OIF Approves IC-TROSA Implementation Agreement, Specifications Speed Delivery of a Higher Level of Integration for Transmit and Receive Optical Components

IC-TROSA IA enables miniaturization of optical transceiver modules and lowers the component cost for 400ZR, metro, data center interconnect (DCI) applications

Fremont, Calif.—September 23, 2019OIF, where the optical networking industry’s interoperability work gets done, continues its efforts to reduce cost and speed market adoption of next-generation solutions through the approval of the Integrated Coherent Transmitter-Receiver Optical Subassembly (IC-TROSA) Implementation Agreement (IA). IC-TROSA integration will be demonstrated during this week’s OIF Physical and Link Layer (PLL) Interoperability Demo at ECOC 2019 in Dublin, Ireland (OIF booth 441).

“The IC-TROSA project took an aggressive approach to coherent optical component integration and has delivered two new package designs incorporating TX and RX integration, common digital controls and performance monitoring all in a small form factor package,” explained Scott Grindstaff, Director R&D, ADVA, and IC-TROSA IA Technical Editor. “Additionally, package specific features such as fiber-free interface and solder reflow compatibility have been incorporated.”

The optical sub-assembly supports high-bandwidth and high-order dual-polarization quadrature amplitude modulation (QAM) operations and is suited for data center interconnect, metro and long-haul applications. As module sizes decrease, coherent optics components need similar size reductions to enable next generation multi-terabit switches, line cards and transport platforms.

“The IC-TROSA IA is a solution for density requirements for line cards, front-pluggable and future on-board coherent 400G+ optical modules,” said Karl Gass, OIF PLL Working Group, Optical Vice Chair. “It aims to standardize a photonic package for coherent applications that is easy to use while leaving the internal implementation to the vendor.”

The IC-TROSA Type-1 is optimized for silicon photonics technology and uses a surface-mount package with Ball Grid Array (BGA) electrical interface. Important advantages include an increased electrical bandwidth and solder reflow capability. The IC-TROSA Type-2 is optimized for Indium Phosphide technology and uses a gold-box package with flex-cable electrical interface. Important advantages include an integrated tunable laser and a duplex LC optical connector.

The IC-TROSA’s low power dissipation and miniature footprint enables small form factor digital coherent optics (DCO) transceivers in a QSFP-DD or OSFP form factor, as well as very high-density coherent line card or daughtercard designs. Devices can support multiple modulation formats, including QPSK, 8QAM, and 16QAM, at symbol rates up to 64Gbaud, enabling data transmission up to 600 Gb/s.

About OIF
OIF is where the optical networking industry’s interoperability work gets done. Building on 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
Email: leah@wilkinson.associates
Office: 703-907-0010

Lightwave Friday 5 video – September 2019

AT&T is under siege, data center 800G is on the horizon, 1.2 Tbps looks like it’s here, and 400GZR is right around the corner.

OIF Showcases 400ZR, CEI-112G and IC-TROSA Interoperability Demos at ECOC 2019

OIF selected to lead Market Focus presentation on deployment of the 400ZR ecosystem

Fremont, Calif.—September 9, 2019 – OIF member companies will showcase their industry leadership with a multi-vendor interoperability demonstration of 400ZR, Common Electrical I/O (CEI)-112G and IC-TROSA during ECOC 2019, September 23-25 in Dublin, Ireland.

Demonstrating how critical interoperability work gets done, 12 OIF member companies including ADVA, Amphenol, Cadence Design System, Credo, Finisar, Inphi, Keysight Technologies, Marvell, Molex, MultiLane, TE Connectivity and YAMAICHI ELECTRONICS will participate in the demonstration in OIF’s booth, # 441.

“Understanding and seeing first-hand how key technologies – 400ZR, CEI-112G and IC-TROSA – are each specified to enable interoperable deployment across the ecosystem is critically important to building market confidence and accelerating adoption,” said Steve Sekel, OIF Physical and Link Layer Interoperability Working Group Chair. “This showcase of 12 companies and key technologies is a clear representation of OIF’s leadership in driving electrical, optical and control interoperability.”

OIF Physical and Link Layer (PLL) Interoperability Demo @ ECOC 2019

OIF Drives Industry Collaboration and Growth Through Timely Interoperability Work.

Live interoperability demonstrations at ECOC 2019 will feature member company solutions that are critical to the global network, including 400ZR, Common Electrical I/O (CEI)-112G and IC-TROSA

400ZR & IC-TROSA Demo

OIF’s 400ZR project is not only facilitating cost and complexity reduction for 400GbE over 80 km DWDM networks, it’s also bringing forward a wave of necessary components and complementary applications. The IC-TROSA features all of the optical building blocks for a coherent module in a single package. The demonstrations will highlight important aspects of IC-TROSA integration as well as real-time EVM measurements with the updated script for 400ZR. In addition, a hardware-based 400ZR installation will show a typical application case.

CEI-112G Demo

OIF is taking a lead role in moving the industry to the next generation with its development of electrical interface specifications for 112 Gbps per differential pair. Multiple live demonstrations featuring interoperability clearly prove the key role OIF provides. The CEI-112G demonstrations in the OIF booth will feature multi-party silicon supplier interoperability over mated compliance board channels, a full host to module channel and direct attach copper cable channels, all demonstrating the technical viability of 112 Gbps operation, along with multiple industry form factors including OSFP and QSFP-DD.

