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OIF Unveils CEI-112G-XSR+-PAM4 Extended Extra Short Reach Implementation Agreement, Paving the Way for Advanced Interconnectivity

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Organization also releases C-CMIS IA, publishes AI network operations and 400ZR+ demo white papers and announces next CMIS webinar

Fremont, Calif. – OIF, where the optical networking industry’s interoperability work gets done, has published a new Implementation Agreement (IA) for Common Electrical I/O (CEI) CEI-112G-XSR+-PAM4 Extended Extra Short Reach.

The CEI-112G-XSR+-PAM4 IA specifies a 112 Gb/s PAM4 electrical interface for die-to-die (D2D) and die-to-optical-engine (D2OE) interconnect with bump-to-bump insertion loss up to 13 dB at the Nyquist frequency and baud rate in the range 36 Gsym/s to 58 Gsym/s. The intended applications encompass multiple-chip modules (MCM), co-packaged optics (CPO) and near-package optics (NPO) assemblies. It also details the requirements for the CEI-112G-XSR+-PAM4 extended extra short reach high-speed electrical interface with nominal baud rates between 36 Gsym/s and 58 Gsym/s using PAM4 modulation.

“The CEI-112G-XSR+-PAM4 IA represents a significant milestone, extending the reach of previously published XSR class specifications at this speed range,” said David Stauffer, OIF Physical and Link Layer Working Group Chair and Kandou Bus, S.A. “This IA empowers advanced interconnectivity solutions in die-to-die and die-to-optical-engine scenarios, supporting baud rates up to 112 Gb/s (58 Gsym/s). These specifications have the opportunity to revolutionize multiple-chip modules, co-packaged optics, and near-package optics applications, pushing the boundaries of high-speed data transmission.”

Matt Brown, editor of the CEI-112G-XSR+-PAM4 IA and Alphawave Semi, added, “The CEI-112G-XSR+-PAM4 IA addresses a gap in the set of OIF CEI specifications to address new applications identified by the diverse membership of the OIF.”

OIF also recently released the Coherent Common Management Interface Specification (C-CMIS) IA 1.3, published an Application of Artificial Intelligence (AI) to Enhanced Network Operations technical white paper, published the ECOC 400ZR+ demo white paper and launched a series of CMIS technical webinars.

C-CMIS IA 1.3: This Implementation Agreement extends the Common Management Interface Specification [CMIS] to allow the management of digital coherent optics (DCO) modules. Initially covering 400ZR modules, this IA supports the management of modules that have a single data path with an eight-lane host interface for a 400GBASE-R Ethernet signal and a single-lane 400G coherent media interface based on the 400ZR specification. Future extensions to accommodate other DCO modules are anticipated.

Application of Artificial Intelligence (AI) to Enhanced Network Operations Technical White Paper: This new white paper addresses the interoperability requirements for enhanced network functions that interface between transport networks and their management-control systems. It identifies various use cases for applying AI to guide interoperability and provides insights into data requirements, processing needs, output specifications and interfaces relevant to each use case.

ECOC 400ZR+ Demo White Paper: This paper presents the methodology and results of an interoperability study of OpenZR+ MSA QSFP-DD transceivers conducted during the ECOC 2023 plugfest. Ten different transceivers were cross-connected in a matrix of transmitter-to-receiver combinations using a noise-loaded link to characterize the penalties associated with supplier interoperability. Individual transceiver performance was tested using 400GE traffic over a shortened optical line system link with a DWDM 75GHz fixed channel grid and a separate configuration to capture the transmitter error vector magnitude (EVM) performance. The transceiver receiver OSNR performance is compared against the transceiver transmitter EVM performance for each vendor.

CMIS Technical Webinar Series: OIF is hosting a series of free, public CMIS tutorial webinars. The next webinar, “Data Path State Machine (DPSM) and Application Advertising,” will be held on February 7th. These webinars aim to equip engineers, developers and industry professionals with a comprehensive understanding of CMIS. More information on the series can be found here.

