project (TIP) Mandatory Use Case Requirements for SDN for Transport (MUST) project. Additionally, members elected a new Networking & Operations Working Group Chair following the meeting. The Q121 Technical and MA&E Committees Meeting was held virtually February 22-26.

NEW PROJECT

OIF started a 3.2T Co-Packaged Module project for intra data center switching applications. The 3.2T Co-Packaged Optical Module Implementation Agreement (IA) is the first project initiated under the umbrella of the Co-Packaged Framework Project announced in November 2020. The IA will define a 3.2T co-packaged optical module that targets Ethernet switching applications utilizing 100G electrical lanes. It will include the following interoperability specifications:

  • Optical interface options supporting 400GBASE-FR4 and 400GBASE-DR4 with backwards compatible to 200G interfaces
  • CEI-112G-XSR high speed electrical interfaces
  • Electrical, mechanical, and management interfaces

“This 3.2T Co-Packaging project builds on OIF’s 20+ year successful track record to anticipate and address the industry’s needs,” said Jeff Hutchins, Ranovus and OIF Physical and Link Layer Working Group, Co-Packaging Vice Chair. “With its broad membership from across the eco-system, OIF is well positioned to create unified host, module and control specifications.”

“The industry has clearly articulated the need for a standardized co-packaged solution to address data center power constraints, and further, to enable new network architectures and applications,” said Mark Filer, Microsoft Principal Hardware Engineer and OIF Board Member. “The 3.2T Co-Packaged Optical Module project is a concrete step toward that goal, and OIF is uniquely qualified to rapidly execute on the implementation agreement in order to meet the market needs.”

GUEST SPEAKER

The meeting’s guest speaker, Kozlov, provided attendees with an overview of the market for Ethernet and DWDM optics such as “ZR optics” for DCI applications, including trends, forecasts and expected changes in the supplier landscape.

“Transition from pluggable to co-packaged optics is a radical change for the industry, but there is no other way to support future bandwidth requirements of Mega Datacenters and AI clusters,” said Kozlov.

TIP MUST WORKSHOP

Members of the OIF Networking Interoperability Working Group and TIP MUST project held a joint workshop. The members agreed to explore potential projects to further define, validate and implement transport SDN technologies in open, disaggregated open optical networks. This work will leverage the TIP MUST reference architecture and use cases as well as the experience and findings of the successful OIF 2020 Transport SDN API Interoperability Demonstration.

TECHNICAL COMMITTEE

Members elected Jia He, Huawei Technologies Co., Ltd., as the new Networking & Operations Working Group Chair.

About OIF
OIF is where the optical networking industry’s interoperability work gets done. Building on more than 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
Email: leah@wilkinson.associates
Office: 703-907-0010

OIF Validates Maturity of Transport SDN APIs in 2020 Multi-Vendor Interoperability Demonstration – Results published in new white paper

Successful collaborative multi-vendor demo revealed high percentage of network operator-favored use cases supported and high product maturity, identified areas for interoperability improvement

Fremont, Calif. OIF today revealed the results of its 2020 Transport SDN Application Programming Interface (API) Interoperability Demonstration in a new white paper now available here. The white paper includes details on the test topology, testing methodology, technical specifications, use cases and findings.

The 2020 joint network operator, multi-vendor demo event focused on testing SDN-based programmability, control, and automation to support the industry to develop standard, robust, interoperable APIs for widescale adoption. The testing was conducted on a partially disaggregated open optical network architecture with operator-defined use cases.

“Interoperable transport SDN APIs are essential capabilities to enable open optical networks,” said Mauro Costa, Head of planning, strategy & architecture, Telia Company, a consulting network operator for this year’s demo. “International co-operations, like this one with OIF, allow the industry to progress at a high pace and Telia Company welcomes the opportunity offered by this interoperability demo. It reinforces that we are advancing in the right direction and that the maturity of the APIs implementation for optical SDN architecture is improving.”

The results of the 2020 demo were presented during a public read-out webinar held on 12 January 2021 in conjunction with Lightwave and on 19 January 2021 at a private, invitation-only virtual event jointly hosted by OIF and Telefónica. On-demand viewing of the Lightwave webinar is available here.

The interoperability testing involved three phases over ten weeks, Sept – Nov 2020, in Telefónica’s Madrid lab:

  • Phase 1: Open Networking Foundation (ONF) T-API NBI testing, Scope: ONF T-API v2.1.3 reference implementation agreement TR-547
  • Phase 2: Open terminals testing including discovery, provisioning, service de-activation and streaming telemetry
  • Phase 3: End-to-end disaggregation demo, Scope: evaluation and demonstration of end-to-end use cases

Findings and results of the testing include:

  • Vendor products demonstrate a high level of maturity and support of operator-favored use cases, based on T-API version 2.1.3 and OpenConfig APIs. Vendors have adopted the ONF 2.1.3 Reference Implementation Agreement (ONF TR-547) rapidly and with few deviations.
  • Inconsistent interpretation of the Internet Engineering Task Force (IETF) RESTCONF standard was one interoperability issue identified, especially standard authentication. Clarification to RESTCONF provisioning behavior and implementation scalability were also identified as issues.
  • A particularly good level of compliance to the OpenConfig models was demonstrated by implementations, however, some areas such as key exchange algorithms for IETF NETCONF and complex use cases for device provisioning and commissioning did generate issues.

Participating vendors included ADVA, Ciena, Cisco Systems, Infinera and Nokia. Network operator Telefónica hosted the demo. China Telecom, Telia Company and TELUS participated as consulting network operators.

Additional information and an infographic describing the demo can be found here.

About OIF

OIF is where the optical networking industry’s interoperability work gets done. Building on 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

Email: leah@wilkinson.associates

Office: 703-907-0010

 

OIF Launches 800G Coherent and Co-Packaging Framework IA Projects, Elects New Board Members/Positions, Officers and Working Group Chairs

Fremont, Calif. – OIF, the global industry forum accelerating market adoption of advanced interoperable optical networking solutions, today announced the start of two new projects –  800G Coherent and Co-Packaging Framework, availability of a new FlexE for 400ZR white paper, newly elected board members/positions and working group representatives. These activities and elections took place at the Q420 Technical and MA&E Committee meetings held virtually November 2-November 6, 2020.

