New specifications will enable a broad range of applications
Fremont, Calif. – OIF, where the optical networking industry’s interoperability work gets done, has published a new Implementation Agreement (IA) for Common Electrical I/O (CEI) 5.0 specifying the next generation of 112Gb/s electrical interconnects. The IA specifies transmitter, receiver and channel requirements associated with Extra Short Reach (XSR), Medium Reach (MR) and Long Reach (LR) interfaces for multi-chip-module, chip-to-chip, and high-speed backplane applications.
“This IA marks a new generation of specifications for 112G interfaces,” said Klaus-Holger Otto, Nokia and OIF Technical Committee Chair. “It is a continuation of OIF’s proud history of adding next-generation data rates that enable broad interconnect solutions and are critical building blocks for several industry standards and platforms.”
“These new data rate specifications will enable applications including backplane, chip-to-chip, and die-to-die interfaces within a package,” said David Stauffer, Kandou Bus and Chair of OIF’s Physical and Link Layer (PLL) Working Group. “And, it enables multiple applications, such as co-packaged optics. Definitions of interfaces within co-packaged die are unique to this IA and OIF’s work.”
OIF is where the optical networking industry’s interoperability work gets done. Building on nearly 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 130+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.
Wilkinson + Associates for OIF