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OIF to Host Common Management Interface Specification (CMIS) Tutorial Webinar: “Exploring the Technical Depths of CMIS”

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Fremont, Calif.—November 14, 2023 – Recognizing the crucial role that CMIS plays in the industry’s ability to harness the full potential of emerging technologies, OIF will host a free, public CMIS tutorial webinar on Tuesday, December 5th, 2023, from 7:00 am to 8:30 am Pacific Time (PST). In the rapidly evolving landscape of networking technologies, being informed about the tools that can streamline functionality and integration is paramount.

OIF is committed to ensuring the industry is up to speed on the progress of CMIS. With this commitment in mind, this webinar kicks off a series of free, public CMIS tutorial webinars – each focusing on individual CMIS functions.

“We are excited to offer this CMIS tutorial webinar, which aims to provide attendees with an in-depth technical knowledge of CMIS, a vital component in today’s optical networking landscape,” said Ian Alderdice, OIF PLL Working Group Management Co-Vice Chair, Ciena. “This session will empower participants to harness the full potential of CMIS, enabling them to make more informed decisions and innovations in the field.”

Building upon the success of OIF’s “CMIS Demystified” webinar last year, this tutorial is designed to take participants one level deeper into the world of CMIS, offering a more profound exploration of the technical intricacies behind its major functions. The webinar, presented by OIF’s Management Working Group Leadership, will provide attendees with a comprehensive high-level technical understanding of CMIS, highlighting major functionalities such as Module State Machine (MSM), Applications advertising (Appsel) and Data Path State Machine (DPSM), Versatile Diagnostic Monitoring (VDM), Command Data Block (CDB) and Firmware (FW) upgrade.

Webinar: Exploring the Technical Depths of CMIS

Date and Time: Tuesday, December 5th, 2023, from 7:00 am to 8:30 am PT

Presenters: Gary Nicholl and Ian Alderdice – OIF’s Management Working Group Leadership

Agenda:

CMIS Overview – A deep dive into the major functionalities of CMIS

  • CMIS concepts
  • CMIS Memory Map
  • MSM
  • DPSM/Appsel
  • VDM
  • CDB
  • FW Upgrade

To attend this tutorial webinar and access Webex details, please visit https://www.oiforum.com/meetings-events/oif-webinar-cmis-tutorial-05dec23/. Registration is not required.

This webinar marks the beginning of a series designed to equip engineers, developers and industry professionals with a comprehensive understanding of CMIS.

“We’ve witnessed from discussions at industry conferences and testing events that there is a knowledge gap concerning the substantial value that CMIS brings to the industry by enabling the true plug-n-play paradigm that customers are now demanding,” said Gary Nicholl, OIF PLL Working Group Management Co-Vice Chair, Cisco. “Our aim with this webinar is to bridge that knowledge divide, connect the dots, and empower industry professionals with expert insights on CMIS.”

Subsequent webinars will delve into specific aspects of individual CMIS functions such as VDM, CDB, FW upgrade and DPSM/Appsel. These sessions will thoroughly explore register-level specifics, defining registers and explaining their interactions.

About OIF

OIF is where the optical networking industry’s interoperability work gets done. Celebrating 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 150+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn, on Threads and at http://www.oiforum.com.

 

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
leah@wilkinson.associates
703-907-0010

OIF to Present “Co-Packaging: Charting the Path Ahead” Webinar Providing an Update on Industry Activities and the Developing Ecosystem

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In partnership with Lightwave, the event will feature viewpoints from academia and industry experts, and a live Q&A

Fremont, Calif.—November 15, 2022 – OIF is driving discussion on co-packaging interoperability efforts in an upcoming webinar, “Co-Packaging: Charting the Path Ahead” being held on Tuesday, December 6, 2022 at 8:00am PST/10:00am CST/11:00am EST/4:00pm GMT. The free two-hour event, hosted by Lightwave, will feature unique perspectives from industry thought leaders: Astera Labs, Cisco, Huawei, Marvell, Meta, NVIDIA, Ranovus, TE Connectivity and University of California, Santa Barbara. Register here for this free event.

Join this OIF sponsored workshop to hear from industry leaders, including vendors, academia and network operators, as they provide insight on the latest in co-packaging and address the developing ecosystem and the best path forward.