New Projects

800G Coherent

In scope for the 800G Coherent project is to define interoperable 800G coherent line specifications for campus and DCI applications. The resulting Implementation Agreement (IA) will:

  • Define single-lambda 800G coherent line interfaces for two applications
    • Amplified, single span, DWDM links up to 80-120km
    • Unamplified, fixed wavelength links of 2-10km
  • Support Ethernet client(s) (minimum 100GE) up to 800G aggregate bandwidth

“The next standardized coherent rate beyond 400ZR will be technically challenging with many factors to be considered,” said Tad Hofmeister, Technical Lead, Optical Networking Technologies at Google and OIF Vice President. “With the 800G Coherent IA, OIF is in a unique position to take a leadership role in defining interoperable 800G coherent line interfaces for various applications.”

Co-Packaging Framework IA

The Co-Packaging Framework IA, announced on November 10, 2020, will study the application spaces and relevant technology considerations for co-packaging of communication interfaces with one or more ASICs. A primary objective of this specification is to identify new opportunities for interoperability standards for possible future work at the OIF or other standards organizations. Upon completion, the work will be summarized in a Framework IA.

White Paper

A new OIF white paper addressing 400ZR applications requiring multiplexing of lower rate Ethernet signals (e.g. 100GE) and how to leverage FlexE for this service multiplexing is now available.

The OIF 400ZR IA includes mapping of 400G Ethernet signals as defined in IEEE 802.3, but not lower rate services such as 100G Ethernet. This white paper describes utilizing the OIF FlexE Implementation Agreement multiplexing of lower service rates, such as 100G and 200G Ethernet to a 400G frame that can be carried by 400ZR devices. Example profiles are provided to guide interoperability in common scenarios.

Election Results

  • Board of Directors:
    • Ian Betty, Ciena, continues to serve on the Board and was appointed as President
    • Mark Filer, Microsoft, was elected to the Board (two-year term)
    • Tad Hofmeister, Google, continues to serve on the Board and was re-appointed as Vice President
    • Mike Li, Intel, was re-elected to the Board (one-year term)
    • Jeffery Maki, Juniper Networks, was elected to the Board (one-year term)
    • Gary Nicholl, Cisco, was re-elected to the Board (two-year term) and appointed as Secretary/Treasurer
    • Nathan Tracy, TE Connectivity, was re-elected to the Board (two-year term) and appointed as VP of Marketing
  • Officers:
    • Klaus-Holger Otto, Nokia, was elected as Technical Committee Chair
    • Karl Bois, Hewlett Packard Enterprise, was elected as Technical Committee Vice Chair
    • Lyndon Ong, Ciena, was re-elected as Market Awareness & Education Committee Co-Chair, Networking
    • Richard Ward, Intel, was elected as Market Awareness & Education Committee Co-Chair, Physical and Link Layer
    • Dave Brown, Nokia, continues to serve as Director of Communications
  • Technical Committee:
    • Michael Klempa, Amphenol, was elected as Physical and Link Layer Interoperability Working Group Chair (two-year term)
    • Jeffery Maki, Juniper Networks, was re-elected as Physical Layer User Group Working Group Chair (two-year term)

“I’m looking forward to serving OIF members as president of this vital organization and thank all those who have served and continue to serve,” said Ian Betty, Ciena and new OIF president. “OIF’s role continues to be critical in making great strides in interoperability solutions for today’s and tomorrow’s challenges. Congratulations to the entire board and those appointed to leadership positions – your role is integral to OIF’s continued success.”
 

About OIF
OIF is where the optical networking industry’s interoperability work gets done. Building on 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
Email: leah@wilkinson.associates
Office: 703-907-0010

 

OIF Completes Successful 2020 Joint Network Operator, Multi-Vendor Transport SDN API Interoperability Demonstration

Public webinar, read-out events planned for Q1 2021

Fremont, Calif.—December 2, 2020 – OIF today announced the completion of its multi-vendor 2020 Transport SDN Application Programming Interface (API) Interoperability Demonstration. To validate the benefits of transport SDN worldwide and transport network transformation for the 5G era, OIF members participated in a ten-week long interoperability testing exercise in Telefonica’s Madrid lab.

The testing focused on SDN-based programmability, control and automation — testing Layer 1 and Layer 0 OTN control using ONF T-API 2.1.3, with additional testing of OpenConfig device APIs for transport equipment in network-operator-defined use cases.

“Operators have demanded more open optical networks to enable flexibility, lower costs, and best-of-breed options,” said Scott Wilkinson, Lead Analyst at Cignal AI. “Standard management interfaces and multi-vendor interoperability are critical to open optical networks. The interoperability demonstration recently performed under the guidance of the OIF is a major step towards achieving those operator goals.”

Participating vendors included ADVA, Ciena, Cisco Systems, Infinera and Nokia. Network operator Telefonica hosted the demo. China Telecom, Telia and TELUS participated as consulting network operators.

“The successful completion of the OIF 2020 Transport SDN API interoperability demonstration is a significant milestone toward widespread SDN deployment in production networks,” said Arturo Mayoral, Telefónica Transport Global CTIO Unit – Technology Expert and Lead of Optical SDN strategy. “By aligning vendors for a shared purpose – interoperability – and testing multiple use cases, we’re fostering manageability and flexibility in the network to allow deployment of cloud-based services, meet dynamic bandwidth demands and accelerate transport network transformation for the 5G era.”

The much-anticipated results of the multi-vendor demonstration will be revealed during a public read-out webinar event being held in partnership with Lightwave, Tuesday 12 January 2021, 6:00-7:30am PST. Register for free here.