OIF @ ECOC 2019 Market Focus

OIF will present “Deployment of the 400ZR Ecosystem” on Tuesday, September 24, 15:00 – 15:30, during the ECOC Market Focus Service and Content Provider Optical Transmission track. OIF expert and OIF Physical and Link Layer Working Group, Vice Chair Optical, Karl Gass will present.

Check the status of OIF’s current work here.

 

About OIF
OIF is where the optical networking industry’s interoperability work gets done. Building on 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
Email: leah@wilkinson.associates
Office: 703-907-0010

OIF Launches Two New Projects — Higher Baud Rate Coherent Driver Modulator and Low-Rate Service Multiplexing Using FlexE and 400ZR White Paper — at Q3 Meeting

Meeting also featured industry talk from Andrew Schmitt, Cignal AI, and initial discussions on next generation network operator requirements

Fremont, Calif.—August 14, 2019 – Member activity at this year’s OIF Q319 Technical and MA&E Committees Meeting in Montreal, Canada resulted in the launch of two new projects — a higher baud rate coherent driver modulator and a white paper detailing low-rate service multiplexing using FlexE and 400ZR.

Andrew Schmitt, founder and directing analyst, Cignal AI gave member attendees a brief overview of emerging pluggable coherent technologies and the opportunity this new market presents and had the opportunity to speak with members about current and upcoming OIF work.

“It’s clear that OIF is not resting after a successful effort to standardize 400ZR, proven by the launch of two new projects at the recent Q3 meeting,” said Schmitt. “Also, as interest in pluggable coherent solutions grows, it is good to see OIF soliciting feedback from additional network operators in order to shape requirements for next generation standards.”

NEW PROJECTS

The “Higher Baud Rate Coherent Driver Modulator” project will define a new version of the Coherent Driver Modulator supporting at least 96 Gbaud for the low modem implementation penalty segment of the coherent market for single optical carrier line rates beyond 400 Gbit/s. Designed for higher data rates and longer reach and optimized for performance, this project is the next generation of the High Bandwidth Coherent Driver Modulator (HB-CDM) Implementation Agreement (IA) published last year.

The second project start is for a white paper on low-rate service multiplexing using FlexE and 400ZR aimed at eliminating ambiguity and providing clarification on how 400ZR should be leveraged in multiplexing applications. Various network operators are looking for a multiplexing scheme to support lower-rate Ethernet clients (e.g. 4x100GE) into a 400ZR coherent line. This technical white paper will educate the market on how FlexE can be used to aggregate low-rate Ethernet services (e.g. 4x100GE) into 400ZR interfaces.

About OIF
OIF is where the optical networking industry’s interoperability work gets done. Building on 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
Email: leah@wilkinson.associates
Office: 703-907-0010

OIF Continues Commitment to Interoperability with Two New Implementation Agreements – Specifications for CFP2-DCO and HB-CDM now available

Fremont, Calif.—May 21, 2019 – OIF, the global industry forum accelerating market adoption of advanced interoperable optical networking solutions, has completed two new Implementation Agreements (IAs) — the CFP2-Digital Coherent Optics Module (CFP2-DCO) and High Bandwidth- Coherent Driver Modulator (HB-CDM).

“As a member-driven organization, OIF’s work is based on our members’ needs. The CFP2-DCO IA is in direct response to feedback from a network operator that needed an IA to fill an interoperability gap in their network,” said Karl Gass, OIF, PLL Working Group – Optical Vice Chair. “The HB-CDM IA addresses a performance need by creating a component that can be used for much higher performance links.”

CFP2-DCO

The CFP2-DCO IA defines the additional information needed in order to implement the DCO function in the CFP2 module. The CFP2-DCO module contains all the required functions to perform dual polarization coherent optical signaling. The module can also provide different bitrates such as 100G/200G/300G/400G and support more modulation formats.

HB-CDM

The IA for HB-CDM targets modulation and data-rate agnostic coherent applications having nominal symbol rates up to 64 Gbaud. It defines a small form factor electro-optic component that integrates the HB-Polarization Multiplexed-Quadrature (HB-PMQ) modulator plus the RF drive functions for the high baud-rate and low modem implementation penalty segment of the coherent market. Additionally, the IA identifies and specifies the common features and properties of coherent transmitters to enable them to broadly meet the needs of current and future coherent systems.

Check the status of OIF’s current work here.

 

About OIF
Optical Internetworking Forum (OIF) is where the optical networking industry’s interoperability work gets done. Celebrating 20 years of effecting progressive change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors, all collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at https://www.oiforum.com/.

 

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
Email: leah@wilkinson.associates
Office: 703-907-0010

Fiber Systems – Summer 2019

Small Wonder – A new implementation agreement for low-power consumption will see small modules push technological barriers

OIF’s Optical Masterclass Series at NGON to Include Updates on 400ZR, Common Electrical I/O, Flex Ethernet & SDN Projects

Fremont, Calif.—May 8, 2019 – At NGON, May 21-23, 2019, OIF experts will kick off the Optical Masterclass Series with a comprehensive update on its 400ZR, Common Electrical I/O (CEI)-112, Flex Ethernet (FlexE) and Software Defined Networking (SDN) projects.

