OIF Announces 2024-2025 Board of Directors and Officers

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Fremont, Calif. — OIF, where the optical networking industry’s interoperability work gets done, today announced its newly elected 2024–2025 Board of Directors and Officers. The new terms began on Oct.1, 2024.

2024-2025 Election Results

  • Board of Directors:

    • Ian Betty, Ciena, was re-elected to the Board
    • Mike Klempa, Alphawave Semi, was elected to the Board and continues as Physical and Link Layer (PLL) Interoperability Working Group Chair
    • Mike Li, Intel, was re-elected to the Board
    • Cathy Liu, Broadcom Inc., was re-elected to the Board and continues to serve as Vice President
    • David Stauffer, Kandou Bus, was elected to the Board and continues to serve as PLL Working Group Chair
  • Continuing to serve on the Board:

    • Nathan Tracy, TE Connectivity, continues to serve as President
    • Jeff Hutchins, Ranovus, will serve as Secretary/Treasurer and continues as PLL Working Group – Energy Efficient Interfaces (EEI) Vice Chair
    • Dave Brown, Nokia, continues to serve as Director of Communications
  • Officers

    • Karl Bois, Nvidia, was re-elected as Technical Committee Chair
    • Tom Issenhuth, Huawei Technologies, was re-elected as Market Awareness & Education Committee Co-Chair, PLL
    • Sam Kocsis, Amphenol Corporation, was elected as Technical Committee Vice Chair

“Congratulations to OIF’s Board of Directors and Officers,” said Nathan Tracy, President of OIF. “As a volunteer organization, OIF relies on the dedication and expertise of its members to advance optical networking interoperability. Their willingness to contribute their time and talent is invaluable, and I am proud to be a part of such a committed and visionary group.”

For more information about OIF and its leadership, visit OIF’s website.

About OIF
OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 150+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF on LinkedIn, on X at @OIForum and http://www.oiforum.com.

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
leah@wilkinson.associates
703-907-0010

OIF Holds Q4 Technical and MA&E Committees Meetings in Melbourne, Australia—Announces Working Group Re-Elections and Launches New Projects

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Fremont, Calif. – OIF successfully concluded its Q4 2024 Technical and MA&E Committees Member Meeting held fully in person in Melbourne, Australia, from November 5-7, 2024.

During the meeting, OIF members re-elected two Working Group Chairs and launched two new projects – 1600 Coherent Light and Protocol-Neutral Management Information Model for Digital Twin Optical Network as Enhanced Network Operations. The meeting also featured guest speaker Alana Nakata, Vice President of Product Engineering, Efficient Power Conversion.

WORKING GROUP CHAIRS RE-ELECTION

OIF members also re-elected two Working Group Chairs (for two-year terms):

  • Mike Klempa, Alphawave Semi – Physical & Link Layer (PLL) Interoperability Working Group Chair
  • Jeffery Maki, Juniper Networks – Physical Layer User Group Working Group Chair

NEW PROJECT – 1600 Coherent Light

The 1600 Coherent Light project aims to support larger data center campuses by developing Long Reach (LR) optics for 1600 Gbit/s data transmission. The proposed solution involves a Coherent Light (CL) standard, which can substantially improve power efficiency and latency compared to the existing 1600ZR technology for these connections. By leveraging the foundation of 800LR technology, CL is positioned to serve as the basis for future LR and FR implementations, potentially scaling up to 3.2T, thereby enhancing the scalability and efficiency of data centers as they continue to grow and evolve.

NEW PROJECT – Protocol-Neutral Management Information Model for Digital Twin Optical Network as Enhanced Network Operations

The new Protocol-Neutral Management Information Model for Digital Twin Optical Network as Enhanced Network Operations project proposes to define a protocol-neutral management information model based on pruning and refactoring of existing information models such as ITU-T G.7711. This model will cover the requirements of digital twin optical network use cases such as network planning and simulation.

“This member-driven collaboration is what makes OIF unique and influential in the industry,” said Karl Bois, OIF Technical Committee Chair and NVIDIA. “We’re proud of the strides we’re making, especially with our latest new project starts, which demonstrate how our members are collaborating to drive global standards in networking technology.”

GUEST SPEAKER

OIF hosted guest speaker Alana Nakata, who shared insights on advancements in efficient power management, underscoring the essential role power technologies play in the evolution of high-performance networking.

OIF’s members-only Q1 2025 Technical and MA&E Committees Meeting will be held in San Diego on February 10-14, 2025.

About OIF
OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 150+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF on LinkedIn, on X at @OIForum and at http://www.oiforum.com.

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
leah@wilkinson.associates
703-907-0010

OIF Releases 800ZR Coherent Interface Implementation Agreement (IA) and Key 400ZR IA Updates, Addressing Market Demands for Scalable, Interoperable, High-Capacity Solutions

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Fremont, CA – Oct. 30, 2024 – In its ongoing commitment to meet evolving market demands for interoperability and address real-world network requirements, OIF has released its highly anticipated 800ZR coherent interface implementation agreement (IA). OIF has also released updates to the foundational 400ZR coherent optical interfaces IA.

The new 800ZR IA, developed through a systematic process driven by OIF’s network operator and vendor members, defines the requirements for an 800G coherent line interface and frame format for single-span, amplified 80-120 km Dense Wavelength Division Multiplexing (DWDM) links, specifically targeting data center interconnect (DCI) applications.

“This IA represents a critical milestone in expanding the capacity and efficiency of DCI solutions,” said Karl Gass, OIF Physical and Link Layer (PLL) Working Group (WG) Optical Vice Chair. “The 800ZR IA builds on the success of OIF’s transformational 400ZR work, providing a clear pathway for vendors and network operators to implement scalable, interoperable 800G solutions.”

The 800ZR IA enables Ethernet client interfaces, starting at a minimum of 100GE, to scale up to 800G aggregate bandwidth over a single coherent line interface. It specifies the Ethernet client mappings, frame format, forward-error correction (FEC), modulation and optical characteristics needed for interoperable 800ZR implementations. An important feature of this IA is its focus on low-power, cost-effective coherent solutions in small form-factor pluggable modules, which provide high port densities typically found in client optics.

This IA marks a significant advancement in 800ZR interoperability, demonstrating its potential to deliver scalable solutions for high-capacity optical links over extended distances.​ OIF recently demonstrated the first multivendor interoperability of 800ZR coherent interfaces at ECOC 2024 in Frankfurt, showcasing the technology’s readiness for deployment in high-capacity DCI applications.

The updates to the 400ZR IA (3.0) focus on addressing identified deficiencies and clarifying several parameter definitions. These updates aim to enhance interoperability and improve the implementation of 400ZR solutions across the industry.

The 400ZR IA has seen rapid adoption since its introduction, with 400ZR modules now widely available from multiple vendors. OIF recently released a success story showcasing the significant industry impact of the 400ZR IA, highlighting how it has transformed the market by enabling interoperable, cost-effective solutions for data center interconnects.

“400ZR and its derivatives are by far the most successful coherent technology of all time,” said Scott Wilkinson, Lead Analyst, Cignal AI. “Without 400ZR, data center development would not be where it is today.”

About OIF

OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 150+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF on LinkedIn, on X at @OIForum and at https://www.oiforum.com/.

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

leah@wilkinson.associates

703-907-0010

 

 

OIF to Demonstrate Industry Leadership in Interoperability at Network X 2024, 2024 OCP Global Summit, TEF 2024 and a Heavy Reading Webinar

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Fremont, CA – Oct. 3, 2024 – OIF, where the optical networking industry’s interoperability work gets done, will participate in several upcoming global conferences – Network X 2024, the 2024 Open Compute Project (OCP) Global Summit and Ethernet Alliance’s Technology Exploration Forum (TEF) 2024 – reinforcing its leadership role in shaping the future of interoperability in the networking and Artificial Intelligence (AI)/Machine Learning (ML) industries.

OIF will also participate in an upcoming webinar with Heavy Reading and host its own Common Management Interface Specification (CMIS) Tutorial Webinar.

OIF’s ongoing work developing and promoting interoperability standards is critical to the industry, enabling seamless communication and performance across diverse platforms. At these upcoming events and webinars, OIF experts will speak and share key insights on coherent optics, reducing optical power consumption, CMIS, IP over DWDM and AI-driven networks.

“By providing updates on critical projects during global events and webinars, OIF is actively helping the industry adapt to emerging challenges,” said Nathan Tracy, OIF President and TE Connectivity. “Through driving interoperability and advancing standards, OIF ensures the industry is prepared for tomorrow’s data-intensive demands while demonstrating thought leadership on today’s most pressing technology issues.”

OIF experts will participate in the following events, sharing insights and updates on the latest advancements in interoperability:

NGON @ Network X 2024 Oct. 8-10, 2024 – Paris, France

OIF will present an update on interoperable pluggable coherent optics, critical for the future of high-speed networks.

  • “Pluggable Coherent Optics – The New Frontier, An OIF Update”
    • Thursday, Oct. 10, 2024 – 2:30 pm – 2:50 pm CEST
    • Presenter: Dave Brown, OIF Director of Communications and Nokia

OIF CMIS Tutorial Webinar Series Oct. 9, 2024 – Webinar

OIF will host the fifth webinar in a series of free tutorial webinars, open to the public, that are designed to provide engineers, developers and industry professionals with a comprehensive understanding of CMIS.

