OIF Completes Coherent Common Management Interface Specification (C-CMIS) Implementation Agreement for Management of Digital Coherent Optics (DCO) Modules

Initial release is focused on supporting 400ZR

Fremont, Calif.—March 3, 2020OIF, where the optical networking industry’s interoperability work gets done, today announced the completion of the Coherent Common Management Interface Specification (C-CMIS) Implementation Agreement (IA). This IA serves as an extension to the CMIS (QSFP-DD/OSFP/COBO) management specification, specifically targeting DCO modules.

“The C-CMIS IA is an important part of the developing 400ZR ecosystem,” said Ian Betty, Ciena and OIF Board Member. “It defines additional management registers, and monitors, together with new functionality, mechanisms, or behaviors, as needed.”

Augmenting the existing CMIS specification which focused on addressing direct detect client optics, the C-CMIS IA provides register definition for coherent modules in pages and parameters that were previously reserved. Users that have previously implemented software to manage optical modules using CMIS will be able to quickly add support for these coherent pages and parameters. This release of the C-CMIS IA is targeted at the 400ZR application.

The technology and complexity of coherent modules requires additional monitoring parameters for use in field applications. This additional monitoring is primarily focused on Forward Error Correction (FEC) monitoring and optical/analog monitoring including items like Chromatic Dispersion, Differential Group Delay and Electrical Signal to Noise Ratio (eSNR). The C-CMIS IA provides specifications to monitor the standard parameters in a normative manner while taking advantage of the flexibility of the CMIS specification to monitor any additional proprietary parameters.

“The current IA is focused on supporting the OIF 400ZR IA, which supports a single data path with eight-lane host electrical interface for a 400GBASE-R PCS signal and a single-lane 400G coherent media interface (with a new signal format called 400ZR),” explained Betty. “However, we expect future versions to include more complex Metro modules and may even extend these management features to other form factors.”

 

About OIF

OIF is where the optical networking industry’s interoperability work gets done. Building on 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com .

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

Email: leah@wilkinson.associates

Office: 703-907-0010

OIF Members to Showcase Innovation and Interoperability Solutions for the Industry’s Most Critical Challenges at OFC 2020

Interoperability demos on 400ZR, CEI-112G, FlexE and IC-TROSA; OIF experts to lead panel discussions and OIF to Host “Cu (see you) Beyond 112 Gbps” Workshop

Fremont, Calif.—February 18, 2020 – OIF will host one of the largest interoperability demos in its history reflecting the ongoing significance of OIF’s work in addressing global network challenges. Twenty industry-leading system vendors, component vendors and test equipment vendors will demonstrate critical insight into how key technologies – 400ZR, Common Electrical I/O (CEI)-112G, Flex Ethernet (FlexE) and Integrated Coherent Transmit-Receive Optical Sub Assembly (IC-TROSA) – interoperate within the industry’s ecosystem at OFC 2020 in San Diego, March 10-12, 2020 (booth #6221).

Participating companies include Acacia Communications, Amphenol, Arista Networks, Cadence Design Systems, Inc., Cisco Systems, Inc., Credo Semiconductor (HK) LTD, Fujitsu Optical Components, II-VI, Inphi Corporation, Juniper Networks, Keysight Technologies, Marvell, Microchip, Molex, NeoPhotonics, Samtec, Inc., Spirent Communications, TE Connectivity, VIAVI Solutions and Yamaichi Electronics.

“The participation level by 20 companies in this year’s interoperability demos for 400ZR, CEI-112G, FlexE and IC-TROSA, is a true reflection of our enduring leadership and evidence that these technologies continue to be the preeminent focus areas for our member companies,” explained Steve Sekel of Keysight and OIF’s Physical and Link Layer (PLL) Interoperability Working Group (WG) Chair. “We are eager to showcase the advancements that these technologies and our work have made over the past year.”

400ZR Demo
OIF has defined the 400ZR interface that provides interoperability of coherent optical interfaces for data center interconnect applications. The demo will show ‘first time ever’ operation of 400ZR equipment from multiple system and module vendors and in multiple pluggable form factors.

CEI-112G Demo
The CEI-112G demo will feature interoperating channels, components and silicon that demonstrate the CEI-112G-XSR, CEI-112G-VSR, CEI-112G-MR and CEI-112G-LR draft implementation agreements. Demonstrating interoperability for extra short reach channels is important to support the co-packaging developments that are expected to be discussed throughout the week at OFC. Interoperable very short reach, medium reach and long reach channels and silicon are also critical to support the developing 112 Gbps equipment that is expected to come to market soon. These updated demos surpass what OIF has demonstrated in the past with additional member contributions and continue to build on the developing ecosystem of products coming to market to support CEI-112G.

FlexE Demo
The FlexE demo that will be on display incorporates FlexE silicon operating with multiple test equipment and interoperating over a 400 Gbps fiber network that will be deployed on the show floor between the Ethernet Alliance booth and the OIF booth. This reflects further developments that are taking place in the FlexE market since the previous OIF FlexE demos.

IC-TROSA Demo
The IC-TROSA features all the optical building blocks for a coherent module in a single package. This demo will highlight important aspects of IC-TROSA integration as well as real-time EVM measurements with the updated script for 400ZR.

An additional point of interest will be a static display of coherent optical components which will emphasize the role of OIF in the coherent optical marketplace over the past 10 years.

OIF @ OFC 2020 Activities
OIF experts will participate in two panels at OFC 2020 that feature the latest updates on critical technologies that work to enable a more efficient and reliable network.

“400ZR Specification Update”
Tuesday, 10 March, 13:30 – 14:30, Theater III
Moderator: Karl Gass, OIF PLL WG Vice Chair Optical

Speakers include: Josef Berger, Inphi Corporation; Masahiro Mogi, Fujitsu Optical Components; Gert Sarlet, II-VI; Marc Stiller, NeoPhotonics and Markus Weber, Acacia Communications

Industry experts from OIF will lead a panel discussion of representatives from the DSP, optics, equipment and end user communities on the conflicting demands for a near-term, high-volume, interoperable, moderate reach, coherent 400G optical link. The session will also include an update on OIF’s project to define a 400ZR link specification.

“112 Gbps Electrical Interfaces – An OIF update on CEI-112G”
Wednesday, 11 March, 16:15 – 17:00, Theater II
Moderator: Nathan Tracy, OIF President, TE Connectivity
Speakers include: Ed Frlan, OIF Technical Committee Chair, Semtech, Corp.; Mike Li, OIF Board, Intel; Cathy Liu, OIF Board, Broadcom, Inc.; Gary Nicholl, OIF Board, Cisco; Steve Sekel, OIF PLL Interoperability WG Chair, Keysight Technologies

OIF experts will lead a panel discussion on the ongoing CEI-112G electrical interface development projects, and the new architectures they will enable including chiplet packaging, co-packaged optics and internal cable-based solutions. The panel will provide an update on the multiple interfaces being defined by OIF including CEI-112G MCM, XSR, VSR, MR and LR for 112 Gbps applications of die-to-die, chip-to-module, chip-to-chip and long reach over backplane and cables.

“Cu (see you) Beyond 112 Gbps” Workshop
Thursday, 12 March, 12:00-17:30, Hilton San Diego Gaslamp, 401 K St (across from the SD Convention Center), San Diego, Ca.

OIF will hold a half-day workshop “Cu (see you) Beyond 112 Gbps” featuring experts from Arista, Broadcom, Inc., Cisco, Facebook, Google, Innovium, Intel, MACOM and TE Connectivity discussing the needs and challenges for electrical interfaces beyond 112 Gbps. Registration required:

• Registration fee for OIF Members: $150.00. OIF Members click HERE to register.
• Registration fee for Non-Members/General Public: $200.00. Non-Members click HERE to register.