“OIF’s interoperability solutions are vital to the global network and with many of the key network operators in attendance, NGON is the ideal platform to provide updates on OIF’s work in 400ZR, CEI, FlexE and SDN,” said Dave Brown, Nokia and OIF Director of Communications.

The “Optical Masterclass Series – The Optical Internetworking Forum” session is being held Tuesday, May 21, 2019 from 09:00 – 11:00 (NEW TIME AS OF 5/16). Brown and Karl Gass, OIF Physical & Link Layer Working Group Vice Chair, Optical, will discuss how OIF is assuring interoperability in open, agile, next-generation optical networks and provide updates on crucial industry projects.

400ZR

OIF’s 400ZR project is critical in facilitating the reduction of cost and complexity for high bandwidth data center interconnects and promoting interoperability among optical module manufacturers. This Implementation Agreement (IA) will specify an interoperable digital coherent 400ZR interface targeted at short reach (80 km or more) DWDM amplified noise limited links and unamplified loss limited links.

CEI

The CEI project update will include discussion of the multiple 112 Gb/s interfaces being defined by OIF including CEI-112G MCM, XSR, VSR, MR and LR. Applications of these 112 Gb/s interfaces include die-to-die, die-to-OE (optical engine) on package, chip-to-module, chip-to-chip and chip-to-chip long reach over backplane and cables.

FlexE

OIF continues to lead in FlexE aggregation architectures through its newest FlexE 2.1 project for FlexE over 50GbE PHY applications, an extension to its FlexE 2.0 Implementation Agreement (IA). FlexE 2.1 will specify a 50G FlexE frame and multiplexing format and will address FlexE applications with lower bandwidth needs and provide an implementation foundation for applications including the access layer of the future 5G mobile network.

SDN

In November 2018, OIF announced the launch of “Requirements for Integrated Packet Optical SDN.” The project outlines requirements for a multi-layer SDN reference architecture as a use case for packet optical transport networks. It will generate functional requirements, a reference architecture and use cases for packet/optical networks guided by the vision to enable agile, open network solutions that simplify operations and optimize resource utilization.

IC-TROSA

The session will also include an update on the Integrated Coherent Transmit-Receive Optical Sub Assembly (IC-TROSA) project that defines a standard optical component containing a complete coherent modem. The availability of highly integrated components accelerates the adoption of coherent transmission into additional markets.

Additionally, Gass will participate in Wednesday’s Plenary session, 09:30 – 10:10, “Present View: To the terabit & beyond – practicalities for coherent transmission.” Also on Wednesday, from 14:35 – 15:30, Brown will speak on the “Open Source Approach: Looking at disaggregation as a pathway for multi-vendor cooperation, interoperability and driving enhanced network interfaces” panel.

Check the status of OIF’s current work here.

About OIF
Optical Internetworking Forum (OIF) is where the optical networking industry’s interoperability work gets done. Celebrating 20 years of effecting progressive change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors, all collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at https://www.oiforum.com/.

 

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
Email: leah@wilkinson.associates
Office: 703-907-0010

 

FierceTelecom – What is 400ZR?

Aimed predominantly at short-reach, single-span fiber optic links for Data Center Interconnect (DCI), 400ZR is an interoperable networking Implementation Agreement (IA) in progress by the OIF. It defines a footprint-optimized solution for transporting 400Gb Ethernet over DCI links targeting a minimum of 80 km. Enabled by advanced coherent optical technology design targeting small, pluggable form factor modules such as QSFP-DD and OSFP, 400ZR proposes a technology-driven solution for high capacity data transport, matched to 400GE switch port market introduction.

https://www.fiercetelecom.com/sponsored/what-400zr

(Sponsored by Ciena)

Lightwave – OIF, Ethernet Alliance pair on FlexE demonstration at OFC 2019

The OIF and the Ethernet Alliance hosted interop and technology demonstrations on the show floor this week at OFC 2019 in San Diego. The activities at the two booths overlapped with a fiber connection across the show floor, via which a 400 Gigabit Ethernet (400GbE) transmission generated via Flex Ethernet based on OIF’s FlexE 2.0 Implementation Agreement became part of the Ethernet Alliance’s 400GbE interop.

https://www.lightwaveonline.com/articles/2019/03/oif-ethernet-alliance-pair-on-flexe-demonstration-at-ofc-2019.html?eid=383971651&bid=2392146

SDxCentral – Microsoft Rises From Irrelevance With Big Bet on Cloud

Microsoft, which not too long ago was facing irrelevance, is successfully riding the cloud to reestablish itself and brighten it prospects.

