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OIF Advances Interoperability at OFC 2025 with Live Demos, Expert Insights and Cross-Industry Collaboration

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35 members will demonstrate the future of optical and electrical networking for AI, cloud and disaggregated architectures

Fremont, Calif. – As network demands grow more complex, OIF is set to showcase interoperability breakthroughs with live demonstrations and expert discussions at OFC 2025 in San Francisco, April 1-3.

With participation from 35 member companies, OIF’s interoperability demos at OFC in booth 5745 will showcase seamless multi-vendor integration driving high-performance networking, energy efficiency and AI infrastructure.

Highlights include the latest 800G technology in the pluggable coherent optics demonstration; a live Common Electrical I/O (CEI)-448G, 224G and 112G demo advancing next-gen data center connectivity; Common Management Interface Specification (CMIS) plug-and-play interoperability; and cutting-edge Energy Efficient Interfaces (EEI) and co-packaging solutions for AI compute and external laser integration.

OIF will also lead and participate in expert panels on AI networking, optical interconnects, scalable architectures and what’s beyond 200 Gb/s signaling.

“OIF’s live interoperability demonstrations at OFC 2025 are the result of months of dedicated collaboration among our member companies, reflecting the immense effort required to bring these cutting-edge technologies to life in a real-world, multi-vendor environment,” said Jeff Hutchins, OIF Physical & Link Layer (PLL) Working Group EEI Vice Chair and Secretary/Treasurer (Ranovus). “Interoperability isn’t just a goal—it’s a necessity for scaling next-generation networks. These demos provide the industry with a firsthand look at the progress being made to ensure seamless integration across coherent optics, electrical interfaces, next generation EEI, ELSFP, CMIS and beyond.”

Live Interoperability Demonstrations
With AI, cloud expansion and disaggregated architectures reshaping connectivity, OIF’s demo in Booth 5745 will provide an in-depth look at the technologies that will define the next decade of networking:

800ZR, 400ZR and Multi-Span Optics – Optical Breakthroughs: Better Than Before
The pluggable coherent optics demonstration will showcase progress in the latest advancements in pluggable coherent optics interoperability, offering a comprehensive view of their capabilities and applications. The single-span demo highlights include even more 800ZR multivendor DSP interop as well as OIF’s foundational 400ZR application. Multi-span connections include OpenZR+, 100ZR and 800G OpenROADM (PCS) over multiple networks, including booth-to-booth collaborations with the Ethernet Alliance and OpenROADM MSA.

CEI-448G, 224G and 112G – Driving Innovation and Collaboration for Future-Oriented Data Centers
OIF is uniting interoperability and innovation at the electrical interface with a suite of 224Gbps and 112Gbps CEI multi-vendor demonstrations spanning a variety of applications, enabling next-generation electrical and optical connectivity. OIF’s live 448G demo will highlight the opportunities and challenges of hyperscalers to scale AI networks as it continues to build upon its previous CEI-224G demonstrations, which include a growing diversity of link types from Very Short Reach (VSR) to Long Reach (LR) and Linear interfaces. A joint demonstration with the EEI track will display the breadth and depth of retimed, half-retimed (RTLR) and Unretimed (Linear) pluggable optics with interoperability from multiple vendors over various link types.

CMIS – Enabling Multi-Vendor Interop
OIF members will demonstrate physical layer management interoperability, enabled by CMIS, across diverse network equipment and pluggable modules including transceivers and cables. The demonstration includes the CMIS industry-standard management interface for a common network control platform, showing interoperability among different plug types, switches/routers and test-measurement equipment, all from different vendors and all operating using the CMIS family of specification documents.

EEI and Co-Packaging – Revolutionizing Connectivity
OIF members will present both live and conceptual demonstrations of next-generation EEI solutions for AI compute, along with live External Laser Small Form-Factor Pluggable (ELSFP) demos highlighting advancements in external laser sources critical for co-packaged architectures.

OIF members participating in the demo include Accelight Technologies, Inc., Adtran, Alphawave Semi, Anritsu Corporation, AOI, Astera Labs, Cadence Design Systems, Inc., CICT/Accelink, Ciena, Cisco, Coherent Corp., Eoptolink Technology, EXFO, HGGenuine, Hisense, Infinera (now part of Nokia), Juniper Networks, Keysight Technologies, Lessengers, MACOM Technology Solutions, Marvell, Molex, MultiLane, Nubis Communications, Inc., O-Net Technologies, Precision Optical Technologies, Inc., Samtec, Semtech, Senko Advanced Components, Sumitomo Electric Industries, Synopsys, Inc, TE Connectivity, TeraHop US, US Conec and Wilder Technologies.