Check the status of OIF’s current work here.

About OIF
OIF is where the optical networking industry’s interoperability work gets done. Building on 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
Email: leah@wilkinson.associates
Office: 703-907-0010

OIF to Host “Cu (see you) Beyond 112 Gbps” Workshop at OFC 2020

Workshop will feature leading end-users, equipment developers, and component suppliers discussing the needs and challenges for electrical interfaces beyond 112 Gbps

Fremont, Calif.—February 4, 2020 – OIF, where the optical networking industry’s interoperability work gets done, will hold a half-day workshop “Cu (see you) Beyond 112 Gbps” on Thursday, March 12 during OFC 2020 in San Diego, Ca. The workshop, featuring industry-leading experts from Arista, Broadcom, Cisco, Facebook, Google, Innovium, Intel, MACOM and TE Connectivity, is open to the public.

Leading experts from end-users, equipment developers and component suppliers will discuss the needs for next generation interoperable electrical IO rates as well the challenges and possible technical options to make these rates possible. The panel will address questions such as: Do electrical interfaces hit the wall beyond 112 Gbps? Is 224 Gbps possible? What is a useful reach? Does copper have a future? The workshop will also include a brief summary of OIF’s existing and in-process electrical IO work.

The first half of the workshop will focus on the industry view and need for the next generation electrical interconnects, including networking trends and cloud scale applications. The second half will include presentations and discussion on the technical challenges and directions that could be considered to realize interoperable next generation common electrical IOs that balance density, power, reach and risk.

“OIF has a long history of developing electrical interface specifications known as CEI Implementation Agreements that have been the foundation for almost every industry standards group,” said Nathan Tracy, TE Connectivity and OIF president. “There is little doubt there will be electrical interfaces required beyond 112 Gbps and it is safe to say the OIF will be a part of that development. This workshop is a critical opportunity for OIF members and industry to participate in an open debate and discussion on this topic.”

Details on the workshop are as follows:

March 12, 2020 – 12:00pm-5:30pm

Hilton San Diego Gaslamp, 401 K St (across from the SD Convention Center), San Diego, Ca.

 

Agenda

12:00pm: Registration and distribution of box lunches

12:30pm: Introduction – Nathan Tracy, OIF president and TE Connectivity

 

Session 1 – User Demand 12:40pm-2:30pm

12:40pm-1:30pm – End Users’ Perspective – Srinivas Venkataraman, Facebook; Sara Zebian, Google

1:30pm-2:15pm – Equipment Developers’ Perspective – Andy Bechtolsheim, Arista; Rakesh Chopra, Cisco

2:15pm-2:30pm – Coffee break

 

Session 2 – Component Suppliers’ Analysis/Perspective 2:30pm-5:00pm

2:30pm-3:00pm – Optics and co-packaging – Richard Grzybowski, MACOM

3:00pm-3:30pm – Switch Developer – Kapil Shrikhande, Innovium

3:30pm-4:20pm – SERDES, Modulation and FEC – Adam Healey, Broadcom, Inc; Mike Li, Intel

4:20pm-4:50pm – Improved Copper Components and Channels – Dave Helster, TE Connectivity

5:00pm – Wrap-up

Informal Networking at local bar/grill (TBD) following wrap-up

 

Registration fee for OIF Members: $150.00. OIF Members click HERE to register.

Registration fee for Non-Members: $200.00. Non-Members click HERE to register.

Late Fee: Additional fee of $25.00 USD will be charged after March 6, 2020.

 

About OIF
OIF is where the optical networking industry’s interoperability work gets done. Building on 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
Email: leah@wilkinson.associates
Office: 703-907-0010

 

 

OIF Thought Leaders Offer CEI-112G Project Update at DesignCon 2020

Panel of electrical interface experts will showcase OIF’s latest work on multiple interfaces including CEI-112G MCM, XSR, VSR, MR and LR for 112 Gbps applications

Fremont, Calif. —January 14, 2020 – OIF industry leaders will present and discuss OIF’s ongoing CEI-112G electrical interface development projects, and the new architectures they will enable including chiplet packaging, co-packaged optics and internal cable-based solutions on Wednesday, January 29 at 3:45 pm (local) at DesignCon in Santa Clara, CA.

OIF’s panel “Enabling New Architectures: An Update on OIF’s CEI-112G Electrical Interfaces,” will provide an update on the five new interfaces, including CEI-112G MCM, XSR, VSR, MR and LR for 112 Gbps applications, that will shape the future of next generation designs, ranging from die-to-die implementations all the way up to backplane and copper cable architectures.

Panel speakers include: Nathan Tracy of TE Connectivity and OIF President; Cathy Liu of Broadcom Inc. and OIF Board Member; Steve Sekel of Keysight Technologies and OIF Physical and Link Layer Interoperability Working Group Chair; Ed Frlan of Semtech and OIF Technical Committee Chair; Gary Nicholl of Cisco and OIF Board Member and Mike Li of Intel Corporation and OIF Board Member.
“Electrical interfaces at 112 Gbps are critical for faster, more efficient and cost-effective networks and data centers,” said Tracy. “This panel discussion will provide the opportunity for an engaging industry debate on the issues surrounding OIF’s CEI-112G projects and the architectures they will enable.”

OIF has led the industry for the past 20 years in the development and publication of next generation electrical definitions for transmitters, receivers and channels to enable interoperable electrical links for chip to chip, chip to optical, line card to line card and equipment to equipment applications. OIF is currently in the process of developing electrical link definitions for the next generation 112 Gbps data rate to provide signalling over a multitude of link types including die to die, chip to chip, chip to module, medium reach chip to chip and long reach chip to chip also known as backplane. OIF’s complete work on the CEI-112G can be found here.

About OIF
OIF is where the optical networking industry’s interoperability work gets done. Building on 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
Email: leah@wilkinson.associates
Office: 703-907-0010

OIF Announces Board of Directors Positions and Working Group Representatives; Launches Network Operator Coherent Optics Survey

OIF Day, hosted by Microsoft, provided participants the opportunity to exchange ideas relating to current network challenges

Fremont, Calif.—November 19, 2019 – OIF, where the optical networking industry’s interoperability work gets done, today announced election results for its Board of Directors and working group representatives (positions took effect Oct 1). OIF also announced the launch of a network operator survey designed to gather specific input on next generation coherent optics application requirements, features and timing.

OIF member activity in October also included the Q419 Technical and MA&E Committee meetings held October 22-24, 2019 in Singapore and a member only OIF Day at Microsoft headquarters in Redmond, WA.

Election Results

  • Board of Directors:
    • Nathan Tracy, TE Connectivity, continues to serve on the Board and was re-appointed as President
    • Tad Hofmeister, Google, was re-elected (two-year term) and re-appointed as Vice President
    • Martin Bouda, Fujitsu, continues to serve on the Board and was re-appointed as Secretary/Treasurer
    • Ian Betty, Ciena, was re-elected to the Board (two-year term)
    • Mike Li, Intel, was re-elected to the Board (one-year term)
    • Cathy Liu, Broadcom Inc., was re-elected to the Board (one-year term)
    • Gary Nicholl, Cisco, continues to serve on the Board
  • Officers:
    • Ed Frlan, Semtech, was elected as Technical Committee Chair
    • Klaus-Holger Otto, Nokia, was elected as Technical Committee Vice Chair
    • Lyndon Ong, Ciena, was re-elected as Market Awareness & Education Committee Co-Chair, Networking
    • Richard Ward, Intel, was appointed by the Board as Market Awareness & Education Committee Co-Chair, PLL (filling the vacant position)
    • Dave Brown, Nokia, continues to serve as Director of Communications
  • Technical Committee:
    • Junjie Li, China Telecom, was re-elected as Network Operator Working Group Chair

“As a member-driven organization, the strength and support of our leadership is critical,” said Nathan Tracy, TE Connectivity and OIF president. “Congratulations to all the new and returning members serving on the Board of Directors and in other leadership positions. Your work to further OIF’s mission and drive interoperability solutions is vital to our industry’s ecosystem.”