  • “Network Path State Machine”
    • Wednesday, Oct 9, 2024 – 9 am-10:30 am PDT
    • Presenter: Eric Maniloff, Ciena

2024 OCP Global Summit Oct. 15-17, 2024 – San Jose, California

OIF will provide a crucial update on standards and how new guidelines are reducing optical power consumption in networking.

  • “Standards Update: Reducing Optical Power Consumption”
    • Wednesday, Oct. 16, 2024 – 8:40 am – 9:00 am PST
    • Presenter: Nathan Tracy, OIF President and TE Connectivity

Light Reading Webinar Oct. 22, 2024 – Webinar

Working with partners including OIF, Heavy Reading has launched an Industry Initiative project aimed at making the case for IP over DWDM adoption, particularly among CSPs. In this special webinar, Heavy Reading and project partners dive into the details of IP over DWDM architectures, including opportunities, challenges, use cases and enabling hardware and software technologies.

  • “Making IP over DWDM a Reality”
    • Tuesday, Oct. 22 – 11:00 am – 12:00 pm EDT
    • Presenter: Ian Alderdice, OIF Physical and Link Layer (PLL) Working Group Management Co-Vice Chair and Ciena

TEF 2024: Ethernet in the Age of AI Oct. 22-23, 2024 – Santa Clara, California

OIF will play a significant role in several sessions at EA’s TEF 2024, addressing the intersection of Ethernet, AI and next-gen interconnect technology.

TEF 2024 Day 1 – Tuesday, Oct. 22, 2024

  • “The State of Today’s Industry SDOs and MSAs”
    • Tuesday, Oct. 22, 2024 – 10:00 am PST
    • Presenter: Nathan Tracy, OIF President and TE Connectivity – Topic: OIF Addresses The Paths To Next Generation AI
  • “The Future of Ethernet, Networks and AI”
    • Tuesday, Oct. 22, 2024 – 1:00 pm PST
    • Presenter: Jeff Hutchins, OIF Board Member and OIF PLL Working Group EEI Vice-Chair and Ranovus – Topic: Considerations for Next Generation AI Compute Interconnect
  • “Exploration of AI Interconnect”
    • Tuesday, Oct. 22, 2024 – 3:55 pm PST
    • Presenter: Cathy Liu, OIF Vice President and Broadcom – Topic: Performance Analysis at 400+Gbps Over Next-Generation VSR Channels

TEF 2024 Day 2 – Wednesday, Oct. 23, 2024

  • “The Future of Electrical Signaling”
    • Wednesday, Oct. 23, 2024 – 9:50 am PST
    • Presenter: Mike Li, OIF Board Member and Intel – Topic: Electrical I/O at 448 Gbps
  • “Industry SDOs and MSAs – Going Forward”
    • Wednesday, Oct. 23, 2024 – 4:20 pm PST
    • Presenter: Nathan Tracy, OIF President and TE Connectivity

For further details on OIF speaking engagements and webinars, please visit: https://www.oiforum.com/meetings-events/speaking-engagements-and-supported-events/

About OIF

OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 150+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF on LinkedIn, on X at @OIForum and at https://www.oiforum.com/.

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

leah@wilkinson.associates

703-907-0010

 

OIF Unveils Three New CMIS Implementation Agreements – CMIS 5.3, ELSFP Pluggable CMIS, CMIS-FF – and a New White Paper “CMIS: Path to Plug-and-Play”

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New specification agreements and white paper set the path toward enhanced interoperability and plug-and-play capabilities

Fremont, Calif. – OIF has unveiled the latest Common Management Interface Specification (CMIS) Implementation Agreement (IA) (version 5.3); the External Laser Small Form Factor (ELSFP) Pluggable CMIS IA; the Formfactor Specific Hardware Management (CMIS-FF) IA; and a new white paper titled “CMIS: Path to Plug and Play.”

“These industry-critical IAs represent significant strides in advancing CMIS interoperability across the industry,” said Gary Nicholl, OIF Board Member and Physical and Link Layer (PLL) Working Group – Management Co-Vice Chair, and Cisco. “These new standards not only enhance the functionality of modules but also streamline the integration process, reducing the time to market for new technologies.”

CMIS 5.3 IA

The CMIS 5.3 IA is a critical update to OIF’s core CMIS document. In addition to multiple maintenance updates to improve useability and correct errors, this update provides new functionality in many spaces including Co-Packaged Optics, ELSFP, serial peripheral interface (SPI) interface, Link Training and support for more applications. As part of our “Path to Plug and Play” initiative, this update also adds new advertising capabilities that let the modules better advertise their capabilities to hosts. This new advertising includes items like per application power consumption and descriptions of custom media/host codes.

This specification applies to various pluggable or on-board modules such as QSFP Double Density (QSFP-DD), OSFP, COBO and QSFP, as well as future module developments. The CMIS 5.3 IA is a critical resource for systems manufacturers, system integrators and suppliers of CMIS-compliant modules, enabling them to ensure seamless management communication between host systems and modules through a two-wire interface.

ELSFP Pluggable CMIS IA

The ELSFP Pluggable CMIS IA, developed in response to the increasing demand for external laser small form factor modules, extends the memory map defined in CMIS to include objects for controlling ELSFP modules. This agreement is vital for aligning the management interface of ELSFP modules with the overarching CMIS framework, ensuring consistent and reliable control through a two-wire communication protocol.

CMIS-FF IA

The Formfactor Specific Hardware Management (CMIS-FF) IA provides a comprehensive specification for managing hardware controls in conjunction with CMIS. CMIS-FF supplements CMIS by defining form factor specific hardware signal usage on a per form factor basis and offering an equivalent management framework to existing standards like SFF-8472, SFF-8636 and SFP-DD MSA MIS. This agreement allows form factors that do not include the same hardware control pins as CMIS managed modules to map functionality to different pins/registers, enabling these form factors to use CMIS for management.

See all the CMIS IAs here.

White Paper: “CMIS: Path to Plug and Play”

Along with these new IAs, OIF has also released a white paper titled “CMIS: Path to Plug and Play.” This paper outlines how CMIS advertising enables hosts to write generic software for managing CMIS-compliant modules, significantly reducing integration time and accelerating the deployment of new capabilities in end-user networks. By promoting a standardized provisioning model, this white paper highlights how CMIS 5.3 enhancements pave the way for true plug-and-play functionality in the industry.

“The launch of the Path to Plug and Play white paper underscores OIF’s commitment to simplifying and accelerating the deployment of CMIS,” said Ian Alderdice, OIF PLL WG – Management Co-Vice Chair and Ciena. “By providing a clear path to plug-and-play capabilities, we are empowering the industry to meet the growing demands of high-speed networks with greater efficiency and reliability.”

For more information on the new IAs and white paper or to learn more about OIF’s ongoing work, please visit OIF’s website.

About OIF

OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 150+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF on LinkedIn, on X at @OIForum and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

leah@wilkinson.associates

703-907-0010

 

OIF Leads the Charge for Interoperability at ECOC 2024

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34 Member Companies to Showcase Cutting-Edge Solutions, OIF Experts to Speak in Three Market Focus Sessions

Fremont, Calif. – OIF today unveiled new details on its live interoperability demonstrations at ECOC 2024, highlighting advancements across critical areas such as 800ZR, 400ZR and multi-span optics; Common Electrical I/O (CEI) CEI-112G and CEI-224G; Common Management Interface Specification (CMIS) and Energy Efficient Interfaces (EEI) & Co-Packaging.

The demonstrations showcased in Booth #B83 Sept. 23-25 in Frankfurt, Germany, feature collaboration among 34 member companies and highlight the organization’s leadership in interoperability across a range of cutting-edge technologies.

In addition to the demonstrations, OIF experts will lead Market Focus Sessions on Coherent Optics, CMIS and EEI.

“Live interoperability demonstrations are essential for the industry to witness firsthand the seamless integration of technologies,” said Dave Brown, OIF Director of Communications, and Nokia. “OIF’s demos at ECOC, featuring contributions from system, component and test-equipment vendors, underscore OIF’s leadership in interoperability across key technologies that are crucial in shaping the standards that will define the next decade of our industry.”

Interoperability Demonstrations at Booth #B83

800ZR, 400ZR and Multi-Span Optics – Unveiling Optical Breakthroughs: The pluggable coherent optics demonstration will showcase progress in the latest advancements in 800ZR, 400ZR and ZR+ optics interoperability, offering a comprehensive view of their capabilities and applications. The demo highlights include the first public 800ZR multivendor DSP interop; OpenZR+, 100ZR and OpenROADM/ITU-T, all over multiple, multi-span networks; and OIF’s foundational 400ZR collocated on the same single-span network as 800ZR.

CEI-112G-Linear & CEI-224G Interoperability – Fast-Track to the Future: OIF is accelerating electrical interface interoperability with a suite of 224Gbps and 112Gbps CEI multi-vendor demonstrations spanning a variety of applications that form the foundation of next-generation optical connectivity. The CEI-224G demonstrations include a diversity of link types from Very Short Reach (VSR) to Long Reach (LR) and linear interfaces leveraging specifications spearheaded by the OIF. The CEI-112G demonstration displays the breadth and depth of linear pluggable optics with interoperability from multiple vendors over various link types.