OIF at OFC 2025: Show Floor Program Panels
In addition to its live in-booth demonstrations, OIF will lead and participate in expert panel sessions featuring discussions on coherent optics, AI-driven networking and what’s beyond 200 Gb/s signaling:

Coherent Optics Unleashed: 400ZR Success to 800ZR/LR Advancements and 1600ZR/ZR+ Kick-off – An OIF Update
Date: Wednesday, April 2
Time: 4 pm – 5 pm PT
Location: Theater I
Moderator: Karl Gass, OIF PLL Working Group Optical Vice Chair
Panelists: Josef Berger (Marvell), Doug Cattarusa (Cisco), Sebastien Gareau (Ciena), David Hillerkuss (Nokia) and Jason Wang (Google)

Optical Interconnects for AI
Date: Thursday, April 3
Time: 12:30 pm – 1:30 pm PT
Location: Theater II
Moderator: Tom Issenhuth, OIF Market Awareness & Education Committee Co-Chair PLL (Huawei Technologies, Inc.)
Panelists: Ashkan Seyedi (Nvidia), Chris Cole (Coherent), Jeff Hutchins, OIF PLL Working Group EEI Vice Chair and Secretary/Treasurer (Ranovus) and Tom Palkert, OIF Editor (MACOM)

Moving Beyond 200 Gb/s Signaling and the Future of AI Systems
Date: Thursday, April 3
Time: 1:45 pm – 2:45 pm PT
Location: Theater I
Panelist: Nathan Tracy, OIF President (TE Connectivity)

For more details about OIF at OFC 2025, please visit: https://www.oiforum.com/meetings-events/oif-ofc-2025/.

About OIF
OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 150+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF on LinkedIn, on X at @OIForum, on Bluesky and at https://www.oiforum.com/.

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
leah@wilkinson.associates
703-907-0010

OIF Unites Interoperability and Innovation at OFC 2025: Driving Industry Progress in Performance, Efficiency and Capacity for Future-Oriented Data Centers

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Fremont, Calif.  – OIF continues to lead the charge in advancing interoperability, with 35 member companies uniting at OFC 2025 to showcase groundbreaking solutions that redefine performance, efficiency and capacity. This year’s demonstrations will highlight advancements in interoperability tailored to address the growing demands of future-oriented data centers, AI/ML technologies and disaggregated systems.

OIF’s live interoperability showcase will feature key developments across technologies, including:

  • 800ZR, 400ZR, OpenZR+ and Multi-Span Optics — Enhancing multi-vendor interoperability in high-capacity, long-distance optical networks.
  • Energy Efficient Interfaces (EEI) and Co-Packaging — Driving sustainability and energy efficiency in data center interconnects.
  • Common Electrical I/O (CEI) CEI-448G, CEI-224G and CEI-112G — Advancing electrical interfaces for next-generation systems.
  • Common Management Interface Specification (CMIS) — Standardizing the management of optical and electrical devices to simplify scalability.

Interoperability in these technologies is shaping the next decade of network specifications and laying the foundation for hyperscalers to scale AI networks seamlessly across interconnected data centers.

“As an organization, OIF is focused on driving innovation and collaboration to meet the demands of hyperscalers and other stakeholders in the rapidly evolving data center ecosystem,” said Mike Klempa, OIF Board and Physical & Link Layer Interoperability Working Group Chair (Alphawave Semi). “Our members’ commitment to advancing interoperability is paving the way for seamless scaling of AI networks and robust data center interconnects. Through collaborative innovation, OIF is enabling an interconnected future.”

OIF members participating in the OFC 2025 demo include Accelight Technologies, Inc., Adtran, Alphawave Semi, Anritsu, AOI, Astera Labs, Cadence Design Systems, Inc., CICT/Accelink, Ciena, Cisco, Coherent Corp., Eoptolink Technology, EXFO, HGGenuine, Hisense, Infinera, Juniper Networks, Keysight Technologies, Lessengers, MACOM Technology Solutions, Marvell Semiconductor, Inc., Molex, MultiLane, Nubis Communications, Inc., O-Net Technologies, Precision Optical Technologies, Inc., Samtec, Semtech, Senko Advanced Components, Sumitomo Electric Industries, Synopsys, Inc, TE Connectivity, Terahop US (PTE Ltd.), US Conec and Wilder Technologies.

