OIF to Take Center Stage at OFC 2024 with Groundbreaking Multi-Vendor Interoperability Demonstrations and Expert Panels

| |

47 member companies will demonstrate innovations in coherent optics, electrical and energy efficient interfaces and management specifications

Fremont, Calif. – OIF’s record-breaking, multi-vendor interoperability demonstrations at OFC 2024 will spotlight groundbreaking interoperable solutions in 800ZR, 400ZR and OpenZR+ optics; Energy Efficient Interfaces (EEI) & Co-Packaging; 112G and 224G Common Electrical I/O (CEI); and Common Management Interface Specification (CMIS) implementations.

This year’s historic interoperability demonstration, the largest ever, not only underscores the progress of OIF member companies in tackling the industry’s most pressing demands but will also unveil multiple industry-firsts. Once again, OIF’s work positions the organization at the forefront of driving the industry forward, offering tangible solutions to the most pressing network challenges.

“The interoperable solutions being demonstrated in the OIF booth are critical to addressing the escalating needs of next-generation data center networking, artificial intelligence/machine learning (AI/ML) and disaggregation applications,” said Nathan Tracy, OIF President and TE Connectivity. “We’ve seen a 38 percent increase in demo participants compared to last year and the addition of nine new participating companies, which emphasizes the remarkable growth and impact of OIF’s work.”

Record-setting Interoperability Demos – 800ZR, 400ZR and OpenZR+ optics, EEI & Co-Packaging, 112G and 224G CEI and CMIS

800ZR, 400ZR and OpenZR+ Optics Interoperability Demos

The pluggable coherent optics demonstration will showcase progress in the latest advancements in 800ZR, 400ZR and ZR+ optics interoperability, offering a comprehensive view of their capabilities and applications. The demo highlights include the first public 800ZR multivendor interop; high transmit power, OpenZR+ over a 1000km, multi-span network; OpenROADM/ITU-T over that same network; and our foundational 400ZR collocated on the single-span network with 800ZR.

EEI & Co-Packaging Interoperability Demos

The EEI and Co-Packaging demo will feature pioneering methods for integrating multiple chips within a single package, driving a new era of enhanced performance and power efficiency in electronic devices. OIF members will display a conceptual demo of AI backend compute utilizing next generation energy efficient interfaces as well as live demos showcasing the latest advancements for external laser sources. This demo highlights innovative approaches that are revolutionizing the performance and power efficiency of electronic device design.

112G and 224G CEI Interoperability Demos

OIF is advancing its pioneering efforts in interoperability with the expansion of its industry-first demonstration of 224G CEI multi-vendor interoperability, the electrical interface for future optical solutions. Additionally, OIF’s demonstration of a 112G CEI Linear ecosystem has broadened, driven by the interoperability of multivendor SerDes links with multi-vendor LPOs, supported by test and measurement validation at each stage of the link.

CMIS Interoperability Demos

The CMIS demo will feature an array of CMIS-managed modules integrated into routers, switches and test gear from various vendors, providing a firsthand glimpse into CMIS’ effective management of modules in real-world applications. Its focus is on the path to plug and play illustrating how modules communicate their capabilities, enabling hosts to manage them seamlessly without requiring specific code for each module.

Live and Interactive Demonstrations: 47 Member Company Participants

The demonstrations in OIF’s booth #1323 will highlight the collaborative efforts of system vendors, component vendors and test equipment vendors, emphasizing their contributions to advancing technology adoption in both present and future networks.

Participating member companies are Adtran; Alphawave Semi; Amphenol; Anritsu; AOI; Astera Labs; Ayar Labs; Broadcom Inc.; Cadence Design Systems, Inc.; Casela Technologies; CICT/Accelink; Ciena; Cisco Systems; Coherent Corp.; Corning; Eoptolink; EXFO; HG Genuine; Hisense; Infinera; Juniper Networks; Keysight Technologies; Lessengers; Linktel Technologies; Lumentum; Luxshare-Tech; MACOM Technology Solutions; Marvell; Molex; MultiLane; NEC; Nokia; Nubis Communications, Inc.; O-Net Technologies; Optomind; Precision Optical Technologies, Inc.; Quantifi Photonics; Samtec; Semtech; Senko Advanced Components; Sumitomo Electric Industries; Synopsys; TE Connectivity; US Conec; Viavi Solutions; Wilder Technologies and Wistron.

In addition to the in-booth demonstrations, OIF experts will lead two panel discussions on the exhibit floor, providing valuable insights into the industry’s latest advancements:

OIF Panels

Wednesday, March 27, 2024: Coherent Optics Unleashed: From 400ZR Success to 800ZR/LR Advancements and 1600ZR Kick-off – An OIF Update

  • Time: 4 pm – 5 pm PT
  • Location: Theater 1
  • Moderator: Karl Gass, OIF Physical & Link Layer Interoperability (PLL) Working Group (WG) Optical Vice Chair
  • Panelists: Sebastien Gareau (Ciena), Jeff Rahn (Meta), Gert Sarlet (Coherent), Tom Williams (Cisco)

Thursday, March 28, 2024: Energy Efficient Interfaces – Reining in Power Consumption Trends for Next-Generation Optical Networking

  • Time: 1:45 pm – 2:45 pm PT
  • Location: Theater 1
  • Moderator: Jeff Hutchins, OIF PLL WG EEI Vice Chair and Board Member (Ranovus)
  • Panelists: Craig Thompson (NVIDIA), Yi Tang, OIF PLL WG Electrical Vice Chair (Cisco), Nathan Tracy, OIF President (TE Connectivity)

For more information about OIF at OFC 2024, please visit: https://www.oiforum.com/meetings-events/oif-ofc-2024/

About OIF

OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 150+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF on LinkedIn, on X at @OIForum and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

leah@wilkinson.associates

703-907-0010

OIF to Showcase Interoperability at OFC 2024 with Nearly 50 Member Companies Collaborating to Address Unprecedented Demand for Next-Generation Network Solutions

| | ,

Demos include 800ZR, 400ZR and OpenZR+ optics, Energy Efficient Interfaces (EEI) & Co-Packaging, Common Electrical I/O (CEI) channels and Common Management Interface Specification (CMIS) implementations

Fremont, Calif. – OIF, where the optical networking industry’s interoperability work gets done, will be a focal point at OFC 2024, where a record-setting 47 member companies will showcase the groundbreaking interoperable solutions that are addressing the unprecedented demand for next-generation data center networking, artificial intelligence/machine learning (AI/ML) and disaggregation applications.

OIF’s OFC demo this year features nine new participating companies and marks a 38 percent increase in participants compared to the OFC 2023 demo. The live and interactive multi-vendor demonstrations in booth #1323 will feature interoperability solutions in 800ZR, 400ZR and OpenZR+ optics, Energy Efficient Interfaces (EEI) & Co-Packaging, Common Electrical I/O (CEI) channels and Common Management Interface Specification (CMIS) implementations that are addressing the speed, power and density challenges that will define the industry landscape for the next decade.

“OFC 2024 serves as an unparalleled platform for OIF members to spotlight their collaborative efforts in driving the evolution of optical networking solutions,” said Mike Klempa, OIF Physical & Link Layer Interoperability Working Group Chair and Alphawave Semi. “This year’s historic, largest-ever interoperability demonstration not only underscores the capabilities of OIF member companies in addressing the industry’s pressing demands, but will also unveil multiple industry-firsts, once again positioning OIF and its work as driving the industry and designing real solutions for pressing network challenges.”

The demos will spotlight the combined efforts of system vendors, component vendors and test equipment vendors underscoring their significant contributions to advancing technology adoption in both present and future networks. Participating member companies are Adtran; Alphawave Semi; Amphenol; Anritsu; AOI; Astera Labs; Ayar Labs; Broadcom Inc.; Cadence Design Systems, Inc.; Casela Technologies; CICT/Accelink; Ciena; Cisco Systems; Coherent Corp.; Corning; Eoptolink; EXFO; HGGenuine; Hisense; Infinera; Juniper Networks; Keysight Technologies; Lessengers; Linktel Technologies; Lumentum; Luxshare-Tech; MACOM Technology Solutions; Marvell; Molex; MultiLane; NEC; Nokia; Nubis Communications, Inc.; O-Net Technologies; Optomind; Precision Optical Technologies, Inc.; Quantifi Photonics; Samtec; Semtech; Senko Advanced Components; Sumitomo Electric Industries; Synopsys; TE Connectivity; US Conec; Viavi Solutions; Wilder Technologies and Wistron.

For more information about OIF at OFC 2024, please visit: https://www.oiforum.com/meetings-events/oif-ofc-2024/

About OIF

OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 150+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF on LinkedIn, on X at @OIForum and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

leah@wilkinson.associates

703-907-0010

 

 

 

OIF Launches 1600ZR+ Coherent Optical, Retimed Tx Linear Rx Optical Energy Efficient Interfaces Projects and Common Management Interface Specification White Paper at Q1 2024 Technical and MA&E Meeting

| | ,

Fremont, Calif. – OIF, where the optical networking industry’s interoperability work gets done, successfully concluded its Q1 2024 Technical and MA&E meeting in Jacksonville, Florida held January 16-18.