CMIS – Path to Plug & Play: OIF members will demonstrate physical layer management interoperability across diverse network equipment and pluggables enabled by CMIS. The demonstration includes the CMIS industry-standard management interface for a common network control platform, showing interoperability among different plug types, switches/routers and test-measurement equipment, all operating with CMIS.

EEI and Co-Packaging – Revolutionizing Connectivity: OIF members will display a conceptual demo of AI compute and live PCIe optical links, all using next-generation EEI, as well as live demos showcasing the latest advancements for ELSFP, external laser source faceplate pluggable, for co-packaging.

Participating member companies include:
Adtran, Alphawave Semi, Amphenol, Anritsu, AOI, Astera Labs, Cadence Design Systems Inc., CICT/Accelink, Cisco, Coherent Corp., EXFO, HG Genuine, Hisense, Infinera, Innolight, Juniper Networks, Keysight Technologies, Lessengers, Linktel Technologies, Lumentum, MACOM Technology Solutions, Marvell, Molex, MultiLane, Nokia, O-Net Technologies, Samtec, Semtech, Senko Advanced Components, Sumitomo Electric Industries, Synopsys, TE Connectivity, US Conec and Wilder Technologies.

OIF Experts to Share Insights in Market Focus Sessions

In addition to the live interoperability demonstrations, OIF experts will contribute their knowledge in three Market Focus Sessions, offering insights into key industry trends and technological advancements:

  • “Coherent Optics in the Datacenter”

Monday, Sept. 23, 2024, from 1:20 pm-1:35 pm CEST

Presenter: Karl Gass, OIF Physical and Link Layer (PLL) Working Group (WG) Optical Vice Chair

  • “CMIS – Is Plug-and-Play Possible?”

Monday, Sept. 23, 2024, from 2:20 pm-2:35 pm CEST

Presenter: Doug Cattarusa, OIF Editor, Cisco

  • “Energy Efficient Interfaces for the Next Generation of AI Compute”

Tuesday, Sept. 24, 2024, from 11:20 am-11:35 am CEST

Presenter: Jeff Hutchins, OIF Board Member and PLL WG EEI Vice Chair, Ranovus

For further details, please visit: https://www.oiforum.com/meetings-events/oif-ecoc-2024/

 

About OIF

OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 150+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF on LinkedIn, on X at @OIForum and at https://www.oiforum.com/.

 

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
leah@wilkinson.associates
703-907-0010

 

OIF Concludes Successful Q3 ‘24 Technical and MA&E Committees Meeting with Launch of Three New Projects to Advance Networking Technologies

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Fremont, Calif. – OIF successfully concluded its Q3 ‘24 Technical and MA&E Committees Meeting, held from Aug. 6-8, 2024, in Ottawa, ON, Canada.

During the meeting, OIF members initiated three new projects: Energy Efficient Interfaces (EEI) Compute Optics Interface (COI) for Artificial Intelligence (AI) Scale-up, EEI-224G-RTLR, and Common Electrical I/O (CEI)-448G Framework. The meeting also included Physical & Link Layer Working Group Interim Meetings on Aug. 5, 2024.

“Our in-person meetings provide a critical platform for collaboration and progress, allowing us to push the boundaries of innovation and address the evolving needs of the networking and AI/Machine Learning (ML) industries,” said Karl Bois, OIF Technical Committee Chair and NVIDIA.

NEW PROJECTS:

EEI COI Project for AI Scale-up: Aimed at addressing the growing demands of AI and ML, this project will focus on developing high-efficiency, low-latency interfaces to support the next generation of AI hardware.

The EEI COI Project will focus on developing energy-efficient, low-latency photonic interfaces to support AI scale-up links such as PCIe, NVLink and UALink. As AI workloads grow, the need for standardized, interoperable solutions for local accelerator connectivity becomes critical. Building on the existing EEI work, this project aims to address the industry’s demand for scalable, high-performance compute optical interfaces that ensure interoperability across diverse AI platforms.

EEI-224G-RTLR Project: This project will concentrate on enhancing electrical interfaces to enable lower power 224G optical signaling, a critical component in the evolution of high-speed data transmission and the expansion of broadband infrastructure.

The EEI-224G-RTLR Project aims to develop an Implementation Agreement (IA) for 224G Retimed Tx Linear Rx (RTLR) optical interfaces, following the decision to split the 224G RTLR work into a dedicated project. RTLR offers significant potential for cost, power and latency savings—approximately half of what is achievable with fully retimed pluggable optics—by eliminating the need for Rx DSP. Unlike Linear Pluggable Optics (LPO), where optical and copper links are mutually constrained, RTLR enables true plug and play interoperability.

This project is critical to ensuring interoperable interfaces with reduced power and higher efficiency in next-generation data and communication systems.

CEI-448G Framework Project: The CEI-448G Framework Project will develop a comprehensive framework for 448G electrical interfaces, enabling higher data rates and improved performance in data center and telecommunications applications.

The CEI-448G Framework Project is focused on defining the next electrical data rate beyond 224Gbps, targeting 448Gbps. As industry discussions begin, this project aims to address the challenges of achieving this high-speed data rate by exploring key factors like interface support, modulation schemes and test methodologies.

By gathering input from end-users, equipment developers and industry experts, the project will create a comprehensive body of knowledge. The findings will be summarized in a technical white paper, laying the groundwork for future projects that will develop specific standards and architectures for 448Gbps data rates.

Looking ahead, OIF’s Q4 ‘24 Technical and MA&E Committees Meeting will be held the week of November 4-8, 2024, in Melbourne, Australia. This members-only meeting will provide a platform for further collaboration and progress on ongoing and new projects.

For more information about OIF’s initiatives, upcoming events or how to become a member, please visit  https://www.oiforum.com.

About OIF
OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 150+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF on LinkedIn, on X at @OIForum and at http://www.oiforum.com.

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
leah@wilkinson.associates
703-907-0010

OIF Champions Interoperability at ECOC 2024: 34 Member Companies to Showcase Solutions for Data Centers, AI/ML Technologies and Disaggregated Systems

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Demos include 800ZR, 400ZR and multi-span optics, Energy Efficient Interfaces (EEI) & co-packaging, 224G and 112G Common Electrical I/O (CEI) and Common Management Interface Specification (CMIS)

Fremont, Calif. – OIF is set to lead a dynamic interoperability demonstration featuring live collaboration between 34 member companies at the upcoming ECOC 2024 exhibition being held Sept. 23-25 in Frankfurt, Germany. This showcase will highlight advancements in performance, efficiency and capacity in response to the burgeoning needs of future-oriented data centers, AI/ML technologies and disaggregated systems.

The demonstration, in Booth #B83, will spotlight interoperability innovations in 800ZR, 400ZR and multi-span optics, Energy Efficient Interfaces (EEI) & co-packaging, 224G and 112G Common Electrical I/O (CEI) and Common Management Interface Specification (CMIS) – all pivotal for shaping the next decade of industry standards.

“OIF’s interoperability demonstrations at this year’s ECOC are a testament to the collaborative efforts of our member companies in enabling next-generation connectivity solutions,” said Nathan Tracy, OIF President, and TE Connectivity. “Our focus on advanced solutions underscores our commitment to addressing the future networking needs driven by evolving technologies like AI/ML.”

The interoperability demonstrations will showcase system, component and test-equipment vendors and highlight their roles in driving the adoption of advanced technologies in near-term and next-generation networks.

Participating member companies include Adtran; Alphawave Semi; Amphenol; Anritsu; AOI; Astera Labs; Cadence Design Systems, Inc.; CICT/Accelink; Cisco; Coherent Corp.; EXFO; HG Genuine; Hisense; Infinera; Innolight; Juniper Networks; Keysight Technologies; Lessengers; Linktel Technologies; Lumentum; MACOM Technology Solutions; Marvell; Molex; MultiLane; Nokia; O-Net Technologies; Samtec; Semtech; Senko Advanced Components; Sumitomo Electric Industries; Synopsys; TE Connectivity; USConec and Wilder Technologies.

For further details, please visit: https://www.oiforum.com/meetings-events/oif-ecoc-2024/

About OIF

OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 150+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF on LinkedIn, on X at @OIForum and at https://www.oiforum.com/.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

leah@wilkinson.associates

703-907-0010

 

 

OIF Q2 Technical and MA&E Committees Meeting Wraps with CEI-224G-Linear Project Launch, New CMIS White Papers and Requirements for Energy Efficient Interfaces

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Interoperability work continues in key project areas, including 1600ZR/1600ZR+ and EEI specifications

 

Fremont, Calif. – June 13, 2024 – OIF’s Q2 Technical and Market Awareness & Education (MA&E) Committees meeting, held May 7-9 in Athens, Greece, concluded with the launch of a Common Electrical I/O (CEI) CEI-224G-Linear project and the publication of two Common Management Interface Specification (CMIS) white papers.

Additionally, the Physical Layer User Group (PLUG) Working Group released a new system vendor requirements document for Energy Efficient Interfaces (EEI).

The event had robust attendance from member companies and featured discussions and debates on advancements in optical networking technology interoperability, as well as a guest speaker from ETH Zürich.

The meeting included ongoing efforts in many technical work areas, including 1600ZR/1600ZR+ and EEI, underscoring OIF’s leadership in tackling the complex challenges facing today’s high-speed optical networks.