“We know that co-packaging implementations bring a number of challenges including electrical channels, external lasers, optical connectivity, packaging, etc.,” explained Jeff Hutchins, Ranovus, OIF Board Member and Physical & Link Layer Working Group – Co-Packaging Vice Chair. “In this webinar, we will provide attendees with valuable information to assess this critical integration technology and discuss options for a path forward.”

Webinar agenda and participants include:

December 6, 2022 – 8:00am-10:00am PST

  • Welcome & Introduction – Stephen Hardy, Editorial Director and Associate Publisher, Lightwave
  • Co-Packaging Overview – Jeff Hutchins, Ranovus, OIF Board Member and Physical & Link Layer Working Group – Co-Packaging Vice Chair
  • Co-Packaging State of the Industry – John Bowers, Fred Kavli Distinguished Professor, Electrical & Computer Engineering and Distinguished Professor, Materials, University of California, Santa Barbara

Where we are?

  • OIF Overview and Co-Packaging Overview – Nathan Tracy, TE Connectivity, OIF Market Awareness & Education Committee Co-Chair, Physical and Link Layer
  • OIF 3.2T Co-Packaged Optical (CPO) Module – Richard Ward, Astera Labs, OIF Physical & Link Layer Working Group – Co-Packaging Track’s 3.2Tb/s CPO module project editor
  • OIF External Laser Small Form Factor Pluggable (ELSFP) – Jock Bovington, Cisco Systems, OIF Physical & Link Layer Working Group – Co-Packaging Track’s ELSFP project editor
  • OIF Common Management Interface Specification (CMIS) – Todd Rope, Marvell
  • OIF Common Electrical I/O (CEI) – Matt Brown, Huawei Technologies, Inc.

What’s next: End-User Perspectives?

  • Drew Alduino, Meta Platforms, Inc.
  • Craig Thompson, NVIDIA

Q&A

 

About OIF
OIF is where the optical networking industry’s interoperability work gets done. Building on nearly 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 130+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

Email: leah@wilkinson.associates

Office: 703-907-0010

OIF to Present “Co-Packaging Standardization Progress” Webinar to Provide Updates on Overcoming Implementation Challenges to Enable Interoperability

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In partnership with Lightwave, the online event will feature a discussion between end-users, equipment developers and component vendors

Fremont, Calif. – OIF continues to drive discussion and work toward industry interoperability through an upcoming webinar, “Co-Packaging Standardization Progress,” being held on Wednesday, February 2, 2022, at 7:00am PST/9:00am CST/10:00am EST/3:00pm GMT. The free event, hosted by Lightwave, will feature presentations and discussions with industry-leading experts from global organizations: Cisco, Intel, Ranovus, Sumitomo Electric and TE Connectivity. Register for this free event.

“Since OIF’s work in co-packaging technologies began in July 2020, we have seen an increased interest and active participation industry-wide for interoperable solutions,” said Jeff Hutchins, Ranovus and OIF Board Member and Physical and Link Layer (PLL) Working Group – Co-Packaging Vice Chair. “This webinar featuring industry-leading experts will explore the current state of standardization efforts and how we are tackling the challenges so that industry can engage this critical integration technology development.”

This webinar will review the co-packaging standardization efforts in progress and identify implementation challenges for electrical channels, external lasers, optical connectivity, packaging, etc. Webinar participants will learn about OIF’s Implementation Agreements (specifications) that are being developed and the latest information for assessing how to engage this critical new integration technology development.

Details are as follows:

February 2, 2022 – 7:00am-9:00am PST

Agenda

  • Welcome & Intro – Stephen Hardy, Lightwave and Jeff Hutchins, Ranovus, OIF Board Member and Physical & Link Layer Working Group – Co-Packaging Vice Chair
  • OIF Overview – Nathan Tracy, TE Connectivity, OIF VP of Marketing
  • Framework Overview – Ken Jackson, Sumitomo Electric
  • 3.2T Module – Richard Ward, Intel, OIF Market Awareness & Education Committee Co-Chair – Physical and Link Layer
  • External Laser Small Form Factor Pluggable (ELSFP) – Jock Bovington, Cisco
  • Co-Packaging Electrical Interfaces – Yi Tang, Cisco
  • Q&A – Stephen Hardy, Lightwave and Jeff Hutchins, Ranovus

To register for the free event, click here. The webinar is open to the public, and a certificate of attendance will be offered.

 

About OIF

OIF is where the optical networking industry’s interoperability work gets done. Building on more than 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 125+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

Email: leah@wilkinson.associates

Office: 703-907-0010