Visit OIF at Booth #5745 during OFC 2025 to experience these solutions live and connect with the experts driving the future of networking. For more information, visit: https://www.oiforum.com/meetings-events/oif-ofc-2025/.

About OIF

OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 150+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF on LinkedIn, on X at @OIForum and at https://www.oiforum.com/.

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

leah@wilkinson.associates

703-907-0010

 

OIF Champions Interoperability at ECOC 2024: 34 Member Companies to Showcase Solutions for Data Centers, AI/ML Technologies and Disaggregated Systems

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Demos include 800ZR, 400ZR and multi-span optics, Energy Efficient Interfaces (EEI) & co-packaging, 224G and 112G Common Electrical I/O (CEI) and Common Management Interface Specification (CMIS)

Fremont, Calif. – OIF is set to lead a dynamic interoperability demonstration featuring live collaboration between 34 member companies at the upcoming ECOC 2024 exhibition being held Sept. 23-25 in Frankfurt, Germany. This showcase will highlight advancements in performance, efficiency and capacity in response to the burgeoning needs of future-oriented data centers, AI/ML technologies and disaggregated systems.

The demonstration, in Booth #B83, will spotlight interoperability innovations in 800ZR, 400ZR and multi-span optics, Energy Efficient Interfaces (EEI) & co-packaging, 224G and 112G Common Electrical I/O (CEI) and Common Management Interface Specification (CMIS) – all pivotal for shaping the next decade of industry standards.

“OIF’s interoperability demonstrations at this year’s ECOC are a testament to the collaborative efforts of our member companies in enabling next-generation connectivity solutions,” said Nathan Tracy, OIF President, and TE Connectivity. “Our focus on advanced solutions underscores our commitment to addressing the future networking needs driven by evolving technologies like AI/ML.”

The interoperability demonstrations will showcase system, component and test-equipment vendors and highlight their roles in driving the adoption of advanced technologies in near-term and next-generation networks.

Participating member companies include Adtran; Alphawave Semi; Amphenol; Anritsu; AOI; Astera Labs; Cadence Design Systems, Inc.; CICT/Accelink; Cisco; Coherent Corp.; EXFO; HG Genuine; Hisense; Infinera; Innolight; Juniper Networks; Keysight Technologies; Lessengers; Linktel Technologies; Lumentum; MACOM Technology Solutions; Marvell; Molex; MultiLane; Nokia; O-Net Technologies; Samtec; Semtech; Senko Advanced Components; Sumitomo Electric Industries; Synopsys; TE Connectivity; USConec and Wilder Technologies.

For further details, please visit: https://www.oiforum.com/meetings-events/oif-ecoc-2024/

About OIF

OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 150+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF on LinkedIn, on X at @OIForum and at https://www.oiforum.com/.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

leah@wilkinson.associates

703-907-0010

 

 

OIF to Take Center Stage at OFC 2024 with Groundbreaking Multi-Vendor Interoperability Demonstrations and Expert Panels

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47 member companies will demonstrate innovations in coherent optics, electrical and energy efficient interfaces and management specifications

Fremont, Calif. – OIF’s record-breaking, multi-vendor interoperability demonstrations at OFC 2024 will spotlight groundbreaking interoperable solutions in 800ZR, 400ZR and OpenZR+ optics; Energy Efficient Interfaces (EEI) & Co-Packaging; 112G and 224G Common Electrical I/O (CEI); and Common Management Interface Specification (CMIS) implementations.

This year’s historic interoperability demonstration, the largest ever, not only underscores the progress of OIF member companies in tackling the industry’s most pressing demands but will also unveil multiple industry-firsts. Once again, OIF’s work positions the organization at the forefront of driving the industry forward, offering tangible solutions to the most pressing network challenges.

“The interoperable solutions being demonstrated in the OIF booth are critical to addressing the escalating needs of next-generation data center networking, artificial intelligence/machine learning (AI/ML) and disaggregation applications,” said Nathan Tracy, OIF President and TE Connectivity. “We’ve seen a 38 percent increase in demo participants compared to last year and the addition of nine new participating companies, which emphasizes the remarkable growth and impact of OIF’s work.”

