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OIF Validates Critical Interoperability Live at OFC 2026 Through Multi-Vendor Demonstrations and Expert Panels

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OIF member experts present panels on CEI-448Gbps signaling, next-generation ZR optics and optical interconnect specs for AI, alongside the interoperability showcase at booth #2017

Fremont, Calif. — OIF and 40 participating member companies will use OFC 2026, March 17–19, to validate the interoperable building blocks AI-era data center networks increasingly depend on – demonstrating, live and across multiple vendors, how the ecosystem delivers scale, speed and energy efficiency under real-world constraints.

On the exhibit floor at the Los Angeles Convention Center, OIF’s interoperability showcase (booth #2017) serves as a vendor proving ground, translating implementation agreements (IAs) into working, repeatable interoperability so operators can reduce integration risk, maintain sourcing flexibility and move from innovation to deployment with greater confidence.

This year’s demonstrations will feature collaboration in four critical technology areas: 400ZR, 800ZR, Multi-Span Coherent Optics, Multi-Core Fiber (MCF) and IP/Optical Controllers; Common Electrical I/O (CEI) CEI-448G and CEI-224G; Co-Packaging; Common Management Interface Specification (CMIS) and Energy Efficient Interfaces (EEI).

OIF leaders and member experts have been selected to present three Show Floor Theater panels at OFC 2026, covering OIF’s work on CEI-448Gbps signaling, next-generation ZR optics, and optical interconnect specifications for AI.

“AI-era infrastructure demands more than speed – it demands interoperability you can trust, plus the energy efficiency required to scale responsibly,” said Nathan Tracy, President of OIF (TE Connectivity). “At this year’s OFC, OIF and 40 of our members will showcase what it looks like when specifications become real multi-vendor operations across coherent optics, high-speed electrical interfaces, energy-efficient architectures and common management, so teams leave OFC with repeatable, multi-vendor building blocks they can deploy faster, source flexibly and scale efficiently.”

Technology Areas Featured in OIF’s OFC 2026 Interoperability Showcase

400ZR, 800ZR, Multi-Span Coherent Optics, Multi-Core Fiber (MCF) and IP/Optical Controllers – Coherent Interoperability at Scale

OIF’s largest multi-vendor system demonstration to date features nearly 100 coherent modules from 15 vendors. These modules are integrated across eleven host platforms and operate on four open line systems, all of which are managed by four IP/Optical Controllers. This large-scale collaboration highlights the robust ecosystem and interoperability achievable in today’s optical networking solutions. Additional growth into L band, transmission of ZR signals over multi-span MCF and the use of MCF-native 800G DR IMDD modules underscore the diversity, equality and inclusion of the optical industry’s foremost demonstration.

Common Electrical I/O (CEI) CEI-448G, CEI-224G – Driving Innovation and Collaboration for Future-Oriented Data Centers

OIF will showcase the application spaces, technical challenges and potential solution paths for electrical interfaces operating at 448Gbps per lane along with expanded interoperability and innovation at the 224G electrical interface. CEI demonstrations align semiconductor, interconnect and test and measurement companies towards essential interoperable frameworks for the AI era. A live, multi-vendor 448G demonstration will focus on hyperscaler needs for scaling AI networks, while a further expanded CEI-224G showcase brings greater ecosystem participation and highlights diverse link types from Very Short Reach (VSR) to Long Reach (LR) and Linear. In collaboration with OIF’s Physical & Link Layer (PLL) Working Group EEI track, OIF will also demonstrate energy-efficient electro-optical innovation across retimed, half-retimed (RTLR) and unretimed (Linear) pluggable optics and silicon. These demonstrations highlight the strength of the CEI ecosystem, proving robust interoperability across vendors and link types while advancing scalable, high-performance connectivity at 224G and the burgeoning 448G.

Common Management Interface Specification (CMIS) – Revolutionizing Management

OIF members will deliver live demonstrations of the latest innovations from the OIF PLL Working Group Management track, including enhanced firmware update capabilities that deliver a consistent, multi-vendor experience for users and network management systems such as OpenConfig. An additional live demo will showcase CMIS management of an ELSFP pluggable module, illustrating a key enabler for next-generation co-packaged optics solutions.

EEI and Co-Packaging – Revolutionizing Connectivity

OIF members will present achievements enabling energy efficient electrical and optical interfaces with both live and conceptual demonstrations of next-generation EEI solutions for AI compute, along with live ELSFP demos highlighting advancements in external laser sources critical for energy efficient solutions. Addressing energy efficiency is one of the highest-priority challenges faced by hyperscalers as they grow their AI resources to the next generation.