A private read-out event for demo participants and invited Network Operators is scheduled for Tuesday 19 January 2021.

OIF representatives will give presentations on the current status of the 2020 OIF Transport SDN API Interoperability Demonstration during the below events:

NGON & DCI World Digital Symposium – Friday 04 December 2020 – 20:00-20:15pm CET, OIF Speaker: Arturo Mayoral López de Lerma, Telefonica S.A

ECOC – Monday 07 December 2020 – 17:20-17:40pm CET, OIF Speaker: Arturo Mayoral López de Lerma, Telefonica S.A

Additionally, OIF developed an infographic to visually explain the 2020 Transport SDN API Interop Demo. Print and web-ready files can be downloaded here: https://1drv.ms/u/s!AgxJQTMC3jSUiIhCVZzu9vewlRGU0w?e=hl5D3C

A technical white paper and an executive summary of the demo result will be available in Q1 2021.

Additional information can be found at https://www.oiforum.com/technical-work/2020-oif-transport-sdn-api-interoperability-demo/

2020 Transport SDN Application Programming Interface (API) Interoperability Demonstration PR Boilerplate:

Leading the acceleration of the commercialization of transport SDN worldwide and transport network transformation for the 5G era, OIF will bring new use cases and deployment scenarios into Telefonica’s lab to test multi-vendor interoperability of Layer 1 and Layer 0 OTN control using ONF T-API 2.1.3 and OpenConfig Transport APIs. The 2020 Transport SDN Application Programming Interface (API) interoperability demonstration builds on OIF’s previous transport API requirements and interoperability demonstrations which substantiated T-API as the northbound interface (NBI) of choice, establishing a foundation for open, programmable networks that allow network operators to efficiently deliver dynamic multi-domain connectivity services to the market.

About OIF

OIF is where the optical networking industry’s interoperability work gets done. Building on 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

Email: leah@wilkinson.associates

Office: 703-907-0010

 

OIF Launches Co-Packaging Framework Implementation Agreement Project

Co-packaging of communication interfaces project establishes OIF’s leadership in this critical new area of standards for interoperability

Fremont, Calif. – OIF, the global industry forum accelerating market adoption of advanced interoperable optical networking solutions, today announced the start of the Co-Packaging Framework Implementation Agreement (IA) umbrella project. The new project start approval took place during last week’s Q420 Technical and MA&E Committee meetings held virtually November 2-6, 2020.

The Co-Packaging Framework IA will study the application spaces and relevant technology considerations for co-packaging of communication interfaces with one or more ASICs. A primary objective of this specification is to identify new opportunities for interoperability standards for possible future work at the OIF or other standards organizations. Upon completion, the work will be summarized in a Framework IA.

“It is critical that the industry be aligned on the solutions needed to move co-packaged interoperability forward,” said Jeff Hutchins, Ranovus and OIF Physical and Link Layer (PLL) Working Group – Co-Packaging Vice Chair. “With its member-driven focus, OIF is the ideal forum to facilitate industry conversation and drive interoperability of co-packaging with ASICs.”

The scope of the Co-Packaging Framework project is to:

  • Identify the key co-packaged applications and their requirements
  • Study and identify key issues associated with co-packaged optics
  • Identify opportunities and develop industry consensus to pursue interoperability standards
  • Document the study in the Framework IA (a technical whitepaper)
  • Launch follow-on standardization activities at the OIF or other appropriate standard bodies

In October, OIF’s public webinar “Co-Packaged Optics – Why, What and How” in partnership with Lightwave drew significant industry interest, reinforcing the need for industry discussion. The virtual event featured talks from industry-leading experts from: Cisco, Facebook, Intel, Juniper Networks,  Microsoft, Ranovus, Senko Advanced Components and TE Connectivity. Click here for free on-demand viewing of this webinar.

 

About OIF
OIF is where the optical networking industry’s interoperability work gets done. Building on 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
Email: leah@wilkinson.associates
Office: 703-907-0010

 

OIF to Lead “Co-Packaged Optics – Why, What and How” Live Webinar Event; Industry Experts to Provide Perspectives on Co-Packaged Optics Challenges and Opportunities

In partnership with Lightwave, the free online event will feature industry-leading experts from end-users, equipment developers and component vendors

Fremont, Calif.—September 21, 2020 – Recognizing the high-level of industry interest in co-packaging of optics with ASICs and the need for industry discussion and collaboration, OIF will hold a public webinar “Co-Packaged Optics – Why, What and How” on Wednesday, October 14th at 7am PDT/9am CDT/10am EDT/4pm CEST. The free 2.5 hour webinar, hosted by OIF and Lightwave, will feature talks and discussion from industry-leading experts from: Cisco, Facebook, Intel, Juniper Networks,  Microsoft, Ranovus, Senko Advanced Components and TE Connectivity. Register here for this free event.

“After holding an OIF members-only workshop on co-packaged optics back in July 2020, OIF quickly recognized the industry-wide interest this topic has generated and the need for wider engagement and discussion,” said Jeff Hutchins, Ranovus, OIF member and coordinator of this webinar. “This public OIF webinar presents a unique opportunity for industry and OIF members to explore and discuss key drivers as well as the important constraints (electrical, thermal, optical, etc.) so we can be aligned on the solutions needed to move co-packaged optics interoperability forward.”

