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OIF to Present “Co-Packaging Standardization Progress” Webinar to Provide Updates on Overcoming Implementation Challenges to Enable Interoperability

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In partnership with Lightwave, the online event will feature a discussion between end-users, equipment developers and component vendors

Fremont, Calif. – OIF continues to drive discussion and work toward industry interoperability through an upcoming webinar, “Co-Packaging Standardization Progress,” being held on Wednesday, February 2, 2022, at 7:00am PST/9:00am CST/10:00am EST/3:00pm GMT. The free event, hosted by Lightwave, will feature presentations and discussions with industry-leading experts from global organizations: Cisco, Intel, Ranovus, Sumitomo Electric and TE Connectivity. Register for this free event.

“Since OIF’s work in co-packaging technologies began in July 2020, we have seen an increased interest and active participation industry-wide for interoperable solutions,” said Jeff Hutchins, Ranovus and OIF Board Member and Physical and Link Layer (PLL) Working Group – Co-Packaging Vice Chair. “This webinar featuring industry-leading experts will explore the current state of standardization efforts and how we are tackling the challenges so that industry can engage this critical integration technology development.”

This webinar will review the co-packaging standardization efforts in progress and identify implementation challenges for electrical channels, external lasers, optical connectivity, packaging, etc. Webinar participants will learn about OIF’s Implementation Agreements (specifications) that are being developed and the latest information for assessing how to engage this critical new integration technology development.

Details are as follows:

February 2, 2022 – 7:00am-9:00am PST

Agenda

  • Welcome & Intro – Stephen Hardy, Lightwave and Jeff Hutchins, Ranovus, OIF Board Member and Physical & Link Layer Working Group – Co-Packaging Vice Chair
  • OIF Overview – Nathan Tracy, TE Connectivity, OIF VP of Marketing
  • Framework Overview – Ken Jackson, Sumitomo Electric
  • 3.2T Module – Richard Ward, Intel, OIF Market Awareness & Education Committee Co-Chair – Physical and Link Layer
  • External Laser Small Form Factor Pluggable (ELSFP) – Jock Bovington, Cisco
  • Co-Packaging Electrical Interfaces – Yi Tang, Cisco
  • Q&A – Stephen Hardy, Lightwave and Jeff Hutchins, Ranovus

To register for the free event, click here. The webinar is open to the public, and a certificate of attendance will be offered.

 

About OIF

OIF is where the optical networking industry’s interoperability work gets done. Building on more than 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 125+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

Email: leah@wilkinson.associates

Office: 703-907-0010

 

OIF Reveals New Common Electrical I/O Project to Strengthen an Open Ecosystem for Near Package Optics Architecture, Launches Management Track and Facebook joins Board of Directors at Q3 2021 Virtual Meeting

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Fremont, Calif.—August 27, 2021 – OIF’s Q3 2021 Technical and MA&E Committees Meeting, held virtually August 2-6, 2021, demonstrated OIF’s leadership in next-generation channel definition by revealing a new Common Electrical I/O (CEI) project. Two projects under the Physical and Link Layer (PLL) newly formed Management track were also initiated. Jimmy Yu, vice president of Dell’Oro Group, was featured as the guest speaker, and a new Board Member was appointed.

NEW PROJECTS:

The CEI-112G-Extra Short Reach (XSR)+ project will allow lower power, multi-source 112Gbps (optimized for 106.25Gbps) electrical I/O interface to be developed with advanced PCB and substrate technology. The project will also support an open ecosystem based on Near Package Optics (NPO) architecture. OIF members are proposing that an “XSR+” type interface is used to add reach for NPO applications over the existing XSR interface to enable a multi-vendor open ecosystem without adding significant power.

The two projects under the PLL Management track include one to transition ownership and maintenance of the Common Management Interface Specification (CMIS) from the Quad Small Form Factor Pluggable Double Density (QSFP-DD) Multi-Source Agreement (MSA) to OIF, and the second project will focus on CMIS extensions for co-packaging implementations.