“OIF’s commitment to interoperability standards and tackling technological challenges was evident at the Q2 meeting,” said Nathan Tracy, OIF President, and TE Connectivity. “The high attendance, start of the CEI-224G-Linear project, CMIS white papers, and the vendor requirements document for EEI, alongside David Moor’s insightful presentation on advanced transceiver design, underscore our leadership in promoting industry-wide collaboration and innovation.”

New Project

The new CEI-224G-Linear project will build on the approach of CEI-112G-Linear in terms of specification methodology. It will support 224G full linear optical modules for next-gen applications (e.g., Ethernet, Ultra Ethernet Consortium (UEC), Artificial Intelligence/Machine Learning [AI/ML]) with low power, cost/complexity and latency. The TP1/TP1a and TP4/TP4a electrical specifications will enable up to 224G full linear optical modules for Linear Pluggable Optics (LPO), co-packaged optics (CPO) and Near Package Optics (NPO), supporting next-generation application requirements.

“The CEI-224G-Linear project will represent significant progress in our technological capabilities, weaving the precision of CEI-112G-Linear with groundbreaking innovations,” said Mike Li, OIF Board Member and Intel. “By enabling 224G full linear optical modules and leveraging the advanced 224G DSP SERDES architecture and technology, this initiative is poised to redefine the landscapes of Ethernet, UEC and AI/ML applications. As we embrace lower power, cost and latency, this project is a giant step forward in next-generation computing and connectivity driven by AI/ML.”

New White Papers

Common Management Interface Specification (CMIS) White Paper on Management of Smart Optical Modules

This white paper explores how the DWDM functions, parameters and operational aspects of “smart” optical pluggable modules can be handled more efficiently to address various challenges. It introduces an alternative control paradigm for optical modules that decouples optical layer control from packet layer control and from host software and packet controller software development and outlines the pros and cons of this approach. This paradigm is called “host independent management,” enabling advanced capabilities of smart optical modules via additional management methods. The white paper is available for download here.

CMIS-Based Out-of-Band Messaging for Link Training

This white paper provides background on link training and a proposed message catalog by which any transmit SerDes can be trained initially (or tuned adaptively while in service) based on the needs of the corresponding receive SerDes, with the help of message exchange.

It promotes out-of-band (OOB) messaging via the ubiquitous CMIS management link as a flexible solution for exchanging link training messages. The technical specifications of the messaging facility and the representation of the messages will be defined in a CMIS-LT supplement. Potential CMIS-LT applications could include CEI-112G Very Short Reach (VSR), Extra Short Reach (XSR), XSR+, and Medium Reach (MR), IEEE 802.3 AUI C2M links, Fibre Channel, InfiniBand, Optical Transport Network (OTN), etc. Download the white paper here.

Requirements Document 

System Vendor Requirements Document for Energy Efficient Interfaces

In today’s fast-paced technological landscape, where data processing and communication demands for AI continue to soar, pursuing energy-efficient solutions is critical. This requirements document for EEI is a direct result of engaging with end users to understand their needs and expectations. It seeks to prioritize applications and establish fundamental criteria for the next generation of energy-efficient electrical and optical link projects and specifications.

Through these discussions, it’s clear the most pressing need for EEI is in high-density application scenarios. The document outlines critical requirements to achieve optimal performance for various applications that necessitate the utilization of such interfaces. These requirements encompass a range of factors, including energy targets, latency targets, desired form factors, degrees of interoperability, traffic types and more. 

Download the requirements document here.

Guest Speaker

The event was further highlighted by guest speaker David Moor, a representative from ETH Zürich and the FLEX-SCALE consortium. Moor discussed the development of an optical digital-to-analog converter (oDAC) supporting Tbps+ data rates with lower power per bit than conventional modulation methods. According to Moor, this design utilizes currently available electronics and photonic devices and is well suited to support high-capacity transport with improved power efficiency.

For more information about the OIF and to access the latest white papers, please visit OIF’s website.

 

About OIF

OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 150+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF on LinkedIn, on X at @OIForum and at http://www.oiforum.com.

 

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

leah@wilkinson.associates

703-907-0010

OIF to Take Center Stage at OFC 2024 with Groundbreaking Multi-Vendor Interoperability Demonstrations and Expert Panels

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47 member companies will demonstrate innovations in coherent optics, electrical and energy efficient interfaces and management specifications

Fremont, Calif. – OIF’s record-breaking, multi-vendor interoperability demonstrations at OFC 2024 will spotlight groundbreaking interoperable solutions in 800ZR, 400ZR and OpenZR+ optics; Energy Efficient Interfaces (EEI) & Co-Packaging; 112G and 224G Common Electrical I/O (CEI); and Common Management Interface Specification (CMIS) implementations.

This year’s historic interoperability demonstration, the largest ever, not only underscores the progress of OIF member companies in tackling the industry’s most pressing demands but will also unveil multiple industry-firsts. Once again, OIF’s work positions the organization at the forefront of driving the industry forward, offering tangible solutions to the most pressing network challenges.

“The interoperable solutions being demonstrated in the OIF booth are critical to addressing the escalating needs of next-generation data center networking, artificial intelligence/machine learning (AI/ML) and disaggregation applications,” said Nathan Tracy, OIF President and TE Connectivity. “We’ve seen a 38 percent increase in demo participants compared to last year and the addition of nine new participating companies, which emphasizes the remarkable growth and impact of OIF’s work.”

Record-setting Interoperability Demos – 800ZR, 400ZR and OpenZR+ optics, EEI & Co-Packaging, 112G and 224G CEI and CMIS

800ZR, 400ZR and OpenZR+ Optics Interoperability Demos

The pluggable coherent optics demonstration will showcase progress in the latest advancements in 800ZR, 400ZR and ZR+ optics interoperability, offering a comprehensive view of their capabilities and applications. The demo highlights include the first public 800ZR multivendor interop; high transmit power, OpenZR+ over a 1000km, multi-span network; OpenROADM/ITU-T over that same network; and our foundational 400ZR collocated on the single-span network with 800ZR.

EEI & Co-Packaging Interoperability Demos

The EEI and Co-Packaging demo will feature pioneering methods for integrating multiple chips within a single package, driving a new era of enhanced performance and power efficiency in electronic devices. OIF members will display a conceptual demo of AI backend compute utilizing next generation energy efficient interfaces as well as live demos showcasing the latest advancements for external laser sources. This demo highlights innovative approaches that are revolutionizing the performance and power efficiency of electronic device design.

112G and 224G CEI Interoperability Demos

OIF is advancing its pioneering efforts in interoperability with the expansion of its industry-first demonstration of 224G CEI multi-vendor interoperability, the electrical interface for future optical solutions. Additionally, OIF’s demonstration of a 112G CEI Linear ecosystem has broadened, driven by the interoperability of multivendor SerDes links with multi-vendor LPOs, supported by test and measurement validation at each stage of the link.

CMIS Interoperability Demos

The CMIS demo will feature an array of CMIS-managed modules integrated into routers, switches and test gear from various vendors, providing a firsthand glimpse into CMIS’ effective management of modules in real-world applications. Its focus is on the path to plug and play illustrating how modules communicate their capabilities, enabling hosts to manage them seamlessly without requiring specific code for each module.

Live and Interactive Demonstrations: 47 Member Company Participants

The demonstrations in OIF’s booth #1323 will highlight the collaborative efforts of system vendors, component vendors and test equipment vendors, emphasizing their contributions to advancing technology adoption in both present and future networks.

Participating member companies are Adtran; Alphawave Semi; Amphenol; Anritsu; AOI; Astera Labs; Ayar Labs; Broadcom Inc.; Cadence Design Systems, Inc.; Casela Technologies; CICT/Accelink; Ciena; Cisco Systems; Coherent Corp.; Corning; Eoptolink; EXFO; HG Genuine; Hisense; Infinera; Juniper Networks; Keysight Technologies; Lessengers; Linktel Technologies; Lumentum; Luxshare-Tech; MACOM Technology Solutions; Marvell; Molex; MultiLane; NEC; Nokia; Nubis Communications, Inc.; O-Net Technologies; Optomind; Precision Optical Technologies, Inc.; Quantifi Photonics; Samtec; Semtech; Senko Advanced Components; Sumitomo Electric Industries; Synopsys; TE Connectivity; US Conec; Viavi Solutions; Wilder Technologies and Wistron.

In addition to the in-booth demonstrations, OIF experts will lead two panel discussions on the exhibit floor, providing valuable insights into the industry’s latest advancements:

OIF Panels

Wednesday, March 27, 2024: Coherent Optics Unleashed: From 400ZR Success to 800ZR/LR Advancements and 1600ZR Kick-off – An OIF Update

  • Time: 4 pm – 5 pm PT
  • Location: Theater 1
  • Moderator: Karl Gass, OIF Physical & Link Layer Interoperability (PLL) Working Group (WG) Optical Vice Chair
  • Panelists: Sebastien Gareau (Ciena), Jeff Rahn (Meta), Gert Sarlet (Coherent), Tom Williams (Cisco)

Thursday, March 28, 2024: Energy Efficient Interfaces – Reining in Power Consumption Trends for Next-Generation Optical Networking

  • Time: 1:45 pm – 2:45 pm PT
  • Location: Theater 1
  • Moderator: Jeff Hutchins, OIF PLL WG EEI Vice Chair and Board Member (Ranovus)
  • Panelists: Craig Thompson (NVIDIA), Yi Tang, OIF PLL WG Electrical Vice Chair (Cisco), Nathan Tracy, OIF President (TE Connectivity)

For more information about OIF at OFC 2024, please visit: https://www.oiforum.com/meetings-events/oif-ofc-2024/

About OIF

OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 150+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF on LinkedIn, on X at @OIForum and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

leah@wilkinson.associates

703-907-0010

OIF to Showcase Interoperability at OFC 2024 with Nearly 50 Member Companies Collaborating to Address Unprecedented Demand for Next-Generation Network Solutions

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Demos include 800ZR, 400ZR and OpenZR+ optics, Energy Efficient Interfaces (EEI) & Co-Packaging, Common Electrical I/O (CEI) channels and Common Management Interface Specification (CMIS) implementations

Fremont, Calif. – OIF, where the optical networking industry’s interoperability work gets done, will be a focal point at OFC 2024, where a record-setting 47 member companies will showcase the groundbreaking interoperable solutions that are addressing the unprecedented demand for next-generation data center networking, artificial intelligence/machine learning (AI/ML) and disaggregation applications.