Participating Members: The interoperability showcase includes 3M, Accelight, Adtek, Adtran, Alphawave Semi, Amphenol Communications Solutions, Anritsu Corporation, AOI, Cadence Design Systems, Inc., CICT/Accelink, Ciena, Cisco, Coherent Corp., Eoptolink Technology, EXFO, Furukawa Electric/Lightera, HGGenuine, HPE, Keysight Technologies, Lessengers, Ligent, Inc., Luxshare-Tech, Marvell, MaxLinear Inc., Molex, MultiLane, Nokia, O-Net, Samtec, Semtech, SENKO Advanced Components, Silith, Sumitomo Electric Industries, Synopsys, Inc., TE Connectivity, Terahop PTE Ltd., US Conec, VeEX Inc., Wilder Technologies and Xscape Photonics.

OIF Brings Interoperability Insights to OFC 2026 Show Floor Theaters

OIF CEI-448Gbps – Fast and Furious Signaling Spec Development
Date: March 17

Time: 4:00pm–5:00pm PT

Location: Theater III
Moderator: Nathan Tracy, OIF President (TE Connectivity)
Panelists: John Calvin (Keysight Technologies); Mike Klempa, OIF Secretary/Treasurer and Physical & Link Layer Interoperability Working Group Chair (Qualcomm Incorporated); Cathy Liu, OIF Board Member (Broadcom, Inc.); Yi Tang, OIF Board Member and Physical & Link Layer Working Group Electrical Vice Chair (Cisco); Nathan Tracy, OIF President (TE Connectivity)

OIF 800ZR/LR and 1600ZR/ZR+/CL – Changing the Game…Again
Date: March 18

Time: 11:45am–12:45pm PT

Location: Theater II
Moderator: Karl Gass, OIF Physical & Link Layer Working Group Optical Vice Chair

Panelists: Georg Clarici (Coherent); Joerg Pfeifle (Keysight Technologies)

OIF – Driving Optical Interconnect Specs for AI
Date: March 19

Time: 1:30pm–2:30pm PT

Location: Theater II

Moderator: Jeff Hutchins, OIF Physical & Link Layer Working Group Energy Efficient Interfaces Vice Chair (Ranovus)
Panelists: Jeff Hutchins; Mike Klempa; Cathy Liu; Nathan Tracy

Visit OIF at OFC 2026

Visit OIF at booth #2017 during OFC (March 17–19) to see interoperability in action. Learn more: https://www.oiforum.com/meetings-events/oif-ofc-2026/

About OIF

OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 170+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF on LinkedIn, on X, on Bluesky and at https://www.oiforum.com/.

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

leah@wilkinson.associates

703-907-0010

 

OIF Demonstrates Industry-Wide Interoperability at Scale at OFC 2026, Advancing Energy Efficiency, Performance and Capacity for AI-Era Data Center Networks

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Live multi-vendor interoperability demo features 40 member companies and highlights 800ZR, 400ZR, Multi-span Optics, CEI-448G, CEI-224G, Co-Packaging, CMIS, EEI and more

Fremont, Calif. —  OIF, where the optical networking industry’s interoperability work gets done, will present a live, multi-vendor interoperability demonstration at OFC 2026 in Los Angeles. Featuring 40 member companies, the showcase highlights how OIF-driven interoperable networking solutions enable scalable, energy-efficient networks for AI-era data center environments.

OFC 2026 will take place March 15–19, 2026, at the Los Angeles Convention Center, with the exhibition running March 17–19.

Located in booth #2017, OIF’s demo will highlight real-world interoperability across key technologies including 800ZR, 400ZR, Multi-span Optics, Common Electrical I/O (CEI) CEI-448G, CEI-224G, Common Management Interface Specification (CMIS), Co-Packaging, Energy Efficient Interfaces (EEI) and more. This work underscores the industry’s need for deployable, multi-vendor building blocks across optical, electrical, energy-efficient and management interfaces that deliver higher performance, improved efficiency and scalable capacity in disaggregated architectures.

Participating companies are 3M, Accelight, Adtek, Adtran, Alphawave Semi, Amphenol Communications Solutions, Anritsu Corporation, AOI, Cadence Design Systems, Inc., CICT/Accelink, Ciena, Cisco, Coherent Corp., Eoptolink Technology, EXFO, Furukawa Electric, HGGenuine, HPE, Keysight Technologies, Lessengers, Ligent, Inc., Luxshare-Tech, Marvell, MaxLinear Inc., Molex, MultiLane, Nokia, O-Net, Samtec, Semtech, SENKO Advanced Components, Silith, Sumitomo Electric Industries, Synopsys, Inc., TE Connectivity, Terahop PTE Ltd., US Conec, VeEX Inc., Wilder Technologies and Xscape Photonics.