“Our quarterly meetings provide a critical platform for our members to discuss and debate interoperability challenges and industry standards that help OIF continue its mission to accelerate industry innovation,” explained David Stauffer, OIF Physical & Link Layer WG Chair and Kandou. “The new CEI-112G-XSR+ project will help strengthen an open ecosystem for NPO demonstrating OIF’s leadership in next-generation channel definition. Another significant new activity that addresses industry interoperability and standards is OIF’s new Management track. Due to the complementary/synergistic nature of the work with the OIF co-packaged optics, NPO, CEI and coherent optics projects, OIF will take over the ongoing CMIS revisions as well as further enhancements and CMIS extensions under this track.”

BOARD OF DIRECTORS APPOINTMENT

Rob Stone of Facebook was appointed to the OIF Board of Directors, filling an open position. Stone will serve the term for this position that goes through September 2022.

GUEST SPEAKER

Jimmy Yu served as the guest speaker providing OIF members with an update on the optical transport market. He leads Dell’Oro’s Optical Transport, Microwave Transmission and Mobile Backhaul Transport market research.

“OIF is a critical enabler to the optical market’s progression,” commented Yu. “The work of OIF members in these quarterly meetings to help guide interoperability is a significant benefit to the industry.”

About OIF

OIF is where the optical networking industry’s interoperability work gets done. Building on more than 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 125+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

Email: leah@wilkinson.associates

Office: 703-907-0010

 

 

 

OIF Thought Leaders to Provide Updates on Co-Packaging, 400ZR, Electrical Data Rates and Transport SDN Projects at Global Conferences

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Presenting developments on innovative projects at OFC 2021, Optinet China 2021 and
China Fiber Connect Forum 2021

Fremont, Calif.—June 7, 2021 – OIF thought leaders will share insight into OIF’s interoperability work in groundbreaking technologies at some of the world’s largest global communications conferences: OFC 2021, Optinet China 2021 and China Fiber Connect Forum 2021.

OIF’s dynamic membership has brought about significant advances in the industry through its interoperability work.

“For more than 20 years, we’ve led the way for network operators and system, component and test equipment vendors to collaborate on, and test the interoperability of the electrical, optical and control solutions that directly impact the industry. Our members continue the path forward by sharing their expertise and OIF project updates at three global conferences this month,” said Ian Betty, OIF Board President, Ciena.

OFC 2021 Panels – Virtual

“Electrical Data Rates Keep Pushing Forward: An OIF Update”
Tuesday, June 08, 2021 – 11:00-12:00 PDT
A panel of industry experts and OIF members will provide an update on OIF’s CEI-112G and CEI-224G development work, including discussion and debate of 224G modulations.

  • Moderator: Nathan Tracy, OIF VP of Marketing, TE Connectivity
  • Panelists: David Stauffer, OIF Physical & Link Layer Working Group Chair, Kandou Bus SA; Gary Nicholl, OIF Secretary/Treasurer, Cisco; Cathy Liu, Broadcom Inc.; Mike Li, OIF Board Member, Intel and Thananya Baldwin, Keysight Technologies

“OFC Media/Analyst Panel: Data Center Optics are Heading Toward Co-packaged Optics: Why, How and When?”
Tuesday, June 08, 2021 – 12:30 – 13:30 PDT
This OFC-sponsored panel of industry experts will discuss the need for co-packaged optics (CPO) inside the data center. The path to CPO commercialization is fraught with risk. An entire ecosystem must be developed to support the transition from pluggable modules. The panel consists of specialists who come from different parts of this potential ecosystem to deliberate CPO’s merits, its potential pitfalls, how and perhaps when it can be successful.

  • OIF Speaker: Mark Filer, OIF Board Member, Microsoft

“400ZR Deployment and What’s Next: An OIF Update”
Friday, June 11, 2021 – 11:30-13:00 PDT
A panel of industry experts will provide an update to the state of the 400G coherent transmission ecosystem. They will provide an update for 400ZR deployment and the status of ongoing OIF projects that are intended to accelerate the deployment of optical networking equipment. A panel discussion including representatives of the DSP, optics, equipment, and end-user communities will ensure this will be a lively discussion.