Webinar presenters will review key drivers for co-packaged optics as well as the conventional alternatives and highlight applications where co-packaged optics can deliver unique benefits. Hear from end-users, equipment developers, and component vendors as they discuss:

  • Pluggable modules, board mounted optics, and co-packaged optics comparisons
  • Applications which drive the need for co-packaged optics
  • Considerations for realizing co-packaged optics
  • Steps to industry standardization

Details on this live webinar event are as follows:

October 14, 2020 – 7:00am-9:30am PDT

Agenda

7:00am – Welcome & Intro – Stephen Hardy, Editorial Director, Lightwave and Nathan Tracy, TE Connectivity and OIF President

7:10am – Optical Transceivers, Pros & Cons – Mark Nowell, Cisco

7:25am – Co-Packaged Optics – Rob Stone, Facebook

7:40am – Co-Packaged Optics – Ram Huggahalli, Microsoft

7:55am – Dense Optical Form Factors – Jeffery Maki, Juniper Networks and OIF Physical Layer User Group Working Group Chair

8:10am – Optical Connectivity – Tiger Ninomiya, Senko Advanced Components

8:25am – Laser Sources – Richard Jones, Intel

8:40am – Standardization – Jeff Hutchins, Ranovus

8:55am – Q&A – Stephen Hardy and Nathan Tracy

 

To register for the free event, click here. The webinar is open to the public and a certificate of attendance will be offered.

 

About OIF
OIF is where the optical networking industry’s interoperability work gets done. Building on 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
Email: leah@wilkinson.associates
Office: 703-907-0010

 

 

OIF Approves CEI-224G Development Project, Reviews Co-packaging of Optics with ASICs Workshop, Announces Optical Module Management Interface Survey Results at Q3 Meeting

Fremont, Calif.—August 26, 2020 – OIF members continued to drive industry interoperability efforts forward during the Q3 2020 Technical and MA&E Committees Meeting, held August 3-7. This quarter’s virtual meeting resulted in the approval of the CEI (Common Electrical I/O) -224G Development Project, a wrap-up of the “Co-packaging of Optics with ASICs” members-only workshop that was held July 20th and a readout of the results of the public Optical Module Management Interface Survey.

“OIF strives to challenge our member companies to achieve more in order to accelerate industry innovation and standards that maintain alignment with network operator trends and needs,” explained Nathan Tracy, TE Connectivity and OIF President. “We are continually advocating for increased interoperability and the OIF quarterly meetings provide the ideal forum for members to debate and discuss the interoperability challenges that the industry is trying to overcome. For example, getting electrical signals to travel at 224 Gbps over workable distances is a challenge we are looking forward to exploring.”

NEW PROJECT – 224 Gbps CEI PROJECT APPROVED

During OIF’s Q2 meeting in May, members previewed a proposed project start to address next generation architectures and data rates around 224 Gbps for CEI interfaces. The project was formally approved during this month’s meeting. The expected result will be a technical white paper summarizing a consensus-based body of knowledge which will then enable several project starts for next generation CEI clauses addressing specific reaches and architectures.

“CO-PACKAGING OF OPTICS WITH ASICs” WORKSHOP RECAP

OIF held a “Co-packaging of Optics with ASICs” workshop on July 20th for OIF members. The workshop explored the various challenges of co-packaging of optics and identified opportunities for industry collaboration. Presenting companies included Applied Optoelectronics, Inc., Facebook, Inphi, Intel, Keysight Technologies, Microsoft, Ranovus, Senko Advanced Components, Inc. and TE Connectivity. Based on the success of the member workshop and increasing interest in the topic industry-wide, OIF is planning a public workshop on co-packaging of optics. Details and registration will be available soon.

OPTICAL MODULE MANAGEMENT INTERFACE SURVEY

OIF recently conducted a public industry survey designed to determine how the Coherent Common Management Interface Specification Implementation Agreement is viewed by the industry and the level of industry alignment and support for further standardization of optical module management. Results of the survey were presented on a public webinar on July 30 and recapped during the Q3 meeting. Click HERE to download the survey results.

About OIF

OIF is where the optical networking industry’s interoperability work gets done. Building on more than 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

Email: leah@wilkinson.associates

Office: 703-907-0010

 

OIF Launches Optical Module Management Interface Survey, Solicits Industry Input

Survey to gather industry opinion regarding evolution of optical module management

Fremont, Calif.—July 1, 2020 – There is ongoing evolution of form factors and a trend for modules to incorporate data processing and programmable module functions. However, there is increasing consensus that the intrinsic restrictions of throughput and data organization will not scale well into the future.

OIF, where the optical networking industry’s interoperability work gets done, is launching a survey designed to determine how the Common Management Interface Specification is viewed by the industry and the level of industry alignment on and support for further standardization of optical module management. The subject of module management encompasses physical interfaces, communication protocols and management applications layers.

The survey is available now and open to all who can act as a stakeholder and represent their company’s viewpoint – module vendors, system vendors, and network operators. Multiple responses per company are also allowed. Responses will be collated anonymously and then evaluated by a dedicated survey evaluation team.

OIF will hold a public webinar on Thursday, July 30, 2020 at 7am PDT to announce the results of the survey. Visit the survey webpage to download the survey and for information on the survey deadline, where to submit answers and how to register for the webinar.

“The OIF 400ZR specification covers interoperability on the network fiber and also at the host by defining the electrical interface and software management interface,” said Jeffery J. Maki, distinguished engineer II, Juniper Networks and OIF Physical Layer User Group Working Group Chair. “All of this is done to drive a true multi-sourcing opportunity for the module. Beyond 400ZR, support of the software management interface is an area OIF would like to continue to address and seeks, through the use of a survey, to gauge industry interest and the potential solution approach.”

OIF announced the Coherent Common Management Interface Specification (C-CMIS) Implementation Agreement (IA) in March. This IA serves as an extension to the CMIS (QSFP-DD/OSFP/COBO) management specification, specifically targeting DCO modules and is an important part of the developing 400ZR ecosystem.

 

About OIF

OIF is where the optical networking industry’s interoperability work gets done. Building on 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

Email: leah@wilkinson.associates

Office: 703-907-0010

OIF Announces Participants in 2020 Joint Network Operator, Multi-Vendor Transport SDN API Interoperability Demonstration

Interoperability is vital to facilitating operator deployment of SDN and accelerating transport network transformation for the 5G era

Fremont, Calif. —June 16, 2020 – Leading the acceleration of the commercialization of transport SDN worldwide and transport network transformation for the 5G era, OIF today announced plans for its 2020 Transport SDN Application Programming Interface (API) interoperability demonstration.

