The Optical Internetworking Forum announced today a half-day workshop, open to the public, featuring subject matter experts from the OIF and an industry view by Alan Weckel of Dell’Oro. The workshop will address 112 Gbps per lane serial electrical interconnect needs and will take place concurrent with OFC on March 23, 2017 at the Los Angeles Convention Center.
In August 2016, the OIF began the CEI-112G project to define the serial electrical interface for next generation optical modules at 112 Gbps. This technical work is expected to be the first of a series of CEI-112G clauses for various reaches, ranging from ultra-short reach interfaces designed for intra multi-chip module (MCM) communications to longer chip-to-chip interfaces.
“Operation of electrical interfaces at 112 Gbps speeds is feasible, but demands careful attention to some of the thorny technical issues that are involved and the technology trade off decisions that are going to be required,” said Nathan Tracy of TE Connectivity and the OIF vice president of marketing . “This workshop will present the multiple facets and perspectives for the 112 Gbps serial electrical development work including applications, equipment, optics, SERDES, connectors and channels.”
The first half of this workshop will focus on the industry view and application spaces for the next generation interconnects, including networking trends and cloud scale applications. It is anticipated that requirements for these application spaces are characterized by a combination of parameters such as:
- loss budgets (distance, number of connectors),
- electrical and optical data rates,
- electrical channel properties,
- power constraints,
- equalization and retimers,
- mechanical constraints (faceplate density, etc.)
The second half of this workshop will focus on potential electrical link and interconnect technologies being developed to support serial data rates of 100 Gbps and higher.
Workshop details can be found at http://www.oiforum.com/meetings-and-events/march-2017-workshop-100g-serial-electrical-interconnect-needs/
12:00pm: Registration and Box Lunches
12:30pm: Intro – Tom Palkert, OIF PLL WG Electrical Vice Chair, Molex
1:00pm: Industry Analyst – Alan Weckel, Dell’Oro
Session 1 – User Demand
1:40pm: High Level Systems
2:20pm: Equipment Perspective
3:00pm: Coffee break
Session 2 – Component Suppliers’ Vision
4:35pm: Copper cable/connector/PCB trace
6:00pm: Informal Networking at local bar & grill (TBD)
March 23, 2017
Los Angeles Convention Center, Los Angeles, CA
OIF Members: $150.00 USD; Non-members: $200.00 USD (fee includes lunch).
OIF Members, click HERE to register.
Non-Members, click HERE to register.
About the OIF
The OIF facilitates the development and deployment of interoperable networking solutions and services. Members collaborate to drive Implementation Agreements (IAs) and interoperability demonstrations to accelerate and maximize market adoption of advanced internetworking technologies. OIF work applies to optical and electrical interconnects, optical component and network processing technologies, and to network control and operations including software defined networks and network function virtualization. The OIF actively supports and extends the work of national and international standards bodies. Launched in 1998, the OIF is the only industry group uniting representatives from across the spectrum of networking, including many of the world’s leading service providers, system vendors, component manufacturers, software and testing vendors. Information on the OIF can be found at http://www.oiforum.com.