OIF’s quarterly member meetings serve as a platform for collaboration and innovation within the optical networking industry. This meeting resulted in the initiation of two new projects – the Interoperable 1600ZR+ and Retimed Tx Linear Rx Specs Energy Efficient Interfaces (EEI) projects – the reelection of the Physical and Link Layer (PLL) Working Group (WG) Chair and a white paper focused on advancing plug and play for Common Management Interface Specification (CMIS) modules. The meeting also featured Andrew Schmitt, Cignal AI as a guest speaker.

“OIF’s quarterly membership meetings serve as a vital nexus for industry leaders to converge, collaborate and propel the field forward,” said Nathan Tracy, OIF President and TE Connectivity. “These meetings are invaluable platforms for members to share insights, discuss and debate ongoing work and launch new projects. The synergy of minds and the shared commitment to innovation in these meetings not only ensures the timely execution of current initiatives but also lays the groundwork for solutions that have a tangible impact on the market now and in the years to come. It is through this collaborative spirit that OIF continues to be a driving force in advancing optical networking standards and technologies, fostering a community that thrives on the exchange of ideas and the collective pursuit of excellence.”

NEW PROJECTS

Interoperable 1600ZR+

The new OIF Interoperable 1600ZR+ project complements the 1600ZR project unveiled last September (2023). Responding to market demand for higher-performance (ZR+) modes, OIF is working towards integrating these modes into its application scope for 1600 Gb/s interfaces.

“OIF recognizes the importance of consolidated requirements in the ZR/ZR+ space to streamline development costs and enhance industry collaboration,” said Karl Gass, OIF PLL WG – Optical Vice Chair. “This project reinforces OIF’s role as the forum for coherent line interface discussions and demonstrates leadership by facilitating the evolution of next-generation technologies.”

Retimed Tx Linear Rx Specs EEI Project

OIF has launched the Retimed Tx Linear Rx Specs EEI project, focusing on developing specifications for Retimed Tx Linear Rx (RTxLRx). The initial applications target Ethernet and Artificial Intelligence/Machine Learning (AI/ML), operating at 200G/lane over 500m single mode fiber (SMF) and 100G/lane over 30m multimode fiber (MMF), with potential for alternate applications. The project aims for full plug and play functionality in both electrical and optical domains, meeting the industry demand for power and latency savings. RTxLRx addresses constraints found in Linear Pluggable Optics (LPO) and provides flexibility, making it a candidate when LPO is not suitable.

“Embracing innovation, OIF maintains its pathfinder role in shaping new optical interface approaches,” said Jeff Hutchins, OIF Board Member and PLL WG – EEI Vice Chair and Ranovus. “Building upon the foundation laid by the ongoing work in the OIF PLL, our commitment extends to expanding the scope, diversity and standards of optical interfaces specified by OIF, ushering in a new era of connectivity and possibilities.”

White Paper: Path to CMIS Plug and Play

In response to key challenges identified by members, OIF unveiled a white paper project on advancing plug and play for CMIS-managed modules. Feedback has emphasized difficulties in consistently managing modules from different vendors and the need for extensive host development with new module introductions. This white paper will provide practical recommendations to enhance plug and play. It focuses on creating guidelines that empower hosts to manage third-party modules effectively, with the goal of enabling seamless integration of new or unknown modules without requiring host software changes. The proposed guidelines will prioritize simplifying provisioning processes and improving module-to-host integration for enhanced efficiency in optical networking.

“This white paper will enhance the transformative power of CMIS, unveiling its capacity to revolutionize network management and interoperability,” said Ian Alderdice, OIF PLL Working Group – Management Co-Vice Chair and Ciena. “By providing valuable insights, it becomes a beacon guiding the evolution of optical networking standards, paving the way for a future where efficiency and seamless integration define the technological landscape.”

PLL WG Chair

OIF announced the reelection of David Stauffer, Kandou Bus, as PLL WG Chair.

Special Guest Speaker: Andrew Schmitt, Cignal AI

The Q1 meeting featured guest speaker, Andrew Schmitt from Cignal AI, who shared valuable insights into the latest trends and developments in the optical networking industry. His presentation provided attendees with a comprehensive understanding of the current landscape and future possibilities within the field.

“OIF is an excellent forum for establishing standards on rapidly emerging technologies, and it is well-positioned to tackle the tough problems network operators and their suppliers face,” said Schmitt. “This meeting’s kick off of the 1600ZR+ process – a third generation follow up to the hugely successful 400ZR project – marks a major milestone for the industry. Further increasing the ease of deployment for 400ZR technology via CMIS is also a very valuable endeavor.  I’m excited about these OIF initiatives and very pleased to offer Cignal AI’s current perspective on the market to such a capable and effective audience.”

About OIF

OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 150+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF on LinkedIn, on X at @OIForum and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

leah@wilkinson.associates

703-907-0010

 

OIF Unveils CEI-112G-XSR+-PAM4 Extended Extra Short Reach Implementation Agreement, Paving the Way for Advanced Interconnectivity

| | ,

Organization also releases C-CMIS IA, publishes AI network operations and 400ZR+ demo white papers and announces next CMIS webinar

Fremont, Calif. – OIF, where the optical networking industry’s interoperability work gets done, has published a new Implementation Agreement (IA) for Common Electrical I/O (CEI) CEI-112G-XSR+-PAM4 Extended Extra Short Reach.

The CEI-112G-XSR+-PAM4 IA specifies a 112 Gb/s PAM4 electrical interface for die-to-die (D2D) and die-to-optical-engine (D2OE) interconnect with bump-to-bump insertion loss up to 13 dB at the Nyquist frequency and baud rate in the range 36 Gsym/s to 58 Gsym/s. The intended applications encompass multiple-chip modules (MCM), co-packaged optics (CPO) and near-package optics (NPO) assemblies. It also details the requirements for the CEI-112G-XSR+-PAM4 extended extra short reach high-speed electrical interface with nominal baud rates between 36 Gsym/s and 58 Gsym/s using PAM4 modulation.

“The CEI-112G-XSR+-PAM4 IA represents a significant milestone, extending the reach of previously published XSR class specifications at this speed range,” said David Stauffer, OIF Physical and Link Layer Working Group Chair and Kandou Bus, S.A. “This IA empowers advanced interconnectivity solutions in die-to-die and die-to-optical-engine scenarios, supporting baud rates up to 112 Gb/s (58 Gsym/s). These specifications have the opportunity to revolutionize multiple-chip modules, co-packaged optics, and near-package optics applications, pushing the boundaries of high-speed data transmission.”

Matt Brown, editor of the CEI-112G-XSR+-PAM4 IA and Alphawave Semi, added, “The CEI-112G-XSR+-PAM4 IA addresses a gap in the set of OIF CEI specifications to address new applications identified by the diverse membership of the OIF.”

OIF also recently released the Coherent Common Management Interface Specification (C-CMIS) IA 1.3, published an Application of Artificial Intelligence (AI) to Enhanced Network Operations technical white paper, published the ECOC 400ZR+ demo white paper and launched a series of CMIS technical webinars.

C-CMIS IA 1.3: This Implementation Agreement extends the Common Management Interface Specification [CMIS] to allow the management of digital coherent optics (DCO) modules. Initially covering 400ZR modules, this IA supports the management of modules that have a single data path with an eight-lane host interface for a 400GBASE-R Ethernet signal and a single-lane 400G coherent media interface based on the 400ZR specification. Future extensions to accommodate other DCO modules are anticipated.

Application of Artificial Intelligence (AI) to Enhanced Network Operations Technical White Paper: This new white paper addresses the interoperability requirements for enhanced network functions that interface between transport networks and their management-control systems. It identifies various use cases for applying AI to guide interoperability and provides insights into data requirements, processing needs, output specifications and interfaces relevant to each use case.

ECOC 400ZR+ Demo White Paper: This paper presents the methodology and results of an interoperability study of OpenZR+ MSA QSFP-DD transceivers conducted during the ECOC 2023 plugfest. Ten different transceivers were cross-connected in a matrix of transmitter-to-receiver combinations using a noise-loaded link to characterize the penalties associated with supplier interoperability. Individual transceiver performance was tested using 400GE traffic over a shortened optical line system link with a DWDM 75GHz fixed channel grid and a separate configuration to capture the transmitter error vector magnitude (EVM) performance. The transceiver receiver OSNR performance is compared against the transceiver transmitter EVM performance for each vendor.

CMIS Technical Webinar Series: OIF is hosting a series of free, public CMIS tutorial webinars. The next webinar, “Data Path State Machine (DPSM) and Application Advertising,” will be held on February 7th. These webinars aim to equip engineers, developers and industry professionals with a comprehensive understanding of CMIS. More information on the series can be found here.

 

About OIF

OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 150+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

leah@wilkinson.associates

703-907-0010

OIF Experts to Provide Technology Updates on Power Consumption in Next Generation Optical AI Networking, Common Electrical I/O (CEI) Trends at DesignCon 2024

| | ,

Fremont, Calif. – OIF experts will provide valuable insights into the latest trends and developments in power consumption in optical AI networking and 224 Gbps Common Electrical I/O (CEI) at DesignCon 2024, taking place from January 30 to February 1, 2024, in Santa Clara, California.

DesignCon is the premier event for chip, board and systems design engineers in the high-speed communications and semiconductor industries. This year, OIF will lead two panel discussions:

Panel 1 – Wednesday, January 31, 2024: 12:15pm – 1pm PT

Reining in Power Consumption Trends for Next Generation Optical Networking – this panel will focus on strategies to address the ever-increasing power consumption challenges in the next generation of optical networking, featuring experts from leading companies in the field.

