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OIF Members to Showcase Innovation and Interoperability Solutions for the Industry’s Most Critical Challenges at OFC 2020

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Interoperability demos on 400ZR, CEI-112G, FlexE and IC-TROSA; OIF experts to lead panel discussions and OIF to Host “Cu (see you) Beyond 112 Gbps” Workshop

Fremont, Calif.—February 18, 2020 – OIF will host one of the largest interoperability demos in its history reflecting the ongoing significance of OIF’s work in addressing global network challenges. Twenty industry-leading system vendors, component vendors and test equipment vendors will demonstrate critical insight into how key technologies – 400ZR, Common Electrical I/O (CEI)-112G, Flex Ethernet (FlexE) and Integrated Coherent Transmit-Receive Optical Sub Assembly (IC-TROSA) – interoperate within the industry’s ecosystem at OFC 2020 in San Diego, March 10-12, 2020 (booth #6221).

Participating companies include Acacia Communications, Amphenol, Arista Networks, Cadence Design Systems, Inc., Cisco Systems, Inc., Credo Semiconductor (HK) LTD, Fujitsu Optical Components, II-VI, Inphi Corporation, Juniper Networks, Keysight Technologies, Marvell, Microchip, Molex, NeoPhotonics, Samtec, Inc., Spirent Communications, TE Connectivity, VIAVI Solutions and Yamaichi Electronics.

“The participation level by 20 companies in this year’s interoperability demos for 400ZR, CEI-112G, FlexE and IC-TROSA, is a true reflection of our enduring leadership and evidence that these technologies continue to be the preeminent focus areas for our member companies,” explained Steve Sekel of Keysight and OIF’s Physical and Link Layer (PLL) Interoperability Working Group (WG) Chair. “We are eager to showcase the advancements that these technologies and our work have made over the past year.”

400ZR Demo
OIF has defined the 400ZR interface that provides interoperability of coherent optical interfaces for data center interconnect applications. The demo will show ‘first time ever’ operation of 400ZR equipment from multiple system and module vendors and in multiple pluggable form factors.

CEI-112G Demo
The CEI-112G demo will feature interoperating channels, components and silicon that demonstrate the CEI-112G-XSR, CEI-112G-VSR, CEI-112G-MR and CEI-112G-LR draft implementation agreements. Demonstrating interoperability for extra short reach channels is important to support the co-packaging developments that are expected to be discussed throughout the week at OFC. Interoperable very short reach, medium reach and long reach channels and silicon are also critical to support the developing 112 Gbps equipment that is expected to come to market soon. These updated demos surpass what OIF has demonstrated in the past with additional member contributions and continue to build on the developing ecosystem of products coming to market to support CEI-112G.

FlexE Demo
The FlexE demo that will be on display incorporates FlexE silicon operating with multiple test equipment and interoperating over a 400 Gbps fiber network that will be deployed on the show floor between the Ethernet Alliance booth and the OIF booth. This reflects further developments that are taking place in the FlexE market since the previous OIF FlexE demos.

IC-TROSA Demo
The IC-TROSA features all the optical building blocks for a coherent module in a single package. This demo will highlight important aspects of IC-TROSA integration as well as real-time EVM measurements with the updated script for 400ZR.

An additional point of interest will be a static display of coherent optical components which will emphasize the role of OIF in the coherent optical marketplace over the past 10 years.

OIF @ OFC 2020 Activities
OIF experts will participate in two panels at OFC 2020 that feature the latest updates on critical technologies that work to enable a more efficient and reliable network.

“400ZR Specification Update”
Tuesday, 10 March, 13:30 – 14:30, Theater III
Moderator: Karl Gass, OIF PLL WG Vice Chair Optical

Speakers include: Josef Berger, Inphi Corporation; Masahiro Mogi, Fujitsu Optical Components; Gert Sarlet, II-VI; Marc Stiller, NeoPhotonics and Markus Weber, Acacia Communications

Industry experts from OIF will lead a panel discussion of representatives from the DSP, optics, equipment and end user communities on the conflicting demands for a near-term, high-volume, interoperable, moderate reach, coherent 400G optical link. The session will also include an update on OIF’s project to define a 400ZR link specification.

“112 Gbps Electrical Interfaces – An OIF update on CEI-112G”
Wednesday, 11 March, 16:15 – 17:00, Theater II
Moderator: Nathan Tracy, OIF President, TE Connectivity
Speakers include: Ed Frlan, OIF Technical Committee Chair, Semtech, Corp.; Mike Li, OIF Board, Intel; Cathy Liu, OIF Board, Broadcom, Inc.; Gary Nicholl, OIF Board, Cisco; Steve Sekel, OIF PLL Interoperability WG Chair, Keysight Technologies

OIF experts will lead a panel discussion on the ongoing CEI-112G electrical interface development projects, and the new architectures they will enable including chiplet packaging, co-packaged optics and internal cable-based solutions. The panel will provide an update on the multiple interfaces being defined by OIF including CEI-112G MCM, XSR, VSR, MR and LR for 112 Gbps applications of die-to-die, chip-to-module, chip-to-chip and long reach over backplane and cables.

