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OIF to Present “Co-Packaging Standardization Progress” Webinar to Provide Updates on Overcoming Implementation Challenges to Enable Interoperability

In partnership with Lightwave, the online event will feature a discussion between end-users, equipment developers and component vendors

Fremont, Calif. – OIF continues to drive discussion and work toward industry interoperability through an upcoming webinar, “Co-Packaging Standardization Progress,” being held on Wednesday, February 2, 2022, at 7:00am PST/9:00am CST/10:00am EST/3:00pm GMT. The free event, hosted by Lightwave, will feature presentations and discussions with industry-leading experts from global organizations: Cisco, Intel, Ranovus, Sumitomo Electric and TE Connectivity. Register for this free event.

“Since OIF’s work in co-packaging technologies began in July 2020, we have seen an increased interest and active participation industry-wide for interoperable solutions,” said Jeff Hutchins, Ranovus and OIF Board Member and Physical and Link Layer (PLL) Working Group – Co-Packaging Vice Chair. “This webinar featuring industry-leading experts will explore the current state of standardization efforts and how we are tackling the challenges so that industry can engage this critical integration technology development.”

This webinar will review the co-packaging standardization efforts in progress and identify implementation challenges for electrical channels, external lasers, optical connectivity, packaging, etc. Webinar participants will learn about OIF’s Implementation Agreements (specifications) that are being developed and the latest information for assessing how to engage this critical new integration technology development.

Details are as follows:

February 2, 2022 – 7:00am-9:00am PST

Agenda

  • Welcome & Intro – Stephen HardyLightwave and Jeff Hutchins, Ranovus, OIF Board Member and Physical & Link Layer Working Group – Co-Packaging Vice Chair
  • OIF Overview – Nathan Tracy, TE Connectivity, OIF VP of Marketing
  • Framework Overview – Ken Jackson, Sumitomo Electric
  • 3.2T Module – Richard Ward, Intel, OIF Market Awareness & Education Committee Co-Chair – Physical and Link Layer
  • External Laser Small Form Factor Pluggable (ELSFP) – Jock Bovington, Cisco
  • Co-Packaging Electrical Interfaces – Yi Tang, Cisco
  • Q&A – Stephen HardyLightwave and Jeff Hutchins, Ranovus

To register for the free event, click here. The webinar is open to the public, and a certificate of attendance will be offered.

 

About OIF

OIF is where the optical networking industry’s interoperability work gets done. Building on more than 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 125+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

Email: leah@wilkinson.associates

Office: 703-907-0010

 

OIF Launches Co-Packaging Framework Implementation Agreement Project

Co-packaging of communication interfaces project establishes OIF’s leadership in this critical new area of standards for interoperability

Fremont, Calif. – OIF, the global industry forum accelerating market adoption of advanced interoperable optical networking solutions, today announced the start of the Co-Packaging Framework Implementation Agreement (IA) umbrella project. The new project start approval took place during last week’s Q420 Technical and MA&E Committee meetings held virtually November 2-6, 2020.

The Co-Packaging Framework IA will study the application spaces and relevant technology considerations for co-packaging of communication interfaces with one or more ASICs. A primary objective of this specification is to identify new opportunities for interoperability standards for possible future work at the OIF or other standards organizations. Upon completion, the work will be summarized in a Framework IA.

“It is critical that the industry be aligned on the solutions needed to move co-packaged interoperability forward,” said Jeff Hutchins, Ranovus and OIF Physical and Link Layer (PLL) Working Group – Co-Packaging Vice Chair. “With its member-driven focus, OIF is the ideal forum to facilitate industry conversation and drive interoperability of co-packaging with ASICs.”

The scope of the Co-Packaging Framework project is to:

  • Identify the key co-packaged applications and their requirements
  • Study and identify key issues associated with co-packaged optics
  • Identify opportunities and develop industry consensus to pursue interoperability standards
  • Document the study in the Framework IA (a technical whitepaper)
  • Launch follow-on standardization activities at the OIF or other appropriate standard bodies

In October, OIF’s public webinar “Co-Packaged Optics – Why, What and How” in partnership with Lightwave drew significant industry interest, reinforcing the need for industry discussion. The virtual event featured talks from industry-leading experts from: Cisco, Facebook, Intel, Juniper Networks,  Microsoft, Ranovus, Senko Advanced Components and TE Connectivity. Click here for free on-demand viewing of this webinar.

 

About OIF
OIF is where the optical networking industry’s interoperability work gets done. Building on 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
Email: leah@wilkinson.associates
Office: 703-907-0010