The 2020 event will focus on SDN-based programmability, control and automation and showcase testing in Telefonica’s lab in Europe over a six-week period (September to October).

Building on OIF’s 2018 and 2016 interoperability demonstrations that helped establish ONF Transport-API (T-API) as the defacto northbound interface (NBI) standard, the 2020 demonstration will test Ethernet, Layer 1 OTN and Layer 0 OTN control using ONF T-API 2.1.3, with additional testing of OpenConfig device APIs for transport equipment in network-operator-defined use cases.

Manageability and flexibility of the network are critical to allow network operators to successfully deliver a range of cloud-based services, meet dynamic bandwidth demands, and to accelerate transport network transformation for the 5G era. Established open Transport SDN APIs can help network operators:

  • improve network agility to adapt to dynamic service demands and traffic patterns
  • improve service provisioning and time-to-revenue
  • reduce maintenance and management with simplified control and automation

The multi-vendor interoperability demonstration includes participating vendors ADVA, Ciena, Cisco Systems, Infinera and Nokia. China Telecom and Telia are participating as consulting network operators.

“Widespread adoption of transport SDN is a must for network operators to accelerate their transformation for the 5G era and reap the benefits of a more dynamic and open network,” said Dave Brown, Nokia and OIF Officer – Director of Communications. “OIF’s facilitation of this thorough test of specifications and interoperability of open transport SDN APIs will highlight the tools necessary to create an open manageable, flexible network.”

“Interoperability is the key success factor for SDN deployment in production networks,” said Arturo Mayoral, Telefónica Transport Global CTIO Unit – Technology Expert and Lead of Optical SDN strategy. “This OIF interop event arrives at the perfect moment to evaluate maturity of the commercial solutions, fostered by the recent efforts done by Telefónica through the iFUSION project, in the design of reference implementations based on ONF T-API and OpenConfig standards.”

Public read-out events highlighting the results of the testing will take place at select industry events in Q4 2020. In Q1 2021, OIF will hold a webinar and launch a whitepaper describing the results of the event. Additional information can be found at https://www.oiforum.com/technical-work/2020-oif-transport-sdn-api-interoperability-demo/

About the 2020 OIF Transport SDN Application Programming Interface (API) Interoperability Demonstration

Leading the acceleration of the commercialization of transport SDN worldwide and transport network transformation for the 5G era, Optical Internetworking Forum (OIF), will bring new use cases and deployment scenarios into Telefonica’s lab to test multi-vendor interoperability of Ethernet, Layer 1 OTN, Layer 0 OTN control using ONF T-API 2.1.3 and OpenConfig device APIs. The 2020 Transport SDN Application Programming Interface (API) interoperability demonstration builds on OIF’s previous transport API requirements and interoperability demonstrations which substantiated T-API as the northbound interface (NBI) of choice, establishing a foundation for open, programmable networks that allow network operators to efficiently deliver dynamic multi-domain connectivity services to the market.

About OIF

OIF is where the optical networking industry’s interoperability work gets done. Building on 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

Email: leah@wilkinson.associates

Office: 703-907-0010

 

 

OIF Announces 224 Gbps Project Preview, Election Results, Upcoming Webinars and Integrated Packet Optical SDN Implementation Agreement at Q2 Virtual Meeting

Fremont, Calif.—June 4, 2020 – OIF’s Q2 2020 Technical and MA&E Committees Meeting, held virtually May 11-15, resulted in a preview of a proposed 224 Gbps project, election results, upcoming webinar announcements and the release of the Integrated Packet Optical SDN Implementation Agreement (IA).

NEW PROJECT PREVIEW – 224 Gbps PROJECT START PROPOSAL

The next electrical data rate beyond 112 Gbps will be technically challenging with many factors to be considered, but already industry discussions are beginning to take place. In its continued efforts to meet industry needs, OIF previewed a proposed project start to address data rates around 224 Gbps. The project is expected to start in Q3 and will consider the following challenges:

  • What reaches need to be supported
  • What modulations will be appropriate for each reach
  • Simulation tools
  • Test and measurement methodologies

“By providing an active forum for discussions on next generation architectures and data rate beyond 112 Gbps, OIF is performing an essential role in accelerating standards and requirements. We expect this project to result in output data and baseline materials that will drive next generation CEI clauses and enable 1.6 Tbps rate architectures,” said Nathan Tracy, TE Connectivity and OIF President. “In addition, it is anticipated this next generation electrical rate will keep the industry on track to deliver lower cost and complexity 400 Gbps and 800 Gbps architectures as well.”

ELECTIONS

Dave Stauffer, Kandou Bus, S.A., was re-elected as Physical and Link Layer Working Group Chair through January 2022.

UPCOMING WEBINARS

OIF will hold two upcoming webinars:

– “Cu (See you) Beyond 112 Gbps” – Thursday, June 18th at 7am PDT/9am CDT/10am EDT/4pm CEST – This online event, in partnership with Lightwave and Electronic Design, will feature a dynamic discussion between end-users, equipment developers and component suppliers. The webinar event is free and open to the public. Register here.

– OIF will hold a members-only “Co-packaging of Optics with ASICs” webinar on Monday, July 20th at 7am PDT/9am CDT/10am EDT/4pm CEST. The webinar will explore challenges in realizing high density co-packaged optic solutions for artificial intelligence (AI) and machine learning (ML) applications. It will identify key drivers as well as important constraints (electrical, thermal, optical, etc.) as it continues OIF’s mission of identifying industry gaps in standards and explores opportunities to provide interoperable solutions.

INTEGRATED PACKET OPTICAL SDN IMPLEMENTATION AGREEMENT

Packet networks and optical networks have typically been managed separately in operator networks, resulting in low efficiency in both service provisioning and network maintenance. SDN brings in new options and opportunities based on its open and software-ized characteristics.

