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OIF Accelerates Industry Alignment on AI Scale-up Architectures with Two New Publications

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Hyperscaler-driven requirements inform the Energy Efficient Interfaces Framework document and Compute Optics Interface for AI Scale-up white paper

FREMONT, Calif. — OIF, where the optical networking industry’s interoperability work gets done, has released two new publications developed to help the ecosystem move faster on the interconnect challenges shaping next-generation AI systems: the Energy Efficient Interfaces Framework document which provides an overview of the interconnection links in an AI cluster and the Compute Optics Interface (COI) white paper which focuses specifically on optical scale-up interconnects.

Frontier AI models and workloads are scaling fast, and hyperscalers and system designers are building larger, highly interconnected compute clusters that must move enormous volumes of data between processing elements. Meeting these demands requires interconnect solutions that are cost-effective, low-latency, high-density and energy efficient. OIF’s new publications provide a practical set of documents for evaluating architectures, link types and tradeoffs, with a specific focus on the Compute Optics Interface (COI) and the broader Energy Efficient Interfaces (EEI) landscape.

“As AI infrastructure cycles compress, hyperscalers can’t wait for the ecosystem to catch up — they need clarity on interconnect options now, while architectures are still taking shape,” said Jeff Hutchins, OIF Physical & Link Layer Working Group Energy Efficient Interfaces Vice Chair (Ranovus). “That urgency is exactly why we were able to fast-track this work through OIF. By capturing hyperscaler-driven requirements and connecting the real tradeoffs across bandwidth density, power, thermal limits, latency, radix, reliability and cost, these publications give the industry a shared, practical foundation to make faster, better-aligned decisions as AI compute scale-up architectures evolve.”

Compute Optics Interface (COI): Energy Efficient Photonic Interconnects for AI Compute Scale-up White Paper

The new comprehensive Compute Optics Interface (COI) white paper focuses on AI scale-up interconnects and examines where optical links deliver the greatest benefit within AI compute architectures, especially over distances where optics can provide clear energy advantages. It reviews considerations and challenges across a range of approaches, including co-packaged and chiplet-based designs, on-board optics and pluggable architectures. The paper also compares interface strategies such as non-retimed, transmit-retimed, fully retimed and die-to-die (D2D) solutions, and explores a range of modulation techniques.

In addition, the paper assesses tradeoffs between electrical and optical interfaces and evaluates how different implementation choices align with end-user targets for performance, efficiency, latency, reliability, cost and radix. The result is a practical decision framework engineers can use to compare COI options and understand the downstream system impacts.

OIF developed the COI white paper on an accelerated timeline to match the pace of change in AI infrastructure, incorporating hyperscaler-driven metrics for next-generation COI links while enabling broad technical discussion within OIF membership.

Energy Efficient Interfaces Framework Document

OIF also announced a companion document, the Energy Efficient Interfaces Framework, which discusses the various opportunities for creating interoperability standards for communication links in AI Compute clusters. The OIF had published a Co-Packaging Framework document in February 2022. Since that time, the industry has evolved rapidly. This updated framework expands the solution space beyond co-packaged implementations and explores a variety of topics important for communication links within AI Compute clusters. It also reviews a number of retiming approaches and touches on issues such as link training, impact of protocol choice, latency, compliance testing, management interface, and form factors.

To learn more and see interoperability in action, visit OIF at OFC 2026 at booth #2017 during the exhibition March 17–19 in Los Angeles. OIF will also host a Show Floor Theater session, “OIF – Driving Optical Interconnect Specs for AI,” on March 19 from 1:30–2:30 p.m. PT in Theater II, moderated by Hutchins. Panelists include Hutchins; Mike Klempa, OIF Secretary/Treasurer and Physical & Link Layer Interoperability Working Group Chair (Qualcomm Incorporated); Cathy Liu, OIF Board Member (Broadcom, Inc.); and Nathan Tracy, OIF President (TE Connectivity). Learn more: https://www.oiforum.com/meetings-events/oif-ofc-2026/

About OIF

OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 170+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF on LinkedIn, on X, on Bluesky and at https://www.oiforum.com/.

PR Contact:

Leah Wilkinson
Wilkinson + Associates for OIF
leah@wilkinson.associates
703-907-0010

OIF Validates Critical Interoperability Live at OFC 2026 Through Multi-Vendor Demonstrations and Expert Panels

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OIF member experts present panels on CEI-448Gbps signaling, next-generation ZR optics and optical interconnect specs for AI, alongside the interoperability showcase at booth #2017

Fremont, Calif. — OIF and 40 participating member companies will use OFC 2026, March 17–19, to validate the interoperable building blocks AI-era data center networks increasingly depend on – demonstrating, live and across multiple vendors, how the ecosystem delivers scale, speed and energy efficiency under real-world constraints.

On the exhibit floor at the Los Angeles Convention Center, OIF’s interoperability showcase (booth #2017) serves as a vendor proving ground, translating implementation agreements (IAs) into working, repeatable interoperability so operators can reduce integration risk, maintain sourcing flexibility and move from innovation to deployment with greater confidence.

This year’s demonstrations will feature collaboration in four critical technology areas: 400ZR, 800ZR, Multi-Span Coherent Optics, Multi-Core Fiber (MCF) and IP/Optical Controllers; Common Electrical I/O (CEI) CEI-448G and CEI-224G; Co-Packaging; Common Management Interface Specification (CMIS) and Energy Efficient Interfaces (EEI).

OIF leaders and member experts have been selected to present three Show Floor Theater panels at OFC 2026, covering OIF’s work on CEI-448Gbps signaling, next-generation ZR optics, and optical interconnect specifications for AI.