Network Operator Survey

The OIF Network Operators Working Group is reaching out to global operators to identify technology challenges for future generation architectures beyond 2020 with the goal of stimulating work projects to meet operator needs. Building on significant participation in two recent invitation-only executive summits, the group has issued a formal coherent optics survey to operators. The group will discuss the survey results at a member only workshop planned for February 10 prior to the 1Q 2020 Technical Committee meeting (February 11-13) in New Orleans.

OIF Day

OIF Day held on October 9 and hosted by Microsoft, was a live educational workshop program designed to expand awareness of, and educate member company employees on, the work of the OIF. The full day program included an overview of OIF work, including 400ZR, CEI-112G and FlexE and updates from Microsoft on cloud hardware futures, rack-level interconnect architecture and row architectures.

“We received fantastic feedback from OIF membership and Microsoft employees from the OIF Day hosted by Microsoft. The event served to further clarify numerous use cases and problem sets with the OIF membership in an interactive manner, hopefully establishing requirements for next gen products that the interworking community can rally around. It also provided greater awareness and context for Microsoft employees on the great work and benefits of the OIF,” said Mark Filer, Principle Optical Engineer, Azure Networking, Microsoft.

 

About OIF
OIF is where the optical networking industry’s interoperability work gets done. Building on 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
Email: leah@wilkinson.associates
Office: 703-907-0010

 

OIF Approves IC-TROSA Implementation Agreement, Specifications Speed Delivery of a Higher Level of Integration for Transmit and Receive Optical Components

IC-TROSA IA enables miniaturization of optical transceiver modules and lowers the component cost for 400ZR, metro, data center interconnect (DCI) applications

Fremont, Calif.—September 23, 2019OIF, where the optical networking industry’s interoperability work gets done, continues its efforts to reduce cost and speed market adoption of next-generation solutions through the approval of the Integrated Coherent Transmitter-Receiver Optical Subassembly (IC-TROSA) Implementation Agreement (IA). IC-TROSA integration will be demonstrated during this week’s OIF Physical and Link Layer (PLL) Interoperability Demo at ECOC 2019 in Dublin, Ireland (OIF booth 441).

“The IC-TROSA project took an aggressive approach to coherent optical component integration and has delivered two new package designs incorporating TX and RX integration, common digital controls and performance monitoring all in a small form factor package,” explained Scott Grindstaff, Director R&D, ADVA, and IC-TROSA IA Technical Editor. “Additionally, package specific features such as fiber-free interface and solder reflow compatibility have been incorporated.”

The optical sub-assembly supports high-bandwidth and high-order dual-polarization quadrature amplitude modulation (QAM) operations and is suited for data center interconnect, metro and long-haul applications. As module sizes decrease, coherent optics components need similar size reductions to enable next generation multi-terabit switches, line cards and transport platforms.

“The IC-TROSA IA is a solution for density requirements for line cards, front-pluggable and future on-board coherent 400G+ optical modules,” said Karl Gass, OIF PLL Working Group, Optical Vice Chair. “It aims to standardize a photonic package for coherent applications that is easy to use while leaving the internal implementation to the vendor.”

The IC-TROSA Type-1 is optimized for silicon photonics technology and uses a surface-mount package with Ball Grid Array (BGA) electrical interface. Important advantages include an increased electrical bandwidth and solder reflow capability. The IC-TROSA Type-2 is optimized for Indium Phosphide technology and uses a gold-box package with flex-cable electrical interface. Important advantages include an integrated tunable laser and a duplex LC optical connector.

The IC-TROSA’s low power dissipation and miniature footprint enables small form factor digital coherent optics (DCO) transceivers in a QSFP-DD or OSFP form factor, as well as very high-density coherent line card or daughtercard designs. Devices can support multiple modulation formats, including QPSK, 8QAM, and 16QAM, at symbol rates up to 64Gbaud, enabling data transmission up to 600 Gb/s.

About OIF
OIF is where the optical networking industry’s interoperability work gets done. Building on 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
Email: leah@wilkinson.associates
Office: 703-907-0010

OIF Showcases 400ZR, CEI-112G and IC-TROSA Interoperability Demos at ECOC 2019

OIF selected to lead Market Focus presentation on deployment of the 400ZR ecosystem

Fremont, Calif.—September 9, 2019 – OIF member companies will showcase their industry leadership with a multi-vendor interoperability demonstration of 400ZR, Common Electrical I/O (CEI)-112G and IC-TROSA during ECOC 2019, September 23-25 in Dublin, Ireland.

Demonstrating how critical interoperability work gets done, 12 OIF member companies including ADVA, Amphenol, Cadence Design System, Credo, Finisar, Inphi, Keysight Technologies, Marvell, Molex, MultiLane, TE Connectivity and YAMAICHI ELECTRONICS will participate in the demonstration in OIF’s booth, # 441.

“Understanding and seeing first-hand how key technologies – 400ZR, CEI-112G and IC-TROSA – are each specified to enable interoperable deployment across the ecosystem is critically important to building market confidence and accelerating adoption,” said Steve Sekel, OIF Physical and Link Layer Interoperability Working Group Chair. “This showcase of 12 companies and key technologies is a clear representation of OIF’s leadership in driving electrical, optical and control interoperability.”

OIF Physical and Link Layer (PLL) Interoperability Demo @ ECOC 2019

OIF Drives Industry Collaboration and Growth Through Timely Interoperability Work.

Live interoperability demonstrations at ECOC 2019 will feature member company solutions that are critical to the global network, including 400ZR, Common Electrical I/O (CEI)-112G and IC-TROSA

400ZR & IC-TROSA Demo

OIF’s 400ZR project is not only facilitating cost and complexity reduction for 400GbE over 80 km DWDM networks, it’s also bringing forward a wave of necessary components and complementary applications. The IC-TROSA features all of the optical building blocks for a coherent module in a single package. The demonstrations will highlight important aspects of IC-TROSA integration as well as real-time EVM measurements with the updated script for 400ZR. In addition, a hardware-based 400ZR installation will show a typical application case.

CEI-112G Demo

OIF is taking a lead role in moving the industry to the next generation with its development of electrical interface specifications for 112 Gbps per differential pair. Multiple live demonstrations featuring interoperability clearly prove the key role OIF provides. The CEI-112G demonstrations in the OIF booth will feature multi-party silicon supplier interoperability over mated compliance board channels, a full host to module channel and direct attach copper cable channels, all demonstrating the technical viability of 112 Gbps operation, along with multiple industry form factors including OSFP and QSFP-DD.

OIF @ ECOC 2019 Market Focus

OIF will present “Deployment of the 400ZR Ecosystem” on Tuesday, September 24, 15:00 – 15:30, during the ECOC Market Focus Service and Content Provider Optical Transmission track. OIF expert and OIF Physical and Link Layer Working Group, Vice Chair Optical, Karl Gass will present.

Check the status of OIF’s current work here.

 

About OIF
OIF is where the optical networking industry’s interoperability work gets done. Building on 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
Email: leah@wilkinson.associates
Office: 703-907-0010

OIF Launches Two New Projects — Higher Baud Rate Coherent Driver Modulator and Low-Rate Service Multiplexing Using FlexE and 400ZR White Paper — at Q3 Meeting

Meeting also featured industry talk from Andrew Schmitt, Cignal AI, and initial discussions on next generation network operator requirements

Fremont, Calif.—August 14, 2019 – Member activity at this year’s OIF Q319 Technical and MA&E Committees Meeting in Montreal, Canada resulted in the launch of two new projects — a higher baud rate coherent driver modulator and a white paper detailing low-rate service multiplexing using FlexE and 400ZR.