The company’s research and development efforts, the Playbook says, focus on AI, quantum computing, productivity tools, streaming cloud-based gaming, and networking. “Scaling the cloud requires not only more data centers, but also faster intra- and inter-data center connectivity links,” Menon wrote. “For instance, Microsoft is very active with the OIF in pushing 400ZR, a 400 Gbps link specification for data center interconnect.”

https://www.sdxcentral.com/articles/news/microsoft-rises-from-irrelevance-with-big-bet-on-cloud/2019/03/

Light Reading – 5G Transport, 400ZR Star at OFC19

Heavy Reading’s optical expert Sterling Perrin discusses some of the major trends in transport network technology at this year’s OFC event in San Diego, including 5G Transport, 800G and 400ZR.

https://www.lightreading.com/optical-ip/400g-terabit/5g-transport-400zr-star-at-ofc19/v/d-id/750020

OIF and Ethernet Alliance Collaborate to Run Live FlexE Traffic over 400G Network at OFC 2019

SAN DIEGO – March 5, 2019 – Industry leading organizations, OIF and the Ethernet Alliance, today announced an interoperating 400 Gbps Ethernet (400 GbE) network demonstration at OFC in San Diego, CA, March 5-7, 2019. The joint demonstration will feature Flex Ethernet (FlexE) traffic sent over three bonded and subrated 100 GbE interfaces streaming over the Ethernet Alliance 400 GbE network with interconnection between the OIF and Ethernet Alliance booths on the show floor.

The demonstration is designed to showcase the Ethernet Alliance’s IEEE 802.3bs 400 Gbps network and OIF’s FlexE 2.0 Implementation Agreement (IA).

“The Ethernet Alliance’s 400 GbE network over the OFC exhibit floor is the perfect setting to illustrate the real-world features and capabilities of the OIF FlexE 2.0 IA that allows network operators to tailor their traffic while still leveraging Ethernet,” according to Nathan Tracy, OIF’s President and Technologist at TE Connectivity. “The Ethernet Alliance’s deployment of the 400 GbE network at OFC combined with OIF’s FlexE demonstration illustrates the coincident availability of these new technologies.”

The member companies participating in the OIF demo, booth #6215, include Amphenol, Cisco, Credo Semiconductor (HK) LTD, Finisar, Inphi, Juniper Networks, Keysight Technologies, Molex, Spirent Communications, TE Connectivity, VIAVI Solutions, Xilinx and YAMAICHI ELECTRONICS. For more info on OIF’s activities at OFC, please visit https://www.oiforum.com/meetings-events/oif-ofc-2019/

Happening in booth #4749, the Ethernet Alliance’s OFC 2019 demo incorporates equipment and solutions from 21 different companies: Amphenol Corporation; Anritsu Corporation; Arista Networks, Inc.; Cisco; Credo Semiconductor, Inc.; EXFO, Inc.; Finisar; Intel Corporation; Ixia / Keysight Technologies, Inc.; Juniper Networks, Inc.; Lumentum Holdings Inc.; Nexans S.A.; Panduit Corp.; Source Photonics Inc.; Spectra7 Microsystems Ltd.; Spirent Communications; TE Connectivity Ltd.; Tektronix, Inc.; Teledyne LeCroy, Inc.; VIAVI Solutions, Inc. and Xilinx, Inc.

About OIF
Optical Internetworking Forum (OIF) is where the optical networking industry’s interoperability work gets done. Celebrating 20 years of effecting progressive change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors, all collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at https://www.oiforum.com/.

About the Ethernet Alliance

The Ethernet Alliance is a global consortium that includes system and component vendors, industry experts, and university and government professionals who are committed to the continued success and expansion of Ethernet technology. The Ethernet Alliance takes Ethernet standards to market by supporting activities that span from incubation of new Ethernet technologies to interoperability demonstrations and education.

 

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

leah@wilkinson.associates

703-907-0010

 

 

EE Web – 112G Digs in at DesignCon 2019

112G serial links have moved out of the lab and onto the exhibit floor. 56G ramps up while 28G goes mainstream.

By Martin Rowe, EE Web, 

Last year at DesignCon 2018, we witnessed high-speed digital designs that moved past 56 Gbits/s (56G) and onto 112 Gbits/s (112G). This year, DesignCon 2019 brought numerous demonstrations of 112G as the connectors and cables caught up with the silicon. While still appearing in technical papers and panels, 112G has certainly moved into the exhibit hall. Meanwhile, 56G has matured and is now a complete ecosystem.

When it comes to signal integrity and high-speed signals, transmission lengths certainly matter, especially with electrical signals over copper connections. Yes, optical transmission is an option, but nobody wants to pay for it. At a panel session on Jan. 31, OIF board president Nathan Tracy presented the table shown in Figure 1 that describes five OIF standards for different electrical transmission lengths.

mar0008-01-oif-standards
Figure 1: The Optical Internetworking Forum has created standards for 112-Gbit/s copper connections. (Source: Optical Internetworking Forum and DesignCon)
Given a rule of thumb of 0.1 dB/in./GHz of insertion loss (Figure 2), PCB traces of, say, 10 inches are simply too long. That’s where cables that jump over PCBs have become popular.

mar0008-02-112gbps
Figure 2: Cable assemblies jump over PCBs to reduce insertion loss. (Source: Optical Internetworking Forum, Broadcom, and DesignCon)
Connectors for 112G took several forms at DesignCon, depending on the length of the transmission. For chip-to-chip or chip-to-module distances, sending 112G four-level pulse-amplitude modulation (PAM4) signals (28 GHz) over PCB traces results in excessive insertion loss. To get past that restriction, several connector companies have developed cable assemblies that jump over sections of boards.