Moderator: Jeff Hutchins, Physical and Link Layer (PLL) Working Group (WG) Energy Efficient Interfaces (EEI) Vice Chair and Board Member, Ranovus

Panelists: Karl Bois, OIF Technical Committee Chair, NVIDIA; Yi Tang, OIF PLL WG Electrical Vice Chair, Cisco; and Nathan Tracy, OIF President, TE Connectivity

Panel 2 – Wednesday, January 31, 2024: 4pm – 5:15pm PT

OIF Update on 224 Gbps CEI Development – in this session, OIF will provide updates on the development of 224 Gbps CEI with insights from industry leaders involved in this cutting-edge technology.

Moderator: Nathan Tracy, OIF President, TE Connectivity

Panelists: John Calvin, Keysight Technologies; Mike Klempa, OIF PLL Interoperability WG Chair, Alphawave Semi; Mike Li, OIF Board Member, Intel and Cathy Liu, OIF Vice President, Broadcom Inc.

“Our participation at DesignCon 2024 underscores OIF’s commitment to driving technological innovation,” said Tracy. “These panel discussions offer a unique opportunity to learn from some of the industry’s foremost thought leaders and gain critical insights into OIF’s work. DesignCon provides a platform for connecting with colleagues, sharing insights and collectively shaping the future of optical networking and CEI. It’s where collaboration meets innovation.”

CMIS Technical Webinar Series: Separate from DesignCon, OIF is also hosting a series of free, public CMIS tutorial webinars. These webinars aim to equip engineers, developers and industry professionals with a comprehensive understanding of CMIS. The next session in the series – Data Path State Machine (DPSM) and Application Advertising – will be held on Wednesday, February 7, 2024. Presenters are Doug Cattarusa, Technical Marketing Engineer, Cisco and Paul Brooks, Applications and Technology, VIAVI Solutions. More information on the series can be found here.

About OIF

OIF is where the optical networking industry’s interoperability work gets done. With more than 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 150+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

leah@wilkinson.associates

703-907-0010

 

OIF to Host Common Management Interface Specification (CMIS) Tutorial Webinar: “Exploring the Technical Depths of CMIS”

| | ,

Fremont, Calif.—November 14, 2023 – Recognizing the crucial role that CMIS plays in the industry’s ability to harness the full potential of emerging technologies, OIF will host a free, public CMIS tutorial webinar on Tuesday, December 5th, 2023, from 7:00 am to 8:30 am Pacific Time (PST). In the rapidly evolving landscape of networking technologies, being informed about the tools that can streamline functionality and integration is paramount.

OIF is committed to ensuring the industry is up to speed on the progress of CMIS. With this commitment in mind, this webinar kicks off a series of free, public CMIS tutorial webinars – each focusing on individual CMIS functions.

“We are excited to offer this CMIS tutorial webinar, which aims to provide attendees with an in-depth technical knowledge of CMIS, a vital component in today’s optical networking landscape,” said Ian Alderdice, OIF PLL Working Group Management Co-Vice Chair, Ciena. “This session will empower participants to harness the full potential of CMIS, enabling them to make more informed decisions and innovations in the field.”

Building upon the success of OIF’s “CMIS Demystified” webinar last year, this tutorial is designed to take participants one level deeper into the world of CMIS, offering a more profound exploration of the technical intricacies behind its major functions. The webinar, presented by OIF’s Management Working Group Leadership, will provide attendees with a comprehensive high-level technical understanding of CMIS, highlighting major functionalities such as Module State Machine (MSM), Applications advertising (Appsel) and Data Path State Machine (DPSM), Versatile Diagnostic Monitoring (VDM), Command Data Block (CDB) and Firmware (FW) upgrade.

Webinar: Exploring the Technical Depths of CMIS

Date and Time: Tuesday, December 5th, 2023, from 7:00 am to 8:30 am PT

Presenters: Gary Nicholl and Ian Alderdice – OIF’s Management Working Group Leadership

Agenda:

CMIS Overview – A deep dive into the major functionalities of CMIS

  • CMIS concepts
  • CMIS Memory Map
  • MSM
  • DPSM/Appsel
  • VDM
  • CDB
  • FW Upgrade

To attend this tutorial webinar and access Webex details, please visit https://www.oiforum.com/meetings-events/oif-webinar-cmis-tutorial-05dec23/. Registration is not required.

This webinar marks the beginning of a series designed to equip engineers, developers and industry professionals with a comprehensive understanding of CMIS.

“We’ve witnessed from discussions at industry conferences and testing events that there is a knowledge gap concerning the substantial value that CMIS brings to the industry by enabling the true plug-n-play paradigm that customers are now demanding,” said Gary Nicholl, OIF PLL Working Group Management Co-Vice Chair, Cisco. “Our aim with this webinar is to bridge that knowledge divide, connect the dots, and empower industry professionals with expert insights on CMIS.”

Subsequent webinars will delve into specific aspects of individual CMIS functions such as VDM, CDB, FW upgrade and DPSM/Appsel. These sessions will thoroughly explore register-level specifics, defining registers and explaining their interactions.

About OIF

OIF is where the optical networking industry’s interoperability work gets done. Celebrating 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 150+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn, on Threads and at http://www.oiforum.com.

 

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
leah@wilkinson.associates
703-907-0010

OIF Unveils 2023-2024 Board and Officers, Dedicated to Advancing Optical Networking Interoperability

| | ,

Fremont, Calif. – OIF, where the optical networking industry’s interoperability work gets done, today announced its newly elected 2023-2024 Board of Directors and Officers. The Technical Committee and Market Awareness & Education Committee Chairs were elected in person at the hybrid Q323 Technical Committee Meeting in Vancouver, Canada, while the Board positions were elected via email ballot. The new terms began on October 2, 2023.

2023 – 2024 Election Results

  • Board of Directors: 
    • Jeff Hutchins, Ranovus, was re-elected to the Board and continues as Physical & Link Layer (PLL) Working Group – Co-Packaging Vice Chair
    • Mike Li, Intel, was re-elected to the Board
    • Jeffery Maki, Juniper Networks, was re-elected to the Board and continues as Physical Layer User Group Working Group Chair
    • Nathan Tracy, TE Connectivity, was elected to the Board and will serve as President

Continuing in their positions are:

    • Ian Betty, Ciena, continues to serve on the Board
    • Cathy Liu, Broadcom Inc., continues to serve on the Board and will serve as Vice President
    • Gary Nicholl, Cisco, continues to serve on the Board as Secretary/Treasurer and as PLL Working Group – Management Co-Vice Chair
  • Officers: 
    • Karl Bois, Nvidia, was elected as Technical Committee Chair
    • Dave Brown, Nokia, continues to serve as Director of Communications
    • Tom Issenhuth, Huawei Technologies, was elected as Market Awareness & Education Committee Co-Chair, PLL
    • Lyndon Ong, Ciena, was re-elected as Market Awareness & Education Committee Co-Chair, Networking
    • Klaus-Holger Otto, Nokia, was elected as Technical Committee Vice Chair

“Congratulations to both the new and returning Board of Directors and Officers, we extend tremendous gratitude for their unwavering dedication and commitment of time to OIF,” said Nathan Tracy, President of OIF. “As a member-driven and volunteer-powered organization, these individuals hold pivotal roles in helping advance OIF’s mission to foster innovation and promote interoperability in today’s marketplace.”

About OIF
OIF is where the optical networking industry’s interoperability work gets done. Building on 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 150+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

Email: leah@wilkinson.associates

Office: 703-907-0010

 

OIF Showcases Multi-vendor Interoperability at ECOC 2023: Demo Features Nearly 40 Companies Demonstrating Innovation Across 400ZR+, Co-Packaging, CEI-112G & CEI-224G and CMIS

| | ,

Fremont, Calif.—September 20, 2023 – OIF’s demo at ECOC 2023 will feature a record 39 companies demonstrating innovation and collaboration across four sectors: 400ZR+ optics, Co-Packaging Solutions, Common Electrical I/O (CEI) channels and Common Management Interface Specification (CMIS) implementations. ECOC, taking place Oct. 2-4 in Glasgow, Scotland, provides an ideal platform for OIF and its member companies to showcase their multi-vendor interoperability achievements.

“This year’s massive demo is a testament to the collective progress made by the industry, and we are proud to have nearly 40 companies participating in our multi-vendor interoperability demonstrations,” said Mike Klempa, Alphawave Semi and Chair of the OIF Physical & Link Layer Interoperability Working Group. “With a focus on some of the most critical technologies driving industry progress, we will illustrate the exceptional strides OIF members have taken in fostering compatibility and facilitating innovation.”

The live and static interoperability demos being held at OIF’s booth, #304, will include: 

400ZR+ Optics Demo: Exhibiting cutting-edge optical networking technologies that enable high-speed data transmission over extended distances, opening new horizons for data centers and telecommunication networks.

OIF’s 400ZR project has played a pivotal role in facilitating the reduction of power and complexity for high-bandwidth data center interconnects and promoting interoperability among optical module manufacturers. We’ve expanded this year’s public demonstration to showcase progress to include the OpenZR+ and OpenROADM applications over a multi-span ROADM network.

The ECOC demo will consist of a full implementation of 400GE across numerous DWDM networks using multiple vendors—module, router, open-line system and test equipment— all collaboratively demonstrating the successful realization of interoperability objectives for these projects.