“AI-era infrastructure demands more than speed — it demands interoperability you can trust, plus the energy efficiency required to scale responsibly,” said Mike Klempa, OIF Secretary/Treasurer and Physical and Link Layer (PLL) Interoperability Working Group Chair (Alphawave Semi). “At OFC 2026, OIF and our members will show how the industry is translating specifications into real interoperability across coherent optics, high-speed electrical interfaces, energy-efficient architectures and common management so networks can move from innovation to deployment with confidence.”

OIF’s work is grounded in generating specifications that become the foundation for interoperability. Its Implementation Agreements (IAs) close the gap between standards and interoperable products, systems and networks. By convening the entire ecosystem — component suppliers, system vendors, hyperscalers and network operators — OIF accelerates alignment on practical, interoperable interfaces that enable open, scalable networking.

Visit OIF at booth #2017 at OFC 2026 to see interoperability in action, or learn more about the demo here.

About OIF

OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 170+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF on LinkedIn, on X, on Bluesky and at https://www.oiforum.com/.

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

leah@wilkinson.associates

703-907-0010

OIF at ECOC 2025: Eliminating Barriers and Accelerating Innovation Through Industry-Wide Interoperability

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35 member companies join forces to demonstrate real-world interoperability across optical and electrical domains

FREMONT, Calif. — OIF returns to ECOC 2025, Europe’s largest optical communications exhibition, with a live, multi-vendor demonstration that showcases how its members are bridging critical gaps and accelerating innovation through collaboration and interoperable standards-based solutions.

Featuring 35 participating companies, the demo encompasses several of OIF’s core technical domains — optical, electrical, energy efficient and management interfaces — and highlights interoperability across key technologies including 400ZR, 800ZR, Multi-span Optics, Common Electrical I/O (CEI) CEI-448G, CEI-224G, CEI-112G, Co-Packaging, Common Management Interface Specification (CMIS), Energy Efficient Interfaces (EEI) and more.

The following companies spanning system vendors, component and module suppliers, test and measurement providers, semiconductor and electronic design automation (EDA) companies and leading connector and cabling manufacturers are participating in OIF’s Interoperability Demo at ECOC: 1Finity, Adtran, Alphawave Semi, Amphenol, Anritsu Corporation, AOI, Cadence Design Systems, Inc., CICT/Accelink, Ciena, Cisco, Coherent Corp., Eoptolink Technology, EXFO, Furukawa FITEL, HGGenuine, Juniper Networks (now part of HPE), Keysight Technologies, Lessengers, Ligent, Inc., Lumentum, Marvell, MaxLinear Inc., Molex LLC, MultiLane, Nokia, Nubis Communications, O-Net, Samtec, SENKO Advanced Components, Sumitomo Electric Industries, Synopsys, Inc., Terahop PTE Ltd., TE Connectivity, US Conec and Wilder Technologies.

New this year, CMIS will operate within a live, simulated network environment rather than as a standalone configuration. This shift reflects the specification’s maturity and its critical role in enabling plug-and-play integration across disaggregated systems delivering real-world value to both operators and system vendors.

“OIF’s interoperability work is grounded in collaboration — across suppliers, hyperscalers, system vendors and network operators,” said Mike Klempa, OIF Board and Physical and Link Layer (PLL) Interoperability Working Group Chair (Alphawave Semi). “This year’s demo reflects the depth and diversity of that collaboration and continues OIF’s mission of closing the gap between technology promise and practical deployment, especially for future-oriented AI architectures.”

The demonstration reinforces OIF’s role as the leading forum for accelerating the development and deployment of open, scalable network infrastructure — delivering implementation-ready solutions that the industry can count on.

Visit OIF at booth #C3425 or learn more about the OIF Demo at ECOC 2025 at: https://www.oiforum.com/meetings-events/oif-ecoc-2025/

About OIF
OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 160+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF on LinkedIn, on X, on Bluesky and at https://www.oiforum.com/.