Record-setting Interoperability Demos – 800ZR, 400ZR and OpenZR+ optics, EEI & Co-Packaging, 112G and 224G CEI and CMIS

800ZR, 400ZR and OpenZR+ Optics Interoperability Demos

The pluggable coherent optics demonstration will showcase progress in the latest advancements in 800ZR, 400ZR and ZR+ optics interoperability, offering a comprehensive view of their capabilities and applications. The demo highlights include the first public 800ZR multivendor interop; high transmit power, OpenZR+ over a 1000km, multi-span network; OpenROADM/ITU-T over that same network; and our foundational 400ZR collocated on the single-span network with 800ZR.

EEI & Co-Packaging Interoperability Demos

The EEI and Co-Packaging demo will feature pioneering methods for integrating multiple chips within a single package, driving a new era of enhanced performance and power efficiency in electronic devices. OIF members will display a conceptual demo of AI backend compute utilizing next generation energy efficient interfaces as well as live demos showcasing the latest advancements for external laser sources. This demo highlights innovative approaches that are revolutionizing the performance and power efficiency of electronic device design.

112G and 224G CEI Interoperability Demos

OIF is advancing its pioneering efforts in interoperability with the expansion of its industry-first demonstration of 224G CEI multi-vendor interoperability, the electrical interface for future optical solutions. Additionally, OIF’s demonstration of a 112G CEI Linear ecosystem has broadened, driven by the interoperability of multivendor SerDes links with multi-vendor LPOs, supported by test and measurement validation at each stage of the link.

CMIS Interoperability Demos

The CMIS demo will feature an array of CMIS-managed modules integrated into routers, switches and test gear from various vendors, providing a firsthand glimpse into CMIS’ effective management of modules in real-world applications. Its focus is on the path to plug and play illustrating how modules communicate their capabilities, enabling hosts to manage them seamlessly without requiring specific code for each module.

Live and Interactive Demonstrations: 47 Member Company Participants

The demonstrations in OIF’s booth #1323 will highlight the collaborative efforts of system vendors, component vendors and test equipment vendors, emphasizing their contributions to advancing technology adoption in both present and future networks.

Participating member companies are Adtran; Alphawave Semi; Amphenol; Anritsu; AOI; Astera Labs; Ayar Labs; Broadcom Inc.; Cadence Design Systems, Inc.; Casela Technologies; CICT/Accelink; Ciena; Cisco Systems; Coherent Corp.; Corning; Eoptolink; EXFO; HG Genuine; Hisense; Infinera; Juniper Networks; Keysight Technologies; Lessengers; Linktel Technologies; Lumentum; Luxshare-Tech; MACOM Technology Solutions; Marvell; Molex; MultiLane; NEC; Nokia; Nubis Communications, Inc.; O-Net Technologies; Optomind; Precision Optical Technologies, Inc.; Quantifi Photonics; Samtec; Semtech; Senko Advanced Components; Sumitomo Electric Industries; Synopsys; TE Connectivity; US Conec; Viavi Solutions; Wilder Technologies and Wistron.

In addition to the in-booth demonstrations, OIF experts will lead two panel discussions on the exhibit floor, providing valuable insights into the industry’s latest advancements:

OIF Panels

Wednesday, March 27, 2024: Coherent Optics Unleashed: From 400ZR Success to 800ZR/LR Advancements and 1600ZR Kick-off – An OIF Update

  • Time: 4 pm – 5 pm PT
  • Location: Theater 1
  • Moderator: Karl Gass, OIF Physical & Link Layer Interoperability (PLL) Working Group (WG) Optical Vice Chair
  • Panelists: Sebastien Gareau (Ciena), Jeff Rahn (Meta), Gert Sarlet (Coherent), Tom Williams (Cisco)

Thursday, March 28, 2024: Energy Efficient Interfaces – Reining in Power Consumption Trends for Next-Generation Optical Networking

  • Time: 1:45 pm – 2:45 pm PT
  • Location: Theater 1
  • Moderator: Jeff Hutchins, OIF PLL WG EEI Vice Chair and Board Member (Ranovus)
  • Panelists: Craig Thompson (NVIDIA), Yi Tang, OIF PLL WG Electrical Vice Chair (Cisco), Nathan Tracy, OIF President (TE Connectivity)

For more information about OIF at OFC 2024, please visit: https://www.oiforum.com/meetings-events/oif-ofc-2024/

About OIF

OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 150+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF on LinkedIn, on X at @OIForum and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

leah@wilkinson.associates

703-907-0010