“AI-era infrastructure demands more than speed – it demands interoperability you can trust, plus the energy efficiency required to scale responsibly,” said Nathan Tracy, President of OIF (TE Connectivity). “At this year’s OFC, OIF and 40 of our members will showcase what it looks like when specifications become real multi-vendor operations across coherent optics, high-speed electrical interfaces, energy-efficient architectures and common management, so teams leave OFC with repeatable, multi-vendor building blocks they can deploy faster, source flexibly and scale efficiently.”

Technology Areas Featured in OIF’s OFC 2026 Interoperability Showcase

400ZR, 800ZR, Multi-Span Coherent Optics, Multi-Core Fiber (MCF) and IP/Optical Controllers – Coherent Interoperability at Scale

OIF’s largest multi-vendor system demonstration to date features nearly 100 coherent modules from 15 vendors. These modules are integrated across eleven host platforms and operate on four open line systems, all of which are managed by four IP/Optical Controllers. This large-scale collaboration highlights the robust ecosystem and interoperability achievable in today’s optical networking solutions. Additional growth into L band, transmission of ZR signals over multi-span MCF and the use of MCF-native 800G DR IMDD modules underscore the diversity, equality and inclusion of the optical industry’s foremost demonstration.

Common Electrical I/O (CEI) CEI-448G, CEI-224G – Driving Innovation and Collaboration for Future-Oriented Data Centers

OIF will showcase the application spaces, technical challenges and potential solution paths for electrical interfaces operating at 448Gbps per lane along with expanded interoperability and innovation at the 224G electrical interface. CEI demonstrations align semiconductor, interconnect and test and measurement companies towards essential interoperable frameworks for the AI era. A live, multi-vendor 448G demonstration will focus on hyperscaler needs for scaling AI networks, while a further expanded CEI-224G showcase brings greater ecosystem participation and highlights diverse link types from Very Short Reach (VSR) to Long Reach (LR) and Linear. In collaboration with OIF’s Physical & Link Layer (PLL) Working Group EEI track, OIF will also demonstrate energy-efficient electro-optical innovation across retimed, half-retimed (RTLR) and unretimed (Linear) pluggable optics and silicon. These demonstrations highlight the strength of the CEI ecosystem, proving robust interoperability across vendors and link types while advancing scalable, high-performance connectivity at 224G and the burgeoning 448G.

Common Management Interface Specification (CMIS) – Revolutionizing Management

OIF members will deliver live demonstrations of the latest innovations from the OIF PLL Working Group Management track, including enhanced firmware update capabilities that deliver a consistent, multi-vendor experience for users and network management systems such as OpenConfig. An additional live demo will showcase CMIS management of an ELSFP pluggable module, illustrating a key enabler for next-generation co-packaged optics solutions.

EEI and Co-Packaging – Revolutionizing Connectivity

OIF members will present achievements enabling energy efficient electrical and optical interfaces with both live and conceptual demonstrations of next-generation EEI solutions for AI compute, along with live ELSFP demos highlighting advancements in external laser sources critical for energy efficient solutions. Addressing energy efficiency is one of the highest-priority challenges faced by hyperscalers as they grow their AI resources to the next generation.

Participating Members: The interoperability showcase includes 3M, Accelight, Adtek, Adtran, Alphawave Semi, Amphenol Communications Solutions, Anritsu Corporation, AOI, Cadence Design Systems, Inc., CICT/Accelink, Ciena, Cisco, Coherent Corp., Eoptolink Technology, EXFO, Furukawa Electric/Lightera, HGGenuine, HPE, Keysight Technologies, Lessengers, Ligent, Inc., Luxshare-Tech, Marvell, MaxLinear Inc., Molex, MultiLane, Nokia, O-Net, Samtec, Semtech, SENKO Advanced Components, Silith, Sumitomo Electric Industries, Synopsys, Inc., TE Connectivity, Terahop PTE Ltd., US Conec, VeEX Inc., Wilder Technologies and Xscape Photonics.

OIF Brings Interoperability Insights to OFC 2026 Show Floor Theaters

OIF CEI-448Gbps – Fast and Furious Signaling Spec Development
Date: March 17

Time: 4:00pm–5:00pm PT

Location: Theater III
Moderator: Nathan Tracy, OIF President (TE Connectivity)
Panelists: John Calvin (Keysight Technologies); Mike Klempa, OIF Secretary/Treasurer and Physical & Link Layer Interoperability Working Group Chair (Qualcomm Incorporated); Cathy Liu, OIF Board Member (Broadcom, Inc.); Yi Tang, OIF Board Member and Physical & Link Layer Working Group Electrical Vice Chair (Cisco); Nathan Tracy, OIF President (TE Connectivity)

OIF 800ZR/LR and 1600ZR/ZR+/CL – Changing the Game…Again
Date: March 18

Time: 11:45am–12:45pm PT

Location: Theater II
Moderator: Karl Gass, OIF Physical & Link Layer Working Group Optical Vice Chair

Panelists: Georg Clarici (Coherent); Joerg Pfeifle (Keysight Technologies)

OIF – Driving Optical Interconnect Specs for AI
Date: March 19

Time: 1:30pm–2:30pm PT

Location: Theater II

Moderator: Jeff Hutchins, OIF Physical & Link Layer Working Group Energy Efficient Interfaces Vice Chair (Ranovus)
Panelists: Jeff Hutchins; Mike Klempa; Cathy Liu; Nathan Tracy

Visit OIF at OFC 2026

Visit OIF at booth #2017 during OFC (March 17–19) to see interoperability in action. Learn more: https://www.oiforum.com/meetings-events/oif-ofc-2026/

About OIF

OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 170+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF on LinkedIn, on X, on Bluesky and at https://www.oiforum.com/.