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
leah@wilkinson.associates
703-907-0010

OIF Leads the Charge for Interoperability at ECOC 2024

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34 Member Companies to Showcase Cutting-Edge Solutions, OIF Experts to Speak in Three Market Focus Sessions

Fremont, Calif. – OIF today unveiled new details on its live interoperability demonstrations at ECOC 2024, highlighting advancements across critical areas such as 800ZR, 400ZR and multi-span optics; Common Electrical I/O (CEI) CEI-112G and CEI-224G; Common Management Interface Specification (CMIS) and Energy Efficient Interfaces (EEI) & Co-Packaging.

The demonstrations showcased in Booth #B83 Sept. 23-25 in Frankfurt, Germany, feature collaboration among 34 member companies and highlight the organization’s leadership in interoperability across a range of cutting-edge technologies.

In addition to the demonstrations, OIF experts will lead Market Focus Sessions on Coherent Optics, CMIS and EEI.

“Live interoperability demonstrations are essential for the industry to witness firsthand the seamless integration of technologies,” said Dave Brown, OIF Director of Communications, and Nokia. “OIF’s demos at ECOC, featuring contributions from system, component and test-equipment vendors, underscore OIF’s leadership in interoperability across key technologies that are crucial in shaping the standards that will define the next decade of our industry.”

Interoperability Demonstrations at Booth #B83

800ZR, 400ZR and Multi-Span Optics – Unveiling Optical Breakthroughs: The pluggable coherent optics demonstration will showcase progress in the latest advancements in 800ZR, 400ZR and ZR+ optics interoperability, offering a comprehensive view of their capabilities and applications. The demo highlights include the first public 800ZR multivendor DSP interop; OpenZR+, 100ZR and OpenROADM/ITU-T, all over multiple, multi-span networks; and OIF’s foundational 400ZR collocated on the same single-span network as 800ZR.

CEI-112G-Linear & CEI-224G Interoperability – Fast-Track to the Future: OIF is accelerating electrical interface interoperability with a suite of 224Gbps and 112Gbps CEI multi-vendor demonstrations spanning a variety of applications that form the foundation of next-generation optical connectivity. The CEI-224G demonstrations include a diversity of link types from Very Short Reach (VSR) to Long Reach (LR) and linear interfaces leveraging specifications spearheaded by the OIF. The CEI-112G demonstration displays the breadth and depth of linear pluggable optics with interoperability from multiple vendors over various link types.

CMIS – Path to Plug & Play: OIF members will demonstrate physical layer management interoperability across diverse network equipment and pluggables enabled by CMIS. The demonstration includes the CMIS industry-standard management interface for a common network control platform, showing interoperability among different plug types, switches/routers and test-measurement equipment, all operating with CMIS.

EEI and Co-Packaging – Revolutionizing Connectivity: OIF members will display a conceptual demo of AI compute and live PCIe optical links, all using next-generation EEI, as well as live demos showcasing the latest advancements for ELSFP, external laser source faceplate pluggable, for co-packaging.

Participating member companies include:
Adtran, Alphawave Semi, Amphenol, Anritsu, AOI, Astera Labs, Cadence Design Systems Inc., CICT/Accelink, Cisco, Coherent Corp., EXFO, HG Genuine, Hisense, Infinera, Innolight, Juniper Networks, Keysight Technologies, Lessengers, Linktel Technologies, Lumentum, MACOM Technology Solutions, Marvell, Molex, MultiLane, Nokia, O-Net Technologies, Samtec, Semtech, Senko Advanced Components, Sumitomo Electric Industries, Synopsys, TE Connectivity, US Conec and Wilder Technologies.

OIF Experts to Share Insights in Market Focus Sessions

In addition to the live interoperability demonstrations, OIF experts will contribute their knowledge in three Market Focus Sessions, offering insights into key industry trends and technological advancements:

  • “Coherent Optics in the Datacenter”

Monday, Sept. 23, 2024, from 1:20 pm-1:35 pm CEST

Presenter: Karl Gass, OIF Physical and Link Layer (PLL) Working Group (WG) Optical Vice Chair

  • “CMIS – Is Plug-and-Play Possible?”

Monday, Sept. 23, 2024, from 2:20 pm-2:35 pm CEST

Presenter: Doug Cattarusa, OIF Editor, Cisco

  • “Energy Efficient Interfaces for the Next Generation of AI Compute”

Tuesday, Sept. 24, 2024, from 11:20 am-11:35 am CEST

Presenter: Jeff Hutchins, OIF Board Member and PLL WG EEI Vice Chair, Ranovus

For further details, please visit: https://www.oiforum.com/meetings-events/oif-ecoc-2024/

 

About OIF

OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 150+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF on LinkedIn, on X at @OIForum and at https://www.oiforum.com/.

 

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
leah@wilkinson.associates
703-907-0010