 

About OIF

OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 150+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

leah@wilkinson.associates

703-907-0010

OIF Achieves Milestone with Largest Ever Multi-Vendor Interoperability Demo at ECOC 2023, Featuring 39 Companies Accelerating Implementation of Next-Generation Capabilities

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Demos will highlight interoperability work in four areas – 400ZR+; Co-Packaging solutions; CEI-112G & CEI-224G and CMIS implementations

Fremont, Calif.— OIF, where the optical networking industry’s interoperability work gets done, will showcase its largest-ever multi-vendor interoperability demonstration at ECOC 2023, being held October 2-4 in Glasgow, Scotland. Additionally, during ECOC, OIF will continue its commemoration of 25 years dedicated to driving meaningful progress in the industry.

39 companies will participate in live and static interoperability demos at OIF’s booth #304, highlighting advancements in four key technology areas: 400ZR+ optics, Co-Packaging solutions, Common Electrical I/O (CEI) channels and Common Management Interface Specification (CMIS) implementations.

“OIF stands at the forefront of critical multi-vendor interoperability efforts, driving the industry’s evolution and providing the transformative technical solutions to meet the rapidly growing demand for broadband access,” said Mike Klempa, Alphawave Semi and Chair of the OIF Physical & Link Layer Interoperability Working Group. “As a member-driven organization, our work remains at the cutting edge, aligned with the industry’s needs and fostering collaboration to accelerate product development and solutions to market. For 25 years, we have been instrumental in facilitating industry progress. This year’s largest-ever demo underscores the vital role we play in shaping the network and the significance of our work in advancing the industry overall.”

The collaborative efforts of OIF’s network operator, system vendor, component vendor and test equipment vendor members will be on display at ECOC, illustrating their contributions in driving the adoption of technologies for both present and future networks. OIF member companies participating in the demo are Adtran; Alphawave Semi; Amphenol; Applied Optoelectronics, Inc.; Broadcom Inc.; Cadence Design Systems, Inc.; Casela Technologies; Ciena; Cisco Systems; Coherent; Credo Technology Group; Eoptolink; EXFO; Fujitsu Optical Components; Hisense Broadband; Infinera; Juniper Networks; Keysight Technologies; Linktel Technologies; Lumentum; MACOM Technology Solutions; Molex; MultiLane, Inc.; NEC Corporation; Nokia; O-Net Technologies; Precision Optical Transceivers, Inc.; Quantifi Photonics; Samtec; Semtech; Senko Advanced Components; Sicoya; Source Photonics; Sumitomo Electric Industries; Synopsys; Telefonica S.A.; VIAVI Solutions and Wilder Technologies. The interoperability demo is supported by participating companies Telefonica and LightRiver. Telefonica is the hosting consulting network operator, and LightRiver is a host for technology-specific pre-demonstration integration testing.

About OIF

OIF is where the optical networking industry’s interoperability work gets done. Celebrating 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 140+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn, on Threads and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

leah@wilkinson.associates

703-907-0010

 

OIF Approves IC-TROSA Implementation Agreement, Specifications Speed Delivery of a Higher Level of Integration for Transmit and Receive Optical Components

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IC-TROSA IA enables miniaturization of optical transceiver modules and lowers the component cost for 400ZR, metro, data center interconnect (DCI) applications

Fremont, Calif.—September 23, 2019 – OIF, where the optical networking industry’s interoperability work gets done, continues its efforts to reduce cost and speed market adoption of next-generation solutions through the approval of the Integrated Coherent Transmitter-Receiver Optical Subassembly (IC-TROSA) Implementation Agreement (IA). IC-TROSA integration will be demonstrated during this week’s OIF Physical and Link Layer (PLL) Interoperability Demo at ECOC 2019 in Dublin, Ireland (OIF booth 441).

“The IC-TROSA project took an aggressive approach to coherent optical component integration and has delivered two new package designs incorporating TX and RX integration, common digital controls and performance monitoring all in a small form factor package,” explained Scott Grindstaff, Director R&D, ADVA, and IC-TROSA IA Technical Editor. “Additionally, package specific features such as fiber-free interface and solder reflow compatibility have been incorporated.”

The optical sub-assembly supports high-bandwidth and high-order dual-polarization quadrature amplitude modulation (QAM) operations and is suited for data center interconnect, metro and long-haul applications. As module sizes decrease, coherent optics components need similar size reductions to enable next generation multi-terabit switches, line cards and transport platforms.

“The IC-TROSA IA is a solution for density requirements for line cards, front-pluggable and future on-board coherent 400G+ optical modules,” said Karl Gass, OIF PLL Working Group, Optical Vice Chair. “It aims to standardize a photonic package for coherent applications that is easy to use while leaving the internal implementation to the vendor.”

