March 21-23, 2017
Los Angeles, CA

2017 OIF Physical and Link Layer Interoperability Demo

OIF Delivers on Enabling Next Generation Networks!

OIF member companies listed below teamed up to demonstrate significant progress in delivering an interoperable ecosystem of suppliers and solutions for critical market needs:

  • 56Gbps live electrical signaling over all reaches
  • CFP2-ACO Optical Interoperability
  • FlexE (Flex Ethernet)

Demo Participants

Speaking Sessions

Tuesday, March 21, 2017 – 1:45pm-2:45pm – Expo Theater III
Enabling Next Generation Physical Layer Solutions
Moderator: Steve Sekel, Keysight Technologies, OIF Physical & Link Layer Interoperability Working Group Chair
Panelists: Ed Frlan, Semtech, OIF Technical Committee Vice Chair; Karl Gass, OIF Physical & Link Layer Working Group – Optical Vice Chair; Tad Hofmeister, Google, OIF Representative

Tuesday, March 21, 2017 – 3pm-4pm – Expo Theater III
OIF Interop – The Key to Unlocking the Benefits of SDN
Moderator: Dave Brown, Nokia, OIF President
Panelists: Victor Lopez, Telefonica; Lyndon Ong, Ciena, OIF MA&E Committee Co-Chair – Networking; Jonathan Sadler, Coriant, OIF Board member and Networking Interoperability WG Chair

OIF Workshop – 100G Serial Electrical Interconnect Needs

March 23, 2017
Los Angeles, CA – USA
More info