“Cu (see you) Beyond 112 Gbps” Workshop
Thursday, 12 March, 12:00-17:30, Hilton San Diego Gaslamp, 401 K St (across from the SD Convention Center), San Diego, Ca.

OIF will hold a half-day workshop “Cu (see you) Beyond 112 Gbps” featuring experts from Arista, Broadcom, Inc., Cisco, Facebook, Google, Innovium, Intel, MACOM and TE Connectivity discussing the needs and challenges for electrical interfaces beyond 112 Gbps. Registration required:

• Registration fee for OIF Members: $150.00. OIF Members click HERE to register.
• Registration fee for Non-Members/General Public: $200.00. Non-Members click HERE to register.

Check the status of OIF’s current work here.

About OIF
OIF is where the optical networking industry’s interoperability work gets done. Building on 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
Email: leah@wilkinson.associates
Office: 703-907-0010

OIF Approves IC-TROSA Implementation Agreement, Specifications Speed Delivery of a Higher Level of Integration for Transmit and Receive Optical Components

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IC-TROSA IA enables miniaturization of optical transceiver modules and lowers the component cost for 400ZR, metro, data center interconnect (DCI) applications

Fremont, Calif.—September 23, 2019 – OIF, where the optical networking industry’s interoperability work gets done, continues its efforts to reduce cost and speed market adoption of next-generation solutions through the approval of the Integrated Coherent Transmitter-Receiver Optical Subassembly (IC-TROSA) Implementation Agreement (IA). IC-TROSA integration will be demonstrated during this week’s OIF Physical and Link Layer (PLL) Interoperability Demo at ECOC 2019 in Dublin, Ireland (OIF booth 441).

“The IC-TROSA project took an aggressive approach to coherent optical component integration and has delivered two new package designs incorporating TX and RX integration, common digital controls and performance monitoring all in a small form factor package,” explained Scott Grindstaff, Director R&D, ADVA, and IC-TROSA IA Technical Editor. “Additionally, package specific features such as fiber-free interface and solder reflow compatibility have been incorporated.”

The optical sub-assembly supports high-bandwidth and high-order dual-polarization quadrature amplitude modulation (QAM) operations and is suited for data center interconnect, metro and long-haul applications. As module sizes decrease, coherent optics components need similar size reductions to enable next generation multi-terabit switches, line cards and transport platforms.

“The IC-TROSA IA is a solution for density requirements for line cards, front-pluggable and future on-board coherent 400G+ optical modules,” said Karl Gass, OIF PLL Working Group, Optical Vice Chair. “It aims to standardize a photonic package for coherent applications that is easy to use while leaving the internal implementation to the vendor.”

The IC-TROSA Type-1 is optimized for silicon photonics technology and uses a surface-mount package with Ball Grid Array (BGA) electrical interface. Important advantages include an increased electrical bandwidth and solder reflow capability. The IC-TROSA Type-2 is optimized for Indium Phosphide technology and uses a gold-box package with flex-cable electrical interface. Important advantages include an integrated tunable laser and a duplex LC optical connector.

The IC-TROSA’s low power dissipation and miniature footprint enables small form factor digital coherent optics (DCO) transceivers in a QSFP-DD or OSFP form factor, as well as very high-density coherent line card or daughtercard designs. Devices can support multiple modulation formats, including QPSK, 8QAM, and 16QAM, at symbol rates up to 64Gbaud, enabling data transmission up to 600 Gb/s.

About OIF
OIF is where the optical networking industry’s interoperability work gets done. Building on 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
Email: leah@wilkinson.associates
Office: 703-907-0010

OIF Showcases 400ZR, CEI-112G and IC-TROSA Interoperability Demos at ECOC 2019

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OIF selected to lead Market Focus presentation on deployment of the 400ZR ecosystem

Fremont, Calif.—September 9, 2019 – OIF member companies will showcase their industry leadership with a multi-vendor interoperability demonstration of 400ZR, Common Electrical I/O (CEI)-112G and IC-TROSA during ECOC 2019, September 23-25 in Dublin, Ireland.

Demonstrating how critical interoperability work gets done, 12 OIF member companies including ADVA, Amphenol, Cadence Design System, Credo, Finisar, Inphi, Keysight Technologies, Marvell, Molex, MultiLane, TE Connectivity and YAMAICHI ELECTRONICS will participate in the demonstration in OIF’s booth, # 441.

“Understanding and seeing first-hand how key technologies – 400ZR, CEI-112G and IC-TROSA – are each specified to enable interoperable deployment across the ecosystem is critically important to building market confidence and accelerating adoption,” said Steve Sekel, OIF Physical and Link Layer Interoperability Working Group Chair. “This showcase of 12 companies and key technologies is a clear representation of OIF’s leadership in driving electrical, optical and control interoperability.”

OIF Physical and Link Layer (PLL) Interoperability Demo @ ECOC 2019

OIF Drives Industry Collaboration and Growth Through Timely Interoperability Work.