Co-Packaging Solutions Demo: Showcasing innovative approaches to integrating multiple chips within a single package, revolutionizing performance and power efficiency in electronic devices.

OIF remains at the forefront of the industry’s initiatives to facilitate co-packaging solutions using interoperable electrical and optical interfaces, featuring efficiency in terms of power consumption and high-bandwidth edge densities. This year’s interoperability showcase will highlight the key multi-vendor elements essential for enabling co-packaging architectures.

Live demonstrations will encompass the use of the External Laser Small Form Factor Pluggables (ELSFP) to power an optical link, all while being managed by the Common Management Interface Specification (CMIS). Additionally, various multi-vendor optical connectivity solutions will be on display.

Common Electrical I/O (CEI) Channels: Highlighting advancements in high-speed electrical interfaces, enhancing data-transfer rates and efficiency across various applications.

OIF is the industry leader in 224G hardware interconnection application spaces and definitions, achieving an industry-first milestone of multi-vendor interoperability at 224G. OIF is also moving quickly to address and define a low-power, low-latency 112G CEI specification for linear direct-drive optics. This initiative has resulted in a significant milestone: the first multi-vendor interoperability showcase of an ecosystem dedicated to advancing these efforts. Live, in the booth, system, linear pluggable optics and test and measurement equipment vendors will collaboratively demonstrate the advantages of this cutting-edge technology.

Participating members have come together to underscore OIF’s pivotal role in serving the developing supplier ecosystem. The CEI-224G and 112G demonstrations will showcase multi-party silicon supplier interoperability across a diverse array of Long Reach (LR), Medium Reach (MR) and VSR (Very Short Reach) links that address many widely used applications.

Common Management Interface Specification (CMIS) Implementations: Demonstrating management interfaces across diverse networking equipment, promoting streamlined control and management.

CMIS has established itself as the management interface of choice for next-generation pluggable modules, capable of managing both simple and advanced modules. CMIS provides a well-defined mechanism to initialize and manage optical and copper modules in a standard way, while still providing the capability to provide custom functionality. This commonality makes integrating different host platforms easier for both the host and module vendors.

The live CMIS demos at ECOC will show a variety of CMIS-managed modules in routers,  switches and test gear from different vendors and showcase how CMIS is used to manage modules in real-world applications.

OIF member companies participating in the demo are Adtran; Alphawave Semi; Amphenol; Applied Optoelectronics, Inc.; Broadcom Inc.; Cadence Design Systems, Inc.; Casela Technologies; Ciena; Cisco Systems; Coherent; Credo Technology Group; Eoptolink; EXFO; Fujitsu Optical Components; Hisense Broadband; Infinera; Juniper Networks; Keysight Technologies; Linktel Technologies; Lumentum; MACOM Technology Solutions; Molex; MultiLane, Inc.; NEC Corporation; Nokia; O-Net Technologies; Precision Optical Technologies; Quantifi Photonics; Samtec; Semtech; Senko Advanced Components; Sicoya; Source Photonics; Sumitomo Electric Industries; Synopsys; Telefonica S.A.; VIAVI Solutions and Wilder Technologies. The interoperability demo is supported by participating companies Telefonica and LightRiver. Telefonica is the hosting consulting network operator, and LightRiver is a host for technology-specific pre-demonstration integration testing.

“Attendees at ECOC can also look forward to celebrating OIF’s 25-year journey in fostering industry-wide collaboration and interoperability,” added Klempa.

To commemorate its 25 years of groundbreaking interoperability work, OIF will host a celebration at its booth from 4 pm to 5 pm on Tuesday, Oct 3.

About OIF

OIF is where the optical networking industry’s interoperability work gets done. Celebrating 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 140+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn, on Threads and at http://www.oiforum.com.

 

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
leah@wilkinson.associates
703-907-0010

OIF’s Q3 Technical and MA&E Committees Meeting Spurs Four New Innovative Projects – Link Training for 224G Electrical Interfaces, 1600ZR, Data Center/Optical Network Coordination, Energy Efficient Interfaces

| | ,

Fremont, Calif.—September 8, 2023 – OIF concluded its hybrid Q3 Technical and MA&E Committees Meeting, August 8-10 in Vancouver, BC, Canada, with the launch of four groundbreaking new projects. The meeting also featured guest speaker Ian Redpath, Research Director, Transport Networks and Components, Omdia.

“OIF’s quarterly meetings are a vital hub for fostering industry collaboration, thought leadership and innovation within the optical networking community,” said Klaus-Holger Otto, OIF Technical Committee Chair and Nokia. “By bringing together industry experts, visionaries and stakeholders, OIF and its members continue to shape a diverse range of cutting-edge technologies and solutions, addressing pivotal challenges and opportunities in the optical networking industry. The new projects and ongoing work in other critical areas are tangible proof of the organization’s value and significance.”

NEW PROJECTS

224G PAM4 protocol agnostic link training for electrical interfaces project

Electrical interface link training holds considerable significance throughout the industry. This project will define communication method, messaging format and contents, training patterns, states and sequences, diagnostics and fault handling, etc. for link training of a 224G PAM4 class electrical link. The objective is to enhance overall link performance, a critical factor, particularly under challenging conditions, to establish a functional connection.

As part of this initiative, the CEI (Common Electrical IO) framework will be expanded with an additional tool to encompass a comprehensive solution, reinforcing OIF’s leadership in the electrical/SERDES domain.

“This project is critical for OIF, yielding a standardized solution that seamlessly fosters SERDES interoperability and implementation, transcending the boundaries of specific applications,” said David Stauffer, OIF Physical & Link Layer Working Group Chair and Kandou Bus, S.A. “Through collaborative efforts with other industry groups, we aim to forge a consistent industry-wide solution that simplifies implementation.”

1600ZR Project

The 1600ZR project will define a power optimized solution for a multi-vendor interoperable 1600 Gbps coherent optical interface, with a focus on Data Center Interconnect (DCI) scenarios. This Implementation Agreement (IA) will create a comprehensive electrical/protocol/optical framework that facilitates realization into pluggable modules. It will also establish a reference point for additional applications that contribute to the growth of the coherent ecosystem.

“It has become clear that multiple evolution paths from 400ZR will be required in DCI transport,” said Ian Betty, OIF Board Member and Ciena. “While the 800ZR IA development is still ongoing, the group has started a parallel project to address the complexities of supporting 1.6T Ethernet clients in single span DCI applications for reaches of at least 80km. OIF is leading the industry by creating an IA for an interoperable 1.6T Ethernet coherent line interface designed for ZR/DCI applications. This project further validates that OIF is the platform for next-generation coherent line interface discussions and to facilitate the development of innovative applications and architectural solutions. We encourage network operators to actively participate in these efforts to help shape the specifications to best meet their needs.” 

Data Center Storage and Optical Multi-layer Coordination

Transaction failures in the financial industry are sometimes attributed to network issues such as jitter, intermittent disconnection and bit errors, caused by unstable DCI links. Fast fault detection and recovery of optical connections can be leveraged to address these issues and support new DC applications, by coordinating between the application layer and optical connections in the DCI network. This project will result in a white paper that will delineate anticipated scenarios, crucial technical requirements, and potential multi-layer protection solutions, and provide a comprehensive gap analysis regarding the coordination of storage and optical connections.

“This project stands as a testament to OIF’s mission to develop interoperable solutions for challenging optical interworking applications like DCI,” said Jia He, OIF Networking & Operations Working Group Chair and Huawei Technologies Co., Ltd.

System Vendor Requirements Document for Energy Efficient Interfaces

This project will result in a requirements document for Energy Efficient Interfaces (EEI) through input gathered by system vendors from end users and provide a list of prioritized applications and a basic set of requirements for the next generation of energy efficient electrical and optical links. A primary objective of this work is to provide guidance to the EEI Framework Project and future IAs based on the framework at the OIF or other standards organizations. 

“This project introduces a new area of standards for the OIF, expanding its ecosystem and industry influence,” said Jeffery Maki, OIF Physical Layer User Group Chair and Juniper Networks. “A key objective of this project is to outline user-driven prerequisites that will shape the trajectory of future EEI initiatives within the organization.”

Through these four new projects, OIF continues to reinforce its position as a driving force for progress and collaboration in the industry.

GUEST SPEAKER

Guest speaker, Ian Redpath, Omdia, engaged attendees with invaluable market insights on the optical network landscape. He also spotlighted the Dempster Highway Fiber Project, an extraordinary endeavor that has captured attention due to its innovative approach and potential to reshape connectivity in remote regions.

“For a quarter of a century, OIF’s work has remained pivotal within the optical sector, playing a vital role in enabling seamless collaboration and interoperability,” said Redpath. “During OIF’s recent Q3 member meeting, I was deeply impressed by the significant headway the organization has made in advancing CMIS, 800G ZR and 1600ZR solutions. As evidence of OIF’s impact, 400ZR has reached high volume deployment, paving the way for 100G ZR, 400ZR+, 800ZR and now 1600ZR. It was also my pleasure to present to members Omdia’s update on the Optical Network Market and Technology, featuring the Dempster Highway-Canadian Arctic fiber build project.”

ABOUT OIF

OIF is where the optical networking industry’s interoperability work gets done. Celebrating 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 140+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn, on Threads and at http://www.oiforum.com.

