Posts

OIF Links Industry Vision with Interoperability Validation Enabling AI Growth at ECOC 2025: 35 Member Companies to Participate in a Multi-Vendor Demonstration

| | ,

OIF highlights how interoperability enables scalable, AI-era networks through Market Focus sessions and live demos

Fremont, Calif. – September 17, 2025 – OIF, together with 35 participating member companies, is shaping the future of AI-era networks by demonstrating how multi-vendor collaboration delivers real-world interoperability and enables the scale, speed, and efficiency that tomorrow’s networks demand at ECOC 2025 Exhibition, taking place from September 29 to October 1 in Copenhagen, Denmark.

Interoperability in Action

OIF’s live demonstration at booth #C3425 unites member companies across the ecosystem to prove that the building blocks of the future — optical, electrical, management and energy efficient interfaces — are ready for deployment. Showcasing interoperability in a complex, real-world environment, the demonstration highlights technologies including 400ZR, 800ZR, Multi-span Optics, Common Electrical I/O (CEI) CEI-448G, CEI-224G, CEI-112G, Co-Packaging, Common Management Interface Specification (CMIS), Energy Efficient Interfaces (EEI) and more — illustrating how standards enable networks to scale for AI and data-intensive applications.

800ZR, 400ZR and Multi-Span Optics – Optical Breakthroughs: Better Than Before

This demonstration will present the latest developments in interoperability for pluggable coherent optics, providing a thorough overview of their features and applications. The single-span demo highlights include 800ZR multivendor interop between modules using five different DSPs alongside the foundational OIF 400ZR application. For multi-span connectivity, the demonstration will feature OpenZR+, 100ZR and 800G OpenROADM across multiple network infrastructures.

CEI-448G, 224G and 112G – Driving Innovation and Collaboration for Future-Oriented Data Centers

At ECOC, OIF will showcase interoperability and innovation at the electrical interface with 448G and 224G CEI demonstrations that span the full spectrum of next-generation connectivity. The 448G demo focuses on hyperscaler needs for scaling AI networks, while expanded CEI-224G showcases bring greater ecosystem participation and highlight diverse link types from Very Short Reach (VSR) to Long Reach (LR) and Linear. In collaboration with the EEI track, OIF will also demonstrate energy-efficient electro-optical innovation across retimed, half-retimed (RTLR) and unretimed (Linear) pluggable optics. These demonstrations highlight the strength of the CEI ecosystem, proving robust interoperability across vendors and link types while advancing scalable, high-performance connectivity.

EEI and Co-Packaging – Revolutionizing Connectivity

OIF members will present achievements enabling energy efficient electrical and optical interfaces with both live and conceptual demonstrations of next-generation EEI solutions for AI compute, along with live External Laser Small Form-Factor Pluggable (ELSFP) demos highlighting advancements in external laser sources critical for co-packaged optics architectures. Addressing energy efficiency is one of the highest-priority challenges faced by hyperscalers as they grow their AI resources to the next generation.

As part of this year’s demonstration, CMIS will run within a live, simulated network environment rather than as a standalone setup — underscoring the specification’s maturity and its role in enabling seamless, plug-and-play integration across disaggregated systems.

These member companies — system vendors, component and module suppliers, test and measurement providers, semiconductor and electronic design automation (EDA) companies, and leading connector and cabling manufacturers — are participating in the demo: 1Finity, Adtran, Alphawave Semi, Amphenol, Anritsu Corporation, AOI, Cadence Design Systems, Inc., CICT/Accelink, Ciena, Cisco, Coherent Corp., Eoptolink Technology, EXFO, Furukawa FITEL, HGGenuine, Juniper Networks (now part of HPE), Keysight Technologies, Lessengers, Ligent, Inc., Lumentum, Marvell, MaxLinear Inc., Molex, MultiLane, Nokia, Nubis Communications, O-Net, Samtec, SENKO Advanced Components, Sumitomo Electric Industries, Synopsys, Inc., Terahop PTE Ltd., TE Connectivity, US Conec and Wilder Technologies.

“Interoperability isn’t an abstract promise — it’s a market enabler,” said Nathan Tracy, OIF President (TE Connectivity). “By bringing these diverse technologies/challenges together under one roof, OIF is accelerating adoption, reducing risks and enabling operators, hyperscalers and vendors to move faster in addressing surging AI demand.”

