Posts

OIF Thought Leaders Offer CEI-112G Project Update at DesignCon 2020

Panel of electrical interface experts will showcase OIF’s latest work on multiple interfaces including CEI-112G MCM, XSR, VSR, MR and LR for 112 Gbps applications

Fremont, Calif. —January 14, 2020 – OIF industry leaders will present and discuss OIF’s ongoing CEI-112G electrical interface development projects, and the new architectures they will enable including chiplet packaging, co-packaged optics and internal cable-based solutions on Wednesday, January 29 at 3:45 pm (local) at DesignCon in Santa Clara, CA.

OIF’s panel “Enabling New Architectures: An Update on OIF’s CEI-112G Electrical Interfaces,” will provide an update on the five new interfaces, including CEI-112G MCM, XSR, VSR, MR and LR for 112 Gbps applications, that will shape the future of next generation designs, ranging from die-to-die implementations all the way up to backplane and copper cable architectures.

Panel speakers include: Nathan Tracy of TE Connectivity and OIF President; Cathy Liu of Broadcom Inc. and OIF Board Member; Steve Sekel of Keysight Technologies and OIF Physical and Link Layer Interoperability Working Group Chair; Ed Frlan of Semtech and OIF Technical Committee Chair; Gary Nicholl of Cisco and OIF Board Member and Mike Li of Intel Corporation and OIF Board Member.
“Electrical interfaces at 112 Gbps are critical for faster, more efficient and cost-effective networks and data centers,” said Tracy. “This panel discussion will provide the opportunity for an engaging industry debate on the issues surrounding OIF’s CEI-112G projects and the architectures they will enable.”

OIF has led the industry for the past 20 years in the development and publication of next generation electrical definitions for transmitters, receivers and channels to enable interoperable electrical links for chip to chip, chip to optical, line card to line card and equipment to equipment applications. OIF is currently in the process of developing electrical link definitions for the next generation 112 Gbps data rate to provide signalling over a multitude of link types including die to die, chip to chip, chip to module, medium reach chip to chip and long reach chip to chip also known as backplane. OIF’s complete work on the CEI-112G can be found here.

About OIF
OIF is where the optical networking industry’s interoperability work gets done. Building on 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
Email: leah@wilkinson.associates
Office: 703-907-0010

EE Web – 112G Digs in at DesignCon 2019

112G serial links have moved out of the lab and onto the exhibit floor. 56G ramps up while 28G goes mainstream.

By Martin Rowe, EE Web, 

Last year at DesignCon 2018, we witnessed high-speed digital designs that moved past 56 Gbits/s (56G) and onto 112 Gbits/s (112G). This year, DesignCon 2019 brought numerous demonstrations of 112G as the connectors and cables caught up with the silicon. While still appearing in technical papers and panels, 112G has certainly moved into the exhibit hall. Meanwhile, 56G has matured and is now a complete ecosystem.

When it comes to signal integrity and high-speed signals, transmission lengths certainly matter, especially with electrical signals over copper connections. Yes, optical transmission is an option, but nobody wants to pay for it. At a panel session on Jan. 31, OIF board president Nathan Tracy presented the table shown in Figure 1 that describes five OIF standards for different electrical transmission lengths.

mar0008-01-oif-standards
Figure 1: The Optical Internetworking Forum has created standards for 112-Gbit/s copper connections. (Source: Optical Internetworking Forum and DesignCon)
Given a rule of thumb of 0.1 dB/in./GHz of insertion loss (Figure 2), PCB traces of, say, 10 inches are simply too long. That’s where cables that jump over PCBs have become popular.

mar0008-02-112gbps
Figure 2: Cable assemblies jump over PCBs to reduce insertion loss. (Source: Optical Internetworking Forum, Broadcom, and DesignCon)
Connectors for 112G took several forms at DesignCon, depending on the length of the transmission. For chip-to-chip or chip-to-module distances, sending 112G four-level pulse-amplitude modulation (PAM4) signals (28 GHz) over PCB traces results in excessive insertion loss. To get past that restriction, several connector companies have developed cable assemblies that jump over sections of boards.

Read more here: https://www.eeweb.com/profile/martin-rowe-2/articles/112g-digs-in-at-designcon-2019

 

OIF Experts to Provide CEI-112G Project Update at DesignCon

Expert panel will provide an update on the multiple interfaces being defined by OIF including CEI-112G MCM, XSR, VSR, MR and LR for 112G

Fremont, Calif.—January 23, 2019 – A panel of OIF experts will present and discuss the ongoing, multi-faceted Common Electrical I/O (CEI)-112G interface effort at this year’s DesignCon being held in Santa Clara, CA January 29-31. “112-Gbps Electrical Interface: An OIF Update on CEI-112G,” is scheduled for Thursday, January 31 at 3:45 pm (local) and will provide an update on the multiple interfaces being defined by OIF including CEI-112G MCM, XSR, VSR, MR and LR. Applications of these 112 Gb/s interfaces include die-to-die, chip-to-module, chip-to-chip and long reach over backplane and cables.

Panel speakers include Brian Holden of Kandou Bus and OIF member; Cathy Liu of Broadcom Inc. and OIF Board Member; Steve Sekel of Keysight Technologies and OIF PLL Interoperability Working Group Chair and Nathan Tracy of TE Connectivity and OIF President.

Since 2000, OIF has defined Interoperability Agreements (IA)s for electrical interconnects known as CEI.  CEI is a clause-based document that defines implementation details for interoperable electrical channels initially issued for 6 Gbps, then 11, 28, and 56 and includes definitions for multiple channel implementation topologies and will soon include 112 Gbps clauses. In August of 2016, OIF announced the first CEI-112G project in an overall effort that has now expanded to five projects.

“Previous CEI development has been highly influential and has been adopted, influenced or adapted by many other high-speed interconnect specifications throughout the industry,” said Tracy. “Given that the CEI-112G generation of high-speed transmitters, receivers and channels will be challenging to define, implement and measure, this panel will provide guidance to where the industry is headed and what the key challenge points are likely to be.”

The CEI-112G IA effort is challenging in signal integrity, implementation complexity and measurement terms. The signals are increasingly vulnerable to channel discontinuities, leading to signal impairment and crosstalk. The switching speed and the density of the available SerDes transistors have not kept pace with other silicon functions, resulting in architectural challenges. Finally, the ability to probe and repeatably capture measurements at these rates with sufficient accuracy and precision is challenging.

Check the status of OIF’s current work in CEI-112G here.

About OIF
OIF is where the optical networking industry’s interoperability work gets done. Celebrating 20 years of effecting progressive change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors, all collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
Email: leah@wilkinson.associates
Office: 703-907-0010