 

PR CONTACT

Leah Wilkinson

Wilkinson + Associates for OIF

leah@wilkinson.associates

703-907-0010

OIF Achieves Milestone with Largest Ever Multi-Vendor Interoperability Demo at ECOC 2023, Featuring 39 Companies Accelerating Implementation of Next-Generation Capabilities

| | ,

Demos will highlight interoperability work in four areas – 400ZR+; Co-Packaging solutions; CEI-112G & CEI-224G and CMIS implementations

Fremont, Calif.— OIF, where the optical networking industry’s interoperability work gets done, will showcase its largest-ever multi-vendor interoperability demonstration at ECOC 2023, being held October 2-4 in Glasgow, Scotland. Additionally, during ECOC, OIF will continue its commemoration of 25 years dedicated to driving meaningful progress in the industry.

39 companies will participate in live and static interoperability demos at OIF’s booth #304, highlighting advancements in four key technology areas: 400ZR+ optics, Co-Packaging solutions, Common Electrical I/O (CEI) channels and Common Management Interface Specification (CMIS) implementations.

“OIF stands at the forefront of critical multi-vendor interoperability efforts, driving the industry’s evolution and providing the transformative technical solutions to meet the rapidly growing demand for broadband access,” said Mike Klempa, Alphawave Semi and Chair of the OIF Physical & Link Layer Interoperability Working Group. “As a member-driven organization, our work remains at the cutting edge, aligned with the industry’s needs and fostering collaboration to accelerate product development and solutions to market. For 25 years, we have been instrumental in facilitating industry progress. This year’s largest-ever demo underscores the vital role we play in shaping the network and the significance of our work in advancing the industry overall.”

The collaborative efforts of OIF’s network operator, system vendor, component vendor and test equipment vendor members will be on display at ECOC, illustrating their contributions in driving the adoption of technologies for both present and future networks. OIF member companies participating in the demo are Adtran; Alphawave Semi; Amphenol; Applied Optoelectronics, Inc.; Broadcom Inc.; Cadence Design Systems, Inc.; Casela Technologies; Ciena; Cisco Systems; Coherent; Credo Technology Group; Eoptolink; EXFO; Fujitsu Optical Components; Hisense Broadband; Infinera; Juniper Networks; Keysight Technologies; Linktel Technologies; Lumentum; MACOM Technology Solutions; Molex; MultiLane, Inc.; NEC Corporation; Nokia; O-Net Technologies; Precision Optical Transceivers, Inc.; Quantifi Photonics; Samtec; Semtech; Senko Advanced Components; Sicoya; Source Photonics; Sumitomo Electric Industries; Synopsys; Telefonica S.A.; VIAVI Solutions and Wilder Technologies. The interoperability demo is supported by participating companies Telefonica and LightRiver. Telefonica is the hosting consulting network operator, and LightRiver is a host for technology-specific pre-demonstration integration testing.

About OIF

OIF is where the optical networking industry’s interoperability work gets done. Celebrating 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 140+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn, on Threads and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

leah@wilkinson.associates

703-907-0010

 

OIF Announces External Laser Small Form-Factor Pluggable (ELSFP) Implementation Agreement, Paving the Way for Advancements in Co-Packaged Optics Applications

| | ,

Fremont, Calif. – OIF, celebrating 25 years of getting the optical networking industry’s interoperability work done, today unveiled the External Laser Small Form-Factor Pluggable (ELSFP) Implementation Agreement (IA), defining a revolutionary front panel pluggable form factor tailored to co-packaged optical systems and other multiple laser external laser source applications.

The ELSFP IA introduces the first multi-sourced future-proof front panel pluggable external laser source form factor to address the evolving needs of the industry. This innovative IA offers numerous benefits, including definitions for the placement of laser sources at the front panel, the coolest section of the system, enhancing system reliability and allowing for efficient “hot-swap” field replacement when necessary.

The ELSFP uses a multi-fiber blind-mate optical connector positioned at the rear of the module. This strategic design mitigates potential eye-safety risks, particularly in applications where high optical powers are involved. Each ELSFP can supply optical power to one or more optical engines, all seamlessly managed by OIF’s Common Management Interface Specification (CMIS).

This IA also defines interoperability for mechanical, thermal, electrical and optical parameters as well as establishing standard power ranges and fiber configurations to focus the industry’s development. The final feature unique to ELSFP is the pass-through option which allows systems architects to maximize face plate real estate, solidifying ELSFP’s position as a versatile and adaptable solution for various optical networking applications.

“The ELSFP IA represents a significant milestone for the optical networking industry,” said Jeff Hutchins, OIF Board Member and Physical & Link Layer (PLL) Working Group Co-Packaging Vice Chair and Ranovus. “By providing a front panel pluggable external laser source form factor, we’re empowering network operators and equipment manufacturers with a cutting-edge solution that not only improves reliability but also paves the way for future innovations. The ELSFP’s flexible design accommodates the ever-changing needs of the industry, enabling seamless integration with OIF’s 3.2T co-packaged optical module project and beyond.”

While the ELSFP project was originally envisioned to complement the 3.2T co-packaged optical module, its forward-looking design makes it easily extensible to address future requirements.

“The ELSFP has already garnered a favorable industry reception through its potential to propel external laser source applications forward, as evidenced by strong collaboration among OIF member both in writing the IA and the substantial engagement in numerous interoperability demonstrations facilitated by OIF,” said Jock Bovington, Cisco, and editor of the OIF ELSFP IA.

For more information about the ELSFP Implementation Agreement and other OIF initiatives, please visit here.

About OIF
OIF is where the optical networking industry’s interoperability work gets done. Celebrating 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 140+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn, Threads and at http://www.oiforum.com.

PR Contact:
Leah Wilkinson
Wilkinson + Associates for OIF
leah@wilkinson.associates
703-907-0010

OIF Launches Forward-Looking Project to Explore the Next Generation of Energy-Efficient Electrical and Optical Interfaces

| | ,

Critical applications driving demand for energy-efficient links include data center networking, artificial intelligence training/machine learning and disaggregation

Fremont, Calif.— OIF, where the optical networking industry’s interoperability work gets done, today announced the launch of an innovative new project, the Energy Efficient Interfaces (EEI) Framework. The project, initiated at the Q2 2023 Technical and MA&E Committees meeting in May, will focus on studying new energy-efficient electrical and optical interfaces (which, among others, includes the next generation of low power optics, also referred to as “Linear” or “Direct Drive”). These new interfaces will be required to meet the demands of various applications such as data center networking, artificial intelligence (AI) training/machine learning (ML) and disaggregation.

“With an increasing industry-wide demand, particularly from data center operators, the focus on energy efficiency is more important than ever,” said Rob Stone, Meta Platforms and OIF Board Member. “Addressing this need head-on, the new OIF framework will explore energy-efficient interfaces for the optical interconnects of next-generation data centers that will support the performance scaling of current internet applications and enable groundbreaking AI-driven applications and immersive experiences.”

Through this project, OIF will explore and study energy-efficient links with less than fully retimed interfaces, which have the potential to unlock a multitude of benefits for diverse stakeholders. The objective is to identify critical applications and their requirements for next-generation electrical and optical links, including die-to-die, co-packaged, near-packaged and pluggable solutions. The project will conduct a thorough study to identify critical issues associated with these links and identify opportunities to pursue interoperability standards. The findings of the study will be outlined in the Framework Document, which will serve as a technical white paper for the project.

“A primary goal of this project is to identify new opportunities for interoperability standards, laying the groundwork for potential future collaborations at OIF or other standards organizations,” added Jeff Hutchins, OIF Board Member and Physical & Link Layer (PLL) Working Group Co-Packaging Vice Chair and Ranovus.

“OIF is always listening to the wants and needs our members bring forward, and this project start proposal authored by several industry leading companies directly addresses a need that exists across many IT applications,” said Nathan Tracy, OIF Co-chair of the Market Awareness and Education committee and TE Connectivity. “This one project has the potential to significantly benefit several critical industry applications.”

Additionally, Yi Tang, Cisco Systems, was recently appointed as PLL Working Group Electrical Vice Chair.

About OIF

OIF is where the optical networking industry’s interoperability work gets done. Celebrating 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 140+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

703-907-0010

leah@wilkinson.associates

 

OIF Launches Four Innovative Projects Covering a Broad Range of Technologies at Q2 Technical and MA&E Committees Meeting

| | ,

Fremont, Calif.—June 6, 2023 – At OIF’s hybrid Q2 2023 Technical and MA&E Committees meeting held in Budapest, Hungary, May 9-11, members voted to initiate four new projects spanning multiple technology tracks. Additionally, a new member of the Board of Directors was appointed, a Working Group Chair was re-elected and a WG Vice Chair was appointed.

The volume of activity reinforces OIF’s significant role in the optical networking industry as the sole global forum driving electrical, optical and control interoperability. This interoperability is crucial in enabling a more efficient and reliable network.

The new projects across the multiple technology tracks showcase the breadth of OIF’s value to the industry and ongoing commitment to driving innovation.

“This quarter’s OIF meeting was a clear testament to the organization’s unwavering dedication to progress,” said Cathy Liu, Broadcom Inc and OIF President. “The overall energy and remarkable productivity within each technology track reflected a collective determination to spearhead innovative projects that foster interoperability.”