Setting the Agenda at ECOC Market Focus

Beyond the exhibit floor, OIF leaders will deliver timely perspectives during ECOC’s Market Focus program, offering actionable insights into the forces reshaping networks:

Coherent Technology Advances in the Market, DCI Interop and Shorter Reaches for AI
Date: Tuesday, Sept. 30
Time: 12:20–12:35pm CEST
Presenter: Karl Gass, OIF Physical & Link Layer Working Group Optical Vice Chair

CMIS – The Interface that Ties Everything Together for AI
Date: Tuesday, Sept. 30
Time: 2:20–2:35pm CEST
Presenter: Ian Alderdice, OIF Physical & Link Layer Working Group Management Co-Vice Chair (Ciena)

Energy Efficiency in AI Applications – Making Sense of the Multiple Requirements
Date: Wednesday, Oct. 1
Time: 10:40–10:55am CEST
Presenter: Jeff Hutchins, OIF Board Member and Secretary/Treasurer, Physical & Link Layer Working Group Energy Efficient Interfaces Vice Chair (Ranovus)

448G Architectures For AI – Addressing the Challenges, Enabling the Future
Date: Wednesday, Oct. 1
Time: 12:00–12:15pm CEST
Presenter: Mike Klempa, OIF Board Member and Physical & Link Layer Interoperability Working Group Chair (Alphawave Semi)

Visit OIF at booth #C3425 or learn more about the OIF Demo at ECOC 2025 here.

About OIF
OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 160+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF on LinkedIn, on X, on Bluesky and at https://www.oiforum.com/.

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
leah@wilkinson.associates
703-907-0010

OIF Achieves Milestone with Largest Ever Multi-Vendor Interoperability Demo at ECOC 2023, Featuring 39 Companies Accelerating Implementation of Next-Generation Capabilities

| | ,

Demos will highlight interoperability work in four areas – 400ZR+; Co-Packaging solutions; CEI-112G & CEI-224G and CMIS implementations

Fremont, Calif.— OIF, where the optical networking industry’s interoperability work gets done, will showcase its largest-ever multi-vendor interoperability demonstration at ECOC 2023, being held October 2-4 in Glasgow, Scotland. Additionally, during ECOC, OIF will continue its commemoration of 25 years dedicated to driving meaningful progress in the industry.

39 companies will participate in live and static interoperability demos at OIF’s booth #304, highlighting advancements in four key technology areas: 400ZR+ optics, Co-Packaging solutions, Common Electrical I/O (CEI) channels and Common Management Interface Specification (CMIS) implementations.

“OIF stands at the forefront of critical multi-vendor interoperability efforts, driving the industry’s evolution and providing the transformative technical solutions to meet the rapidly growing demand for broadband access,” said Mike Klempa, Alphawave Semi and Chair of the OIF Physical & Link Layer Interoperability Working Group. “As a member-driven organization, our work remains at the cutting edge, aligned with the industry’s needs and fostering collaboration to accelerate product development and solutions to market. For 25 years, we have been instrumental in facilitating industry progress. This year’s largest-ever demo underscores the vital role we play in shaping the network and the significance of our work in advancing the industry overall.”

The collaborative efforts of OIF’s network operator, system vendor, component vendor and test equipment vendor members will be on display at ECOC, illustrating their contributions in driving the adoption of technologies for both present and future networks. OIF member companies participating in the demo are Adtran; Alphawave Semi; Amphenol; Applied Optoelectronics, Inc.; Broadcom Inc.; Cadence Design Systems, Inc.; Casela Technologies; Ciena; Cisco Systems; Coherent; Credo Technology Group; Eoptolink; EXFO; Fujitsu Optical Components; Hisense Broadband; Infinera; Juniper Networks; Keysight Technologies; Linktel Technologies; Lumentum; MACOM Technology Solutions; Molex; MultiLane, Inc.; NEC Corporation; Nokia; O-Net Technologies; Precision Optical Transceivers, Inc.; Quantifi Photonics; Samtec; Semtech; Senko Advanced Components; Sicoya; Source Photonics; Sumitomo Electric Industries; Synopsys; Telefonica S.A.; VIAVI Solutions and Wilder Technologies. The interoperability demo is supported by participating companies Telefonica and LightRiver. Telefonica is the hosting consulting network operator, and LightRiver is a host for technology-specific pre-demonstration integration testing.