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

leah@wilkinson.associates

703-907-0010

 

OIF Demonstrates Industry-Wide Interoperability at Scale at OFC 2026, Advancing Energy Efficiency, Performance and Capacity for AI-Era Data Center Networks

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Live multi-vendor interoperability demo features 40 member companies and highlights 800ZR, 400ZR, Multi-span Optics, CEI-448G, CEI-224G, Co-Packaging, CMIS, EEI and more

Fremont, Calif. —  OIF, where the optical networking industry’s interoperability work gets done, will present a live, multi-vendor interoperability demonstration at OFC 2026 in Los Angeles. Featuring 40 member companies, the showcase highlights how OIF-driven interoperable networking solutions enable scalable, energy-efficient networks for AI-era data center environments.

OFC 2026 will take place March 15–19, 2026, at the Los Angeles Convention Center, with the exhibition running March 17–19.

Located in booth #2017, OIF’s demo will highlight real-world interoperability across key technologies including 800ZR, 400ZR, Multi-span Optics, Common Electrical I/O (CEI) CEI-448G, CEI-224G, Common Management Interface Specification (CMIS), Co-Packaging, Energy Efficient Interfaces (EEI) and more. This work underscores the industry’s need for deployable, multi-vendor building blocks across optical, electrical, energy-efficient and management interfaces that deliver higher performance, improved efficiency and scalable capacity in disaggregated architectures.

Participating companies are 3M, Accelight, Adtek, Adtran, Alphawave Semi, Amphenol Communications Solutions, Anritsu Corporation, AOI, Cadence Design Systems, Inc., CICT/Accelink, Ciena, Cisco, Coherent Corp., Eoptolink Technology, EXFO, Furukawa Electric, HGGenuine, HPE, Keysight Technologies, Lessengers, Ligent, Inc., Luxshare-Tech, Marvell, MaxLinear Inc., Molex, MultiLane, Nokia, O-Net, Samtec, Semtech, SENKO Advanced Components, Silith, Sumitomo Electric Industries, Synopsys, Inc., TE Connectivity, Terahop PTE Ltd., US Conec, VeEX Inc., Wilder Technologies and Xscape Photonics.

“AI-era infrastructure demands more than speed — it demands interoperability you can trust, plus the energy efficiency required to scale responsibly,” said Mike Klempa, OIF Secretary/Treasurer and Physical and Link Layer (PLL) Interoperability Working Group Chair (Alphawave Semi). “At OFC 2026, OIF and our members will show how the industry is translating specifications into real interoperability across coherent optics, high-speed electrical interfaces, energy-efficient architectures and common management so networks can move from innovation to deployment with confidence.”

OIF’s work is grounded in generating specifications that become the foundation for interoperability. Its Implementation Agreements (IAs) close the gap between standards and interoperable products, systems and networks. By convening the entire ecosystem — component suppliers, system vendors, hyperscalers and network operators — OIF accelerates alignment on practical, interoperable interfaces that enable open, scalable networking.

Visit OIF at booth #2017 at OFC 2026 to see interoperability in action, or learn more about the demo here.

About OIF

OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 170+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF on LinkedIn, on X, on Bluesky and at https://www.oiforum.com/.

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

leah@wilkinson.associates

703-907-0010

OIF Publishes Implementation Agreement for 112 Gb/s Retimed Transmitter Linear Receiver (RTLR) Electrical and Optical Interface Advancing Energy Efficiency

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IA connects electrical and optical design to meet rising datacenter and AI bandwidth demands with greater interoperability and power savings

Fremont, Calif. – November 18, 2025 – OIF, where the optical networking industry’s interoperability work gets done, today announced the publication of a new Implementation Agreement (IA) — OIF-EEI-112G-RTLR (Retimed Transmitter Linear Receiver).

The new IA defines a high-speed, energy-efficient 112 Gb/s chip-to-module electrical interface that connects retimed optical transmitters with linear optical receivers, sometimes referred to as ‘half retimed optical links.’ It supports Ethernet C2M 100 Gb/s and OIF CEI-112G-VSR-PAM4 16 dB channels, operating in the 36-56 GSym/s range for full Ethernet compatibility. By eliminating the need for a receive DSP in the optical module and leveraging signal processing already available in the host device, the IA helps reduce power, cost and design complexity while maintaining interoperability and performance across vendors — a critical need in AI architectures.

“Across the ecosystem, OIF heard a clear message — the industry needs robust lower power links that are IEEE compliant,” said Jeff Hutchins, OIF Physical and Link Layer (PLL) Working Group Energy Efficient Interfaces (EEI) Vice Chair (Ranovus). “This IA reflects that input, advancing energy efficiency without sacrificing link quality or compatibility. It reinforces that OIF is where collaboration and technical leadership deliver the interoperability specifications needed for AI-driven, high-performance networks.”

Recently at ECOC 2025, more than 30 OIF member companies participated in a comprehensive, multi-vendor interoperability demonstration showcasing technologies spanning 400ZR, 800ZR, Multi-span Optics, Common Electrical I/O (CEI) — including CEI-448G and CEI-224G — Co-Packaging, CMIS and Energy Efficient Interfaces (EEI). Within this broad ecosystem demonstration, RTLR technology was featured as part of OIF’s EEI track, illustrating how retimed, half-retimed and unretimed pluggable optics interoperate across vendors. The RTLR portion specifically highlighted how OIF’s work bridges electrical and optical design to enable lower power, reduced complexity and real-world, multi-vendor interoperability — validating the framework defined in this new IA.