New Projects

Management of Smart Optical Modules Project: Current system management paradigms require tight coupling between hosts and pluggable optical modules. As module capabilities advance, host software must be updated. This additional development cycle delays the deployment of these advanced capabilities. In multi-vendor environments, it is becoming challenging for the various equipment developers to implement and track all the advanced features implemented by the various module vendors. There is also the requirement by end users for disaggregation of IPoDWDM solutions. This new OIF project will result in a white paper describing a new paradigm that decouples the controller from host software development, enabling faster realization of advanced module capabilities.

Energy Efficient Interfaces Framework Project: This umbrella framework project will study energy-efficient electrical and optical interfaces (sometimes referred to as “Linear” or “Direct Drive”) necessary to support the energy-efficient application requirements prioritized by OIF’s Physical Layer User Group Working Group.

800G/1.6T FlexE Project: This project will define interoperable next-generation FlexE specifications for 800G/1.6T PHY rates for mobile backhaul and data center interconnect applications. It will result in the revision of the OIF-FLEXE-02.2 implementation agreement by adding support for 800Gb/s and 1.6Tb/s FlexE PHYs.

Digital Twin Optical Network as an Enhanced Network Operation Project: Digital twins can enhance and accelerate network transformations, systems and operational process integrations. Verifying the accuracy of configuration or optimization orders provided by Digital Twin Network (DTN) systems is a challenge. This project will result in a white paper that identifies the challenges and technical requirements for digital twin modeling as an enhanced optical network operation. It will specify the relationship between the DTN and network management and control, interface operation, input/output data requirements and data collection – essential steps to broaden the adoption of digital twin use in optical networks.

Guest Speaker

Andreas Gladisch, Vice President Emerging Technologies, Deutsche Telekom, addressed the member audience and shared his perspectives on disaggregation and its significance in the telecommunications industry. He emphasized the necessity for network operators to collaborate in order to achieve success in this area and that by working together, they can reap the benefits of disaggregation and build more agile, flexible and cost-effective networks.

New Member of the Board of Directors

Prior to the meeting, the Board of Directors appointed Robert Stone, Meta Platforms, to fill an open seat on the Board through September 2023.

Technical Committee Working Group Updates

Jia He, Huawei Technologies Co., Ltd., was re-elected as Chair of the Networking & Operations Working Group and Tom Huber, Nokia, was appointed as Physical & Link Layer Working Group Protocol Vice Chair.

 

About OIF

OIF is where the optical networking industry’s interoperability work gets done. Celebrating 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 140+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson
Wilkinson + Associates for OIF
703-907-0010
leah@wilkinson.associates

 

OIF to Showcase 25 Years of Driving Optical Networking Transformation at NGON & 5G Transport 2023, Hosts Sessions on Interoperability Advancements in 800LR/ZR, 400ZR, CEI, CMIS and Co-Packaging

| | ,

Fremont, Calif.—May 22, 2023 – OIF will share updates on its latest projects and highlight its 25-year legacy of driving critical standards and advancing optical networking at NGON & 5G Transport 2023 in Cote d’Azur, France, May 30 – June 1, 2023.

The sessions will provide attendees with insights into OIF’s latest projects and advancements in 800LR/ZR, 400ZR, CEI, CMIS and Co-Packaging, underscoring OIF’s commitment to advancing the optical networking industry.

“We are excited to showcase our 25 years of work in advancing the optical networking industry and highlight key projects at NGON & 5G Transport 2023,” said Nathan Tracy, TE Connectivity and OIF Market Awareness & Education Committee Co-Chair, Physical & Link Layer (PLL). “Our commitment to progressing technology through interoperability has been integral to the growth and evolution of the optical networking industry, and we look forward to sharing our latest work.”

The workshop titled “OIF: Bringing Order to Chaos,” which will feature Dave Brown, OIF Director of Communications, Nokia and Karl Gass, OIF PLL Working Group Optical Vice Chair, will take place on Tuesday, May 30, 2023, from 9:00 am – 10:30 am CEST.

The “IP-Optical with Coherent Optics” panel will take place on Wednesday, May 31, 2023, from 5:10 pm – 5:40 pm CEST. The OIF-hosted panel, moderated by Karl Gass, OIF PLL Working Group Optical Vice Chair will include panelists Edward Echeverry, Transport and SDN Network Engineer, Telefonica; and Ian Redpath, Research Director, Transport and Components, Omdia.

About OIF

OIF is where the optical networking industry’s interoperability work gets done. Celebrating 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 140+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

leah@wilkinson.associates

703-907-0010

 

 

OIF Launches the Industry’s First Co-Packaging Standard – the 3.2T Co-Packaged Module Implementation Agreement

| | ,

Organization’s first project under the umbrella of the Co-packaging Framework Document

Fremont, Calif.—April 5, 2023 – OIF, celebrating 25 years of getting the optical networking industry’s interoperability work done, continues to be at the forefront of the industry, promoting collaboration and coordination among different players in the supply chain and driving efforts to foster a co-packaging ecosystem to support innovative applications.

An industry-first, the OIF-Co-Packaging-3.2T-Module-01.0 – Implementation Agreement for a 3.2Tb/s Co-Packaged (CPO) Module defines a 3.2T co-packaged module that targets Ethernet switching applications utilizing 100G electrical lanes and provides backward compatibility with 50G lanes. The module definition can be in the form of an optical module or a passive copper cable assembly and provides ~140G/mm of bandwidth edge-density. It can enable optical and/or electrical interfaces for a 51.2Tb/s aggregate bandwidth switch.

“OIF’s members are committed to driving innovation and progress in co-packaging, continuously seeking ways to improve and innovate,” said Jeff Hutchins, OIF PLL Working Group Co-Packaging Vice Chair and Board Member, Ranovus. “This IA is part of a trio of projects which include the Framework project and the External Laser Small Form Factor Pluggable (ELSFP) project. Building on OIF’s successful track record of coherent and laser module IAs, it addresses the market need for interoperable integrated optics standardization identified by the CPO Framework IA.”

The new IA includes interoperability specifications for the 3.2 Tb/s CPO modules, including:

  • 8x400Gb/s optical interface options for FR4 and DR4 connectivity
  • 32 x CEI-112G-XSR host interface (or 32 x CEI-56G-XSR in “backwards compatible” mode)
  • Opto-mechanical module specifications
  • Electrical specifications
  • Control and management interface, enabled by enhancements to the existing OIF CMIS specification

“Considerable progress has been made in co-packaging, and this new IA, along with a collaborative ecosystem, is a critical piece to propel the technology so that it meets industry needs, including that of Cloud service providers as they build their next-generation AI networks,” said Richard Ward, Technical Editor of the OIF 3.2T Co-Packaged Module IA, Astera Labs. 

At OFC 2023 in March, OIF revealed its progress in co-packaging specifications in a set of interoperability demonstrations. The demos included pivotal multi-vendor elements to enable co-packaging architectures, including live demos for the External Laser Small Form Factor Pluggable (ELSFP) external laser source form factor, co-packaged 3.2T copper cable assemblies, an operating linear optical module, and a variety of optical connectivity solutions as well as an expanded set of OIF member participants representing the growing ecosystem.

About OIF

OIF is where the optical networking industry’s interoperability work gets done. Celebrating 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 140+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

leah@wilkinson.associates

703-907-0010

OIF Highlights 400ZR, Co-Packaging Architectures, CEI-112G & CEI-224G and CMIS Implementations Interoperability Among 30+ Global Companies; Hosts Special Anniversary Events at OFC 2023

| | ,

Fremont, Calif.—February 22, 2023 – At OFC 2023, OIF will host more than 30 member companies for its largest-ever interoperability demonstration, a special technology session and reception to commemorate its 25th anniversary and will participate in two show floor program sessions showcasing OIF’s work. OIF also announced the availability of a white paper highlighting the findings from a 400ZR Interoperability Plugfest held in January.

“This year’s OFC is the ideal platform for OIF and its members to showcase multivendor interoperability and to celebrate 25 years of interop work critical in moving the industry forward,” said Nathan Tracy, TE Connectivity and OIF Market Awareness & Education Committee Co-Chair, Physical & Link Layer (PLL).

Record-setting Interoperability Demo – 400ZR, Co-Packaging, CEI-112G & CEI-224G and CMIS

OIF’s multivendor interoperability demo at OFC will feature 34 member companies in live demonstrations in OIF’s booth, #5101, in four areas: 400ZR optics, Co-Packaging architectures, Common Electrical I/O (CEI) architectures and Common Management Interface Specification (CMIS) implementations.

400ZR Demo

OIF’s 400ZR project is critical in facilitating the reduction of cost and complexity for high bandwidth data center interconnects and promoting interoperability among optical module manufacturers. This year’s public demonstration includes nearly double the number of participants over last year, including links to multiple collaborator’s booths using OFCnet, OFC’s high-speed optical network. The demo consists of a full implementation of 400GE across a 75km, DWDM ecosystem using multiple module, router, open line system, and test equipment vendors, demonstrating that the project achieved its interoperability goals.

Co-Packaging Demo

OIF continues to lead the industry’s efforts to enable co-packaging solutions utilizing interoperable electrical and optical interfaces featuring low power and high bandwidth edge densities. This co-packaging demo will show OIF’s considerable progress toward that objective since OFC 2022. This year’s interop demonstrations include pivotal multi-vendor elements to enable co-packaging architectures, including live demos for the External Laser Small Form Factor Pluggable (ELSFP) external laser source form factor, co-packaged 3.2T copper cable assemblies, an operating linear optical module, and a variety of optical connectivity solutions as well as an expanded set of OIF member participants representing the growing ecosystem.

