OIF Reveals Three Innovative Projects – External Laser Small Form Factor Pluggable Module for Co-Packaged Optics, Artificial Intelligence for Enhanced Network Operations and CEI-112G-Linear – at Q2 2021 Virtual Meeting
Fremont, Calif.—May 26, 2021 – Activity was high at OIF’s Q2 2021 Technical and MA&E Committees Meeting, held virtually May 10-14. Members initiated three new innovative projects, including a Co-Packaged Optics external laser module, Artificial Intelligence (AI) for Enhanced Network Operations and CEI-112G-Linear, in addition to announcing a network operator survey for the 2022 Networking Demo.
External Laser Small Form Factor Pluggable (ELSFP) Module Project – companion project to support co-packaged optics applications
This project for a blind-mate pluggable external light source module will define a new form factor optimized to package lasers to support co-packaged optical modules. It also includes provisions for the longevity of this form factor beyond the initial scope of the Co-Packaged Optics Module project (i.e., more fibers, thermal, and optical power classes).
“The ELSFP project is an important step for enabling co-packaged optics deployments,” according to Gary Nicholl, Cisco and OIF board member. “And, the project objectives include the necessary technical considerations to ensure this project will be relevant for multiple generations.”
Application of Artificial Intelligence to Enhanced Network Operations Project
A healthy and high-performance network serves as the foundation for all 5G application scenarios. Traditional approaches face significant difficulties in automatically and efficiently analyzing network data, solving network faults, and optimizing network performance. This new project will result in a white paper identifying a collection of use cases for applying AI to construct intelligent, resilient and high-performance optical and packet networks.
CEI-112G-Linear Project
A linear Chip-to-Optical Engine interface is needed to enable low power, low cost, small form factor 112G serial optical modules in Co-Packaged Optics, Near Package Optics (NPO) and server/GPU applications. This new project will facilitate increased bandwidth and reduced power of switch ports using co-packaged and closely packaged optical modules.
Network Operator Survey – 2022 Transport SDN Interoperability Demonstration
The OIF Networking Interoperability Working Group is surveying operators worldwide for their input and interest in participating in a 2022 Transport SDN Interoperability Demonstration. As with past surveys, responses will be anonymized, tabulated and summarized. The deadline to complete the survey is Tuesday, June 15, 2021. Interested operators can click here to download the survey.
About OIF
OIF is where the optical networking industry’s interoperability work gets done. Building on more than 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.
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