Live interoperability demonstrations at ECOC 2019 will feature member company solutions that are critical to the global network, including 400ZR, Common Electrical I/O (CEI)-112G and IC-TROSA

400ZR & IC-TROSA Demo

OIF’s 400ZR project is not only facilitating cost and complexity reduction for 400GbE over 80 km DWDM networks, it’s also bringing forward a wave of necessary components and complementary applications. The IC-TROSA features all of the optical building blocks for a coherent module in a single package. The demonstrations will highlight important aspects of IC-TROSA integration as well as real-time EVM measurements with the updated script for 400ZR. In addition, a hardware-based 400ZR installation will show a typical application case.

CEI-112G Demo

OIF is taking a lead role in moving the industry to the next generation with its development of electrical interface specifications for 112 Gbps per differential pair. Multiple live demonstrations featuring interoperability clearly prove the key role OIF provides. The CEI-112G demonstrations in the OIF booth will feature multi-party silicon supplier interoperability over mated compliance board channels, a full host to module channel and direct attach copper cable channels, all demonstrating the technical viability of 112 Gbps operation, along with multiple industry form factors including OSFP and QSFP-DD.

OIF @ ECOC 2019 Market Focus

OIF will present “Deployment of the 400ZR Ecosystem” on Tuesday, September 24, 15:00 – 15:30, during the ECOC Market Focus Service and Content Provider Optical Transmission track. OIF expert and OIF Physical and Link Layer Working Group, Vice Chair Optical, Karl Gass will present.

Check the status of OIF’s current work here.

 

About OIF
OIF is where the optical networking industry’s interoperability work gets done. Building on 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
Email: leah@wilkinson.associates
Office: 703-907-0010

OIF’s Optical Masterclass Series at NGON to Include Updates on 400ZR, Common Electrical I/O, Flex Ethernet & SDN Projects

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Fremont, Calif.—May 8, 2019 – At NGON, May 21-23, 2019, OIF experts will kick off the Optical Masterclass Series with a comprehensive update on its 400ZR, Common Electrical I/O (CEI)-112, Flex Ethernet (FlexE) and Software Defined Networking (SDN) projects.

“OIF’s interoperability solutions are vital to the global network and with many of the key network operators in attendance, NGON is the ideal platform to provide updates on OIF’s work in 400ZR, CEI, FlexE and SDN,” said Dave Brown, Nokia and OIF Director of Communications.

The “Optical Masterclass Series – The Optical Internetworking Forum” session is being held Tuesday, May 21, 2019 from 09:00 – 11:00 (NEW TIME AS OF 5/16). Brown and Karl Gass, OIF Physical & Link Layer Working Group Vice Chair, Optical, will discuss how OIF is assuring interoperability in open, agile, next-generation optical networks and provide updates on crucial industry projects.

400ZR

OIF’s 400ZR project is critical in facilitating the reduction of cost and complexity for high bandwidth data center interconnects and promoting interoperability among optical module manufacturers. This Implementation Agreement (IA) will specify an interoperable digital coherent 400ZR interface targeted at short reach (80 km or more) DWDM amplified noise limited links and unamplified loss limited links.

CEI

The CEI project update will include discussion of the multiple 112 Gb/s interfaces being defined by OIF including CEI-112G MCM, XSR, VSR, MR and LR. Applications of these 112 Gb/s interfaces include die-to-die, die-to-OE (optical engine) on package, chip-to-module, chip-to-chip and chip-to-chip long reach over backplane and cables.

FlexE

OIF continues to lead in FlexE aggregation architectures through its newest FlexE 2.1 project for FlexE over 50GbE PHY applications, an extension to its FlexE 2.0 Implementation Agreement (IA). FlexE 2.1 will specify a 50G FlexE frame and multiplexing format and will address FlexE applications with lower bandwidth needs and provide an implementation foundation for applications including the access layer of the future 5G mobile network.

SDN

In November 2018, OIF announced the launch of “Requirements for Integrated Packet Optical SDN.” The project outlines requirements for a multi-layer SDN reference architecture as a use case for packet optical transport networks. It will generate functional requirements, a reference architecture and use cases for packet/optical networks guided by the vision to enable agile, open network solutions that simplify operations and optimize resource utilization.

IC-TROSA

The session will also include an update on the Integrated Coherent Transmit-Receive Optical Sub Assembly (IC-TROSA) project that defines a standard optical component containing a complete coherent modem. The availability of highly integrated components accelerates the adoption of coherent transmission into additional markets.

Additionally, Gass will participate in Wednesday’s Plenary session, 09:30 – 10:10, “Present View: To the terabit & beyond – practicalities for coherent transmission.” Also on Wednesday, from 14:35 – 15:30, Brown will speak on the “Open Source Approach: Looking at disaggregation as a pathway for multi-vendor cooperation, interoperability and driving enhanced network interfaces” panel.

Check the status of OIF’s current work here.

About OIF
Optical Internetworking Forum (OIF) is where the optical networking industry’s interoperability work gets done. Celebrating 20 years of effecting progressive change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors, all collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at https://www.oiforum.com/.

 

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
Email: leah@wilkinson.associates
Office: 703-907-0010