The IC-TROSA Type-1 is optimized for silicon photonics technology and uses a surface-mount package with Ball Grid Array (BGA) electrical interface. Important advantages include an increased electrical bandwidth and solder reflow capability. The IC-TROSA Type-2 is optimized for Indium Phosphide technology and uses a gold-box package with flex-cable electrical interface. Important advantages include an integrated tunable laser and a duplex LC optical connector.

The IC-TROSA’s low power dissipation and miniature footprint enables small form factor digital coherent optics (DCO) transceivers in a QSFP-DD or OSFP form factor, as well as very high-density coherent line card or daughtercard designs. Devices can support multiple modulation formats, including QPSK, 8QAM, and 16QAM, at symbol rates up to 64Gbaud, enabling data transmission up to 600 Gb/s.

About OIF
OIF is where the optical networking industry’s interoperability work gets done. Building on 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
Email: leah@wilkinson.associates
Office: 703-907-0010

Lightwave Friday 5 video – September 2019

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AT&T is under siege, data center 800G is on the horizon, 1.2 Tbps looks like it’s here, and 400GZR is right around the corner.

OIF Showcases 400ZR, CEI-112G and IC-TROSA Interoperability Demos at ECOC 2019

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OIF selected to lead Market Focus presentation on deployment of the 400ZR ecosystem

Fremont, Calif.—September 9, 2019 – OIF member companies will showcase their industry leadership with a multi-vendor interoperability demonstration of 400ZR, Common Electrical I/O (CEI)-112G and IC-TROSA during ECOC 2019, September 23-25 in Dublin, Ireland.

Demonstrating how critical interoperability work gets done, 12 OIF member companies including ADVA, Amphenol, Cadence Design System, Credo, Finisar, Inphi, Keysight Technologies, Marvell, Molex, MultiLane, TE Connectivity and YAMAICHI ELECTRONICS will participate in the demonstration in OIF’s booth, # 441.

“Understanding and seeing first-hand how key technologies – 400ZR, CEI-112G and IC-TROSA – are each specified to enable interoperable deployment across the ecosystem is critically important to building market confidence and accelerating adoption,” said Steve Sekel, OIF Physical and Link Layer Interoperability Working Group Chair. “This showcase of 12 companies and key technologies is a clear representation of OIF’s leadership in driving electrical, optical and control interoperability.”

OIF Physical and Link Layer (PLL) Interoperability Demo @ ECOC 2019

OIF Drives Industry Collaboration and Growth Through Timely Interoperability Work.

Live interoperability demonstrations at ECOC 2019 will feature member company solutions that are critical to the global network, including 400ZR, Common Electrical I/O (CEI)-112G and IC-TROSA

400ZR & IC-TROSA Demo

OIF’s 400ZR project is not only facilitating cost and complexity reduction for 400GbE over 80 km DWDM networks, it’s also bringing forward a wave of necessary components and complementary applications. The IC-TROSA features all of the optical building blocks for a coherent module in a single package. The demonstrations will highlight important aspects of IC-TROSA integration as well as real-time EVM measurements with the updated script for 400ZR. In addition, a hardware-based 400ZR installation will show a typical application case.

CEI-112G Demo

OIF is taking a lead role in moving the industry to the next generation with its development of electrical interface specifications for 112 Gbps per differential pair. Multiple live demonstrations featuring interoperability clearly prove the key role OIF provides. The CEI-112G demonstrations in the OIF booth will feature multi-party silicon supplier interoperability over mated compliance board channels, a full host to module channel and direct attach copper cable channels, all demonstrating the technical viability of 112 Gbps operation, along with multiple industry form factors including OSFP and QSFP-DD.

OIF @ ECOC 2019 Market Focus

OIF will present “Deployment of the 400ZR Ecosystem” on Tuesday, September 24, 15:00 – 15:30, during the ECOC Market Focus Service and Content Provider Optical Transmission track. OIF expert and OIF Physical and Link Layer Working Group, Vice Chair Optical, Karl Gass will present.

Check the status of OIF’s current work here.

 

About OIF
OIF is where the optical networking industry’s interoperability work gets done. Building on 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
Email: leah@wilkinson.associates
Office: 703-907-0010