  • Moderator: Richard Ward, OIF Market Awareness & Education Committee Co-Chair – PLL, Intel
  • Panelists: Ian Betty, OIF President, Ciena; Josef Berger, Marvell; Tom Williams, Cisco;  Paul Brooks, Viavi Solutions

Optinet China 2021 – Beijing

“Overview of OIF Transport SDN Projects”
Wednesday, June 16, 2021 – 11:50-12:10 China Standard Time
During this session, an OIF expert will discuss OIF’s Transport SDN projects and the 2020 Transport SDN API Interop Demonstration, where operator-defined use cases and deployment scenarios for multi-vendor Layer 0 and Layer 1 networks were tested in the Telefonica Madrid lab using the ONF T-API 2.1.3 and OpenConfig device APIs for interoperability between devices, SDN controllers and orchestrators.

  • Presenter: Hu Qian, OIF Representative, Senior Engineer, Optical Communication Research Center of China Telecom Beijing Research Institute

China Fiber Connect Forum 2021 – Suzhou

“Standardization for the Co-packaging of Photonics and Electronics”
Thursday, June 24, 2021 – Time TBD
OIF has been studying the co-packaging of ASICs with optical and electrical transceivers within its Co-Packaging Framework Project.   During this session, an OIF expert will define co-packaging, its’ unique challenges, and describe OIF activities to address multi-vendor interoperability for co-packaging.

  • Presenter:  Jeff Hutchins, OIF Physical & Link Layer Working Group – Co-Packaging Vice Chair, Ranovus

 

About OIF

OIF is where the optical networking industry’s interoperability work gets done. Building on more than 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

Email: leah@wilkinson.associates

Office: 703-907-0010

 

 

OIF Launches Co-Packaging Framework Implementation Agreement Project

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Co-packaging of communication interfaces project establishes OIF’s leadership in this critical new area of standards for interoperability

Fremont, Calif. – OIF, the global industry forum accelerating market adoption of advanced interoperable optical networking solutions, today announced the start of the Co-Packaging Framework Implementation Agreement (IA) umbrella project. The new project start approval took place during last week’s Q420 Technical and MA&E Committee meetings held virtually November 2-6, 2020.

The Co-Packaging Framework IA will study the application spaces and relevant technology considerations for co-packaging of communication interfaces with one or more ASICs. A primary objective of this specification is to identify new opportunities for interoperability standards for possible future work at the OIF or other standards organizations. Upon completion, the work will be summarized in a Framework IA.

“It is critical that the industry be aligned on the solutions needed to move co-packaged interoperability forward,” said Jeff Hutchins, Ranovus and OIF Physical and Link Layer (PLL) Working Group – Co-Packaging Vice Chair. “With its member-driven focus, OIF is the ideal forum to facilitate industry conversation and drive interoperability of co-packaging with ASICs.”

The scope of the Co-Packaging Framework project is to:

  • Identify the key co-packaged applications and their requirements
  • Study and identify key issues associated with co-packaged optics
  • Identify opportunities and develop industry consensus to pursue interoperability standards
  • Document the study in the Framework IA (a technical whitepaper)
  • Launch follow-on standardization activities at the OIF or other appropriate standard bodies

In October, OIF’s public webinar “Co-Packaged Optics – Why, What and How” in partnership with Lightwave drew significant industry interest, reinforcing the need for industry discussion. The virtual event featured talks from industry-leading experts from: Cisco, Facebook, Intel, Juniper Networks,  Microsoft, Ranovus, Senko Advanced Components and TE Connectivity. Click here for free on-demand viewing of this webinar.

 

About OIF
OIF is where the optical networking industry’s interoperability work gets done. Building on 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
Email: leah@wilkinson.associates
Office: 703-907-0010