Read more here: https://www.eeweb.com/profile/martin-rowe-2/articles/112g-digs-in-at-designcon-2019

 

OIF Members to Demonstrate Interoperability of Industry’s Hottest Technologies at OFC 2019

Multi-vendor live demos to feature 400ZR, CEI-112G and FlexE technology; OIF experts to lead panel discussions on hot topics, interoperability

Fremont, Calif.—February 20, 2019 – Demonstrating how interoperability works get done, 13 OIF member companies will participate in live interoperability demos of the industry’s hottest technologies – 400ZR, Common Electrical I/O (CEI)-112G  and Flex Ethernet (FlexE) – at OFC 2019 in San Diego, March 5-7, 2019.

Amphenol, Cisco Systems, Credo Semiconductor (HK) LTD, Finisar, Inphi, Juniper Networks, Keysight Technologies, Molex, Spirent Communications, TE Connectivity, VIAVI Solutions, Xilinx and YAMAICHI ELECTRONICS will demonstrate the interoperability of their products and technologies in OIF’s booth, #6215.

“400ZR, CEI-112G and FlexE are critical technologies in our industry so it’s no surprise these are the interoperability specifications our members are most focused on for OFC,” said Steve Sekel of Keysight and OIF’s Physical and Link Layer Interoperability Working Group Chair. “The live demos will demonstrate critical insight into how key technologies interoperate within the industry’s ecosystem.”

400ZR Demo

OIF’s 400ZR project is critical in facilitating the reduction of cost and complexity for high bandwidth data center interconnects and promoting interoperability among optical module manufacturers. Currently in progress, the project will result in an implementation agreement for 400G ZR and short-reach DWDM multi-vendor interoperability. The 400ZR demo consists of real-time Error Vector Magnitude measurements demonstrating the maturity of the methodology used for transmitter specifications. In addition, a hardware-based 400ZR installation will show how participants communicate a typical application case.

CEI-112G Demo

OIF is taking a lead role in moving the industry to the next generation with its development of electrical interface specifications for 112 Gbps per differential pair. Multiple live demonstrations featuring interoperability clearly prove the key role OIF provides. The CEI-112G demonstrations in the OIF booth will feature multi-party silicon supplier interoperability over mated compliance board channels and direct attach copper cable channels, all demonstrating the technical viability of 112 Gbps operation, along with multiple industry form factors including OSFP and QSFP-DD.

FlexE Demo

OIF continues to lead in FlexE aggregation architectures through its newest FlexE 2.1 project for FlexE over 50GbE PHY applications, an extension to its FlexE 2.0 Implementation Agreement (IA). The FlexE 2.0 demo will show off the bonding, subrating, and channelization features that allows FlexE-enabled hardware to support non-standard Ethernet rates over standard Ethernet optics. Realistic multi-vendor deployment scenarios, client rate reconfiguration, and in-band messaging features will be demonstrated on a network built from a variety of Ethernet optics and interconnecting the OIF and Ethernet Alliance booths.

OIF @ OFC 2019 Speaking Sessions

On Thursday, March 7, industry experts from OIF will lead panels focused on the latest update on 400ZR specifications and the drivers, needs, and challenges in the evolution to widescale adoption of open, interoperable optical networks.

OIF – 400ZR Specification Update

Thursday, 7 March, 10:15-11:15 – Theater II, Hall E

Moderator: Karl Gass, OIF PLL WG Vice Chair Optical

Speakers include: Josef Berger, Inphi; Mark Filer, Microsoft Azure; Marc Stiller, NeoPhotonics and Markus Weber, Acacia Communications

 

The Path to Open, Interoperable Optical Networking

Thursday, 7 March, 11:15-12:15 – Theater II, Hall E

Moderator: Dave Brown, OIF Director of Communications, Nokia

Speakers include: Victor Lopez, Telefónica gCTIO; Lyndon Ong, OIF MA&E Co-Chair – Networking, Ciena and Jonathan Sadler, OIF Networking Interoperability WG Chair, Infinera

 

Check the status of OIF’s current work here.

 

About OIF
Optical Internetworking Forum (OIF) is where the optical networking industry’s interoperability work gets done. Celebrating 20 years of effecting progressive change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors, all collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at https://www.oiforum.com/.

 

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
Email: leah@wilkinson.associates
Office: 703-907-0010

 

OIF Experts to Provide CEI-112G Project Update at DesignCon

Expert panel will provide an update on the multiple interfaces being defined by OIF including CEI-112G MCM, XSR, VSR, MR and LR for 112G

Fremont, Calif.—January 23, 2019 – A panel of OIF experts will present and discuss the ongoing, multi-faceted Common Electrical I/O (CEI)-112G interface effort at this year’s DesignCon being held in Santa Clara, CA January 29-31. “112-Gbps Electrical Interface: An OIF Update on CEI-112G,” is scheduled for Thursday, January 31 at 3:45 pm (local) and will provide an update on the multiple interfaces being defined by OIF including CEI-112G MCM, XSR, VSR, MR and LR. Applications of these 112 Gb/s interfaces include die-to-die, chip-to-module, chip-to-chip and long reach over backplane and cables.