The EEI-112G-RTLR IA builds on OIF’s CEI-112G-PAM4 foundation and aligns fully with relevant IEEE 802.3 standards. The specification details general requirements, electrical and optical specifications, test methodologies and parameter definitions.

About OIF

OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 160+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF on LinkedIn, on X, on Bluesky and at https://www.oiforum.com/.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

leah@wilkinson.associates

703-907-0010 

OIF Links Industry Vision with Interoperability Validation Enabling AI Growth at ECOC 2025: 35 Member Companies to Participate in a Multi-Vendor Demonstration

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OIF highlights how interoperability enables scalable, AI-era networks through Market Focus sessions and live demos

Fremont, Calif. – September 17, 2025 – OIF, together with 35 participating member companies, is shaping the future of AI-era networks by demonstrating how multi-vendor collaboration delivers real-world interoperability and enables the scale, speed, and efficiency that tomorrow’s networks demand at ECOC 2025 Exhibition, taking place from September 29 to October 1 in Copenhagen, Denmark.

Interoperability in Action

OIF’s live demonstration at booth #C3425 unites member companies across the ecosystem to prove that the building blocks of the future — optical, electrical, management and energy efficient interfaces — are ready for deployment. Showcasing interoperability in a complex, real-world environment, the demonstration highlights technologies including 400ZR, 800ZR, Multi-span Optics, Common Electrical I/O (CEI) CEI-448G, CEI-224G, CEI-112G, Co-Packaging, Common Management Interface Specification (CMIS), Energy Efficient Interfaces (EEI) and more — illustrating how standards enable networks to scale for AI and data-intensive applications.

800ZR, 400ZR and Multi-Span Optics – Optical Breakthroughs: Better Than Before

This demonstration will present the latest developments in interoperability for pluggable coherent optics, providing a thorough overview of their features and applications. The single-span demo highlights include 800ZR multivendor interop between modules using five different DSPs alongside the foundational OIF 400ZR application. For multi-span connectivity, the demonstration will feature OpenZR+, 100ZR and 800G OpenROADM across multiple network infrastructures.

CEI-448G, 224G and 112G – Driving Innovation and Collaboration for Future-Oriented Data Centers

At ECOC, OIF will showcase interoperability and innovation at the electrical interface with 448G and 224G CEI demonstrations that span the full spectrum of next-generation connectivity. The 448G demo focuses on hyperscaler needs for scaling AI networks, while expanded CEI-224G showcases bring greater ecosystem participation and highlight diverse link types from Very Short Reach (VSR) to Long Reach (LR) and Linear. In collaboration with the EEI track, OIF will also demonstrate energy-efficient electro-optical innovation across retimed, half-retimed (RTLR) and unretimed (Linear) pluggable optics. These demonstrations highlight the strength of the CEI ecosystem, proving robust interoperability across vendors and link types while advancing scalable, high-performance connectivity.

EEI and Co-Packaging – Revolutionizing Connectivity

OIF members will present achievements enabling energy efficient electrical and optical interfaces with both live and conceptual demonstrations of next-generation EEI solutions for AI compute, along with live External Laser Small Form-Factor Pluggable (ELSFP) demos highlighting advancements in external laser sources critical for co-packaged optics architectures. Addressing energy efficiency is one of the highest-priority challenges faced by hyperscalers as they grow their AI resources to the next generation.

As part of this year’s demonstration, CMIS will run within a live, simulated network environment rather than as a standalone setup — underscoring the specification’s maturity and its role in enabling seamless, plug-and-play integration across disaggregated systems.

These member companies — system vendors, component and module suppliers, test and measurement providers, semiconductor and electronic design automation (EDA) companies, and leading connector and cabling manufacturers — are participating in the demo: 1Finity, Adtran, Alphawave Semi, Amphenol, Anritsu Corporation, AOI, Cadence Design Systems, Inc., CICT/Accelink, Ciena, Cisco, Coherent Corp., Eoptolink Technology, EXFO, Furukawa FITEL, HGGenuine, Juniper Networks (now part of HPE), Keysight Technologies, Lessengers, Ligent, Inc., Lumentum, Marvell, MaxLinear Inc., Molex, MultiLane, Nokia, Nubis Communications, O-Net, Samtec, SENKO Advanced Components, Sumitomo Electric Industries, Synopsys, Inc., Terahop PTE Ltd., TE Connectivity, US Conec and Wilder Technologies.

“Interoperability isn’t an abstract promise — it’s a market enabler,” said Nathan Tracy, OIF President (TE Connectivity). “By bringing these diverse technologies/challenges together under one roof, OIF is accelerating adoption, reducing risks and enabling operators, hyperscalers and vendors to move faster in addressing surging AI demand.”

Setting the Agenda at ECOC Market Focus

Beyond the exhibit floor, OIF leaders will deliver timely perspectives during ECOC’s Market Focus program, offering actionable insights into the forces reshaping networks:

Coherent Technology Advances in the Market, DCI Interop and Shorter Reaches for AI
Date: Tuesday, Sept. 30
Time: 12:20–12:35pm CEST
Presenter: Karl Gass, OIF Physical & Link Layer Working Group Optical Vice Chair

CMIS – The Interface that Ties Everything Together for AI
Date: Tuesday, Sept. 30
Time: 2:20–2:35pm CEST
Presenter: Ian Alderdice, OIF Physical & Link Layer Working Group Management Co-Vice Chair (Ciena)

Energy Efficiency in AI Applications – Making Sense of the Multiple Requirements
Date: Wednesday, Oct. 1
Time: 10:40–10:55am CEST
Presenter: Jeff Hutchins, OIF Board Member and Secretary/Treasurer, Physical & Link Layer Working Group Energy Efficient Interfaces Vice Chair (Ranovus)

448G Architectures For AI – Addressing the Challenges, Enabling the Future
Date: Wednesday, Oct. 1
Time: 12:00–12:15pm CEST
Presenter: Mike Klempa, OIF Board Member and Physical & Link Layer Interoperability Working Group Chair (Alphawave Semi)

Visit OIF at booth #C3425 or learn more about the OIF Demo at ECOC 2025 here.