About OIF

OIF is where the optical networking industry’s interoperability work gets done. Celebrating 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 140+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn, on Threads and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

leah@wilkinson.associates

703-907-0010

 

OIF to Showcase 25 Years of Driving Optical Networking Transformation at NGON & 5G Transport 2023, Hosts Sessions on Interoperability Advancements in 800LR/ZR, 400ZR, CEI, CMIS and Co-Packaging

| | ,

Fremont, Calif.—May 22, 2023 – OIF will share updates on its latest projects and highlight its 25-year legacy of driving critical standards and advancing optical networking at NGON & 5G Transport 2023 in Cote d’Azur, France, May 30 – June 1, 2023.

The sessions will provide attendees with insights into OIF’s latest projects and advancements in 800LR/ZR, 400ZR, CEI, CMIS and Co-Packaging, underscoring OIF’s commitment to advancing the optical networking industry.

“We are excited to showcase our 25 years of work in advancing the optical networking industry and highlight key projects at NGON & 5G Transport 2023,” said Nathan Tracy, TE Connectivity and OIF Market Awareness & Education Committee Co-Chair, Physical & Link Layer (PLL). “Our commitment to progressing technology through interoperability has been integral to the growth and evolution of the optical networking industry, and we look forward to sharing our latest work.”

The workshop titled “OIF: Bringing Order to Chaos,” which will feature Dave Brown, OIF Director of Communications, Nokia and Karl Gass, OIF PLL Working Group Optical Vice Chair, will take place on Tuesday, May 30, 2023, from 9:00 am – 10:30 am CEST.

The “IP-Optical with Coherent Optics” panel will take place on Wednesday, May 31, 2023, from 5:10 pm – 5:40 pm CEST. The OIF-hosted panel, moderated by Karl Gass, OIF PLL Working Group Optical Vice Chair will include panelists Edward Echeverry, Transport and SDN Network Engineer, Telefonica; and Ian Redpath, Research Director, Transport and Components, Omdia.

About OIF

OIF is where the optical networking industry’s interoperability work gets done. Celebrating 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 140+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

leah@wilkinson.associates

703-907-0010

 

 

OIF Launches the Industry’s First Co-Packaging Standard – the 3.2T Co-Packaged Module Implementation Agreement

| | ,

Organization’s first project under the umbrella of the Co-packaging Framework Document

Fremont, Calif.—April 5, 2023 – OIF, celebrating 25 years of getting the optical networking industry’s interoperability work done, continues to be at the forefront of the industry, promoting collaboration and coordination among different players in the supply chain and driving efforts to foster a co-packaging ecosystem to support innovative applications.

An industry-first, the OIF-Co-Packaging-3.2T-Module-01.0 – Implementation Agreement for a 3.2Tb/s Co-Packaged (CPO) Module defines a 3.2T co-packaged module that targets Ethernet switching applications utilizing 100G electrical lanes and provides backward compatibility with 50G lanes. The module definition can be in the form of an optical module or a passive copper cable assembly and provides ~140G/mm of bandwidth edge-density. It can enable optical and/or electrical interfaces for a 51.2Tb/s aggregate bandwidth switch.

“OIF’s members are committed to driving innovation and progress in co-packaging, continuously seeking ways to improve and innovate,” said Jeff Hutchins, OIF PLL Working Group Co-Packaging Vice Chair and Board Member, Ranovus. “This IA is part of a trio of projects which include the Framework project and the External Laser Small Form Factor Pluggable (ELSFP) project. Building on OIF’s successful track record of coherent and laser module IAs, it addresses the market need for interoperable integrated optics standardization identified by the CPO Framework IA.”