The OIF Integrated Packet Optical SDN IA defines a standardized universal open framework and principal use cases for integrated SDN control of packet and optical networks that at the solution level will normalize the architecture, interfaces and behaviors and help move the industry forward. The new IA can be downloaded here.

“OIF’s Integrated Packet Optical SDN IA brings meaningful use cases, architecture and technical requirements for cooperation between IP and Optical layers via SDN,” said Junjie Li, China Telecom and OIF Network Operator Working Group Chair. “Operators look to OIF as a place to address industry gaps and achieve maximum benefit for their optical networks. I believe this work will help us to construct a bridge between packet and optical and make our network smarter and simpler.”

About OIF

OIF is where the optical networking industry’s interoperability work gets done. Building on 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

Email: leah@wilkinson.associates

Office: 703-907-0010

 

OIF to Present “Cu (see you) Beyond 112 Gbps” Webinar to Debate Requirements for Next Generation Electrical Interconnects, including Networking Trends and Cloud Scale Applications

The online event, in partnership with Lightwave and Electronic Design, will feature a dynamic discussion between end-users, equipment developers and component suppliers

Fremont, Calif.—June 1, 2020 – OIF, where the optical networking industry’s interoperability work gets done, will hold a webinar “Cu (see you) Beyond 112 Gbps” on Thursday, June 18th at 7am PDT/9am CDT/10am EDT/4pm CEST. The free webinar, hosted by Lightwave and Electronic Design, will feature talks and discussion from industry-leading experts: Arista, Broadcom Inc., Cisco, Facebook, Google, Innovium, Intel and TE Connectivity. Register now for this valuable event.

“OIF has a long history of developing electrical interface specifications (CEI Implementation Agreements) that have been the foundation for almost every industry standards group,” said Nathan Tracy, TE Connectivity and OIF president. “There is little doubt there will be electrical interfaces required beyond 112 Gbps and it is safe to say the OIF will be a part of that development. This webinar is a critical opportunity for OIF members and industry to participate in an open debate and discussion on this topic.”

Participants will gain new insights from end-users, equipment developers and component suppliers on the needs for next generation interoperable electrical IO rates as well the challenges and possible technical options to make these rates attainable. The panel of experts will address questions such as: Do electrical interfaces hit the wall beyond 112 Gbps? Is 224 Gbps possible? What is a useful reach? Does copper have a future? The webinar will also include a brief summary of OIF’s existing and in-process electrical IO work.

The first half of the live event will focus on the industry view and need for the next generation electrical interconnects, including networking trends and cloud scale applications. The second half will include presentations and discussion on the technical challenges and directions that could be considered to realize interoperable next generation common electrical IOs that balance density, power, reach and risk.

Details are as follows:

June 18, 2020 – 7:00am-9:30am PDT
Agenda

Introduction – Stephen Hardy, Editorial Director, Lightwave and Nathan Tracy, OIF president and TE Connectivity

User Demand
End Users’ Perspective – Srinivas Venkataraman, Facebook; Sara Zebian, Google

System Supplier Perspective
Equipment Developers’ Perspective – Andy Bechtolsheim, Arista; Rakesh Chopra, Cisco

Component Suppliers’ Analysis/Perspective
Switch Developer – Kapil Shrikhande, Innovium
Improved Copper Components and Channels – Dave Helster, TE Connectivity
SERDES, Modulation and FEC – Adam Healey, Broadcom Inc; Mike Li, Intel

Live Q&A

To register for the free event, click here. The webinar is open to the public and a certificate of attendance will be offered.

About OIF
OIF is where the optical networking industry’s interoperability work gets done. Building on 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
Email: leah@wilkinson.associates
Office: 703-907-0010

OIF Publishes Implementation Agreement for 400ZR Coherent Optical Interface

Spec addresses 400ZR multi-vendor interoperability required for cloud scale data center interconnect (DCI)

Fremont, Calif.—April 29, 2020OIF, where the optical networking industry’s interoperability work gets done, today announced it has published the Implementation Agreement (IA) for a 400ZR coherent optical interface. The document is available now for all to download.

This IA, the first OIF project with a scope that focused on interoperability at a specific distance, reinforces OIF’s critical role in creating solutions to fulfill industry requirements and accelerating market adoption of optical networking technologies.

“As a member driven organization, OIF’s work toward the 400ZR IA was the combination of significant interest from network operator members and component supplier members responding to that demand,” said Karl Gass, OIF Physical and Link Layer (PLL) Working Group – Optical Vice Chair. “The 400ZR IA is the culmination of this significant effort by OIF member companies and is critical for managing cost and driving interoperability for the industry.”

Developed to create an interoperable, low-cost 400 Gigabit coherent interface, the 400ZR IA addresses two applications:

  • Amplified, point-to-point DWDM links with reaches of 120 km or less
  • Unamplified, single wavelength links with a loss budget of 11dB

The 400ZR project was initiated when large-scale data center operators and their suppliers approached OIF to develop an interoperable coherent interface that transports 400 Gigabit Ethernet over longer distances. Traditional network operators also became interested in 400ZR for their metro needs. Based on their different requirements, OIF developed specs and tweaked the channel requirements so the IA would benefit both data center and network operators. While developing the IA, OIF collaborated closely with other standards bodies.

“400ZR is a key enabler of Microsoft’s regional architecture for the 400G generation,” said Mark Filer, Principal Optical Engineer in Microsoft Azure. “The creation of a multi-vendor, interoperable coherent interface to meet these needs would not have been possible without the extensive work and cooperation of OIF members and leadership.”

“The 400ZR IA is an example of OIF’s ability to quickly and effectively mobilize opinion and to bring interoperability to a rapidly evolving world,” said Andrew Schmitt, Directing Analyst at Cignal AI. “The 400ZR specification is the organization’s first step to establish broader interoperability among coherent transport interfaces.”

The IA aims to enable interoperable, cost-effective, 400Gb/s implementations based on single-carrier coherent DP-16QAM modulation, low-power DSPs supporting absolute (Non-Differential) phase encoding/decoding, and a Concatenated FEC (C-FEC) with a post-FEC error floor <1.0E-15. 400ZR operates as a 400GBASE-R PHY.