Andrew Schmitt, founder and directing analyst, Cignal AI gave member attendees a brief overview of emerging pluggable coherent technologies and the opportunity this new market presents and had the opportunity to speak with members about current and upcoming OIF work.

“It’s clear that OIF is not resting after a successful effort to standardize 400ZR, proven by the launch of two new projects at the recent Q3 meeting,” said Schmitt. “Also, as interest in pluggable coherent solutions grows, it is good to see OIF soliciting feedback from additional network operators in order to shape requirements for next generation standards.”

NEW PROJECTS

The “Higher Baud Rate Coherent Driver Modulator” project will define a new version of the Coherent Driver Modulator supporting at least 96 Gbaud for the low modem implementation penalty segment of the coherent market for single optical carrier line rates beyond 400 Gbit/s. Designed for higher data rates and longer reach and optimized for performance, this project is the next generation of the High Bandwidth Coherent Driver Modulator (HB-CDM) Implementation Agreement (IA) published last year.

The second project start is for a white paper on low-rate service multiplexing using FlexE and 400ZR aimed at eliminating ambiguity and providing clarification on how 400ZR should be leveraged in multiplexing applications. Various network operators are looking for a multiplexing scheme to support lower-rate Ethernet clients (e.g. 4x100GE) into a 400ZR coherent line. This technical white paper will educate the market on how FlexE can be used to aggregate low-rate Ethernet services (e.g. 4x100GE) into 400ZR interfaces.

About OIF
OIF is where the optical networking industry’s interoperability work gets done. Building on 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
Email: leah@wilkinson.associates
Office: 703-907-0010

OIF Continues Commitment to Interoperability with Two New Implementation Agreements – Specifications for CFP2-DCO and HB-CDM now available

Fremont, Calif.—May 21, 2019 – OIF, the global industry forum accelerating market adoption of advanced interoperable optical networking solutions, has completed two new Implementation Agreements (IAs) — the CFP2-Digital Coherent Optics Module (CFP2-DCO) and High Bandwidth- Coherent Driver Modulator (HB-CDM).

“As a member-driven organization, OIF’s work is based on our members’ needs. The CFP2-DCO IA is in direct response to feedback from a network operator that needed an IA to fill an interoperability gap in their network,” said Karl Gass, OIF, PLL Working Group – Optical Vice Chair. “The HB-CDM IA addresses a performance need by creating a component that can be used for much higher performance links.”

CFP2-DCO

The CFP2-DCO IA defines the additional information needed in order to implement the DCO function in the CFP2 module. The CFP2-DCO module contains all the required functions to perform dual polarization coherent optical signaling. The module can also provide different bitrates such as 100G/200G/300G/400G and support more modulation formats.

HB-CDM

The IA for HB-CDM targets modulation and data-rate agnostic coherent applications having nominal symbol rates up to 64 Gbaud. It defines a small form factor electro-optic component that integrates the HB-Polarization Multiplexed-Quadrature (HB-PMQ) modulator plus the RF drive functions for the high baud-rate and low modem implementation penalty segment of the coherent market. Additionally, the IA identifies and specifies the common features and properties of coherent transmitters to enable them to broadly meet the needs of current and future coherent systems.

Check the status of OIF’s current work here.

 

About OIF
Optical Internetworking Forum (OIF) is where the optical networking industry’s interoperability work gets done. Celebrating 20 years of effecting progressive change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors, all collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at https://www.oiforum.com/.

 

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
Email: leah@wilkinson.associates
Office: 703-907-0010

OIF’s Optical Masterclass Series at NGON to Include Updates on 400ZR, Common Electrical I/O, Flex Ethernet & SDN Projects

Fremont, Calif.—May 8, 2019 – At NGON, May 21-23, 2019, OIF experts will kick off the Optical Masterclass Series with a comprehensive update on its 400ZR, Common Electrical I/O (CEI)-112, Flex Ethernet (FlexE) and Software Defined Networking (SDN) projects.

“OIF’s interoperability solutions are vital to the global network and with many of the key network operators in attendance, NGON is the ideal platform to provide updates on OIF’s work in 400ZR, CEI, FlexE and SDN,” said Dave Brown, Nokia and OIF Director of Communications.

The “Optical Masterclass Series – The Optical Internetworking Forum” session is being held Tuesday, May 21, 2019 from 09:00 – 11:00 (NEW TIME AS OF 5/16). Brown and Karl Gass, OIF Physical & Link Layer Working Group Vice Chair, Optical, will discuss how OIF is assuring interoperability in open, agile, next-generation optical networks and provide updates on crucial industry projects.

400ZR

OIF’s 400ZR project is critical in facilitating the reduction of cost and complexity for high bandwidth data center interconnects and promoting interoperability among optical module manufacturers. This Implementation Agreement (IA) will specify an interoperable digital coherent 400ZR interface targeted at short reach (80 km or more) DWDM amplified noise limited links and unamplified loss limited links.

CEI

The CEI project update will include discussion of the multiple 112 Gb/s interfaces being defined by OIF including CEI-112G MCM, XSR, VSR, MR and LR. Applications of these 112 Gb/s interfaces include die-to-die, die-to-OE (optical engine) on package, chip-to-module, chip-to-chip and chip-to-chip long reach over backplane and cables.

FlexE

OIF continues to lead in FlexE aggregation architectures through its newest FlexE 2.1 project for FlexE over 50GbE PHY applications, an extension to its FlexE 2.0 Implementation Agreement (IA). FlexE 2.1 will specify a 50G FlexE frame and multiplexing format and will address FlexE applications with lower bandwidth needs and provide an implementation foundation for applications including the access layer of the future 5G mobile network.

SDN

In November 2018, OIF announced the launch of “Requirements for Integrated Packet Optical SDN.” The project outlines requirements for a multi-layer SDN reference architecture as a use case for packet optical transport networks. It will generate functional requirements, a reference architecture and use cases for packet/optical networks guided by the vision to enable agile, open network solutions that simplify operations and optimize resource utilization.

IC-TROSA

The session will also include an update on the Integrated Coherent Transmit-Receive Optical Sub Assembly (IC-TROSA) project that defines a standard optical component containing a complete coherent modem. The availability of highly integrated components accelerates the adoption of coherent transmission into additional markets.

Additionally, Gass will participate in Wednesday’s Plenary session, 09:30 – 10:10, “Present View: To the terabit & beyond – practicalities for coherent transmission.” Also on Wednesday, from 14:35 – 15:30, Brown will speak on the “Open Source Approach: Looking at disaggregation as a pathway for multi-vendor cooperation, interoperability and driving enhanced network interfaces” panel.

Check the status of OIF’s current work here.

About OIF
Optical Internetworking Forum (OIF) is where the optical networking industry’s interoperability work gets done. Celebrating 20 years of effecting progressive change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors, all collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at https://www.oiforum.com/.

 

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
Email: leah@wilkinson.associates
Office: 703-907-0010

 

OIF and Ethernet Alliance Collaborate to Run Live FlexE Traffic over 400G Network at OFC 2019

SAN DIEGO – March 5, 2019 – Industry leading organizations, OIF and the Ethernet Alliance, today announced an interoperating 400 Gbps Ethernet (400 GbE) network demonstration at OFC in San Diego, CA, March 5-7, 2019. The joint demonstration will feature Flex Ethernet (FlexE) traffic sent over three bonded and subrated 100 GbE interfaces streaming over the Ethernet Alliance 400 GbE network with interconnection between the OIF and Ethernet Alliance booths on the show floor.