Panel speakers include Brian Holden of Kandou Bus and OIF member; Cathy Liu of Broadcom Inc. and OIF Board Member; Steve Sekel of Keysight Technologies and OIF PLL Interoperability Working Group Chair and Nathan Tracy of TE Connectivity and OIF President.

Since 2000, OIF has defined Interoperability Agreements (IA)s for electrical interconnects known as CEI.  CEI is a clause-based document that defines implementation details for interoperable electrical channels initially issued for 6 Gbps, then 11, 28, and 56 and includes definitions for multiple channel implementation topologies and will soon include 112 Gbps clauses. In August of 2016, OIF announced the first CEI-112G project in an overall effort that has now expanded to five projects.

“Previous CEI development has been highly influential and has been adopted, influenced or adapted by many other high-speed interconnect specifications throughout the industry,” said Tracy. “Given that the CEI-112G generation of high-speed transmitters, receivers and channels will be challenging to define, implement and measure, this panel will provide guidance to where the industry is headed and what the key challenge points are likely to be.”

The CEI-112G IA effort is challenging in signal integrity, implementation complexity and measurement terms. The signals are increasingly vulnerable to channel discontinuities, leading to signal impairment and crosstalk. The switching speed and the density of the available SerDes transistors have not kept pace with other silicon functions, resulting in architectural challenges. Finally, the ability to probe and repeatably capture measurements at these rates with sufficient accuracy and precision is challenging.

Check the status of OIF’s current work in CEI-112G here.

About OIF
OIF is where the optical networking industry’s interoperability work gets done. Celebrating 20 years of effecting progressive change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors, all collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
Email: leah@wilkinson.associates
Office: 703-907-0010

 

OIF Launches Flexe 2.1 Project and Elects new Board Positions and Working Group Representatives

This work continues OIF’s lead in FlexE aggregation architectures by keeping current with industry PHY rates Fremont, Calif.—December 4, 2018 – OIF, the global industry forum accelerating market adoption of advanced interoperable optical networking solutions, today announced the launch of the FlexE 2.1 project and newly elected board members and working group chairs. The new project initiation and elections took place at the Q418 Technical and MA&E Committee meetings held October 29-November 2, 2018 in Sydney, Australia.

This work continues OIF’s lead in FlexE aggregation architectures by keeping current with industry PHY rates Fremont, Calif.—December 4, 2018 – OIF, the global industry forum accelerating market adoption of advanced interoperable optical networking solutions, today announced the launch of the FlexE 2.1 project and newly elected board members and working group chairs. The new project initiation and elections took place at the Q418 Technical and MA&E Committee meetings held October 29-November 2, 2018 in Sydney, Australia. This work continues OIF’s lead in FlexE aggregation architectures by keeping current with industry PHY rates Fremont, Calif.—December 4, 2018 – OIF, the global industry forum accelerating market adoption of advanced interoperable optical networking solutions, today announced the launch of the FlexE 2.1 project and newly elected board members and working group chairs. The new project initiation and elections took place at the Q418 Technical and MA&E Committee meetings held October 29-November 2, 2018 in Sydney, Australia

 

OIF Work Continues to Advance SDN Commercialization Through New Project – “Requirements for Integrated Packet Optical SDN”

Webinar in partnership with Lightwave to feature OIF global multi-vendor interop demonstration results for SDN T-API use cases Fremont, Calif.—November 15, 2018 – Reinforcing its work to speed the implementation and commercialization of software-defined networking (SDN), OIF announced the launch of its newest project — “Requirements for Integrated Packet Optical SDN.” The project outlines requirements for a multi-layer SDN reference architecture as a use case for packet optical transport networks.

This work continues OIF’s lead in FlexE aggregation architectures by keeping current with industry PHY rates Fremont, Calif.—December 4, 2018 – OIF, the global industry forum accelerating market adoption of advanced interoperable optical networking solutions, today announced the launch of the FlexE 2.1 project and newly elected board members and working group chairs. The new project initiation and elections took place at the Q418 Technical and MA&E Committee meetings held October 29-November 2, 2018 in Sydney, Australia. This work continues OIF’s lead in FlexE aggregation architectures by keeping current with industry PHY rates Fremont, Calif.—December 4, 2018 – OIF, the global industry forum accelerating market adoption of advanced interoperable optical networking solutions, today announced the launch of the FlexE 2.1 project and newly elected board members and working group chairs. The new project initiation and elections took place at the Q418 Technical and MA&E Committee meetings held October 29-November 2, 2018 in Sydney, Australia.

OIF Delivers on Enabling Next Generation Network Flexibility through Three New Interoperability Agreements

OIF efforts provide the growing networking industry with advanced network connectivity, provisioning and flexibility combined with improved data rates

Fremont, Calif.—October 23, 2018 – Continuing its efforts to drive network connectivity and flexibility worldwide, OIF announced three Interoperability Agreements (IAs) aimed at expanded interoperability of Flex Ethernet and increased data rates. The completed IAs—FlexE 2.0, FlexE Neighbor Discovery and Common ACO Electrical I/O—reinforce OIF’s work to provide the industry with solutions for flexible deployment and provisioning of network bandwidth.