 CEI Demo

As the industry looks forward to higher data rates and increased throughput for the next generation of systems based on 224 Gbps per lane, new specifications and technologies will be required. OIF is leading the charge on 224G hardware interconnection application spaces and definitions, demonstrating 224G transmitter and receiver SerDes operation across different vendor channels.

Multiple live CEI demonstrations featuring interoperability amongst 16 participating members prove the critical role OIF serves as well as the developing supplier ecosystem. The CEI-112G demonstrations will feature multi-party silicon supplier interoperability over various Long Reach (LR) channels, including mated compliance boards, PCB channels, direct attach passive, active, and linearly boosted copper cable channels. Optics modules demonstrating VSR links will also be on display, as well as multi-vendor interop traversing single mode and multimode CEI Linear interfaces. Each configuration demonstrates the technical viability of 112 Gbps operation and multiple industry form factors, including SFP, QSFP, OSFP and QSFP-DD. The demo will also show a measured far-end linear eye diagram on an oscilloscope with analysis to show an example of the silicon signal integrity.

CMIS Implementations Demo

CMIS has established itself as the management interface of choice for next generation pluggable modules, capable of managing both simple and advanced modules. CMIS provides a well-defined mechanism to initialize and manage optical and copper modules in a standard way, while still providing the capability to provide custom functionality. This commonality makes integration into different host platforms easier for both the host vendor and the module vendor. The live CMIS demo will show a variety of CMIS managed modules and a copper cable in routers and switches from different vendors and showcases how modules are managed in a real-world application.

Participating Companies

The live and static interoperable optical networking solutions demo will feature 34 OIF member companies – ADVA; Alphawave Semi; Amphenol; Astera Labs; Cadence Design Systems, Inc.; Casela Technologies; Ciena; Cisco Systems; Coherent; ColorChip Group; EXFO; InnoLight Technology; Juniper Networks; Keysight Technologies; Lumentum; MACOM Technology Solutions Inc.; Marvell; Microchip Technology; Molex; MultiLane, Inc.; NEC Corporation; Nokia; O-Net Technologies; Precision Optical Transceivers, Inc.; Quantifi Photonics; Samtec; Senko Advanced Components; Sicoya; Source Photonics; Sumitomo Electric Industries; Synopsys; TE Connectivity; US Conec, and Wilder Technologies.

Special 25th Anniversary Tech Showcase

To commemorate its 25th anniversary during OFC, OIF will host a special one-hour session, “Bringing Order to Chaos – OIF,” on Wednesday, March 8 at 3 pm PT in Theater III.

This dynamic session will feature Stephen Hardy, editorial director of Lightwave, and a panel of industry analysts and OIF experts discussing how OIF has helped bring order to a chaotic marketplace over the past 25 years and debate the challenges ahead for OIF and the optical networking industry.

Attendees will learn:

– How OIF’s member-driven model leverages collaboration and consensus to solve complex industry challenges

– What current and trending challenges are in play

Panelists:

  • Karl Gass, OIF PLL Working Group Optical Vice Chair
  • Vladimir Kozlov, Founder and CEO, LightCounting
  • Sterling Perrin, Senior Principal Analyst, Optical Networks and Transport, Heavy Reading
  • Nathan Tracy, OIF Market Awareness & Education Committee Co-Chair, PLL; Technologist, System Architecture Team, TE Connectivity
  • Alan Weckel, Founder and Technology Analyst, 650 Group

25th Anniversary Reception

A celebration reception will be held Wednesday, March 8, at 4 pm PT at OIF booth #5101.

Show Floor Programs

Wednesday, March 8, 1 pm-2 pm PT in Theater II

“Defining 800ZR and 800LR; An OIF Update”

Moderator: Karl Gass, OIF PLL Working Group Optical Vice Chair

Panelists:

  • Josef Berger, Associate Vice President, Optical and Copper Connectivity Group, Marvell
  • Sebastien Gareau, Systems Architect, Ciena
  • Scott Wilkinson, Lead Analyst, Optical Components, Cignal AI
  • Tom Williams, Director of Technical Marketing, Cisco Systems

Thursday, March 9, 12:15 pm-1:15 pm PT in Theater II

“Enabling Next Generation Co-Packaging Solutions”

Moderator: Jeff Hutchins, OIF PLL Working Group Co-Packaging Vice Chair and Board Member; CTO Office, Ranovus

Panelists:

  • Kenneth Jackson, Product Marketing Director, Sumitomo Electric Device Innovations, USA
  • Yi Tang, Principal Hardware Engineer, Cisco
  • Nathan Tracy, OIF MA&E Committee Co-Chair, PLL; Technologist, System Architecture Team, TE Connectivity
  • Richard Ward, Chief Technologist Data Connectivity, Astera Labs

400ZR Interoperability Plugfest White Paper

This new OIF white paper presents the methodology and results of an interoperability study of 400ZR transceivers conducted during a performance testing plugfest held in late January. Twelve different transceivers were cross-connected in a matrix of combinations (Tx-Rx) using a noise-loaded link to characterize the penalties associated with interoperability between suppliers. The white paper is available here.

About OIF

OIF is where the optical networking industry’s interoperability work gets done. Celebrating 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 140+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

leah@wilkinson.associates

703-907-0010

 

OIF Hosts Largest Ever Multi-Vendor Interoperability Demonstration of the Solutions Accelerating Next-Generation Capabilities at OFC 2023; Celebrates 25 Years of Interoperability Work

| | ,

More than 30 global companies will participate in this year’s interoperability demo in four areas – 400ZR; Co-Packaging architectures, CEI-112G & CEI-224G and CMIS implementations

Fremont, Calif. – OIF, celebrating 25 years of getting the optical networking industry’s interoperability work done, is hosting the largest ever multi-vendor interoperability demonstration at OFC 2023, March 7-9 in San Diego, California.

 

 

 

A record number of participants, more than 30 OIF-member companies, are participating in demonstrations in OIF’s booth, #5101, in four critical areas: 400ZR optics, Co-Packaging architectures, Common Electrical I/O (CEI) architectures and Common Management Interface Specification (CMIS) implementations.

“Given the pace of demand for access to broadband and the revolutionary technical advancements needed to support that demand, interoperability is more important than ever,” said Mike Klempa, Alphawave Semi, and OIF Physical & Link Layer Interoperability Working Group Chair. “This year marks 25 years of industry-changing work bringing together an ecosystem of members to solve some of the network’s greatest challenges, so it’s no surprise that OIF’s demo at OFC will be the largest it’s ever hosted.”

The live and static interoperable optical networking solutions demo at OFC will feature 34 OIF member companies – ADVA; Alphawave Semi; Amphenol; Astera Labs; Cadence Design Systems, Inc.; Casela Technologies; Ciena; Cisco Systems; Coherent; ColorChip Group; EXFO; InnoLight Technology; Juniper Networks; Keysight Technologies; Lumentum; MACOM Technology Solutions Inc.; Marvell; Microchip Technology Incorporated; Molex; MultiLane, Inc.; NEC Corporation; Nokia; O-Net Communications; Precision Optical Transceivers, Inc.; Quantifi Photonics; Samtec; Senko Advanced Components; Sicoya; Source Photonics; Sumitomo Electric Industries; Synopsys; TE Connectivity; US Conec and Wilder Technologies.

To commemorate its 25th anniversary during OFC, OIF will host a special session, “Bringing Order to Chaos – OIF,” on Wednesday, March 8 at 3 pm PT, Theater 3. The one-hour session will feature OIF leadership, Karl Gass, OIF and Nathan Tracy, OIF, TE Connectivity, and special guests: Stephen Hardy, Lightwave; Vladimir Kozlov, LightCounting; Sterling Perrin, Heavy Reading/Omdia and Alan Weckel, 650 Group.

A celebration reception will follow at OIF Booth #5101 – Wednesday, March 8, at 4 pm PT.

More details to be announced.

About OIF

OIF is where the optical networking industry’s interoperability work gets done. Celebrating 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 140+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

leah@wilkinson.associates

703-907-0010

 

OIF Marks 25th Anniversary, Launches New Physical & Link Layer Working Group Electrical Project and Adds 112G VSR Clause to CEI 5.0 IA at Q1 Technical and MA&E Committees Meeting

| | ,

The meeting hosted leading analysts from 650 Group and LightCounting as guest speakers giving member participants direct access to research, forecasting of industry growth and the impact of OIF’s work

Fremont, Calif.—January 23, 2023 – OIF’s first Technical and MA&E Committees Meeting of the year kicked off a year-long celebration of OIF’s 25th anniversary, the launch of an enhanced SGMII project – a Physical & Link Layer (PLL) Working Group Electrical track project – and the completion of the Common Electrical I/O (CEI)-112G-VSR, as well as featured guest speakers, Vladimir Kozlov, CEO, LightCounting; and Alan Weckel, Founder and Technology Analyst, 650 Group.

The Q1 Technical and MA&E Committees Meeting was held in person and virtually January 10-12, 2023, in Indian Wells, California.