The demonstration is designed to showcase the Ethernet Alliance’s IEEE 802.3bs 400 Gbps network and OIF’s FlexE 2.0 Implementation Agreement (IA).

“The Ethernet Alliance’s 400 GbE network over the OFC exhibit floor is the perfect setting to illustrate the real-world features and capabilities of the OIF FlexE 2.0 IA that allows network operators to tailor their traffic while still leveraging Ethernet,” according to Nathan Tracy, OIF’s President and Technologist at TE Connectivity. “The Ethernet Alliance’s deployment of the 400 GbE network at OFC combined with OIF’s FlexE demonstration illustrates the coincident availability of these new technologies.”

The member companies participating in the OIF demo, booth #6215, include Amphenol, Cisco, Credo Semiconductor (HK) LTD, Finisar, Inphi, Juniper Networks, Keysight Technologies, Molex, Spirent Communications, TE Connectivity, VIAVI Solutions, Xilinx and YAMAICHI ELECTRONICS. For more info on OIF’s activities at OFC, please visit https://www.oiforum.com/meetings-events/oif-ofc-2019/

Happening in booth #4749, the Ethernet Alliance’s OFC 2019 demo incorporates equipment and solutions from 21 different companies: Amphenol Corporation; Anritsu Corporation; Arista Networks, Inc.; Cisco; Credo Semiconductor, Inc.; EXFO, Inc.; Finisar; Intel Corporation; Ixia / Keysight Technologies, Inc.; Juniper Networks, Inc.; Lumentum Holdings Inc.; Nexans S.A.; Panduit Corp.; Source Photonics Inc.; Spectra7 Microsystems Ltd.; Spirent Communications; TE Connectivity Ltd.; Tektronix, Inc.; Teledyne LeCroy, Inc.; VIAVI Solutions, Inc. and Xilinx, Inc.

About OIF
Optical Internetworking Forum (OIF) is where the optical networking industry’s interoperability work gets done. Celebrating 20 years of effecting progressive change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors, all collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at https://www.oiforum.com/.

About the Ethernet Alliance

The Ethernet Alliance is a global consortium that includes system and component vendors, industry experts, and university and government professionals who are committed to the continued success and expansion of Ethernet technology. The Ethernet Alliance takes Ethernet standards to market by supporting activities that span from incubation of new Ethernet technologies to interoperability demonstrations and education.

 

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

leah@wilkinson.associates

703-907-0010

 

 

OIF Members to Demonstrate Interoperability of Industry’s Hottest Technologies at OFC 2019

Multi-vendor live demos to feature 400ZR, CEI-112G and FlexE technology; OIF experts to lead panel discussions on hot topics, interoperability

Fremont, Calif.—February 20, 2019 – Demonstrating how interoperability works get done, 13 OIF member companies will participate in live interoperability demos of the industry’s hottest technologies – 400ZR, Common Electrical I/O (CEI)-112G  and Flex Ethernet (FlexE) – at OFC 2019 in San Diego, March 5-7, 2019.

Amphenol, Cisco Systems, Credo Semiconductor (HK) LTD, Finisar, Inphi, Juniper Networks, Keysight Technologies, Molex, Spirent Communications, TE Connectivity, VIAVI Solutions, Xilinx and YAMAICHI ELECTRONICS will demonstrate the interoperability of their products and technologies in OIF’s booth, #6215.

“400ZR, CEI-112G and FlexE are critical technologies in our industry so it’s no surprise these are the interoperability specifications our members are most focused on for OFC,” said Steve Sekel of Keysight and OIF’s Physical and Link Layer Interoperability Working Group Chair. “The live demos will demonstrate critical insight into how key technologies interoperate within the industry’s ecosystem.”

400ZR Demo

OIF’s 400ZR project is critical in facilitating the reduction of cost and complexity for high bandwidth data center interconnects and promoting interoperability among optical module manufacturers. Currently in progress, the project will result in an implementation agreement for 400G ZR and short-reach DWDM multi-vendor interoperability. The 400ZR demo consists of real-time Error Vector Magnitude measurements demonstrating the maturity of the methodology used for transmitter specifications. In addition, a hardware-based 400ZR installation will show how participants communicate a typical application case.

CEI-112G Demo

OIF is taking a lead role in moving the industry to the next generation with its development of electrical interface specifications for 112 Gbps per differential pair. Multiple live demonstrations featuring interoperability clearly prove the key role OIF provides. The CEI-112G demonstrations in the OIF booth will feature multi-party silicon supplier interoperability over mated compliance board channels and direct attach copper cable channels, all demonstrating the technical viability of 112 Gbps operation, along with multiple industry form factors including OSFP and QSFP-DD.

FlexE Demo

OIF continues to lead in FlexE aggregation architectures through its newest FlexE 2.1 project for FlexE over 50GbE PHY applications, an extension to its FlexE 2.0 Implementation Agreement (IA). The FlexE 2.0 demo will show off the bonding, subrating, and channelization features that allows FlexE-enabled hardware to support non-standard Ethernet rates over standard Ethernet optics. Realistic multi-vendor deployment scenarios, client rate reconfiguration, and in-band messaging features will be demonstrated on a network built from a variety of Ethernet optics and interconnecting the OIF and Ethernet Alliance booths.

OIF @ OFC 2019 Speaking Sessions

On Thursday, March 7, industry experts from OIF will lead panels focused on the latest update on 400ZR specifications and the drivers, needs, and challenges in the evolution to widescale adoption of open, interoperable optical networks.

OIF – 400ZR Specification Update

Thursday, 7 March, 10:15-11:15 – Theater II, Hall E

Moderator: Karl Gass, OIF PLL WG Vice Chair Optical

Speakers include: Josef Berger, Inphi; Mark Filer, Microsoft Azure; Marc Stiller, NeoPhotonics and Markus Weber, Acacia Communications

 

The Path to Open, Interoperable Optical Networking

Thursday, 7 March, 11:15-12:15 – Theater II, Hall E

Moderator: Dave Brown, OIF Director of Communications, Nokia

Speakers include: Victor Lopez, Telefónica gCTIO; Lyndon Ong, OIF MA&E Co-Chair – Networking, Ciena and Jonathan Sadler, OIF Networking Interoperability WG Chair, Infinera

 

Check the status of OIF’s current work here.

 

About OIF
Optical Internetworking Forum (OIF) is where the optical networking industry’s interoperability work gets done. Celebrating 20 years of effecting progressive change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors, all collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at https://www.oiforum.com/.

 

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
Email: leah@wilkinson.associates
Office: 703-907-0010

 

OIF Experts to Provide CEI-112G Project Update at DesignCon

Expert panel will provide an update on the multiple interfaces being defined by OIF including CEI-112G MCM, XSR, VSR, MR and LR for 112G

Fremont, Calif.—January 23, 2019 – A panel of OIF experts will present and discuss the ongoing, multi-faceted Common Electrical I/O (CEI)-112G interface effort at this year’s DesignCon being held in Santa Clara, CA January 29-31. “112-Gbps Electrical Interface: An OIF Update on CEI-112G,” is scheduled for Thursday, January 31 at 3:45 pm (local) and will provide an update on the multiple interfaces being defined by OIF including CEI-112G MCM, XSR, VSR, MR and LR. Applications of these 112 Gb/s interfaces include die-to-die, chip-to-module, chip-to-chip and long reach over backplane and cables.

Panel speakers include Brian Holden of Kandou Bus and OIF member; Cathy Liu of Broadcom Inc. and OIF Board Member; Steve Sekel of Keysight Technologies and OIF PLL Interoperability Working Group Chair and Nathan Tracy of TE Connectivity and OIF President.