No restriction on the physical form factor is implied by the IA (QSFP-DD, OSFP, COBO, CFP2, CFP8), but the specifications target a pluggable DCO architecture with port densities equivalent to grey client optics.

About OIF

OIF is where the optical networking industry’s interoperability work gets done. Building on 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

Email: leah@wilkinson.associates

Office: 703-907-0010

OIF Completes Coherent Common Management Interface Specification (C-CMIS) Implementation Agreement for Management of Digital Coherent Optics (DCO) Modules

Initial release is focused on supporting 400ZR

Fremont, Calif.—March 3, 2020OIF, where the optical networking industry’s interoperability work gets done, today announced the completion of the Coherent Common Management Interface Specification (C-CMIS) Implementation Agreement (IA). This IA serves as an extension to the CMIS (QSFP-DD/OSFP/COBO) management specification, specifically targeting DCO modules.

“The C-CMIS IA is an important part of the developing 400ZR ecosystem,” said Ian Betty, Ciena and OIF Board Member. “It defines additional management registers, and monitors, together with new functionality, mechanisms, or behaviors, as needed.”

Augmenting the existing CMIS specification which focused on addressing direct detect client optics, the C-CMIS IA provides register definition for coherent modules in pages and parameters that were previously reserved. Users that have previously implemented software to manage optical modules using CMIS will be able to quickly add support for these coherent pages and parameters. This release of the C-CMIS IA is targeted at the 400ZR application.

The technology and complexity of coherent modules requires additional monitoring parameters for use in field applications. This additional monitoring is primarily focused on Forward Error Correction (FEC) monitoring and optical/analog monitoring including items like Chromatic Dispersion, Differential Group Delay and Electrical Signal to Noise Ratio (eSNR). The C-CMIS IA provides specifications to monitor the standard parameters in a normative manner while taking advantage of the flexibility of the CMIS specification to monitor any additional proprietary parameters.

“The current IA is focused on supporting the OIF 400ZR IA, which supports a single data path with eight-lane host electrical interface for a 400GBASE-R PCS signal and a single-lane 400G coherent media interface (with a new signal format called 400ZR),” explained Betty. “However, we expect future versions to include more complex Metro modules and may even extend these management features to other form factors.”

 

About OIF

OIF is where the optical networking industry’s interoperability work gets done. Building on 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com .

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

Email: leah@wilkinson.associates

Office: 703-907-0010

OIF Members to Showcase Innovation and Interoperability Solutions for the Industry’s Most Critical Challenges at OFC 2020

Interoperability demos on 400ZR, CEI-112G, FlexE and IC-TROSA; OIF experts to lead panel discussions and OIF to Host “Cu (see you) Beyond 112 Gbps” Workshop

Fremont, Calif.—February 18, 2020 – OIF will host one of the largest interoperability demos in its history reflecting the ongoing significance of OIF’s work in addressing global network challenges. Twenty industry-leading system vendors, component vendors and test equipment vendors will demonstrate critical insight into how key technologies – 400ZR, Common Electrical I/O (CEI)-112G, Flex Ethernet (FlexE) and Integrated Coherent Transmit-Receive Optical Sub Assembly (IC-TROSA) – interoperate within the industry’s ecosystem at OFC 2020 in San Diego, March 10-12, 2020 (booth #6221).

Participating companies include Acacia Communications, Amphenol, Arista Networks, Cadence Design Systems, Inc., Cisco Systems, Inc., Credo Semiconductor (HK) LTD, Fujitsu Optical Components, II-VI, Inphi Corporation, Juniper Networks, Keysight Technologies, Marvell, Microchip, Molex, NeoPhotonics, Samtec, Inc., Spirent Communications, TE Connectivity, VIAVI Solutions and Yamaichi Electronics.

“The participation level by 20 companies in this year’s interoperability demos for 400ZR, CEI-112G, FlexE and IC-TROSA, is a true reflection of our enduring leadership and evidence that these technologies continue to be the preeminent focus areas for our member companies,” explained Steve Sekel of Keysight and OIF’s Physical and Link Layer (PLL) Interoperability Working Group (WG) Chair. “We are eager to showcase the advancements that these technologies and our work have made over the past year.”

400ZR Demo
OIF has defined the 400ZR interface that provides interoperability of coherent optical interfaces for data center interconnect applications. The demo will show ‘first time ever’ operation of 400ZR equipment from multiple system and module vendors and in multiple pluggable form factors.

CEI-112G Demo
The CEI-112G demo will feature interoperating channels, components and silicon that demonstrate the CEI-112G-XSR, CEI-112G-VSR, CEI-112G-MR and CEI-112G-LR draft implementation agreements. Demonstrating interoperability for extra short reach channels is important to support the co-packaging developments that are expected to be discussed throughout the week at OFC. Interoperable very short reach, medium reach and long reach channels and silicon are also critical to support the developing 112 Gbps equipment that is expected to come to market soon. These updated demos surpass what OIF has demonstrated in the past with additional member contributions and continue to build on the developing ecosystem of products coming to market to support CEI-112G.

FlexE Demo
The FlexE demo that will be on display incorporates FlexE silicon operating with multiple test equipment and interoperating over a 400 Gbps fiber network that will be deployed on the show floor between the Ethernet Alliance booth and the OIF booth. This reflects further developments that are taking place in the FlexE market since the previous OIF FlexE demos.

IC-TROSA Demo
The IC-TROSA features all the optical building blocks for a coherent module in a single package. This demo will highlight important aspects of IC-TROSA integration as well as real-time EVM measurements with the updated script for 400ZR.

An additional point of interest will be a static display of coherent optical components which will emphasize the role of OIF in the coherent optical marketplace over the past 10 years.

OIF @ OFC 2020 Activities
OIF experts will participate in two panels at OFC 2020 that feature the latest updates on critical technologies that work to enable a more efficient and reliable network.