About OIF
OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 160+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF on LinkedIn, on X, on Bluesky and at https://www.oiforum.com/.

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
leah@wilkinson.associates
703-907-0010

OIF to Showcase Advancements in Common Electrical I/O (CEI) Development and Energy-Efficient Interfaces (EEI) for AI Compute at DesignCon 2025

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Fremont, Calif. – Showcasing its commitment to connecting with technical professionals in chip, board and systems design, OIF will host two panels at DesignCon 2025, the premier event for the high-speed communications and semiconductor industries taking place Jan. 28-30 in Santa Clara.

The sessions will highlight OIF’s work and advancements in Common Electrical I/O (CEI) development and its commitment to Energy Efficiency Interfaces (EEI) in next-generation AI compute systems. Details are as follows:

Panel 1 – Wednesday, Jan. 29, 2025 – 4 PM to 5:15 PM PT

OIF Update on 224 Gbps & 448 Gbps Common Electrical I/O (CEI) Development – Moderated by Nathan Tracy, OIF President (TE Connectivity), this panel will feature OIF experts who will explore the latest advancements in CEI development and address the challenges and opportunities of supporting the rapidly evolving requirements for higher data rates.

Panelists: Cathy Liu, OIF Vice President (Broadcom); Mike Li, OIF Board Member (Intel); Srinivas Venkataraman (Meta); and John Calvin (Keysight)

Panel 2 – Thursday, Jan. 30, 2025 – 1:15 PM to 2 PM PT

EEI for the Next Generation of AI Compute – Jeff Hutchins, OIF Board Secretary/Treasurer and Physical and Link Layer (PLL) Working Group (WG) Energy Efficient Interfaces (EEI) Vice Chair (Ranovus), will moderate this panel, which will examine EEI technologies vital to enabling scalable AI compute and networking solutions, a cornerstone of future data center sustainability.

Panelists: Mike Klempa, OIF Board Member and PLL Interoperability WG Chair (Alphawave Semi); Sam Kocsis, OIF Technical Committee Vice Chair (Amphenol); and Nathan Tracy, OIF President (TE Connectivity)

“These two panels exemplify how important it is for OIF to engage with DesignCon’s highly technical and influential audience of engineers and system architects,” Tracy said. “By presenting at DesignCon, we ensure these key audiences are equipped with the latest updates on OIF’s work in high-speed design and AI compute systems, enabling them to effectively address their specific needs and challenges.”

For more information about OIF’s panels at DesignCon 2025, visit OIF’s website.

CMIS Technical Webinar Series: Besides participating at DesignCon, OIF is hosting a series of free public CMIS tutorial webinars designed to provide engineers, developers and industry professionals with a comprehensive understanding of CMIS. The next session in the series, focused on the Versatile Control Set (VCS), will be presented by Luz Osorio, Systems Design Architect at Ciena, on Wednesday, March 5, 2025. More information on the series can be found here.

About OIF
OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 150+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF on LinkedIn, on X at @OIForum and http://www.oiforum.com.

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
leah@wilkinson.associates
703-907-0010

OIF Leads the Charge for Interoperability at ECOC 2024

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34 Member Companies to Showcase Cutting-Edge Solutions, OIF Experts to Speak in Three Market Focus Sessions

Fremont, Calif. – OIF today unveiled new details on its live interoperability demonstrations at ECOC 2024, highlighting advancements across critical areas such as 800ZR, 400ZR and multi-span optics; Common Electrical I/O (CEI) CEI-112G and CEI-224G; Common Management Interface Specification (CMIS) and Energy Efficient Interfaces (EEI) & Co-Packaging.

The demonstrations showcased in Booth #B83 Sept. 23-25 in Frankfurt, Germany, feature collaboration among 34 member companies and highlight the organization’s leadership in interoperability across a range of cutting-edge technologies.

In addition to the demonstrations, OIF experts will lead Market Focus Sessions on Coherent Optics, CMIS and EEI.

“Live interoperability demonstrations are essential for the industry to witness firsthand the seamless integration of technologies,” said Dave Brown, OIF Director of Communications, and Nokia. “OIF’s demos at ECOC, featuring contributions from system, component and test-equipment vendors, underscore OIF’s leadership in interoperability across key technologies that are crucial in shaping the standards that will define the next decade of our industry.”

Interoperability Demonstrations at Booth #B83

800ZR, 400ZR and Multi-Span Optics – Unveiling Optical Breakthroughs: The pluggable coherent optics demonstration will showcase progress in the latest advancements in 800ZR, 400ZR and ZR+ optics interoperability, offering a comprehensive view of their capabilities and applications. The demo highlights include the first public 800ZR multivendor DSP interop; OpenZR+, 100ZR and OpenROADM/ITU-T, all over multiple, multi-span networks; and OIF’s foundational 400ZR collocated on the same single-span network as 800ZR.

