OIF to Present “Co-Packaging Standardization Progress” Webinar to Provide Updates on Overcoming Implementation Challenges to Enable Interoperability

In partnership with Lightwave, the online event will feature a discussion between end-users, equipment developers and component vendors

Fremont, Calif. – OIF continues to drive discussion and work toward industry interoperability through an upcoming webinar, “Co-Packaging Standardization Progress,” being held on Wednesday, February 2, 2022, at 7:00am PST/9:00am CST/10:00am EST/3:00pm GMT. The free event, hosted by Lightwave, will feature presentations and discussions with industry-leading experts from global organizations: Cisco, Intel, Ranovus, Sumitomo Electric and TE Connectivity. Register for this free event.

“Since OIF’s work in co-packaging technologies began in July 2020, we have seen an increased interest and active participation industry-wide for interoperable solutions,” said Jeff Hutchins, Ranovus and OIF Board Member and Physical and Link Layer (PLL) Working Group – Co-Packaging Vice Chair. “This webinar featuring industry-leading experts will explore the current state of standardization efforts and how we are tackling the challenges so that industry can engage this critical integration technology development.”

This webinar will review the co-packaging standardization efforts in progress and identify implementation challenges for electrical channels, external lasers, optical connectivity, packaging, etc. Webinar participants will learn about OIF’s Implementation Agreements (specifications) that are being developed and the latest information for assessing how to engage this critical new integration technology development.

Details are as follows:

February 2, 2022 – 7:00am-9:00am PST


  • Welcome & Intro – Stephen HardyLightwave and Jeff Hutchins, Ranovus, OIF Board Member and Physical & Link Layer Working Group – Co-Packaging Vice Chair
  • OIF Overview – Nathan Tracy, TE Connectivity, OIF VP of Marketing
  • Framework Overview – Ken Jackson, Sumitomo Electric
  • 3.2T Module – Richard Ward, Intel, OIF Market Awareness & Education Committee Co-Chair – Physical and Link Layer
  • External Laser Small Form Factor Pluggable (ELSFP) – Jock Bovington, Cisco
  • Co-Packaging Electrical Interfaces – Yi Tang, Cisco
  • Q&A – Stephen HardyLightwave and Jeff Hutchins, Ranovus

To register for the free event, click here. The webinar is open to the public, and a certificate of attendance will be offered.


About OIF

OIF is where the optical networking industry’s interoperability work gets done. Building on more than 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 125+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at


PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF


Office: 703-907-0010