OIF’s OFC demo this year features nine new participating companies and marks a 38 percent increase in participants compared to the OFC 2023 demo. The live and interactive multi-vendor demonstrations in booth #1323 will feature interoperability solutions in 800ZR, 400ZR and OpenZR+ optics, Energy Efficient Interfaces (EEI) & Co-Packaging, Common Electrical I/O (CEI) channels and Common Management Interface Specification (CMIS) implementations that are addressing the speed, power and density challenges that will define the industry landscape for the next decade.

“OFC 2024 serves as an unparalleled platform for OIF members to spotlight their collaborative efforts in driving the evolution of optical networking solutions,” said Mike Klempa, OIF Physical & Link Layer Interoperability Working Group Chair and Alphawave Semi. “This year’s historic, largest-ever interoperability demonstration not only underscores the capabilities of OIF member companies in addressing the industry’s pressing demands, but will also unveil multiple industry-firsts, once again positioning OIF and its work as driving the industry and designing real solutions for pressing network challenges.”

The demos will spotlight the combined efforts of system vendors, component vendors and test equipment vendors underscoring their significant contributions to advancing technology adoption in both present and future networks. Participating member companies are Adtran; Alphawave Semi; Amphenol; Anritsu; AOI; Astera Labs; Ayar Labs; Broadcom Inc.; Cadence Design Systems, Inc.; Casela Technologies; CICT/Accelink; Ciena; Cisco Systems; Coherent Corp.; Corning; Eoptolink; EXFO; HGGenuine; Hisense; Infinera; Juniper Networks; Keysight Technologies; Lessengers; Linktel Technologies; Lumentum; Luxshare-Tech; MACOM Technology Solutions; Marvell; Molex; MultiLane; NEC; Nokia; Nubis Communications, Inc.; O-Net Technologies; Optomind; Precision Optical Technologies, Inc.; Quantifi Photonics; Samtec; Semtech; Senko Advanced Components; Sumitomo Electric Industries; Synopsys; TE Connectivity; US Conec; Viavi Solutions; Wilder Technologies and Wistron.

For more information about OIF at OFC 2024, please visit: https://www.oiforum.com/meetings-events/oif-ofc-2024/

About OIF

OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 150+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF on LinkedIn, on X at @OIForum and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

leah@wilkinson.associates

703-907-0010

 

 

 

OIF Launches 1600ZR+ Coherent Optical, Retimed Tx Linear Rx Optical Energy Efficient Interfaces Projects and Common Management Interface Specification White Paper at Q1 2024 Technical and MA&E Meeting

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Fremont, Calif. – OIF, where the optical networking industry’s interoperability work gets done, successfully concluded its Q1 2024 Technical and MA&E meeting in Jacksonville, Florida held January 16-18.

OIF’s quarterly member meetings serve as a platform for collaboration and innovation within the optical networking industry. This meeting resulted in the initiation of two new projects – the Interoperable 1600ZR+ and Retimed Tx Linear Rx Specs Energy Efficient Interfaces (EEI) projects – the reelection of the Physical and Link Layer (PLL) Working Group (WG) Chair and a white paper focused on advancing plug and play for Common Management Interface Specification (CMIS) modules. The meeting also featured Andrew Schmitt, Cignal AI as a guest speaker.

“OIF’s quarterly membership meetings serve as a vital nexus for industry leaders to converge, collaborate and propel the field forward,” said Nathan Tracy, OIF President and TE Connectivity. “These meetings are invaluable platforms for members to share insights, discuss and debate ongoing work and launch new projects. The synergy of minds and the shared commitment to innovation in these meetings not only ensures the timely execution of current initiatives but also lays the groundwork for solutions that have a tangible impact on the market now and in the years to come. It is through this collaborative spirit that OIF continues to be a driving force in advancing optical networking standards and technologies, fostering a community that thrives on the exchange of ideas and the collective pursuit of excellence.”

NEW PROJECTS

Interoperable 1600ZR+

The new OIF Interoperable 1600ZR+ project complements the 1600ZR project unveiled last September (2023). Responding to market demand for higher-performance (ZR+) modes, OIF is working towards integrating these modes into its application scope for 1600 Gb/s interfaces.

“OIF recognizes the importance of consolidated requirements in the ZR/ZR+ space to streamline development costs and enhance industry collaboration,” said Karl Gass, OIF PLL WG – Optical Vice Chair. “This project reinforces OIF’s role as the forum for coherent line interface discussions and demonstrates leadership by facilitating the evolution of next-generation technologies.”

Retimed Tx Linear Rx Specs EEI Project

OIF has launched the Retimed Tx Linear Rx Specs EEI project, focusing on developing specifications for Retimed Tx Linear Rx (RTxLRx). The initial applications target Ethernet and Artificial Intelligence/Machine Learning (AI/ML), operating at 200G/lane over 500m single mode fiber (SMF) and 100G/lane over 30m multimode fiber (MMF), with potential for alternate applications. The project aims for full plug and play functionality in both electrical and optical domains, meeting the industry demand for power and latency savings. RTxLRx addresses constraints found in Linear Pluggable Optics (LPO) and provides flexibility, making it a candidate when LPO is not suitable.

“Embracing innovation, OIF maintains its pathfinder role in shaping new optical interface approaches,” said Jeff Hutchins, OIF Board Member and PLL WG – EEI Vice Chair and Ranovus. “Building upon the foundation laid by the ongoing work in the OIF PLL, our commitment extends to expanding the scope, diversity and standards of optical interfaces specified by OIF, ushering in a new era of connectivity and possibilities.”

White Paper: Path to CMIS Plug and Play

In response to key challenges identified by members, OIF unveiled a white paper project on advancing plug and play for CMIS-managed modules. Feedback has emphasized difficulties in consistently managing modules from different vendors and the need for extensive host development with new module introductions. This white paper will provide practical recommendations to enhance plug and play. It focuses on creating guidelines that empower hosts to manage third-party modules effectively, with the goal of enabling seamless integration of new or unknown modules without requiring host software changes. The proposed guidelines will prioritize simplifying provisioning processes and improving module-to-host integration for enhanced efficiency in optical networking.

“This white paper will enhance the transformative power of CMIS, unveiling its capacity to revolutionize network management and interoperability,” said Ian Alderdice, OIF PLL Working Group – Management Co-Vice Chair and Ciena. “By providing valuable insights, it becomes a beacon guiding the evolution of optical networking standards, paving the way for a future where efficiency and seamless integration define the technological landscape.”

PLL WG Chair

OIF announced the reelection of David Stauffer, Kandou Bus, as PLL WG Chair.

Special Guest Speaker: Andrew Schmitt, Cignal AI

The Q1 meeting featured guest speaker, Andrew Schmitt from Cignal AI, who shared valuable insights into the latest trends and developments in the optical networking industry. His presentation provided attendees with a comprehensive understanding of the current landscape and future possibilities within the field.

“OIF is an excellent forum for establishing standards on rapidly emerging technologies, and it is well-positioned to tackle the tough problems network operators and their suppliers face,” said Schmitt. “This meeting’s kick off of the 1600ZR+ process – a third generation follow up to the hugely successful 400ZR project – marks a major milestone for the industry. Further increasing the ease of deployment for 400ZR technology via CMIS is also a very valuable endeavor.  I’m excited about these OIF initiatives and very pleased to offer Cignal AI’s current perspective on the market to such a capable and effective audience.”

About OIF

OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 150+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF on LinkedIn, on X at @OIForum and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

leah@wilkinson.associates

703-907-0010

 

OIF Unveils CEI-112G-XSR+-PAM4 Extended Extra Short Reach Implementation Agreement, Paving the Way for Advanced Interconnectivity

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Organization also releases C-CMIS IA, publishes AI network operations and 400ZR+ demo white papers and announces next CMIS webinar

Fremont, Calif. – OIF, where the optical networking industry’s interoperability work gets done, has published a new Implementation Agreement (IA) for Common Electrical I/O (CEI) CEI-112G-XSR+-PAM4 Extended Extra Short Reach.

The CEI-112G-XSR+-PAM4 IA specifies a 112 Gb/s PAM4 electrical interface for die-to-die (D2D) and die-to-optical-engine (D2OE) interconnect with bump-to-bump insertion loss up to 13 dB at the Nyquist frequency and baud rate in the range 36 Gsym/s to 58 Gsym/s. The intended applications encompass multiple-chip modules (MCM), co-packaged optics (CPO) and near-package optics (NPO) assemblies. It also details the requirements for the CEI-112G-XSR+-PAM4 extended extra short reach high-speed electrical interface with nominal baud rates between 36 Gsym/s and 58 Gsym/s using PAM4 modulation.