CEI-112G-Linear & CEI-224G Interoperability – Fast-Track to the Future: OIF is accelerating electrical interface interoperability with a suite of 224Gbps and 112Gbps CEI multi-vendor demonstrations spanning a variety of applications that form the foundation of next-generation optical connectivity. The CEI-224G demonstrations include a diversity of link types from Very Short Reach (VSR) to Long Reach (LR) and linear interfaces leveraging specifications spearheaded by the OIF. The CEI-112G demonstration displays the breadth and depth of linear pluggable optics with interoperability from multiple vendors over various link types.

CMIS – Path to Plug & Play: OIF members will demonstrate physical layer management interoperability across diverse network equipment and pluggables enabled by CMIS. The demonstration includes the CMIS industry-standard management interface for a common network control platform, showing interoperability among different plug types, switches/routers and test-measurement equipment, all operating with CMIS.

EEI and Co-Packaging – Revolutionizing Connectivity: OIF members will display a conceptual demo of AI compute and live PCIe optical links, all using next-generation EEI, as well as live demos showcasing the latest advancements for ELSFP, external laser source faceplate pluggable, for co-packaging.

Participating member companies include:
Adtran, Alphawave Semi, Amphenol, Anritsu, AOI, Astera Labs, Cadence Design Systems Inc., CICT/Accelink, Cisco, Coherent Corp., EXFO, HG Genuine, Hisense, Infinera, Innolight, Juniper Networks, Keysight Technologies, Lessengers, Linktel Technologies, Lumentum, MACOM Technology Solutions, Marvell, Molex, MultiLane, Nokia, O-Net Technologies, Samtec, Semtech, Senko Advanced Components, Sumitomo Electric Industries, Synopsys, TE Connectivity, US Conec and Wilder Technologies.

OIF Experts to Share Insights in Market Focus Sessions

In addition to the live interoperability demonstrations, OIF experts will contribute their knowledge in three Market Focus Sessions, offering insights into key industry trends and technological advancements:

  • “Coherent Optics in the Datacenter”

Monday, Sept. 23, 2024, from 1:20 pm-1:35 pm CEST

Presenter: Karl Gass, OIF Physical and Link Layer (PLL) Working Group (WG) Optical Vice Chair

  • “CMIS – Is Plug-and-Play Possible?”

Monday, Sept. 23, 2024, from 2:20 pm-2:35 pm CEST

Presenter: Doug Cattarusa, OIF Editor, Cisco

  • “Energy Efficient Interfaces for the Next Generation of AI Compute”

Tuesday, Sept. 24, 2024, from 11:20 am-11:35 am CEST

Presenter: Jeff Hutchins, OIF Board Member and PLL WG EEI Vice Chair, Ranovus

For further details, please visit: https://www.oiforum.com/meetings-events/oif-ecoc-2024/

 

About OIF

OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 150+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF on LinkedIn, on X at @OIForum and at https://www.oiforum.com/.

 

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
leah@wilkinson.associates
703-907-0010

 

OIF Concludes Successful Q3 ‘24 Technical and MA&E Committees Meeting with Launch of Three New Projects to Advance Networking Technologies

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Fremont, Calif. – OIF successfully concluded its Q3 ‘24 Technical and MA&E Committees Meeting, held from Aug. 6-8, 2024, in Ottawa, ON, Canada.

During the meeting, OIF members initiated three new projects: Energy Efficient Interfaces (EEI) Compute Optics Interface (COI) for Artificial Intelligence (AI) Scale-up, EEI-224G-RTLR, and Common Electrical I/O (CEI)-448G Framework. The meeting also included Physical & Link Layer Working Group Interim Meetings on Aug. 5, 2024.

“Our in-person meetings provide a critical platform for collaboration and progress, allowing us to push the boundaries of innovation and address the evolving needs of the networking and AI/Machine Learning (ML) industries,” said Karl Bois, OIF Technical Committee Chair and NVIDIA.

NEW PROJECTS:

EEI COI Project for AI Scale-up: Aimed at addressing the growing demands of AI and ML, this project will focus on developing high-efficiency, low-latency interfaces to support the next generation of AI hardware.

The EEI COI Project will focus on developing energy-efficient, low-latency photonic interfaces to support AI scale-up links such as PCIe, NVLink and UALink. As AI workloads grow, the need for standardized, interoperable solutions for local accelerator connectivity becomes critical. Building on the existing EEI work, this project aims to address the industry’s demand for scalable, high-performance compute optical interfaces that ensure interoperability across diverse AI platforms.

EEI-224G-RTLR Project: This project will concentrate on enhancing electrical interfaces to enable lower power 224G optical signaling, a critical component in the evolution of high-speed data transmission and the expansion of broadband infrastructure.

The EEI-224G-RTLR Project aims to develop an Implementation Agreement (IA) for 224G Retimed Tx Linear Rx (RTLR) optical interfaces, following the decision to split the 224G RTLR work into a dedicated project. RTLR offers significant potential for cost, power and latency savings—approximately half of what is achievable with fully retimed pluggable optics—by eliminating the need for Rx DSP. Unlike Linear Pluggable Optics (LPO), where optical and copper links are mutually constrained, RTLR enables true plug and play interoperability.

This project is critical to ensuring interoperable interfaces with reduced power and higher efficiency in next-generation data and communication systems.

CEI-448G Framework Project: The CEI-448G Framework Project will develop a comprehensive framework for 448G electrical interfaces, enabling higher data rates and improved performance in data center and telecommunications applications.

The CEI-448G Framework Project is focused on defining the next electrical data rate beyond 224Gbps, targeting 448Gbps. As industry discussions begin, this project aims to address the challenges of achieving this high-speed data rate by exploring key factors like interface support, modulation schemes and test methodologies.