The new IA includes interoperability specifications for the 3.2 Tb/s CPO modules, including:

  • 8x400Gb/s optical interface options for FR4 and DR4 connectivity
  • 32 x CEI-112G-XSR host interface (or 32 x CEI-56G-XSR in “backwards compatible” mode)
  • Opto-mechanical module specifications
  • Electrical specifications
  • Control and management interface, enabled by enhancements to the existing OIF CMIS specification

“Considerable progress has been made in co-packaging, and this new IA, along with a collaborative ecosystem, is a critical piece to propel the technology so that it meets industry needs, including that of Cloud service providers as they build their next-generation AI networks,” said Richard Ward, Technical Editor of the OIF 3.2T Co-Packaged Module IA, Astera Labs. 

At OFC 2023 in March, OIF revealed its progress in co-packaging specifications in a set of interoperability demonstrations. The demos included pivotal multi-vendor elements to enable co-packaging architectures, including live demos for the External Laser Small Form Factor Pluggable (ELSFP) external laser source form factor, co-packaged 3.2T copper cable assemblies, an operating linear optical module, and a variety of optical connectivity solutions as well as an expanded set of OIF member participants representing the growing ecosystem.

About OIF

OIF is where the optical networking industry’s interoperability work gets done. Celebrating 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 140+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

leah@wilkinson.associates

703-907-0010

OIF Hosts Largest Ever Multi-Vendor Interoperability Demonstration of the Solutions Accelerating Next-Generation Capabilities at OFC 2023; Celebrates 25 Years of Interoperability Work

| | ,

More than 30 global companies will participate in this year’s interoperability demo in four areas – 400ZR; Co-Packaging architectures, CEI-112G & CEI-224G and CMIS implementations

Fremont, Calif. – OIF, celebrating 25 years of getting the optical networking industry’s interoperability work done, is hosting the largest ever multi-vendor interoperability demonstration at OFC 2023, March 7-9 in San Diego, California.

 

 

 

A record number of participants, more than 30 OIF-member companies, are participating in demonstrations in OIF’s booth, #5101, in four critical areas: 400ZR optics, Co-Packaging architectures, Common Electrical I/O (CEI) architectures and Common Management Interface Specification (CMIS) implementations.

“Given the pace of demand for access to broadband and the revolutionary technical advancements needed to support that demand, interoperability is more important than ever,” said Mike Klempa, Alphawave Semi, and OIF Physical & Link Layer Interoperability Working Group Chair. “This year marks 25 years of industry-changing work bringing together an ecosystem of members to solve some of the network’s greatest challenges, so it’s no surprise that OIF’s demo at OFC will be the largest it’s ever hosted.”

The live and static interoperable optical networking solutions demo at OFC will feature 34 OIF member companies – ADVA; Alphawave Semi; Amphenol; Astera Labs; Cadence Design Systems, Inc.; Casela Technologies; Ciena; Cisco Systems; Coherent; ColorChip Group; EXFO; InnoLight Technology; Juniper Networks; Keysight Technologies; Lumentum; MACOM Technology Solutions Inc.; Marvell; Microchip Technology Incorporated; Molex; MultiLane, Inc.; NEC Corporation; Nokia; O-Net Communications; Precision Optical Transceivers, Inc.; Quantifi Photonics; Samtec; Senko Advanced Components; Sicoya; Source Photonics; Sumitomo Electric Industries; Synopsys; TE Connectivity; US Conec and Wilder Technologies.

To commemorate its 25th anniversary during OFC, OIF will host a special session, “Bringing Order to Chaos – OIF,” on Wednesday, March 8 at 3 pm PT, Theater 3. The one-hour session will feature OIF leadership, Karl Gass, OIF and Nathan Tracy, OIF, TE Connectivity, and special guests: Stephen Hardy, Lightwave; Vladimir Kozlov, LightCounting; Sterling Perrin, Heavy Reading/Omdia and Alan Weckel, 650 Group.

A celebration reception will follow at OIF Booth #5101 – Wednesday, March 8, at 4 pm PT.

More details to be announced.

About OIF

OIF is where the optical networking industry’s interoperability work gets done. Celebrating 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 140+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

leah@wilkinson.associates

703-907-0010

 

OIF to Present “Co-Packaging Standardization Progress” Webinar to Provide Updates on Overcoming Implementation Challenges to Enable Interoperability

| | ,

In partnership with Lightwave, the online event will feature a discussion between end-users, equipment developers and component vendors

Fremont, Calif. – OIF continues to drive discussion and work toward industry interoperability through an upcoming webinar, “Co-Packaging Standardization Progress,” being held on Wednesday, February 2, 2022, at 7:00am PST/9:00am CST/10:00am EST/3:00pm GMT. The free event, hosted by Lightwave, will feature presentations and discussions with industry-leading experts from global organizations: Cisco, Intel, Ranovus, Sumitomo Electric and TE Connectivity. Register for this free event.