“The CEI-112G-XSR+-PAM4 IA represents a significant milestone, extending the reach of previously published XSR class specifications at this speed range,” said David Stauffer, OIF Physical and Link Layer Working Group Chair and Kandou Bus, S.A. “This IA empowers advanced interconnectivity solutions in die-to-die and die-to-optical-engine scenarios, supporting baud rates up to 112 Gb/s (58 Gsym/s). These specifications have the opportunity to revolutionize multiple-chip modules, co-packaged optics, and near-package optics applications, pushing the boundaries of high-speed data transmission.”

Matt Brown, editor of the CEI-112G-XSR+-PAM4 IA and Alphawave Semi, added, “The CEI-112G-XSR+-PAM4 IA addresses a gap in the set of OIF CEI specifications to address new applications identified by the diverse membership of the OIF.”

OIF also recently released the Coherent Common Management Interface Specification (C-CMIS) IA 1.3, published an Application of Artificial Intelligence (AI) to Enhanced Network Operations technical white paper, published the ECOC 400ZR+ demo white paper and launched a series of CMIS technical webinars.

C-CMIS IA 1.3: This Implementation Agreement extends the Common Management Interface Specification [CMIS] to allow the management of digital coherent optics (DCO) modules. Initially covering 400ZR modules, this IA supports the management of modules that have a single data path with an eight-lane host interface for a 400GBASE-R Ethernet signal and a single-lane 400G coherent media interface based on the 400ZR specification. Future extensions to accommodate other DCO modules are anticipated.

Application of Artificial Intelligence (AI) to Enhanced Network Operations Technical White Paper: This new white paper addresses the interoperability requirements for enhanced network functions that interface between transport networks and their management-control systems. It identifies various use cases for applying AI to guide interoperability and provides insights into data requirements, processing needs, output specifications and interfaces relevant to each use case.

ECOC 400ZR+ Demo White Paper: This paper presents the methodology and results of an interoperability study of OpenZR+ MSA QSFP-DD transceivers conducted during the ECOC 2023 plugfest. Ten different transceivers were cross-connected in a matrix of transmitter-to-receiver combinations using a noise-loaded link to characterize the penalties associated with supplier interoperability. Individual transceiver performance was tested using 400GE traffic over a shortened optical line system link with a DWDM 75GHz fixed channel grid and a separate configuration to capture the transmitter error vector magnitude (EVM) performance. The transceiver receiver OSNR performance is compared against the transceiver transmitter EVM performance for each vendor.

CMIS Technical Webinar Series: OIF is hosting a series of free, public CMIS tutorial webinars. The next webinar, “Data Path State Machine (DPSM) and Application Advertising,” will be held on February 7th. These webinars aim to equip engineers, developers and industry professionals with a comprehensive understanding of CMIS. More information on the series can be found here.

 

About OIF

OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 150+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

leah@wilkinson.associates

703-907-0010

OIF Experts to Provide Technology Updates on Power Consumption in Next Generation Optical AI Networking, Common Electrical I/O (CEI) Trends at DesignCon 2024

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Fremont, Calif. – OIF experts will provide valuable insights into the latest trends and developments in power consumption in optical AI networking and 224 Gbps Common Electrical I/O (CEI) at DesignCon 2024, taking place from January 30 to February 1, 2024, in Santa Clara, California.

DesignCon is the premier event for chip, board and systems design engineers in the high-speed communications and semiconductor industries. This year, OIF will lead two panel discussions:

Panel 1 – Wednesday, January 31, 2024: 12:15pm – 1pm PT

Reining in Power Consumption Trends for Next Generation Optical Networking – this panel will focus on strategies to address the ever-increasing power consumption challenges in the next generation of optical networking, featuring experts from leading companies in the field.

Moderator: Jeff Hutchins, Physical and Link Layer (PLL) Working Group (WG) Energy Efficient Interfaces (EEI) Vice Chair and Board Member, Ranovus

Panelists: Karl Bois, OIF Technical Committee Chair, NVIDIA; Yi Tang, OIF PLL WG Electrical Vice Chair, Cisco; and Nathan Tracy, OIF President, TE Connectivity

Panel 2 – Wednesday, January 31, 2024: 4pm – 5:15pm PT

OIF Update on 224 Gbps CEI Development – in this session, OIF will provide updates on the development of 224 Gbps CEI with insights from industry leaders involved in this cutting-edge technology.

Moderator: Nathan Tracy, OIF President, TE Connectivity

Panelists: John Calvin, Keysight Technologies; Mike Klempa, OIF PLL Interoperability WG Chair, Alphawave Semi; Mike Li, OIF Board Member, Intel and Cathy Liu, OIF Vice President, Broadcom Inc.

“Our participation at DesignCon 2024 underscores OIF’s commitment to driving technological innovation,” said Tracy. “These panel discussions offer a unique opportunity to learn from some of the industry’s foremost thought leaders and gain critical insights into OIF’s work. DesignCon provides a platform for connecting with colleagues, sharing insights and collectively shaping the future of optical networking and CEI. It’s where collaboration meets innovation.”

CMIS Technical Webinar Series: Separate from DesignCon, OIF is also hosting a series of free, public CMIS tutorial webinars. These webinars aim to equip engineers, developers and industry professionals with a comprehensive understanding of CMIS. The next session in the series – Data Path State Machine (DPSM) and Application Advertising – will be held on Wednesday, February 7, 2024. Presenters are Doug Cattarusa, Technical Marketing Engineer, Cisco and Paul Brooks, Applications and Technology, VIAVI Solutions. More information on the series can be found here.

About OIF

OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 150+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

leah@wilkinson.associates

703-907-0010

 

OIF to Host Common Management Interface Specification (CMIS) Tutorial Webinar: “Exploring the Technical Depths of CMIS”

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Fremont, Calif.—November 14, 2023 – Recognizing the crucial role that CMIS plays in the industry’s ability to harness the full potential of emerging technologies, OIF will host a free, public CMIS tutorial webinar on Tuesday, December 5th, 2023, from 7:00 am to 8:30 am Pacific Time (PST). In the rapidly evolving landscape of networking technologies, being informed about the tools that can streamline functionality and integration is paramount.

OIF is committed to ensuring the industry is up to speed on the progress of CMIS. With this commitment in mind, this webinar kicks off a series of free, public CMIS tutorial webinars – each focusing on individual CMIS functions.

“We are excited to offer this CMIS tutorial webinar, which aims to provide attendees with an in-depth technical knowledge of CMIS, a vital component in today’s optical networking landscape,” said Ian Alderdice, OIF PLL Working Group Management Co-Vice Chair, Ciena. “This session will empower participants to harness the full potential of CMIS, enabling them to make more informed decisions and innovations in the field.”

Building upon the success of OIF’s “CMIS Demystified” webinar last year, this tutorial is designed to take participants one level deeper into the world of CMIS, offering a more profound exploration of the technical intricacies behind its major functions. The webinar, presented by OIF’s Management Working Group Leadership, will provide attendees with a comprehensive high-level technical understanding of CMIS, highlighting major functionalities such as Module State Machine (MSM), Applications advertising (Appsel) and Data Path State Machine (DPSM), Versatile Diagnostic Monitoring (VDM), Command Data Block (CDB) and Firmware (FW) upgrade.

Webinar: Exploring the Technical Depths of CMIS

Date and Time: Tuesday, December 5th, 2023, from 7:00 am to 8:30 am PT

Presenters: Gary Nicholl and Ian Alderdice – OIF’s Management Working Group Leadership

Agenda:

CMIS Overview – A deep dive into the major functionalities of CMIS

  • CMIS concepts
  • CMIS Memory Map
  • MSM
  • DPSM/Appsel
  • VDM
  • CDB
  • FW Upgrade

To attend this tutorial webinar and access Webex details, please visit https://www.oiforum.com/meetings-events/oif-webinar-cmis-tutorial-05dec23/. Registration is not required.

This webinar marks the beginning of a series designed to equip engineers, developers and industry professionals with a comprehensive understanding of CMIS.

“We’ve witnessed from discussions at industry conferences and testing events that there is a knowledge gap concerning the substantial value that CMIS brings to the industry by enabling the true plug-n-play paradigm that customers are now demanding,” said Gary Nicholl, OIF PLL Working Group Management Co-Vice Chair, Cisco. “Our aim with this webinar is to bridge that knowledge divide, connect the dots, and empower industry professionals with expert insights on CMIS.”

Subsequent webinars will delve into specific aspects of individual CMIS functions such as VDM, CDB, FW upgrade and DPSM/Appsel. These sessions will thoroughly explore register-level specifics, defining registers and explaining their interactions.

About OIF

OIF is where the optical networking industry’s interoperability work gets done. Celebrating 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 150+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn, on Threads and at http://www.oiforum.com.

 

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
leah@wilkinson.associates
703-907-0010

OIF Unveils 2023-2024 Board and Officers, Dedicated to Advancing Optical Networking Interoperability

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Fremont, Calif. – OIF, where the optical networking industry’s interoperability work gets done, today announced its newly elected 2023-2024 Board of Directors and Officers. The Technical Committee and Market Awareness & Education Committee Chairs were elected in person at the hybrid Q323 Technical Committee Meeting in Vancouver, Canada, while the Board positions were elected via email ballot. The new terms began on October 2, 2023.

