September 29 – October 1, 2025
Bella Center
Copenhagen, Denmark
Booth #C3425
Live Interoperability Demos!
OIF at ECOC 2025: Bridging Gaps, Accelerating Innovation Through Industry-Wide Interoperability
Recognized as the leading organization enabling industry-wide interoperability, OIF returns to ECOC 2025 with a live, multi-vendor demonstration featuring 35 member companies. The demo spans OIF’s core technical areas — optical, electrical, energy efficient and management interfaces — and showcases interoperability across technologies including 400ZR, 800ZR, Multi-span Optics, CEI-448G, CEI-224G, CEI-112G, Co-Packaging, CMIS, EEI and more.
CMIS will be shown operating within a live simulated network, rather than in a standalone configuration, highlighting its role in enabling plug-and-play integration across disaggregated systems.
Driven by collaboration among component suppliers, system vendors, hyperscalers and network operators, OIF’s work helps close implementation gaps and deliver the building blocks of open, scalable infrastructure.
Visit OIF at booth #C3425 to experience these groundbreaking solutions live!
Participating Members
1Finity, Adtran, Alphawave Semi, Amphenol, Anritsu Corporation, AOI, Cadence Design Systems, Inc., CICT/Accelink, Ciena, Cisco, Coherent Corp., Eoptolink Technology, EXFO, Furukawa FITEL, HGGenuine, Juniper Networks (now part of HPE), Keysight Technologies, Lessengers, Ligent, Inc., Lumentum, Marvell, MaxLinear Inc., Molex LLC, MultiLane, Nokia, Nubis Communications, O-Net, Samtec, SENKO Advanced Components, Sumitomo Electric Industries, Synopsys, Inc., Terahop PTE Ltd., TE Connectivity, US Conec and Wilder Technologies
Market Focus Speaking Sessions
“Coherent Technology Advances in the Market, DCI Interop and Shorter Reaches for AI”
Tuesday, September 30 from 12:20pm-12:35pm CEST
Presenter: Karl Gass, OIF Physical & Link Layer Working Group Optical Vice Chair
“CMIS – The Interface that Ties Everything Together for AI”
Tuesday, September 30 from 2:20pm-2:35pm CEST
Presenter: Ian Alderdice, OIF Physical & Link Layer Working Group Management Co-Vice Chair, Ciena
“Energy Efficiency in AI Applications – Making Sense of the Multiple Requirements”
Wednesday, October 1 from 10:40am-10:55pm CEST
Presenter: Jeff Hutchins, Physical & Link Layer Working Group Energy Efficient Interfaces Vice Chair and OIF Board Member and Secretary/Treasurer, Ranovus
“400G Architectures For AI – Addressing the Challenges, Enabling the Future”
Wednesday, October 1 from 12:00pm-12:15pm CEST
Presenter: Mike Klempa, OIF Board Member and Physical & Link Layer Interoperability Working Group Chair, Alphawave Semi
Press Release
OIF at ECOC 2025: Eliminating Barriers and Accelerating Innovation Through Industry-Wide Interoperability
35 member companies join forces to demonstrate real-world interoperability across optical and electrical domains (August 13, 2025)