“Since OIF’s work in co-packaging technologies began in July 2020, we have seen an increased interest and active participation industry-wide for interoperable solutions,” said Jeff Hutchins, Ranovus and OIF Board Member and Physical and Link Layer (PLL) Working Group – Co-Packaging Vice Chair. “This webinar featuring industry-leading experts will explore the current state of standardization efforts and how we are tackling the challenges so that industry can engage this critical integration technology development.”

This webinar will review the co-packaging standardization efforts in progress and identify implementation challenges for electrical channels, external lasers, optical connectivity, packaging, etc. Webinar participants will learn about OIF’s Implementation Agreements (specifications) that are being developed and the latest information for assessing how to engage this critical new integration technology development.

Details are as follows:

February 2, 2022 – 7:00am-9:00am PST

Agenda

  • Welcome & Intro – Stephen Hardy, Lightwave and Jeff Hutchins, Ranovus, OIF Board Member and Physical & Link Layer Working Group – Co-Packaging Vice Chair
  • OIF Overview – Nathan Tracy, TE Connectivity, OIF VP of Marketing
  • Framework Overview – Ken Jackson, Sumitomo Electric
  • 3.2T Module – Richard Ward, Intel, OIF Market Awareness & Education Committee Co-Chair – Physical and Link Layer
  • External Laser Small Form Factor Pluggable (ELSFP) – Jock Bovington, Cisco
  • Co-Packaging Electrical Interfaces – Yi Tang, Cisco
  • Q&A – Stephen Hardy, Lightwave and Jeff Hutchins, Ranovus

To register for the free event, click here. The webinar is open to the public, and a certificate of attendance will be offered.

 

About OIF

OIF is where the optical networking industry’s interoperability work gets done. Building on more than 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 125+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

Email: leah@wilkinson.associates

Office: 703-907-0010

 

OIF Launches Co-Packaging Framework Implementation Agreement Project

| | ,

Co-packaging of communication interfaces project establishes OIF’s leadership in this critical new area of standards for interoperability

Fremont, Calif. – OIF, the global industry forum accelerating market adoption of advanced interoperable optical networking solutions, today announced the start of the Co-Packaging Framework Implementation Agreement (IA) umbrella project. The new project start approval took place during last week’s Q420 Technical and MA&E Committee meetings held virtually November 2-6, 2020.

The Co-Packaging Framework IA will study the application spaces and relevant technology considerations for co-packaging of communication interfaces with one or more ASICs. A primary objective of this specification is to identify new opportunities for interoperability standards for possible future work at the OIF or other standards organizations. Upon completion, the work will be summarized in a Framework IA.

“It is critical that the industry be aligned on the solutions needed to move co-packaged interoperability forward,” said Jeff Hutchins, Ranovus and OIF Physical and Link Layer (PLL) Working Group – Co-Packaging Vice Chair. “With its member-driven focus, OIF is the ideal forum to facilitate industry conversation and drive interoperability of co-packaging with ASICs.”

The scope of the Co-Packaging Framework project is to:

  • Identify the key co-packaged applications and their requirements
  • Study and identify key issues associated with co-packaged optics
  • Identify opportunities and develop industry consensus to pursue interoperability standards
  • Document the study in the Framework IA (a technical whitepaper)
  • Launch follow-on standardization activities at the OIF or other appropriate standard bodies

In October, OIF’s public webinar “Co-Packaged Optics – Why, What and How” in partnership with Lightwave drew significant industry interest, reinforcing the need for industry discussion. The virtual event featured talks from industry-leading experts from: Cisco, Facebook, Intel, Juniper Networks,  Microsoft, Ranovus, Senko Advanced Components and TE Connectivity. Click here for free on-demand viewing of this webinar.

 

About OIF
OIF is where the optical networking industry’s interoperability work gets done. Building on 20 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 100+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
Email: leah@wilkinson.associates
Office: 703-907-0010