2023 – 2024 Election Results

  • Board of Directors: 
    • Jeff Hutchins, Ranovus, was re-elected to the Board and continues as Physical & Link Layer (PLL) Working Group – Co-Packaging Vice Chair
    • Mike Li, Intel, was re-elected to the Board
    • Jeffery Maki, Juniper Networks, was re-elected to the Board and continues as Physical Layer User Group Working Group Chair
    • Nathan Tracy, TE Connectivity, was elected to the Board and will serve as President

Continuing in their positions are:

    • Ian Betty, Ciena, continues to serve on the Board
    • Cathy Liu, Broadcom Inc., continues to serve on the Board and will serve as Vice President
    • Gary Nicholl, Cisco, continues to serve on the Board as Secretary/Treasurer and as PLL Working Group – Management Co-Vice Chair
  • Officers: 
    • Karl Bois, Nvidia, was elected as Technical Committee Chair
    • Dave Brown, Nokia, continues to serve as Director of Communications
    • Tom Issenhuth, Huawei Technologies, was elected as Market Awareness & Education Committee Co-Chair, PLL
    • Lyndon Ong, Ciena, was re-elected as Market Awareness & Education Committee Co-Chair, Networking
    • Klaus-Holger Otto, Nokia, was elected as Technical Committee Vice Chair

“Congratulations to both the new and returning Board of Directors and Officers, we extend tremendous gratitude for their unwavering dedication and commitment of time to OIF,” said Nathan Tracy, President of OIF. “As a member-driven and volunteer-powered organization, these individuals hold pivotal roles in helping advance OIF’s mission to foster innovation and promote interoperability in today’s marketplace.”

About OIF
OIF is where the optical networking industry’s interoperability work gets done. Building on 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 150+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

Email: leah@wilkinson.associates

Office: 703-907-0010

 

OIF Showcases Multi-vendor Interoperability at ECOC 2023: Demo Features Nearly 40 Companies Demonstrating Innovation Across 400ZR+, Co-Packaging, CEI-112G & CEI-224G and CMIS

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Fremont, Calif.—September 20, 2023 – OIF’s demo at ECOC 2023 will feature a record 39 companies demonstrating innovation and collaboration across four sectors: 400ZR+ optics, Co-Packaging Solutions, Common Electrical I/O (CEI) channels and Common Management Interface Specification (CMIS) implementations. ECOC, taking place Oct. 2-4 in Glasgow, Scotland, provides an ideal platform for OIF and its member companies to showcase their multi-vendor interoperability achievements.

“This year’s massive demo is a testament to the collective progress made by the industry, and we are proud to have nearly 40 companies participating in our multi-vendor interoperability demonstrations,” said Mike Klempa, Alphawave Semi and Chair of the OIF Physical & Link Layer Interoperability Working Group. “With a focus on some of the most critical technologies driving industry progress, we will illustrate the exceptional strides OIF members have taken in fostering compatibility and facilitating innovation.”

The live and static interoperability demos being held at OIF’s booth, #304, will include: 

400ZR+ Optics Demo: Exhibiting cutting-edge optical networking technologies that enable high-speed data transmission over extended distances, opening new horizons for data centers and telecommunication networks.

OIF’s 400ZR project has played a pivotal role in facilitating the reduction of power and complexity for high-bandwidth data center interconnects and promoting interoperability among optical module manufacturers. We’ve expanded this year’s public demonstration to showcase progress to include the OpenZR+ and OpenROADM applications over a multi-span ROADM network.

The ECOC demo will consist of a full implementation of 400GE across numerous DWDM networks using multiple vendors—module, router, open-line system and test equipment— all collaboratively demonstrating the successful realization of interoperability objectives for these projects.

Co-Packaging Solutions Demo: Showcasing innovative approaches to integrating multiple chips within a single package, revolutionizing performance and power efficiency in electronic devices.

OIF remains at the forefront of the industry’s initiatives to facilitate co-packaging solutions using interoperable electrical and optical interfaces, featuring efficiency in terms of power consumption and high-bandwidth edge densities. This year’s interoperability showcase will highlight the key multi-vendor elements essential for enabling co-packaging architectures.

Live demonstrations will encompass the use of the External Laser Small Form Factor Pluggables (ELSFP) to power an optical link, all while being managed by the Common Management Interface Specification (CMIS). Additionally, various multi-vendor optical connectivity solutions will be on display.

Common Electrical I/O (CEI) Channels: Highlighting advancements in high-speed electrical interfaces, enhancing data-transfer rates and efficiency across various applications.

OIF is the industry leader in 224G hardware interconnection application spaces and definitions, achieving an industry-first milestone of multi-vendor interoperability at 224G. OIF is also moving quickly to address and define a low-power, low-latency 112G CEI specification for linear direct-drive optics. This initiative has resulted in a significant milestone: the first multi-vendor interoperability showcase of an ecosystem dedicated to advancing these efforts. Live, in the booth, system, linear pluggable optics and test and measurement equipment vendors will collaboratively demonstrate the advantages of this cutting-edge technology.

Participating members have come together to underscore OIF’s pivotal role in serving the developing supplier ecosystem. The CEI-224G and 112G demonstrations will showcase multi-party silicon supplier interoperability across a diverse array of Long Reach (LR), Medium Reach (MR) and VSR (Very Short Reach) links that address many widely used applications.

Common Management Interface Specification (CMIS) Implementations: Demonstrating management interfaces across diverse networking equipment, promoting streamlined control and management.

CMIS has established itself as the management interface of choice for next-generation pluggable modules, capable of managing both simple and advanced modules. CMIS provides a well-defined mechanism to initialize and manage optical and copper modules in a standard way, while still providing the capability to provide custom functionality. This commonality makes integrating different host platforms easier for both the host and module vendors.

The live CMIS demos at ECOC will show a variety of CMIS-managed modules in routers,  switches and test gear from different vendors and showcase how CMIS is used to manage modules in real-world applications.

OIF member companies participating in the demo are Adtran; Alphawave Semi; Amphenol; Applied Optoelectronics, Inc.; Broadcom Inc.; Cadence Design Systems, Inc.; Casela Technologies; Ciena; Cisco Systems; Coherent; Credo Technology Group; Eoptolink; EXFO; Fujitsu Optical Components; Hisense Broadband; Infinera; Juniper Networks; Keysight Technologies; Linktel Technologies; Lumentum; MACOM Technology Solutions; Molex; MultiLane, Inc.; NEC Corporation; Nokia; O-Net Technologies; Precision Optical Technologies; Quantifi Photonics; Samtec; Semtech; Senko Advanced Components; Sicoya; Source Photonics; Sumitomo Electric Industries; Synopsys; Telefonica S.A.; VIAVI Solutions and Wilder Technologies. The interoperability demo is supported by participating companies Telefonica and LightRiver. Telefonica is the hosting consulting network operator, and LightRiver is a host for technology-specific pre-demonstration integration testing.

“Attendees at ECOC can also look forward to celebrating OIF’s 25-year journey in fostering industry-wide collaboration and interoperability,” added Klempa.

To commemorate its 25 years of groundbreaking interoperability work, OIF will host a celebration at its booth from 4 pm to 5 pm on Tuesday, Oct 3.

About OIF

OIF is where the optical networking industry’s interoperability work gets done. Celebrating 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 140+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn, on Threads and at http://www.oiforum.com.

 

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
leah@wilkinson.associates
703-907-0010

OIF’s Q3 Technical and MA&E Committees Meeting Spurs Four New Innovative Projects – Link Training for 224G Electrical Interfaces, 1600ZR, Data Center/Optical Network Coordination, Energy Efficient Interfaces

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Fremont, Calif.—September 8, 2023 – OIF concluded its hybrid Q3 Technical and MA&E Committees Meeting, August 8-10 in Vancouver, BC, Canada, with the launch of four groundbreaking new projects. The meeting also featured guest speaker Ian Redpath, Research Director, Transport Networks and Components, Omdia.

“OIF’s quarterly meetings are a vital hub for fostering industry collaboration, thought leadership and innovation within the optical networking community,” said Klaus-Holger Otto, OIF Technical Committee Chair and Nokia. “By bringing together industry experts, visionaries and stakeholders, OIF and its members continue to shape a diverse range of cutting-edge technologies and solutions, addressing pivotal challenges and opportunities in the optical networking industry. The new projects and ongoing work in other critical areas are tangible proof of the organization’s value and significance.”

NEW PROJECTS

224G PAM4 protocol agnostic link training for electrical interfaces project

Electrical interface link training holds considerable significance throughout the industry. This project will define communication method, messaging format and contents, training patterns, states and sequences, diagnostics and fault handling, etc. for link training of a 224G PAM4 class electrical link. The objective is to enhance overall link performance, a critical factor, particularly under challenging conditions, to establish a functional connection.

As part of this initiative, the CEI (Common Electrical IO) framework will be expanded with an additional tool to encompass a comprehensive solution, reinforcing OIF’s leadership in the electrical/SERDES domain.

“This project is critical for OIF, yielding a standardized solution that seamlessly fosters SERDES interoperability and implementation, transcending the boundaries of specific applications,” said David Stauffer, OIF Physical & Link Layer Working Group Chair and Kandou Bus, S.A. “Through collaborative efforts with other industry groups, we aim to forge a consistent industry-wide solution that simplifies implementation.”