Since 2000, OIF has defined Interoperability Agreements (IA)s for electrical interconnects known as CEI.  CEI is a clause-based document that defines implementation details for interoperable electrical channels initially issued for 6 Gbps, then 11, 28, and 56 and includes definitions for multiple channel implementation topologies and will soon include 112 Gbps clauses. In August of 2016, OIF announced the first CEI-112G project in an overall effort that has now expanded to five projects.

“Previous CEI development has been highly influential and has been adopted, influenced or adapted by many other high-speed interconnect specifications throughout the industry,” said Tracy. “Given that the CEI-112G generation of high-speed transmitters, receivers and channels will be challenging to define, implement and measure, this panel will provide guidance to where the industry is headed and what the key challenge points are likely to be.”

The CEI-112G IA effort is challenging in signal integrity, implementation complexity and measurement terms. The signals are increasingly vulnerable to channel discontinuities, leading to signal impairment and crosstalk. The switching speed and the density of the available SerDes transistors have not kept pace with other silicon functions, resulting in architectural challenges. Finally, the ability to probe and repeatably capture measurements at these rates with sufficient accuracy and precision is challenging.

Check the status of OIF’s current work in CEI-112G here.

About OIF
OIF is where the optical networking industry’s interoperability work gets done. Celebrating 20 years of effecting progressive change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors, all collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
Email: leah@wilkinson.associates
Office: 703-907-0010

 

OIF Launches Flexe 2.1 Project and Elects new Board Positions and Working Group Representatives

This work continues OIF’s lead in FlexE aggregation architectures by keeping current with industry PHY rates

Fremont, Calif.—December 4, 2018 – OIF, the global industry forum accelerating market adoption of advanced interoperable optical networking solutions, today announced the launch of the FlexE 2.1 project and newly elected board members and working group chairs. The new project initiation and elections took place at the Q418 Technical and MA&E Committee meetings held October 29-November 2, 2018 in Sydney, Australia.

The new FlexE 2.1 project is for FlexE over 50Gbe PHY applications and an extension to the recently released FlexE 2.0 Interoperability Agreement (IA). FlexE 2.1 will specify a 50G FlexE frame and multiplexing format and will address Flex Ethernet (FlexE) applications with lower bandwidth needs and provide an implementation foundation for applications including the access layer of the future 5G mobile network. This new 50GbE support will extend the existing support for 100, 200 and 400GE in the just published FlexE 2.0 IA.

With market demand and possible large volume applications for channelization (5Gb/s granularity for minimum 10G clients) and bonding of 50GE PHYs in the future access layer/metro edge (based on IPRAN/PTN) of the 5G mobile backhaul network, FlexE implementation logic will be critical.

“There is continued demand by data center and network operators for a solution for flexible deployment and provisioning of Ethernet bandwidth,” said Dave Ofelt, Juniper Networks and OIF Physical and Link Layer (PLL) Working Group – Protocol Vice Chair. “Building on OIF’s great work for FlexE and FlexE 2.0, this new FlexE 2.1 project will ultimately result in a single IA that adds n×50Gb/s support to FlexE 2.0, along with other possible feature enhancements.”

Election Results

  • Board of Directors:
    • Nathan Tracy, TE Connectivity, was re-elected to the Board and appointed as President
    • Tad Hofmeister, Google, was appointed as Vice President
    • Martin Bouda, Fujitsu, was re-elected to the Board and appointed as Secretary/Treasurer
    • Mike Li, Intel, was newly elected to the Board
    • Cathy Liu, Broadcom Inc., was re-elected to the Board
    • Gary Nicholl, Cisco, was newly elected to the Board
    • Ian Betty, Ciena, continues to serve on the Board
  • Officers:
    • Klaus-Holger Otto, Nokia, was re-elected as Technical Committee Chair
    • Ed Frlan, Semtech, was re-elected as Technical Committee Vice Chair
    • Tom Issenhuth, Huawei Technologies, was newly elected Market Awareness & Education Committee Co-Chair, Physical and Link Layer (PLL)
    • Lyndon Ong, Ciena, was re-elected as Market Awareness & Education Committee Co-Chair, Networking
    • Dave Brown, Nokia, was appointed as Communications Director, having termed out as a Board member and Board President
  • Technical Committee – Working Groups:
    • Jia He, Huawei Technologies, was newly elected as Network & Operations Working Group Chair
    • Jeff Maki, Juniper Networks, was re-elected as Physical Layer User Group Working Group Chair

“I am thrilled and honored to serve as president of the OIF for the coming year,” said Nathan Tracy, TE Connectivity and new OIF president. “This is an exciting time in the industry and OIF has an important role to play with the interoperability solutions that are both in-process and yet to come. I congratulate all the other members who are newly elected to the board of directors and other leadership positions.”

About OIF
OIF is where the optical networking industry’s interoperability work gets done. Celebrating 20 years of effecting progressive change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors, all collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
Email: leah@wilkinson.associates
Office: 703-907-0010

OIF Work Continues to Advance SDN Commercialization Through New Project – “Requirements for Integrated Packet Optical SDN”

Webinar in partnership with Lightwave to feature OIF global multi-vendor interop demonstration results for SDN T-API use cases Fremont, Calif.—November 15, 2018 – Reinforcing its work to speed the implementation and commercialization of software-defined networking (SDN), OIF announced the launch of its newest project — “Requirements for Integrated Packet Optical SDN.” The project outlines requirements for a multi-layer SDN reference architecture as a use case for packet optical transport networks.

This work continues OIF’s lead in FlexE aggregation architectures by keeping current with industry PHY rates Fremont, Calif.—December 4, 2018 – OIF, the global industry forum accelerating market adoption of advanced interoperable optical networking solutions, today announced the launch of the FlexE 2.1 project and newly elected board members and working group chairs. The new project initiation and elections took place at the Q418 Technical and MA&E Committee meetings held October 29-November 2, 2018 in Sydney, Australia. This work continues OIF’s lead in FlexE aggregation architectures by keeping current with industry PHY rates Fremont, Calif.—December 4, 2018 – OIF, the global industry forum accelerating market adoption of advanced interoperable optical networking solutions, today announced the launch of the FlexE 2.1 project and newly elected board members and working group chairs. The new project initiation and elections took place at the Q418 Technical and MA&E Committee meetings held October 29-November 2, 2018 in Sydney, Australia.

OIF Delivers on Enabling Next Generation Network Flexibility through Three New Interoperability Agreements

OIF efforts provide the growing networking industry with advanced network connectivity, provisioning and flexibility combined with improved data rates

Fremont, Calif.—October 23, 2018 – Continuing its efforts to drive network connectivity and flexibility worldwide, OIF announced three Interoperability Agreements (IAs) aimed at expanded interoperability of Flex Ethernet and increased data rates. The completed IAs—FlexE 2.0, FlexE Neighbor Discovery and Common ACO Electrical I/O—reinforce OIF’s work to provide the industry with solutions for flexible deployment and provisioning of network bandwidth.

“The completion of these projects reinforces OIF’s commitment to provide the industry with the flexibility and increased bandwidth solutions combined with increased data speeds it requires to keep up with market demands and drive solutions that enable the next generation of networks,” explained Dave Stauffer of Kandou Bus and OIF’s Physical and Link Layer (PLL) Working Group Chair.

FlexE 2.0

Initiated in 2016, the FlexE 2.0 project enables equipment to support new Ethernet connection types and FlexE allows network providers and operators to utilize optical transport network bandwidth in more flexible ways. FlexE can deterministically utilize the entire aggregated link, creating a more efficient alternative to the traditional IEEE 802.3ad or IEEE 802.1-based Link Aggregation (LAG) solutions which often can only utilize 70-80% of the available bandwidth. Key features of the FlexE 2.0 project include adding support for FlexE groups composed of 200GBASE-R and 400GBASE-R PHYs, in addition to groups composed of 100GBASE-R PHYs, and adding an option for the support of time and frequency synchronization at the FlexE group level.