By gathering input from end-users, equipment developers and industry experts, the project will create a comprehensive body of knowledge. The findings will be summarized in a technical white paper, laying the groundwork for future projects that will develop specific standards and architectures for 448Gbps data rates.

Looking ahead, OIF’s Q4 ‘24 Technical and MA&E Committees Meeting will be held the week of November 4-8, 2024, in Melbourne, Australia. This members-only meeting will provide a platform for further collaboration and progress on ongoing and new projects.

For more information about OIF’s initiatives, upcoming events or how to become a member, please visit  https://www.oiforum.com.

About OIF
OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 150+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF on LinkedIn, on X at @OIForum and at http://www.oiforum.com.

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
leah@wilkinson.associates
703-907-0010

OIF Q2 Technical and MA&E Committees Meeting Wraps with CEI-224G-Linear Project Launch, New CMIS White Papers and Requirements for Energy Efficient Interfaces

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Interoperability work continues in key project areas, including 1600ZR/1600ZR+ and EEI specifications

 

Fremont, Calif. – June 13, 2024 – OIF’s Q2 Technical and Market Awareness & Education (MA&E) Committees meeting, held May 7-9 in Athens, Greece, concluded with the launch of a Common Electrical I/O (CEI) CEI-224G-Linear project and the publication of two Common Management Interface Specification (CMIS) white papers.

Additionally, the Physical Layer User Group (PLUG) Working Group released a new system vendor requirements document for Energy Efficient Interfaces (EEI).

The event had robust attendance from member companies and featured discussions and debates on advancements in optical networking technology interoperability, as well as a guest speaker from ETH Zürich.

The meeting included ongoing efforts in many technical work areas, including 1600ZR/1600ZR+ and EEI, underscoring OIF’s leadership in tackling the complex challenges facing today’s high-speed optical networks.

“OIF’s commitment to interoperability standards and tackling technological challenges was evident at the Q2 meeting,” said Nathan Tracy, OIF President, and TE Connectivity. “The high attendance, start of the CEI-224G-Linear project, CMIS white papers, and the vendor requirements document for EEI, alongside David Moor’s insightful presentation on advanced transceiver design, underscore our leadership in promoting industry-wide collaboration and innovation.”

New Project

The new CEI-224G-Linear project will build on the approach of CEI-112G-Linear in terms of specification methodology. It will support 224G full linear optical modules for next-gen applications (e.g., Ethernet, Ultra Ethernet Consortium (UEC), Artificial Intelligence/Machine Learning [AI/ML]) with low power, cost/complexity and latency. The TP1/TP1a and TP4/TP4a electrical specifications will enable up to 224G full linear optical modules for Linear Pluggable Optics (LPO), co-packaged optics (CPO) and Near Package Optics (NPO), supporting next-generation application requirements.

“The CEI-224G-Linear project will represent significant progress in our technological capabilities, weaving the precision of CEI-112G-Linear with groundbreaking innovations,” said Mike Li, OIF Board Member and Intel. “By enabling 224G full linear optical modules and leveraging the advanced 224G DSP SERDES architecture and technology, this initiative is poised to redefine the landscapes of Ethernet, UEC and AI/ML applications. As we embrace lower power, cost and latency, this project is a giant step forward in next-generation computing and connectivity driven by AI/ML.”

New White Papers

Common Management Interface Specification (CMIS) White Paper on Management of Smart Optical Modules

This white paper explores how the DWDM functions, parameters and operational aspects of “smart” optical pluggable modules can be handled more efficiently to address various challenges. It introduces an alternative control paradigm for optical modules that decouples optical layer control from packet layer control and from host software and packet controller software development and outlines the pros and cons of this approach. This paradigm is called “host independent management,” enabling advanced capabilities of smart optical modules via additional management methods. The white paper is available for download here.

CMIS-Based Out-of-Band Messaging for Link Training

This white paper provides background on link training and a proposed message catalog by which any transmit SerDes can be trained initially (or tuned adaptively while in service) based on the needs of the corresponding receive SerDes, with the help of message exchange.

It promotes out-of-band (OOB) messaging via the ubiquitous CMIS management link as a flexible solution for exchanging link training messages. The technical specifications of the messaging facility and the representation of the messages will be defined in a CMIS-LT supplement. Potential CMIS-LT applications could include CEI-112G Very Short Reach (VSR), Extra Short Reach (XSR), XSR+, and Medium Reach (MR), IEEE 802.3 AUI C2M links, Fibre Channel, InfiniBand, Optical Transport Network (OTN), etc. Download the white paper here.

Requirements Document 

System Vendor Requirements Document for Energy Efficient Interfaces

In today’s fast-paced technological landscape, where data processing and communication demands for AI continue to soar, pursuing energy-efficient solutions is critical. This requirements document for EEI is a direct result of engaging with end users to understand their needs and expectations. It seeks to prioritize applications and establish fundamental criteria for the next generation of energy-efficient electrical and optical link projects and specifications.

Through these discussions, it’s clear the most pressing need for EEI is in high-density application scenarios. The document outlines critical requirements to achieve optimal performance for various applications that necessitate the utilization of such interfaces. These requirements encompass a range of factors, including energy targets, latency targets, desired form factors, degrees of interoperability, traffic types and more. 

Download the requirements document here.

Guest Speaker

The event was further highlighted by guest speaker David Moor, a representative from ETH Zürich and the FLEX-SCALE consortium. Moor discussed the development of an optical digital-to-analog converter (oDAC) supporting Tbps+ data rates with lower power per bit than conventional modulation methods. According to Moor, this design utilizes currently available electronics and photonic devices and is well suited to support high-capacity transport with improved power efficiency.