1600ZR Project

The 1600ZR project will define a power optimized solution for a multi-vendor interoperable 1600 Gbps coherent optical interface, with a focus on Data Center Interconnect (DCI) scenarios. This Implementation Agreement (IA) will create a comprehensive electrical/protocol/optical framework that facilitates realization into pluggable modules. It will also establish a reference point for additional applications that contribute to the growth of the coherent ecosystem.

“It has become clear that multiple evolution paths from 400ZR will be required in DCI transport,” said Ian Betty, OIF Board Member and Ciena. “While the 800ZR IA development is still ongoing, the group has started a parallel project to address the complexities of supporting 1.6T Ethernet clients in single span DCI applications for reaches of at least 80km. OIF is leading the industry by creating an IA for an interoperable 1.6T Ethernet coherent line interface designed for ZR/DCI applications. This project further validates that OIF is the platform for next-generation coherent line interface discussions and to facilitate the development of innovative applications and architectural solutions. We encourage network operators to actively participate in these efforts to help shape the specifications to best meet their needs.” 

Data Center Storage and Optical Multi-layer Coordination

Transaction failures in the financial industry are sometimes attributed to network issues such as jitter, intermittent disconnection and bit errors, caused by unstable DCI links. Fast fault detection and recovery of optical connections can be leveraged to address these issues and support new DC applications, by coordinating between the application layer and optical connections in the DCI network. This project will result in a white paper that will delineate anticipated scenarios, crucial technical requirements, and potential multi-layer protection solutions, and provide a comprehensive gap analysis regarding the coordination of storage and optical connections.

“This project stands as a testament to OIF’s mission to develop interoperable solutions for challenging optical interworking applications like DCI,” said Jia He, OIF Networking & Operations Working Group Chair and Huawei Technologies Co., Ltd.

System Vendor Requirements Document for Energy Efficient Interfaces

This project will result in a requirements document for Energy Efficient Interfaces (EEI) through input gathered by system vendors from end users and provide a list of prioritized applications and a basic set of requirements for the next generation of energy efficient electrical and optical links. A primary objective of this work is to provide guidance to the EEI Framework Project and future IAs based on the framework at the OIF or other standards organizations. 

“This project introduces a new area of standards for the OIF, expanding its ecosystem and industry influence,” said Jeffery Maki, OIF Physical Layer User Group Chair and Juniper Networks. “A key objective of this project is to outline user-driven prerequisites that will shape the trajectory of future EEI initiatives within the organization.”

Through these four new projects, OIF continues to reinforce its position as a driving force for progress and collaboration in the industry.

GUEST SPEAKER

Guest speaker, Ian Redpath, Omdia, engaged attendees with invaluable market insights on the optical network landscape. He also spotlighted the Dempster Highway Fiber Project, an extraordinary endeavor that has captured attention due to its innovative approach and potential to reshape connectivity in remote regions.

“For a quarter of a century, OIF’s work has remained pivotal within the optical sector, playing a vital role in enabling seamless collaboration and interoperability,” said Redpath. “During OIF’s recent Q3 member meeting, I was deeply impressed by the significant headway the organization has made in advancing CMIS, 800G ZR and 1600ZR solutions. As evidence of OIF’s impact, 400ZR has reached high volume deployment, paving the way for 100G ZR, 400ZR+, 800ZR and now 1600ZR. It was also my pleasure to present to members Omdia’s update on the Optical Network Market and Technology, featuring the Dempster Highway-Canadian Arctic fiber build project.”

ABOUT OIF

OIF is where the optical networking industry’s interoperability work gets done. Celebrating 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 140+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn, on Threads and at http://www.oiforum.com.

 

PR CONTACT

Leah Wilkinson

Wilkinson + Associates for OIF

leah@wilkinson.associates

703-907-0010

OIF Achieves Milestone with Largest Ever Multi-Vendor Interoperability Demo at ECOC 2023, Featuring 39 Companies Accelerating Implementation of Next-Generation Capabilities

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Demos will highlight interoperability work in four areas – 400ZR+; Co-Packaging solutions; CEI-112G & CEI-224G and CMIS implementations

Fremont, Calif.— OIF, where the optical networking industry’s interoperability work gets done, will showcase its largest-ever multi-vendor interoperability demonstration at ECOC 2023, being held October 2-4 in Glasgow, Scotland. Additionally, during ECOC, OIF will continue its commemoration of 25 years dedicated to driving meaningful progress in the industry.

39 companies will participate in live and static interoperability demos at OIF’s booth #304, highlighting advancements in four key technology areas: 400ZR+ optics, Co-Packaging solutions, Common Electrical I/O (CEI) channels and Common Management Interface Specification (CMIS) implementations.

“OIF stands at the forefront of critical multi-vendor interoperability efforts, driving the industry’s evolution and providing the transformative technical solutions to meet the rapidly growing demand for broadband access,” said Mike Klempa, Alphawave Semi and Chair of the OIF Physical & Link Layer Interoperability Working Group. “As a member-driven organization, our work remains at the cutting edge, aligned with the industry’s needs and fostering collaboration to accelerate product development and solutions to market. For 25 years, we have been instrumental in facilitating industry progress. This year’s largest-ever demo underscores the vital role we play in shaping the network and the significance of our work in advancing the industry overall.”

The collaborative efforts of OIF’s network operator, system vendor, component vendor and test equipment vendor members will be on display at ECOC, illustrating their contributions in driving the adoption of technologies for both present and future networks. OIF member companies participating in the demo are Adtran; Alphawave Semi; Amphenol; Applied Optoelectronics, Inc.; Broadcom Inc.; Cadence Design Systems, Inc.; Casela Technologies; Ciena; Cisco Systems; Coherent; Credo Technology Group; Eoptolink; EXFO; Fujitsu Optical Components; Hisense Broadband; Infinera; Juniper Networks; Keysight Technologies; Linktel Technologies; Lumentum; MACOM Technology Solutions; Molex; MultiLane, Inc.; NEC Corporation; Nokia; O-Net Technologies; Precision Optical Transceivers, Inc.; Quantifi Photonics; Samtec; Semtech; Senko Advanced Components; Sicoya; Source Photonics; Sumitomo Electric Industries; Synopsys; Telefonica S.A.; VIAVI Solutions and Wilder Technologies. The interoperability demo is supported by participating companies Telefonica and LightRiver. Telefonica is the hosting consulting network operator, and LightRiver is a host for technology-specific pre-demonstration integration testing.

About OIF

OIF is where the optical networking industry’s interoperability work gets done. Celebrating 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 140+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn, on Threads and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

leah@wilkinson.associates

703-907-0010

 

OIF Announces External Laser Small Form-Factor Pluggable (ELSFP) Implementation Agreement, Paving the Way for Advancements in Co-Packaged Optics Applications

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Fremont, Calif. – OIF, celebrating 25 years of getting the optical networking industry’s interoperability work done, today unveiled the External Laser Small Form-Factor Pluggable (ELSFP) Implementation Agreement (IA), defining a revolutionary front panel pluggable form factor tailored to co-packaged optical systems and other multiple laser external laser source applications.

The ELSFP IA introduces the first multi-sourced future-proof front panel pluggable external laser source form factor to address the evolving needs of the industry. This innovative IA offers numerous benefits, including definitions for the placement of laser sources at the front panel, the coolest section of the system, enhancing system reliability and allowing for efficient “hot-swap” field replacement when necessary.

The ELSFP uses a multi-fiber blind-mate optical connector positioned at the rear of the module. This strategic design mitigates potential eye-safety risks, particularly in applications where high optical powers are involved. Each ELSFP can supply optical power to one or more optical engines, all seamlessly managed by OIF’s Common Management Interface Specification (CMIS).

This IA also defines interoperability for mechanical, thermal, electrical and optical parameters as well as establishing standard power ranges and fiber configurations to focus the industry’s development. The final feature unique to ELSFP is the pass-through option which allows systems architects to maximize face plate real estate, solidifying ELSFP’s position as a versatile and adaptable solution for various optical networking applications.

“The ELSFP IA represents a significant milestone for the optical networking industry,” said Jeff Hutchins, OIF Board Member and Physical & Link Layer (PLL) Working Group Co-Packaging Vice Chair and Ranovus. “By providing a front panel pluggable external laser source form factor, we’re empowering network operators and equipment manufacturers with a cutting-edge solution that not only improves reliability but also paves the way for future innovations. The ELSFP’s flexible design accommodates the ever-changing needs of the industry, enabling seamless integration with OIF’s 3.2T co-packaged optical module project and beyond.”

While the ELSFP project was originally envisioned to complement the 3.2T co-packaged optical module, its forward-looking design makes it easily extensible to address future requirements.

“The ELSFP has already garnered a favorable industry reception through its potential to propel external laser source applications forward, as evidenced by strong collaboration among OIF member both in writing the IA and the substantial engagement in numerous interoperability demonstrations facilitated by OIF,” said Jock Bovington, Cisco, and editor of the OIF ELSFP IA.

For more information about the ELSFP Implementation Agreement and other OIF initiatives, please visit here.

About OIF
OIF is where the optical networking industry’s interoperability work gets done. Celebrating 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 140+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn, Threads and at http://www.oiforum.com.

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
leah@wilkinson.associates
703-907-0010