“The completion of these projects reinforces OIF’s commitment to provide the industry with the flexibility and increased bandwidth solutions combined with increased data speeds it requires to keep up with market demands and drive solutions that enable the next generation of networks,” explained Dave Stauffer of Kandou Bus and OIF’s Physical and Link Layer (PLL) Working Group Chair.

FlexE 2.0

Initiated in 2016, the FlexE 2.0 project enables equipment to support new Ethernet connection types and FlexE allows network providers and operators to utilize optical transport network bandwidth in more flexible ways. FlexE can deterministically utilize the entire aggregated link, creating a more efficient alternative to the traditional IEEE 802.3ad or IEEE 802.1-based Link Aggregation (LAG) solutions which often can only utilize 70-80% of the available bandwidth. Key features of the FlexE 2.0 project include adding support for FlexE groups composed of 200GBASE-R and 400GBASE-R PHYs, in addition to groups composed of 100GBASE-R PHYs, and adding an option for the support of time and frequency synchronization at the FlexE group level.

FlexE Neighbor Discovery

The FlexE Neighbor Discovery project recognizes that FlexE capability discovery is still required to facilitate the setup of FlexE groups and clients. The project introduced some extensions to the Link Layer Discovery Protocol (LLDP) for FlexE capability discovery. It enables remote FlexE PHY and deskew capability discovery, PHY connectivity discovery and verifications, and FlexE Group subgroup integrity verification.

Common ACO Electrical I/O Project

The implementation agreement for Common Analog Coherent Optics (ACO) Electrical I/O follows the success of the CFP2-ACO optical transceiver implementation agreement but is form factor agnostic, so it also benefits analog coherent modules based on such form factors as CFP4, CFP8, QSFP, microQSFP, QSFP-DD and OSFP. The project defines the ACO electrical I/O independent of the choice of form factor and optical carrier count for 45 Gbaud and 64 Gbaud per-carrier applications.

“We recognize that the data center and communications industries require solutions for flexible deployment and provisioning of network bandwidth combined with component level interoperable infrastructure that can enable system capacity demands,” Stauffer continued.

OIF Day at CenturyLink

OIF Day at CenturyLink was held on October 16, 2018 in Littleton, CO. The interactive and educational workshop featured OIF and CenturyLink subject matter experts covering: OIF projects and directions including Networking Transport SDN work and an overview of Physical & Link Layer work.

 

About the OIF
The OIF facilitates the development and deployment of interoperable networking solutions and services. Members collaborate to drive Implementation Agreements (IAs) and interoperability demonstrations to accelerate and maximize market adoption of advanced internetworking technologies. OIF work applies to optical and electrical interconnects, optical component and network processing technologies, and to network control and operations including software defined networks and network function virtualization. The OIF actively supports and extends the work of national and international standards bodies. Launched in 1998, the OIF is the only industry group uniting representatives from across the spectrum of networking, including many of the world’s leading service providers, system vendors, component manufacturers, software and testing vendors. Information on the OIF can be found at http://www.oiforum.com

T-API taps into the transport layer

This article originally appeared on Gazettabyte by editor Roy Rubenstein: http://www.gazettabyte.com/home/2018/8/20/t-api-taps-into-the-transport-layer.html

The Optical Internetworking Forum (OIF) in collaboration with the Open Networking Foundation (ONF) and the Metro Ethernet Forum (MEF) have tested the second-generation transport application programming interface (T-API 2.0).

SK Telecom’s Park Jin-hyo

T-API 2.0 is a standardised interface, released in late 2017 by the ONF, that enables the dynamic allocation of transport resources using software-defined networking (SDN) technology.

The interface has been created so that when a service provider, or one of its customers, requests a service, the required resources including the underlying transport are configured promptly.

The OIF-led interoperability demonstration tested T-API 2.0 in dynamic use cases involving equipment from several systems vendors. Four service providers – CenturyLink, Telefonica, China Telecom and SK Telecom – provided their networking labs, located in three continents, for the testing.

Packets and transport 

SDN technology is generally associated with the packet layer but there is also a need for transport links, from fibre and wavelength-division multiplexing technology at Layer 0 through to Layer 2 Ethernet.

Transport SDN differs from packet-based SDN in several ways. Transport SDN sets up dedicated pipes whereas a path is only established when packets flow for packet SDN. “When you order a 100-gigabit connection in the transport network, you get 100 gigabits,” says Jonathan Sadler, the OIF’s vice president and Networking Interoperability Working Group chair. “You are not sharing it with anyone else.”

Another difference is that at the packet layer with its manipulation of packet headers is a digital domain whereas the photonic layer is analogue. “A lot of the details of how a signal interacts with a fibre, with the wavelength-selective switches, and with the different componentry that is used at Layer 0, are important in order to characterise whether the signal makes it through the network,” says Sadler.

T-API 1.0 is a configure and step-away deployment, T-API 2.0 is where the dynamic reactions to things happening in the network become possible

Prior to SDN, control functions resided on a platform as part of a network’s distributed control plane. Each vendor had their own interface between the control and the optical domain embedded within their platforms. T-API has been created to expose and standardise that interface such that applications can request transport resources independent of the underlying vendor equipment.