25th Anniversary

For 25 years, OIF has accelerated progressive transformation in optical networking by serving as the only global industry forum driving the electrical, optical and control interoperability that enables a more efficient and reliable network. Its active member ecosystem of more than 140 companies collaborates through a transparent and fast-paced process to develop, validate and publish Implementation Agreements (IAs) and technical white papers critical to accelerating market adoption of interoperable optical networking technologies.

Opening the week of celebration, Stephen Hardy, Editorial Director of Lightwave, welcomed attendees with a special virtual greeting – a “Friday 5” featuring the five OIF IAs that Hardy believes have been the most transformative to the industry.

Approval of Common Electrical I/O (CEI)-112G-VSR

CEI-112G-VSR-PAM4 specifies a 112 Gb/s chip-to-module PAM4 electrical interface for use in the range 36 to 58 Gsym/s with up to 16 dB loss at the Nyquist frequency, including one connector. Hosts and modules compliant to CEI-112G-VSR-PAM4 from different manufacturers are interoperable.

“CEI-112G-VSR allows for an interoperable environment using optical pluggable modules critical to networking and challenging AI/ML connectivity,” said Dr. Karl Bois, OIF Technical Committee Vice Chair, NVIDIA Corporation. “The networking and data center ecosystems have a new powerful implementation recipe to increase throughput and capacity, especially when the network is part of the Compute infrastructure.”

New Electrical Project – Enhanced SGMII Electrical Specifications

The enhanced SGMII (E-SGMII) specifications will be based on modernized current mode logic (CML) electrical specifications instead of legacy LVDS and provide an optional high-speed 1 GbE interface to supplement the management of modules. Specifically, it will define a 1 GbE (1.25 GBd) high-speed serial interface for modules based on a modernized, enhanced SGMII. E-SGMII will have applications both for next-generation modules and for existing form factors with sufficient pins available.

Guest Speakers – Vladimir Kozlov, Founder and CEO, LightCounting; and Alan Weckel, Founder and Technology Analyst, 650 Group

Kozlov, Founder and CEO of LightCounting, an optical communications market research company:

“It takes a collective mind of the industry experts to filter out the best product ideas enabled by cutting-edge technologies,” said Kozlov. “OIF created a framework to keep the collective mind productive by letting the experts debate respectfully, yet often passionately. Some projects turn into success stories in 2-3 years, with 400ZR being the most recent example. Others take up to 7 years to complete, and many never make it to the market, but they all help chart the industry’s future. I am looking forward to the 50th anniversary of OIF. The next 25 years will be even more fun since the industry has many diverging routes to consider.”

Weckel, Founder and Technology Analyst of 650 Group, a trusted market research firm:

“As OIF celebrates its 25th anniversary, the organization continues to push critical standards and efforts forward that help shape almost every data center and network in the world today,” said Weckel. “If we look at all the recent and upcoming announcements on 56/112/224 Gbps SERDES and ZR optics, the OIF was critical in bringing those products to market.”

About OIF

OIF is where the optical networking industry’s interoperability work gets done. Celebrating 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 140+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

703-907-0010

leah@wilkinson.associates

 

OIF to Update Industry on Next-Generation Electrical and Optical Interface Projects, including 224 Gbps & Co-Packaging, at DesignCon 2023

| | ,

Industry thought leaders will provide an update on work to deliver electrical interfaces for 224 Gbps equipment architectures, co-packaging of optical and electrical interfaces

Fremont, Calif.—January 11, 2023 –OIF has worked to advance the development of interoperable electrical interface specifications, known as CEI (common electrical I/O), for over two decades, leading to the widespread adoption of industry-changing standards. At DesignCon 2023, Jan 31 – Feb 2, in Santa Clara, CA, industry experts will reveal the work OIF is doing to address electrical interfaces optimized for new electrical and optical architecture aspirations, including 224 Gbps and the co-packaging of optical and electrical interfaces with ASICs.

OIF experts will present its work during two panels at the event:

Tuesday, Jan 31, 2023: 4:45-6:00 pm PT
Enabling Next Generation Co-Packaging Solutions
Moderator: Jeff Hutchins, OIF Physical & Link Layer (PLL)  Working Group Co-Packaging Vice Chair and Board Member, Ranovus

Panelists include Jeff Hutchins; Kenneth Jackson, Sumitomo Electric Device Innovations, USA; Yi Tang, Cisco; Nathan Tracy, OIF Market Awareness & Education Committee Co-Chair, PLL, TE Connectivity; and Richard Ward, Astera Labs

OIF experts will summarize OIF’s work on studying the various co-packaging applications, the technical tradeoffs and choices between different approaches, OIF’s projects, and future co-packaging trends. The panel will also cover OIF’s work to create standards (interoperability agreements) that foster the development of a co-packaging ecosystem.

Wednesday, Feb 1, 2023: 4:00 pm-5:15 pm PT
Enabling Next Generation Architectures: 224 Gbps Electrical Interfaces
Moderator: Nathan Tracy, OIF MA&E Committee Co-Chair PLL, TE Connectivity

Panelists include; John Calvin, Keysight; Mike Klempa, OIF PLL Interoperability Working Group Chair, Alphawave IP Group; Mike Li, OIF Board Member, Intel; Cathy Liu, OIF President, Broadcom Inc.

This session will include lessons learned from 112 Gbps and how those lessons are being leveraged for the new 224 Gbps work in OIF. Experts will also discuss the challenges OIF must overcome to enable 224 Gbps electrical I/O interface solutions where reach, performance, power, and cost optimizations become paramount. These solutions are critical to keep the industry moving forward with the next generation of interoperable electrical I/O interface specifications that address the escalating network power consumption trends.

About OIF
OIF is where the optical networking industry’s interoperability work gets done. Celebrating 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 130+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

PR Contact:

Leah Wilkinson
Wilkinson + Associates for OIF
Email: leah@wilkinson.associates
Office: 703-907-0010

OIF Q4 Technical and MA&E Committees Meeting Results in Working Group Chair Re-Elections, White Paper, and 400ZR Demo Survey Availability

| | ,

Guest speaker from Hawaiian Telcom shared an overview of its network investment, and its continued efforts to push the network edge closer to the customer

Fremont, Calif.—November 22, 2022 – OIF’s Q4 Technical and MA&E Committees Meeting, held in person and virtually November 1-3, 2022, in Kona, Hawaii, included guest speaker Francis Alueta, Hawaiian Telcom and resulted in the release of a new white paper, a 400ZR survey, and re-elections of two new Working Group chairs.

White Paper – Management of External Light Sources and Co-packaged Optical Engines

Properly managing optical engines and external light sources requires an efficient system management architecture. A newly launched white paper from OIF outlines the recommended system management architecture that enables co-packaged optical transceivers to use lasers as external light sources. It also describes how OIF’s Common Management Interface Specification (CMIS) can manage transceivers and light sources. The key feature is placing the intelligence for controlling the continuous wave light sources in the host board controller, not in the optical engines.

Working Group Chairs Re-Election

Also, during the meeting, OIF members re-elected Working Group Chairs (for two-year terms):

  • Mike Klempa, Alphawave IP Group – Physical & Link Layer (PLL) Interoperability Working Group Chair
  • Jeffery Maki, Juniper Networks – Physical Layer User Group Working Group Chair

 

Guest Speaker – Francis Alueta, Hawaiian Telcom

As Director, Network Reliability, Alueta, presented a high-level overview of Hawaiian Telcom’s investment in its next-generation network, the landmark Southeast Asia (SEA) US Trans-Pacific Cable System and backbone transport network. Next generation network plans include pushing a low-latency network edge closer to the customer and deploying a resilient, 400G backbone network. He also outlined some of the unique challenges they face as an island chain, geographic limits to route and path diversity options and climate change.

“Big Mahalo for OIF allowing me to present an overview of the architectural and operational challenges we have to overcome, as we transform our network,” said Alueta. “The work OIF continues to do will allow us to address those challenges and ensure a resilient network for our customers and the people of Hawaii.”

 

400ZR Demonstrations and Plugfests Survey – Deadline December 7

OIF is launching a survey designed to gather feedback from network operators and stakeholders on OIF’s 400ZR demonstrations and plugfests. The survey also includes collecting input on the interest of an 800ZR and/or 800LR OIF demo and reaches of interest for 800G (800LR, 800ZR, > 800ZR).

The survey is available and open to all who can represent their company’s viewpoint – module vendors, system vendors and network operators. Multiple responses per company are also allowed. Responses will be collated anonymously and summarized for presentation to the public. Interested parties, please email survey@oiforum.com. The deadline for completing the survey is December 7.

“OIF members guide its demos and plugfests, and this survey supports new directions encouraged by our Interoperability Working Group Chair,” said Karl Gass, OIF PLL Working Group – Optical Vice Chair. “Leveraging the pre-demonstration plugfest as an opportunity to collect quantitative measurements of interoperability with multiple vendors provides critical input for current and future (800ZR) Implementation Agreements.”

 

About OIF

OIF is where the optical networking industry’s interoperability work gets done. Building on nearly 25 years of effecting forward change in the industry, OIF represents the dynamic ecosystem of 130+ industry leading network operators, system vendors, component vendors and test equipment vendors collaborating to develop interoperable electrical, optical and control solutions that directly impact the industry’s ecosystem and facilitate global connectivity in the open network world. Connect with OIF at @OIForum, on LinkedIn and at http://www.oiforum.com.

 

PR Contact:

Leah Wilkinson

Wilkinson + Associates for OIF

703-907-0010

leah@wilkinson.associates