“400ZR Specification Update”
Tuesday, 10 March, 13:30 – 14:30, Theater III
Moderator: Karl Gass, OIF PLL WG Vice Chair Optical

Speakers include: Josef Berger, Inphi Corporation; Masahiro Mogi, Fujitsu Optical Components; Gert Sarlet, II-VI; Marc Stiller, NeoPhotonics and Markus Weber, Acacia Communications

Industry experts from OIF will lead a panel discussion of representatives from the DSP, optics, equipment and end user communities on the conflicting demands for a near-term, high-volume, interoperable, moderate reach, coherent 400G optical link. The session will also include an update on OIF’s project to define a 400ZR link specification.

“112 Gbps Electrical Interfaces – An OIF update on CEI-112G”
Wednesday, 11 March, 16:15 – 17:00, Theater II
Moderator: Nathan Tracy, OIF President, TE Connectivity
Speakers include: Ed Frlan, OIF Technical Committee Chair, Semtech, Corp.; Mike Li, OIF Board, Intel; Cathy Liu, OIF Board, Broadcom, Inc.; Gary Nicholl, OIF Board, Cisco; Steve Sekel, OIF PLL Interoperability WG Chair, Keysight Technologies

OIF experts will lead a panel discussion on the ongoing CEI-112G electrical interface development projects, and the new architectures they will enable including chiplet packaging, co-packaged optics and internal cable-based solutions. The panel will provide an update on the multiple interfaces being defined by OIF including CEI-112G MCM, XSR, VSR, MR and LR for 112 Gbps applications of die-to-die, chip-to-module, chip-to-chip and long reach over backplane and cables.

“Cu (see you) Beyond 112 Gbps” Workshop
Thursday, 12 March, 12:00-17:30, Hilton San Diego Gaslamp, 401 K St (across from the SD Convention Center), San Diego, Ca.

OIF will hold a half-day workshop “Cu (see you) Beyond 112 Gbps” featuring experts from Arista, Broadcom, Inc., Cisco, Facebook, Google, Innovium, Intel, MACOM and TE Connectivity discussing the needs and challenges for electrical interfaces beyond 112 Gbps. Registration required:

• Registration fee for OIF Members: $150.00. OIF Members click HERE to register.
• Registration fee for Non-Members/General Public: $200.00. Non-Members click HERE to register.

Check the status of OIF’s current work here.

About OIF
OIF is where the optical networking industry’s interoperability work gets done. Building on 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
Email: leah@wilkinson.associates
Office: 703-907-0010

OIF to Host “Cu (see you) Beyond 112 Gbps” Workshop at OFC 2020

Workshop will feature leading end-users, equipment developers, and component suppliers discussing the needs and challenges for electrical interfaces beyond 112 Gbps

Fremont, Calif.—February 4, 2020 – OIF, where the optical networking industry’s interoperability work gets done, will hold a half-day workshop “Cu (see you) Beyond 112 Gbps” on Thursday, March 12 during OFC 2020 in San Diego, Ca. The workshop, featuring industry-leading experts from Arista, Broadcom, Cisco, Facebook, Google, Innovium, Intel, MACOM and TE Connectivity, is open to the public.

Leading experts from end-users, equipment developers and component suppliers will discuss the needs for next generation interoperable electrical IO rates as well the challenges and possible technical options to make these rates possible. The panel will address questions such as: Do electrical interfaces hit the wall beyond 112 Gbps? Is 224 Gbps possible? What is a useful reach? Does copper have a future? The workshop will also include a brief summary of OIF’s existing and in-process electrical IO work.

The first half of the workshop will focus on the industry view and need for the next generation electrical interconnects, including networking trends and cloud scale applications. The second half will include presentations and discussion on the technical challenges and directions that could be considered to realize interoperable next generation common electrical IOs that balance density, power, reach and risk.

“OIF has a long history of developing electrical interface specifications known as CEI Implementation Agreements that have been the foundation for almost every industry standards group,” said Nathan Tracy, TE Connectivity and OIF president. “There is little doubt there will be electrical interfaces required beyond 112 Gbps and it is safe to say the OIF will be a part of that development. This workshop is a critical opportunity for OIF members and industry to participate in an open debate and discussion on this topic.”

Details on the workshop are as follows:

March 12, 2020 – 12:00pm-5:30pm

Hilton San Diego Gaslamp, 401 K St (across from the SD Convention Center), San Diego, Ca.

 

Agenda

12:00pm: Registration and distribution of box lunches

12:30pm: Introduction – Nathan Tracy, OIF president and TE Connectivity

 

Session 1 – User Demand 12:40pm-2:30pm

12:40pm-1:30pm – End Users’ Perspective – Srinivas Venkataraman, Facebook; Sara Zebian, Google

1:30pm-2:15pm – Equipment Developers’ Perspective – Andy Bechtolsheim, Arista; Rakesh Chopra, Cisco

2:15pm-2:30pm – Coffee break

 

Session 2 – Component Suppliers’ Analysis/Perspective 2:30pm-5:00pm

2:30pm-3:00pm – Optics and co-packaging – Richard Grzybowski, MACOM

3:00pm-3:30pm – Switch Developer – Kapil Shrikhande, Innovium

3:30pm-4:20pm – SERDES, Modulation and FEC – Adam Healey, Broadcom, Inc; Mike Li, Intel

4:20pm-4:50pm – Improved Copper Components and Channels – Dave Helster, TE Connectivity

5:00pm – Wrap-up

Informal Networking at local bar/grill (TBD) following wrap-up

 

Registration fee for OIF Members: $150.00. OIF Members click HERE to register.

Registration fee for Non-Members: $200.00. Non-Members click HERE to register.

Late Fee: Additional fee of $25.00 USD will be charged after March 6, 2020.

 

About OIF
OIF is where the optical networking industry’s interoperability work gets done. Building on 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
Email: leah@wilkinson.associates
Office: 703-907-0010