NBI refers to a northbound interface while SBI stands for a southbound interface. Source: OIF.

To fulfil a connection across an operator’s network involves a hierarchy of SDN controllers. An application’s request is first handled by a multi-domain SDN controller that decomposes the request for the various domain controllers associated with the vendor-specific platforms. T-API 2.0’s role is to link the multi-domain controller to the application layer’s orchestrator and also connect the individual domain controllers to the multi-domain SDN controller (see diagram above). T-API is an example of a northbound interface.

The same T-API 2.0 interface is used at both SDN controller levels, what differs is the information each handles. Sadler compares the upper T-API 2.0 interface to a high-level map whereas the individual TAPI 2.0 domain interfaces can be seen as maps with detailed ‘local’ data.  “Both [interfaces] work on topology information and both direct the setting-up of connections,” says Sadler. “But the way they are doing it is with different abstractions of the information.”

T-API 2.0

The ONF developed the first T-API interface as part of its Common Information Model (CIM) work. The interface was tested in 2016 as part of a previous interoperability demonstration involving the OIF and the ONF.

One important shortfall revealed during the 2016 demonstrations, and which has slowed its deployment, is that the T-API 1.0 interface didn’t fully define how to notify an upper controller of events in the lower domains. For example, if a link is congested, or worst, lost, it couldn’t inform the upper controller to re-route traffic. This has been put right with T-API 2.0.

“T-API 1.0 is a configure and step-away deployment, T-API 2.0 is where the dynamic reactions to things happening in the network become possible,” says Sadler.

When it comes to the orchestrator tying into the transport network, we do believe T-API will be one of the main approaches for these APIs

Interoperability demonstration

In addition to the four service providers, six systems vendors took part in the recent interoperability demonstration: ADVA Optical Networking, Coriant, Infinera, NEC/ Netcracker, Nokia and SM Optics.

The recent tests focussed on the performance of the TAPI-2.0 interface under dynamic network conditions. Another change since the 2016 tests was the involvement of the MEF. The MEF has adopted and extended T-API as part of its Network Resource Modeling (NRM) and Network Resource Provisioning (NRP) projects, elements of the MEF’s Lifecycle Service Orchestration (LSO) architecture. The LSO allows for service provisioning using T-API extensions that support the MEF’s Carrier Ethernet services.

Three aspects of the T-API 2.0 interface were tested as part of the use cases: connectivity, topology and notification.

Setting up a service requires both connectivity and topology. Topology refers to how a service is represented in terms of the node edge points and the links. Notification refers to the northbound aspect of the interface, pushing information upwards to the orchestrator at the application layer. This allows the orchestrator in a multi-domain network to re-route connectivity services across domains.

The four use cases tested included multi-layer network connections whereby topology information is retrieved from a multi-domain network with services provisioned across domains.

T-API 2.0 was also used to show the successful re-routing of traffic when network situations change such as a fault, congestion, or to accommodate maintenance work. Re-routing can be performed across the same layer such as the IP, Ethernet or optical layer, or, more optimally, across two or more layers. Such a capability promises operators the ability to automate re-routing using SDN technology.

The two other use cases tested during the recent demonstration were the orchestrator performing network restoration across two or more domains, and the linking of data centres’ network functions virtualisation infrastructure (NFVI).  Such NFVI interconnect is a complex use case involving SDN controllers using T-API to create a set of wide area networks connecting the NFV sites. The use case set up is shown in the diagram below.

Source: OIF

SK Telecom, one of the operators that participated in the interoperability demonstration, welcomes the advent of T-API 2.0 and says how such APIs will allow operators to enable services more promptly.

“It has been difficult to provide services such as bandwidth-on-demand and networking services for enterprise customers enabled using a portal,” says Park Jin-hyo, executive vice president of the ICT R&D Centre at SK Telecom. “These services will be provided within minutes, according to the needs, using the graphical user interface of SK Telecom’s network-as-service platform.”

SK Telecom stresses the importance of open APIs in general as part of its network transformation plans. As well as implementing a 5G Standalone (SA) Core, SK Telecom aims to provide NFV and SDN-based services across its network infrastructure including optical transport, IP, data centres, wired access as well as networks for enterprise customers.

“Our final goal is to open the network itself to enterprise customers via an open API,” says Park. “Our mission is to create 5G-enabled network-slicing-based business models and services for vertical markets.”

Takeways

The OIF says the use cases have shown that T-API 2.0 enables real-time orchestration and that the main shortcomings identified with the first T-API interface have been addressed with T-API 2.0.

The OIF recognises that while T-API may not be the sole approach available for the industry – the IETF has a separate activity – the successful tests and the broad involvement of organisations such as the ONF and MEF make a strong case for T-API 2.0 as the approach for operators as they seek to automate their networks.

“When it comes to the orchestrator tying into the transport network, we do believe T-API will be one of the main approaches for these APIs,“ says Sadler.

SK Telecom said participating in the interop demonstrations enabled it to test and verify, at a global level, APIs that the operators and equipment manufacturers have been working on. And from a business perspective, the demonstration work confirmed to SK Telecom the potential of the ‘global network-as-a-service’ concept.

Editor note: Added input from SK Telecom on September 1st.