For more information about the OIF and to access the latest white papers, please visit OIF’s website.

 

About OIF

OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 150+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF on LinkedIn, on X at @OIForum and at http://www.oiforum.com.

 

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

leah@wilkinson.associates

703-907-0010

OIF Launches 1600ZR+ Coherent Optical, Retimed Tx Linear Rx Optical Energy Efficient Interfaces Projects and Common Management Interface Specification White Paper at Q1 2024 Technical and MA&E Meeting

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Fremont, Calif. – OIF, where the optical networking industry’s interoperability work gets done, successfully concluded its Q1 2024 Technical and MA&E meeting in Jacksonville, Florida held January 16-18.

OIF’s quarterly member meetings serve as a platform for collaboration and innovation within the optical networking industry. This meeting resulted in the initiation of two new projects – the Interoperable 1600ZR+ and Retimed Tx Linear Rx Specs Energy Efficient Interfaces (EEI) projects – the reelection of the Physical and Link Layer (PLL) Working Group (WG) Chair and a white paper focused on advancing plug and play for Common Management Interface Specification (CMIS) modules. The meeting also featured Andrew Schmitt, Cignal AI as a guest speaker.

“OIF’s quarterly membership meetings serve as a vital nexus for industry leaders to converge, collaborate and propel the field forward,” said Nathan Tracy, OIF President and TE Connectivity. “These meetings are invaluable platforms for members to share insights, discuss and debate ongoing work and launch new projects. The synergy of minds and the shared commitment to innovation in these meetings not only ensures the timely execution of current initiatives but also lays the groundwork for solutions that have a tangible impact on the market now and in the years to come. It is through this collaborative spirit that OIF continues to be a driving force in advancing optical networking standards and technologies, fostering a community that thrives on the exchange of ideas and the collective pursuit of excellence.”

NEW PROJECTS

Interoperable 1600ZR+

The new OIF Interoperable 1600ZR+ project complements the 1600ZR project unveiled last September (2023). Responding to market demand for higher-performance (ZR+) modes, OIF is working towards integrating these modes into its application scope for 1600 Gb/s interfaces.

“OIF recognizes the importance of consolidated requirements in the ZR/ZR+ space to streamline development costs and enhance industry collaboration,” said Karl Gass, OIF PLL WG – Optical Vice Chair. “This project reinforces OIF’s role as the forum for coherent line interface discussions and demonstrates leadership by facilitating the evolution of next-generation technologies.”

Retimed Tx Linear Rx Specs EEI Project

OIF has launched the Retimed Tx Linear Rx Specs EEI project, focusing on developing specifications for Retimed Tx Linear Rx (RTxLRx). The initial applications target Ethernet and Artificial Intelligence/Machine Learning (AI/ML), operating at 200G/lane over 500m single mode fiber (SMF) and 100G/lane over 30m multimode fiber (MMF), with potential for alternate applications. The project aims for full plug and play functionality in both electrical and optical domains, meeting the industry demand for power and latency savings. RTxLRx addresses constraints found in Linear Pluggable Optics (LPO) and provides flexibility, making it a candidate when LPO is not suitable.

“Embracing innovation, OIF maintains its pathfinder role in shaping new optical interface approaches,” said Jeff Hutchins, OIF Board Member and PLL WG – EEI Vice Chair and Ranovus. “Building upon the foundation laid by the ongoing work in the OIF PLL, our commitment extends to expanding the scope, diversity and standards of optical interfaces specified by OIF, ushering in a new era of connectivity and possibilities.”

White Paper: Path to CMIS Plug and Play

In response to key challenges identified by members, OIF unveiled a white paper project on advancing plug and play for CMIS-managed modules. Feedback has emphasized difficulties in consistently managing modules from different vendors and the need for extensive host development with new module introductions. This white paper will provide practical recommendations to enhance plug and play. It focuses on creating guidelines that empower hosts to manage third-party modules effectively, with the goal of enabling seamless integration of new or unknown modules without requiring host software changes. The proposed guidelines will prioritize simplifying provisioning processes and improving module-to-host integration for enhanced efficiency in optical networking.

“This white paper will enhance the transformative power of CMIS, unveiling its capacity to revolutionize network management and interoperability,” said Ian Alderdice, OIF PLL Working Group – Management Co-Vice Chair and Ciena. “By providing valuable insights, it becomes a beacon guiding the evolution of optical networking standards, paving the way for a future where efficiency and seamless integration define the technological landscape.”

PLL WG Chair

OIF announced the reelection of David Stauffer, Kandou Bus, as PLL WG Chair.

Special Guest Speaker: Andrew Schmitt, Cignal AI

The Q1 meeting featured guest speaker, Andrew Schmitt from Cignal AI, who shared valuable insights into the latest trends and developments in the optical networking industry. His presentation provided attendees with a comprehensive understanding of the current landscape and future possibilities within the field.

“OIF is an excellent forum for establishing standards on rapidly emerging technologies, and it is well-positioned to tackle the tough problems network operators and their suppliers face,” said Schmitt. “This meeting’s kick off of the 1600ZR+ process – a third generation follow up to the hugely successful 400ZR project – marks a major milestone for the industry. Further increasing the ease of deployment for 400ZR technology via CMIS is also a very valuable endeavor.  I’m excited about these OIF initiatives and very pleased to offer Cignal AI’s current perspective on the market to such a capable and effective audience.”

About OIF

OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 150+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF on LinkedIn, on X at @OIForum and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

leah@wilkinson.associates

703-907-0010