FlexE Neighbor Discovery

The FlexE Neighbor Discovery project recognizes that FlexE capability discovery is still required to facilitate the setup of FlexE groups and clients. The project introduced some extensions to the Link Layer Discovery Protocol (LLDP) for FlexE capability discovery. It enables remote FlexE PHY and deskew capability discovery, PHY connectivity discovery and verifications, and FlexE Group subgroup integrity verification.

Common ACO Electrical I/O Project

The implementation agreement for Common Analog Coherent Optics (ACO) Electrical I/O follows the success of the CFP2-ACO optical transceiver implementation agreement but is form factor agnostic, so it also benefits analog coherent modules based on such form factors as CFP4, CFP8, QSFP, microQSFP, QSFP-DD and OSFP. The project defines the ACO electrical I/O independent of the choice of form factor and optical carrier count for 45 Gbaud and 64 Gbaud per-carrier applications.

“We recognize that the data center and communications industries require solutions for flexible deployment and provisioning of network bandwidth combined with component level interoperable infrastructure that can enable system capacity demands,” Stauffer continued.

OIF Day at CenturyLink

OIF Day at CenturyLink was held on October 16, 2018 in Littleton, CO. The interactive and educational workshop featured OIF and CenturyLink subject matter experts covering: OIF projects and directions including Networking Transport SDN work and an overview of Physical & Link Layer work.

 

About the OIF
The OIF facilitates the development and deployment of interoperable networking solutions and services. Members collaborate to drive Implementation Agreements (IAs) and interoperability demonstrations to accelerate and maximize market adoption of advanced internetworking technologies. OIF work applies to optical and electrical interconnects, optical component and network processing technologies, and to network control and operations including software defined networks and network function virtualization. The OIF actively supports and extends the work of national and international standards bodies. Launched in 1998, the OIF is the only industry group uniting representatives from across the spectrum of networking, including many of the world’s leading service providers, system vendors, component manufacturers, software and testing vendors. Information on the OIF can be found at http://www.oiforum.com

OIF INTEROPERABILITY TEST VALIDATES TRANSPORT APPLICATION PROGRAMMING INTERFACE (T-API) 2.0 MARKET-READINESS – RESULTS PUBLISHED IN NEW WHITE PAPER

August 7, 2018  Leah Wilkinson

Successful collaborative demo identified multiple success points and areas where additional work is needed to enhance performance – white paper to provide deep dive and outline specifics

Fremont, Calif.—August 7, 2018 – Detailed results from the OIF’s (Optical Internetworking Forum) 2018 Software-Defined Networking (SDN) Transport Application Programming Interface (T-API) multi-vendor interoperability demonstration showcasing new dynamic behavior use cases and deployment scenarios are available in a white paper published today. To request a copy, please go here.

Demo results were initially announced at a public read-out at NGON in Nice, France, and at two invitation-only events earlier this month at CenturyLink and China Telecom. An additional read-out was held last week during MEF’s Annual Meeting in Nashville, Tenn.

Following a six-week testing period, the OIF released its findings through liaisons to industry bodies.  Among the findings are the following (additional details on the testing and results can be found in the white paper):

  • Open Networking Foundation (ONF) T-API 2.0 specifications have addressed the main issues identified in the OIF’s 2016 testing and provide a basis for real-time orchestration of on-demand connectivity setup, control and monitoring across diverse multi-layer, multi-vendor, multi-domain carrier networks
  • Additional scaling and performance enhancements will need to be addressed as T-API is deployed in real networks, such as refinements to the model, greater detail in error codes to improve debugging properties, and potential implementation options such as a separate server for notifications of network events
  • The API allows for some variability in the use of topology abstraction depending on business requirements and technology; documentation of supplementary examples for topology abstraction will help application and orchestration software developers.

“Standardized and open SDN APIs reduce complexity in intra and inter-domain operations, allowing us to provide more diverse services to our customers in less time,” said Park Jin-hyo, EVP of ICT R&D Center at SK Telecom. “After successfully completing the test trial, SK Telecom will keep engaging in 5G transport network and service development by opening APIs and transforming the current infrastructure into Network-as-a-Service (NaaS) Platform.”

The multi-vendor demo led by four network operator labs included lab-deployed and cloud-deployed systems testing new dynamic behavior use cases and deployment scenarios. The demo also incorporated service provisioning scenarios at the LSO Presto reference point in the MEF LSO architecture, using the MEF NRP Interface Profile Specification (MEF 60), which defines extensions to T-API in support of Carrier Ethernet services.

Participating network operators were CenturyLink, China Telecom, SK Telecom and Telefónica and vendors included ADVA, Coriant, Infinera, NEC/Netcracker, Nokia and SM Optics. Centre Tecnològic de Telecomunicacions de Catalunya (CTTC) was a participating academic institution and TELUS Communications participated as a consulting network operator.

Additional information and an infographic can be found at http://www.oiforum.com/meetings-and-events/2018-oif-sdn-t-api-demo/

2018 OIF SDN Transport API Interoperability Demonstration

Committed to accelerating the commercialization of transport SDN worldwide, the Optical Internetworking Forum (OIF), in collaboration with MEF, will bring new dynamic behavior use cases and deployment scenarios into network operator labs around the world to test multi-vendor interoperability of the industry leading T-API 2.0 northbound interface (NBI) from the Open Networking Foundation (ONF). The 2018 Software-Defined Networking (SDN) Transport Application Programming Interface (T-API) interoperability demonstration builds on the OIF’s 2016 interoperability test and demonstration which addressed multi-layer and multi-domain environments as well as on the 2014 demo which prototyped the use of Northbound APIs and helped advance transport SDN standardization. For an infographic of the demo, click here.

About the OIF

The OIF facilitates the development and deployment of interoperable networking solutions and services. Members collaborate to drive Implementation Agreements (IAs) and interoperability demonstrations to accelerate and maximize market adoption of advanced internetworking technologies. OIF work applies to optical and electrical interconnects, optical component and network processing technologies, and to network control and operations including software defined networks and network function virtualization. The OIF actively supports and extends the work of national and international standards bodies. Launched in 1998, the OIF is the only industry group uniting representatives from across the spectrum of networking, including many of the world’s leading service providers, system vendors, component manufacturers, software and testing vendors. Information on the OIF can be found at http://www.oiforum.com

 

PR Contact:

 

Leah Wilkinson

Wilkinson + Associates for the OIF

Email: leah@wilkinson.associates

Office: +1-703-907-0010

OIF CONCLUDES SUCCESSFUL SDN TRANSPORT API INTEROPERABILITY TESTING – RESULTS TO BE REVEALED TODAY AT NGON

Multi-vendor demo showcases new dynamic behavior uses cases and deployment scenarios

Nice, France—June 26, 2018 – Following a six week testing period, the OIF (Optical Internetworking Forum) today announced the conclusion of its 2018 Software-Defined Networking (SDN) Transport Application Programming Interface (T-API) multi-vendor interoperability demonstration. The much-anticipated demo results will be revealed during a public read-out event being held today from 10:00am-12:00pm at NGON & DCI Europe 2018 in Nice, France. ClicktoTweet

Additionally, Juan Pedro Fernández Palacios, Head of Unit, Telefónica will discuss Telefonica’s view of the demo results and use cases during his NGON keynote presentation tomorrow, June 27th.

“In bringing together service providers and optical networking vendors to demonstrate new SDN deployment scenarios including dynamic-behavior use cases, the OIF in collaboration with MEF has taken another important step towards providing the foundation for service providers to efficiently deliver dynamic multi-domain connectivity services to market,” stated Heidi Adams, Senior Research Director, IP & Optical Networks, IHS Markit. “With the 2018 demo event, the T-API 2.0 interface from the Open Networking Foundation (ONF) is on its way to becoming a standard northbound interface (NBI) to SDN transport network controllers.”

OIF, in collaboration with MEF, is leading the industry toward the validation and widespread commercialization of T-API 2.0 from the Open Networking Foundation (ONF) as a standard northbound interface (NBI) to transport network controllers.

The multi-vendor demo led by four network operator labs included lab deployed and cloud deployed systems testing new dynamic behavior use cases and deployment scenarios. The demo also incorporated service provisioning scenarios at the LSO Presto reference point in the MEF LSO architecture, using the MEF NRP Interface Profile Specification (MEF 60), which defines extensions to T-API in support of Carrier Ethernet services.

“The OIF SDN Interoperability demonstration has successfully brought together carriers, vendors and integrators with a common goal of moving to an open API (TAPI),” said Jack Pugaczewski, Distinguished Architect, CenturyLink. “T-API is a key enabler for providing automated service fulfillment and assurance. We have tested the Connectivity, Topology and Notification software patterns that T-API provides. Common APIs reduce design, development and deployment cycles for all involved, thus getting to market faster and realizing the financial benefits of automation.”

Participating network operators were CenturyLink, China Telecom, SK Telecom and Telefónica and vendors included ADVA, Coriant, Infinera, NEC/Netcracker, Nokia and SM Optics. Centre Tecnològic de Telecomunicacions de Catalunya (CTTC) was a participating academic institution and TELUS Communications participated as a consulting network operator.

Additionally, two private events detailing the test results will be held with participating network operators: CenturyLink on July 10 in Denver, Colorado and China Telecom on July 19 in Beijing. Members of the media and analyst community interested in attending, please contact leah@wilkinson.associates.

“The OIF’s goal for interop events is to improve the quality and clarity of specifications being tested,” explained Jonathan Sadler, OIF VP and Networking & Operations Interoperability Working Group Chair. “As the tests were performed, we noted possible points for misunderstanding and places where the specifications may be enhanced. These results will be liaised to ONF and MEF for review at future meetings.”

A technical white paper and an executive summary of the demo result will be available in August.

An infographic of the demo is

Additional information can be found at 2018 OIF SDN T-API INTEROP DEMO

2018 OIF SDN Transport API Interoperability Demonstration

Committed to accelerating the commercialization of transport SDN worldwide, the Optical Internetworking Forum (OIF), in collaboration with MEF, will bring new dynamic behavior use cases and deployment scenarios into network operator labs around the world to test multi-vendor interoperability of the industry leading T-API 2.0 northbound interface (NBI) from the Open Networking Foundation (ONF). The 2018 Software-Defined Networking (SDN) Transport Application Programming Interface (T-API) interoperability demonstration builds on the OIF’s 2016 interoperability test and demonstration which addressed multi-layer and multi-domain environments as well as on the 2014 demo which prototyped the use of Northbound APIs and helped advance transport SDN standardization. For an infographic of the demo, click here.

About the OIF

The OIF facilitates the development and deployment of interoperable networking solutions and services. Members collaborate to drive Implementation Agreements (IAs) and interoperability demonstrations to accelerate and maximize market adoption of advanced internetworking technologies. OIF work applies to optical and electrical interconnects, optical component and network processing technologies, and to network control and operations including software defined networks and network function virtualization. The OIF actively supports and extends the work of national and international standards bodies. Launched in 1998, the OIF is the only industry group uniting representatives from across the spectrum of networking, including many of the world’s leading service providers, system vendors, component manufacturers, software and testing vendors. Information on the OIF can be found at http://www.oiforum.com

 

PR Contact:

 

Leah Wilkinson

Wilkinson + Associates for the OIF

Email: leah@wilkinson.associates

Office: +1-703-907-0010

OIF Initiates New CEI-112G-XSR Project for D2D/D2OE Common Electrical Interface, Addresses Multiple Chip Integration

Forum continues efforts to support new and evolving architectures by defining a range of electrical interfaces which enable optimized system design for power, cost and packaging

Fremont, Calif.—June 12, 2018 – The OIF (Optical Internetworking Forum) today announced the launch of the CEI-112G-XSR project for Die-to-Die (D2D) and Die-to-Optical Engine (D2OE) Common Electrical Interface at the Q218 Technical and MA&E Committees meeting held April 24-26, 2018 in Nuremberg, Germany. The project aims at enabling intra-package interconnects to optical engines or between dies with high throughput density and low normalized power operating in the data rate range of 72-116 Gbps with a reach up to 50 mm.

In addition to the already existing CEI-112G-MCM OIF project, which is dedicated to wide, high bandwidth CMOS-to-CMOS interconnects, the new CEI-112G-XSR project proposes to support technology mix, in particular CMOS-to-SiGe (Silicon Germanium), which is frequently used to build optical engines. System-in-package (SIP) leads to a requirement of supporting up to 50 mm trace length between the multiple chips on a common (organic) package substrate.

“We jointly designed this project to address the problem of integrating multiple dies, including driver devices for optical engines on non-CMOS technologies, onto a common substrate within a large multi-chip-package design. Supporting this mix of technology allows combining the high logic density of CMOS devices with the high drive strength of analog components,” explained Klaus-Holger Otto of Nokia and OIF Technical Committee Chair.

The working group for the CEI-112G-XSR project has identified the following benefits for OIF members:

  • Allow lower normalized power, double shoreline throughput density and provide a multi-source 72-116 Gbps D2D and D2OE electrical I/O interface. This will enhance the integration, normalized power reduction, and cost reduction for integrated OE, multiple-die SIPs.
  • Enable 1 to N lanes of 72-116 Gbps electrical I/Os (e.g. on ASIC/FPGA/OE).

OIF Day at Nokia

Following the quarterly meeting, a sizeable group of OIF members participated in an OIF Day event at the Nokia Nuremberg facility on April 27, 2018. The OIF Day Program is a live educational workshop program to expand awareness of, and educate member company employees on the work of the OIF. The OIF Day event is conducted at network operator and/or vendor sites to reach and obtain inputs from a range of support functions, e.g. operations, network planning, network management, marketing, etc. It is custom-tailored to the needs of each hosting company and comprised of general sessions and tracks focused on Networking and/or Physical and Link Layer topics.

OIF Transport-API for Transport SDN Survey

OIF also recently conducted a survey of OIF members and non-members, including network operators and vendors, on the OIF’s proposed certification project for Transport-API (T-API) for Transport SDN. Nearly 30 responses to the survey were received – 20+ from network operators and 9 from vendors.  The OIF will consider the feedback in any proposal to expand the current program to include T-API certification.

About the OIF
The OIF facilitates the development and deployment of interoperable networking solutions and services. Members collaborate to drive Implementation Agreements (IAs) and interoperability demonstrations to accelerate and maximize market adoption of advanced internetworking technologies. OIF work applies to optical and electrical interconnects, optical component and network processing technologies, and to network control and operations including software defined networks and network function virtualization. The OIF actively supports and extends the work of national and international standards bodies. Launched in 1998, the OIF is the only industry group uniting representatives from across the spectrum of networking, including many of the world’s leading service providers, system vendors, component manufacturers, software and testing vendors. Information on the OIF can be found at http://www.oiforum.com

 

PR Contact:
Leah Wilkinson
Wilkinson + Associates for the OIF
Email: leah@wilkinson.associates
Office: 703-907-0010